公开(公告)号：US09162303B2

公开(公告)日：2015-10-20

申请号：US13187881

申请日：2011-07-21

Applicant: Fan Li ,  Jie Huang ,  Surinder Jassal

Inventor： Fan Li ,  Jie Huang ,  Surinder Jassal

IPC: B05D5/12 ,  B23K1/00 ,  C23C18/18 ,  B05D1/32 ,  C23C18/06 ,  H05K3/42 ,  H05K3/12 ,  B23K1/008 ,  B23K1/20 ,  B23K3/06 ,  H05K1/11 ,  B05D3/00 ,  H05K5/00

CPC classification number: B23K1/0016 ,  B05D1/32 ,  B05D3/002 ,  B05D5/12 ,  B23K1/008 ,  B23K1/20 ,  B23K3/0638 ,  B23K2101/42 ,  C23C18/06 ,  C23C18/18 ,  H05K1/119 ,  H05K3/1216 ,  H05K3/1233 ,  H05K3/42 ,  H05K5/00 ,  H05K2201/09036 ,  H05K2201/10371

Abstract: A circuit board, associated assembly, and method of manufacture. The circuit board comprises an elongated groove, extending into the circuit board, for accommodating a footing of a large component such as an RF shield. The groove allows solder paste to be deposited therein via a stencil, to a depth greater than the stencil thickness. Thus the same stencil can be used for depositing solder paste for both small and large components.

Abstract translation: 电路板，相关组件和制造方法。 电路板包括延伸到电路板中的细长槽，用于容纳诸如RF屏蔽之类的大部件的基脚。 凹槽允许焊膏通过模板沉积到比模板厚度大的深度。 因此，相同的模板可以用于沉积小型和大型组件的焊膏。

公开(公告)号：US09033740B2

公开(公告)日：2015-05-19

申请号：US13455112

申请日：2012-04-24

Applicant: Erik J. Shahoian

Inventor： Erik J. Shahoian

IPC: H01R13/648 ,  H01R13/6594 ,  H01R13/6581

CPC classification number: H01R13/6594 ,  H01R12/7011 ,  H01R12/716 ,  H01R13/6581 ,  H05K1/0219 ,  H05K3/326 ,  H05K3/34 ,  H05K2201/0311 ,  H05K2201/10356 ,  H05K2201/10371 ,  H05K2201/10378 ,  H05K2201/10409 ,  H05K2201/10962 ,  Y10T29/49147 ,  Y10T29/49149

Abstract: High-speed interposer connectors that may be space-efficient, reliable, and may be readily manufactured. One example may provide an interposer connector that may be particularly space-efficient in a vertical direction by using an interposer to form an electrical connection between conductors and a main-logic board or other appropriate substrate. Another example may provide a reliable connection between conductors and a main-logic board by using fasteners to fix an interposer to the main-logic board. Another example may provide connectors that are well-suited to handling high-speed signals by providing a shield to at least partially cover a top of an interposer connector.

Abstract translation: 高速插入器连接器可以节省空间，可靠，并且可以容易地制造。 一个示例可以提供一种插入器连接器，其可以通过使用插入器在导体和主逻辑板或其他适当的衬底之间形成电连接而在垂直方向上特别空间高效。 另一个例子可以通过使用紧固件将插入件固定到主逻辑板来提供导体和主逻辑板之间的可靠连接。 另一个示例可以提供通过提供屏蔽以至少部分地覆盖插入器连接器的顶部而非常适合于处理高速信号的连接器。

公开(公告)号：US20150003023A1

公开(公告)日：2015-01-01

申请号：US14310007

申请日：2014-06-20

Applicant: FUJITSU COMPONENT LIMITED

Inventor： Shinya Yamamoto ,  Tohru Muramatsu ,  Masakazu Muranaga

IPC: H05K9/00 ,  H05K3/30

CPC classification number: H05K3/30 ,  H05K1/0218 ,  H05K3/341 ,  H05K3/4007 ,  H05K9/0028 ,  H05K9/0035 ,  H05K2201/10371 ,  H05K2203/167 ,  Y10T29/49144

Abstract: An electronic component module includes a board having an electronic component mounted on a surface of the board and a shield case mounted on the surface of the board and covering the electronic component. The board includes a projecting part projecting from the surface of the board. The projecting part is formed of plating at a position along a sidewall of the shield case and is soldered to the shield case.

Abstract translation: 电子部件模块包括具有安装在板的表面上的电子部件的板和安装在板的表面上并覆盖电子部件的屏蔽壳。 板包括从板的表面突出的突出部分。 突出部分在屏蔽壳的侧壁位置处由电镀形成，并被焊接到屏蔽壳上。

公开(公告)号：US08890628B2

公开(公告)日：2014-11-18

申请号：US13600944

申请日：2012-08-31

Applicant: Vijay K. Nair ,  Dale A. Hackitt ,  Carlton E. Hanna

Inventor： Vijay K. Nair ,  Dale A. Hackitt ,  Carlton E. Hanna

IPC: H01L41/053 ,  H03H9/10

CPC classification number: H01L25/16 ,  H01L23/04 ,  H01L23/3121 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73267 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/183 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/0723 ,  H05K2201/10371 ,  Y10T29/49139 ,  Y10T29/49888 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor device package having reduced form factor and a method for forming said semiconductor device are disclosed. In an embodiment, an active die is embedded within a cavity in the core layer of the package substrate, wherein an in-situ electromagnetic shield is formed on the sidewalls of the cavity. In another embodiment, a crystal oscillator is at least partially embedded within the core layer of the package substrate. In another embodiment, a package having a component embedded in the core layer is mounted on a PCB, and a crystal oscillator generating a clock frequency for the package is mounted on the PCB. By embedding components within the core or removing components from the package to be mounted directly on the PCB, the x, y, and z dimensions of a package may be reduced. In addition, in-situ electromagnetic shield may reduce EM noise emitted from the active die.

Abstract translation: 公开了一种具有减小的形状因数的半导体器件封装和用于形成所述半导体器件的方法。 在一个实施例中，有源裸片嵌入在封装衬底的芯层中的空腔内，其中原位电磁屏蔽形成在空腔的侧壁上。 在另一个实施例中，晶体振荡器至少部分地嵌入在封装衬底的芯层内。 在另一个实施例中，具有嵌入在芯层中的部件的封装安装在PCB上，并且在PCB上安装产生封装的时钟频率的晶体振荡器。 通过将组件嵌入芯中或从组件中去除要直接安装在PCB上的部件，可以减小封装的x，y和z尺寸。 此外，原位电磁屏蔽可以减少从有源裸片发射的EM噪声。

公开(公告)号：US08840432B2

公开(公告)日：2014-09-23

申请号：US13454556

申请日：2012-04-24

Applicant: Wayne Stewart Alden, III ,  Jeffery W. Mason

Inventor： Wayne Stewart Alden, III ,  Jeffery W. Mason

IPC: H01R13/648 ,  H01R13/6585 ,  H01R9/05 ,  H01R24/50

CPC classification number: H01R13/6585 ,  H01R9/0515 ,  H01R13/648 ,  H01R13/6588 ,  H01R13/6594 ,  H01R13/6596 ,  H01R13/6658 ,  H01R24/50 ,  H05K1/0216 ,  H05K3/341 ,  H05K2201/10356 ,  H05K2201/10371

Abstract: An electrical connector includes a circuit board having an internal ground plane that defines at least a portion of an internal layer of the circuit board. The circuit board has an exterior side that includes a mounting region and includes electrical contacts arranged on the exterior side within the mounting region for making electrical connection with corresponding signal conductors of electrical wires. Ground shields are mounted to the mounting region of the circuit board and include electrically conductive bodies that are configured to extend over corresponding electrical wires along the mounting region of the circuit board. The bodies of the ground shields include side segments that are configured to extend between the signal conductors of adjacent electrical wires along the mounting region of the circuit board. The bodies are engaged with the internal ground plane of the circuit board to electrically connect the ground shields to the internal ground plane.

Abstract translation: 电连接器包括具有限定电路板的内层的至少一部分的内部接地平面的电路板。 电路板具有包括安装区域的外侧，并且包括布置在安装区域内的外侧上的电触点，用于与相应的电线信号导体进行电连接。 接地屏蔽件安装到电路板的安装区域，并且包括导电体，其配置成沿着电路板的安装区域在相应的电线上延伸。 接地屏蔽体的主体包括被配置为沿着电路板的安装区域在相邻电线的信号导体之间延伸的侧段。 主体与电路板的内部接地平面接合，以将接地屏蔽电连接到内部接地平面。

公开(公告)号：US08724342B2

公开(公告)日：2014-05-13

申请号：US13426311

申请日：2012-03-21

Applicant: Lucas G. Schrab

Inventor： Lucas G. Schrab

IPC: H05K9/00 ,  H05K1/02

CPC classification number: H05K9/0032 ,  H01R13/6587 ,  H01R13/6658 ,  H05K1/0218 ,  H05K9/0028 ,  H05K9/0033 ,  H05K9/0039 ,  H05K2201/10371

Abstract: A cover shield for a circuit board having a body. A peripheral wall is disposed about an edge of the body. First and second slots each include a first portion that extends through the body and a second portion that extends through the peripheral wall. A barbed tab is disposed between the first and second slots. A notch extends through a portion of the barbed tab. A distinct abutting member is disposed on the peripheral wall.

Abstract translation: 一种用于具有主体的电路板的盖罩。 围绕身体的边缘设置周边壁。 第一和第二槽各自包括延伸穿过主体的第一部分和延伸穿过周壁的第二部分。 有倒钩的突片设置在第一和第二槽之间。 凹口延伸穿过有倒勾片的一部分。 在周壁上设置明显的抵接构件。

公开(公告)号：US08697470B2

公开(公告)日：2014-04-15

申请号：US13664449

申请日：2012-10-31

Applicant: General Mems Corporation

Inventor： Yunlong Wang

IPC: H01L21/00

CPC classification number: H04R19/005 ,  H01L2924/15151 ,  H01L2924/16151 ,  H05K1/0243 ,  H05K3/341 ,  H05K2201/10083 ,  H05K2201/10371 ,  H05K2201/10969 ,  Y10T29/49117

Abstract: MEMS microphone packages and fabrication methods thereof are disclosed. One method for fabricating a MEMS microphone package, includes providing a substrate, forming a cavity enclosed by a top cover part, wherein a housing wall part surrounds and supports the top cover part, and the substrate supports the housing wall part and the cover part, forming a MEMS sensing element and an IC chip inside the cavity, forming an opening comprising an acoustic passage connecting the cavity to an ambient space, and forming a conductive casing enclosing the top cover part and the housing wall, wherein the conductive casing is soldered to a PCB board and is electrically connected to a common analog ground lead on the PCB board.

Abstract translation: 公开了MEMS麦克风封装及其制造方法。 一种用于制造MEMS麦克风封装的方法，包括提供基板，形成由顶盖部分包围的空腔，其中壳体壁部分围绕并支撑顶盖部分，并且基板支撑壳体壁部分和盖部分， 在所述空腔内形成MEMS感测元件和IC芯片，形成包括将所述空腔连接到环境空间的声学通道的开口，以及形成封闭所述顶盖部分和所述壳体壁的导电外壳，其中将所述导电套管焊接到 PCB板，并与PCB板上的公共模拟接地引线电连接。

公开(公告)号：US20140071634A1

公开(公告)日：2014-03-13

申请号：US13607014

申请日：2012-09-07

Applicant: David A. Pakula ,  Emery A. Sanford ,  Tyson B. Manullang ,  Anthony S. Montevirgen ,  Nicholas G.L. Merz ,  Christopher M. Werner

Inventor： David A. Pakula ,  Emery A. Sanford ,  Tyson B. Manullang ,  Anthony S. Montevirgen ,  Nicholas G.L. Merz ,  Christopher M. Werner

IPC: H05K1/18 ,  H05K7/00 ,  H01M2/08 ,  H05K9/00

CPC classification number: H01M2/1022 ,  H01M2200/30 ,  H04M1/0277 ,  H05K1/0243 ,  H05K9/0032 ,  H05K2201/10371

Abstract: An electronic device may include subassemblies such as battery structures, electromagnetic shielding structures, and button structures. The electromagnetic shielding structures may include a conductive fence and a flexible shielding layer that covers electronic components. The electromagnetic shielding structure may be formed with a recess that receives a protruding portion of a battery. The recess may be formed from a multi-level shielding structure that includes rigid and flexible portions. The button structures may be mounted to a ledge that is formed as an integral part of a device housing. An electronic device battery may be enclosed in a protective battery sleeve. The battery sleeve may include a center portion that encloses the battery and peripheral portions that are folded and coupled to the center portion by adhesive material interposed between opposing surfaces of the folded peripheral portions and the center portion of the battery sleeve.

Abstract translation: 电子设备可以包括诸如电池结构，电磁屏蔽结构和按钮结构的子组件。 电磁屏蔽结构可以包括导电栅栏和覆盖电子元件的柔性屏蔽层。 电磁屏蔽结构可以形成有容纳电池的突出部分的凹部。 凹部可以由包括刚性和柔性部分的多层屏蔽结构形成。 按钮结构可以安装到形成为装置壳体的整体部分的凸缘。 电子设备电池可以封装在保护电池套中。 电池套可以包括中心部分，其包围电池和外围部分，所述中心部分被插入在折叠周边部分的相对表面和电池套筒的中心部分之间的粘合材料折叠并联接到中心部分。

公开(公告)号：US20130264109A1

公开(公告)日：2013-10-10

申请号：US13857220

申请日：2013-04-05

Applicant: SEIKO EPSON CORPORATION

Inventor： Tomoyuki KAMAKURA

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K1/181 ,  H01L2224/16225 ,  H03H9/0504 ,  H03H9/0509 ,  H03H9/1021 ,  H05K1/113 ,  H05K3/301 ,  H05K3/321 ,  H05K2201/10083 ,  H05K2201/10371 ,  H05K2203/1147 ,  Y10T29/4913

Abstract: An electronic device has a vibrating element and a package accommodating the vibrating element. Moreover, the package has through-electrodes formed to penetrate a base substrate in its thickness direction and electrically connected with connection terminals, and electrically conductive adhesives (covering members) formed above the connection terminals so as to contain the through-electrodes.

Abstract translation: 电子设备具有振动元件和容纳振动元件的封装。 此外，封装具有形成为在其厚度方向上穿透基底基板并与连接端子电连接的贯通电极，以及形成在连接端子上方的导电粘合剂（覆盖部件），以便容纳贯通电极。

公开(公告)号：US20130250534A1

公开(公告)日：2013-09-26

申请号：US13426311

申请日：2012-03-21

Applicant: Lucas G. Schrab

Inventor： Lucas G. Schrab

IPC: H01R9/00 ,  H05K9/00

CPC classification number: H05K9/0032 ,  H01R13/6587 ,  H01R13/6658 ,  H05K1/0218 ,  H05K9/0028 ,  H05K9/0033 ,  H05K9/0039 ,  H05K2201/10371

Abstract: A cover shield for a circuit board having a body. A peripheral wall is disposed about an edge of the body. First and second slots each include a first portion that extends through the body and a second portion that extends through the peripheral wall. A barbed tab is disposed between the first and second slots. A notch extends through a portion of the barbed tab. A distinct abutting member is disposed on the peripheral wall.

Abstract translation: 一种用于具有主体的电路板的盖罩。 围绕身体的边缘设置周边壁。 第一和第二槽各自包括延伸穿过主体的第一部分和延伸穿过周壁的第二部分。 有倒钩的突片设置在第一和第二槽之间。 凹口延伸穿过有倒勾片的一部分。 在周壁上设置明显的抵接构件。