公开(公告)号：US07206055B2

公开(公告)日：2007-04-17

申请号：US11514960

申请日：2006-09-05

Applicant: Kazuhiro Ogawa ,  Kazuhiko Yanagawa

Inventor： Kazuhiro Ogawa ,  Kazuhiko Yanagawa

IPC: G02F1/1345

CPC classification number: G02F1/13452 ,  G02F1/134363 ,  H01L2924/0002 ,  H05K1/117 ,  H05K3/244 ,  H05K3/28 ,  H05K3/323 ,  H05K3/3452 ,  H05K3/361 ,  H05K2201/09709 ,  H05K2201/10659 ,  H05K2201/10681 ,  H01L2924/00

Abstract: A display device includes a display panel, a printed circuit board and a semiconductor device of a film carrier type which is disposed to lie between the liquid crystal display panel and the printed circuit board and is mounted on a film carrier. First terminals of the film carrier are connected by a first anisotropic conductive film to terminals of the printed circuit board and second terminals of the film carrier are connected to terminals of the display panel by a second anistropic conductive film.

Abstract translation: 显示装置包括显示面板，印刷电路板和薄膜载体型的半导体装置，其设置在液晶显示面板和印刷电路板之间并且安装在薄膜载体上。 薄膜载体的第一端子通过第一各向异性导电膜连接到印刷电路板的端子，并且薄膜载体的第二端子通过第二固态导电膜连接到显示面板的端子。

公开(公告)号：US20070051535A1

公开(公告)日：2007-03-08

申请号：US11308935

申请日：2006-05-29

Applicant: CHIH-CHAN GER ,  YU-HSIANG LIAO

Inventor： CHIH-CHAN GER ,  YU-HSIANG LIAO

IPC: H05K1/16

CPC classification number: H05K1/141 ,  H01L2224/48091 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/181 ,  H05K3/328 ,  H05K3/3426 ,  H05K3/3442 ,  H05K2201/09772 ,  H05K2201/1003 ,  H05K2201/10189 ,  H05K2201/10469 ,  H05K2201/10651 ,  H05K2201/10659 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic device includes an electronic component (40), a first printed circuit board (PCB) (100) and a second printed circuit board (200). The electronic component includes a first pin (A1) and a second pin (A2). The first PCB and a second PCB, respectively including first conductor trace lines (102) and second conductor trace lines (108) for electrically connecting the first pin and the second pin. The first PCB is disposed above the second PCB, and is parallel with the second PCB. The first PCB is electrically connected to the second PCB via at least one of the first conductor trace lines and the second conductor trace lines. A surface area of the first PCB is smaller than that of the second PCB.

Abstract translation: 电子设备包括电子部件（40），第一印刷电路板（PCB）（100）和第二印刷电路板（200）。 电子部件包括第一销（A 1）和第二销（A 2）。 第一PCB和第二PCB分别包括用于电连接第一引脚和第二引脚的第一导体迹线（102）和第二导体迹线（108）。 第一PCB设置在第二PCB上方，并与第二PCB平行。 第一PCB经由第一导体迹线和第二导体迹线中的至少一个电连接到第二PCB。 第一PCB的表面积小于第二PCB的表面积。

公开(公告)号：US20060216972A1

公开(公告)日：2006-09-28

申请号：US11389198

申请日：2006-03-24

Applicant: Roland Modinger

Inventor： Roland Modinger

IPC: H05K1/00

CPC classification number: H05K3/3415 ,  H01R43/0256 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10659 ,  H05K2201/10984 ,  H05K2203/0195 ,  H05K2203/0415 ,  H05K2203/1476 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49149 ,  Y10T29/49732 ,  Y10T29/49742

Abstract: A method for repair soldering of multi-pole miniature plug connectors on printed circuit boards, having signal contact pins in the SMT design and shroud pins in the THR design. The plug connectors have shrouds whose shroud pins project out on the back of the printed circuit board. Preforms are glued onto the SMD signal contact pins, and the repair plug connectors are set into THR holes of the board with their shroud pins. The signal contact pins are soldered using SMT technology. Subsequently, the shroud pins are soldered from the back of the board. The solder connects with the solder eyes of the solder holes on the back of the board, as well as flows into the ring gap between the metallized inside walls of the solder holes and the shroud pins in the circuit board, and produces a material-lock connection. Finally, the shroud pins that project out are shortened.

Abstract translation: 一种用于在印刷电路板上修复焊接多极微型插头连接器的方法，其具有SMT设计中的信号触针和THR设计中的护罩引脚。 插头连接器具有护罩，护罩引脚突出在印刷电路板的背面。 预制件粘贴到SMD信号触点引脚上，并将修补插头连接器置于板的THR孔中，并将其导线管插入。 信号触针使用SMT技术进行焊接。 随后，护罩引脚从电路板背面焊接。 焊料与焊盘背面的焊料焊点相连，并流入焊接孔的金属化内壁和电路板的护罩引脚之间的环形间隙，并产生材料锁 连接。 最后，伸出的护罩针脚缩短。

公开(公告)号：US07102211B2

公开(公告)日：2006-09-05

申请号：US10881561

申请日：2004-06-30

Applicant: Isao Ochiai ,  Masato Take

Inventor： Isao Ochiai ,  Masato Take

IPC: H01L23/495

CPC classification number: H05K1/0203 ,  H01L23/49568 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/3426 ,  H05K2201/10659 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2924/20754 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: The related arts have difficulty in efficiently dissipating the heat generated by a resin-molded semiconductor element, and thus have the problem of thermal stress causing damage to the semiconductor element. To solve the problem, a semiconductor device of the preferred embodiments includes common leads coupled to an island, and a part of the common leads projects out from a resin seal body. The projecting common leads have a coupling portion. When mounting the semiconductor device, the common leads are bridged with brazing material. Thus, the heat generated by an integrated circuit chip mounted on the island is dissipated through the common leads to the outside of the resin seal body. In the preferred embodiments of the invention, a further improvement in heat dissipation characteristics can be accomplished by increasing the surface areas of the common leads.

Abstract translation: 相关技术难以有效地消散由树脂模制的半导体元件产生的热量，因此具有导致半导体元件损坏的热应力的问题。 为了解决这个问题，优选实施例的半导体器件包括耦合到岛的公共引线，并且一部分公共引线从树脂密封体突出。 突出的公共引线具有联接部分。 当安装半导体器件时，公共引线用钎焊材料桥接。 因此，安装在岛上的集成电路芯片产生的热量通过公共引线消耗到树脂密封体的外部。 在本发明的优选实施例中，可以通过增加公共引线的表面积来实现散热特性的进一步改进。

公开(公告)号：US06961110B2

公开(公告)日：2005-11-01

申请号：US10073967

申请日：2002-02-14

Applicant: Kazuhiro Ogawa ,  Kazuhiko Yanagawa

Inventor： Kazuhiro Ogawa ,  Kazuhiko Yanagawa

IPC: G02F1/1345 ,  G02F1/13 ,  G09F9/00 ,  H01L21/60 ,  H05K1/11 ,  H05K3/24 ,  H05K3/28 ,  H05K3/32 ,  H05K3/36

CPC classification number: G02F1/13452 ,  G02F1/134363 ,  H01L2924/0002 ,  H05K1/117 ,  H05K3/244 ,  H05K3/28 ,  H05K3/323 ,  H05K3/3452 ,  H05K3/361 ,  H05K2201/09709 ,  H05K2201/10659 ,  H05K2201/10681 ,  H01L2924/00

Abstract: A liquid crystal display device which provides reliable connection between a semiconductor device and a printed circuit board includes a liquid crystal display panel, a printed circuit board disposed close to the liquid crystal display panel, and a semiconductor device of a film carrier type which is disposed to lie between the liquid crystal display panel and the printed circuit board, and terminals of the semiconductor device are respectively connected by an anisotropic conductive film to terminals of the printed circuit board that are disposed in opposition to the respective terminals of the semiconductor device.

Abstract translation: 提供半导体器件和印刷电路板之间的可靠连接的液晶显示装置包括液晶显示面板，靠近液晶显示面板设置的印刷电路板，以及设置在薄膜载体型的半导体器件 位于液晶显示面板和印刷电路板之间，并且半导体器件的端子分别通过各向异性导电膜连接到与半导体器件的各个端子相对设置的印刷电路板的端子。

公开(公告)号：US06900529B2

公开(公告)日：2005-05-31

申请号：US10139597

申请日：2002-05-06

Applicant: Kenneth J. Kledzik ,  Jason C. Engle

Inventor： Kenneth J. Kledzik ,  Jason C. Engle

IPC: H01L25/18 ,  H01L25/10 ,  H01L25/11 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H01L23/50 ,  H01L23/34 ,  H05K7/06

CPC classification number: H05K1/141 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/0002 ,  H05K1/0231 ,  H05K3/0061 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/1034 ,  H05K2201/10515 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2201/10924 ,  H01L2924/00

Abstract: An improved multi-chip module includes a main circuit board having an array of electrical interconnection pads to which are mounted a plurality of IC package units. Each IC package unit includes a pair of IC packages, both of which are mounted on opposite sides of a package carrier. The package units may be mounted on one or both sides of the main circuit board. A first primary embodiment of the invention employs a laminar package carrier having a pair of major planar surfaces. Each planar surface incorporates electrical contact pads. One IC package is surface mounted on each major planar surface, by interconnecting the leads of the package with the contact pads on the planar surface, to form the IC package unit. Several different variations of the chip module are disclosed.

Abstract translation: 改进的多芯片模块包括主电路板，其具有安装有多个IC封装单元的电互连焊盘阵列。 每个IC封装单元包括一对IC封装，两者均安装在封装载体的相对侧上。 封装单元可以安装在主电路板的一侧或两侧。 本发明的第一个主要实施例采用具有一对主平面的层状包装载体。 每个平面都包含电接触垫。 通过将封装的引线与平坦表面上的接触焊盘相互连接，将一个IC封装表面安装在每个主平面上，形成IC封装单元。 公开了芯片模块的几种不同的变型。

公开(公告)号：US06756666B2

公开(公告)日：2004-06-29

申请号：US09734662

申请日：2000-12-13

Applicant: Takahiro Hosomi

Inventor： Takahiro Hosomi

IPC: H01L257693

CPC classification number: H01L23/13 ,  H01L23/49805 ,  H01L23/49816 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/15162 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/10659 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2924/00

Abstract: A surface mount package is composed of a package body and first and second terminals. The package body has first and second surfaces intersecting with each other. Also, the package body has an installing portion for an element to be installed. The first terminal is connected to the first surface, and the second terminal is connected to the second surface.

Abstract translation: 表面安装封装由封装体和第一和第二端子组成。 包装体具有彼此相交的第一和第二表面。 此外，包装体具有用于要安装的元件的安装部。 第一端子连接到第一表面，并且第二端子连接到第二表面。

公开(公告)号：US20030173111A1

公开(公告)日：2003-09-18

申请号：US10446462

申请日：2003-05-28

Applicant: Intel Corporation

Inventor： Kristopher Frutschy ,  Glenn E. Stewart ,  Farzaneh Yahvaei-Moayyed ,  Geoffrey L. Reid

IPC: H05K001/16 ,  H05K007/02 ,  H05K007/04

CPC classification number: H05K1/0263 ,  H01L23/49811 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K3/325 ,  H05K7/1092 ,  H05K2201/10325 ,  H05K2201/10393 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10734 ,  Y10T29/4913

Abstract: An electronic assembly includes one or more conductive clamps (302, 304, FIG. 3), which are used to supply current to an integrated circuit (IC) package (308). The conductive clamps are attached to a printed circuit (PC) board (312), which supplies the current to the IC package over one clamp, and receives returned current from the IC package over another clamp. Each clamp contacts a contact pad (330) on the surface of the PC board, and contacts another contact pad (334) on the top surface of the IC package. Vias (338, 339) and conductive planes (340, 342) within the package then carry current to and from an IC (e.g., IC 306) connected to the package. In another embodiment, the clamp (904, FIG. 9) holds a conductive structure (902) in place between the PC board contact pad (908) and the IC package contact pad (914), and current is carried primarily over the conductive structure, rather than over the clamp.

公开(公告)号：US20030145460A1

公开(公告)日：2003-08-07

申请号：US10067244

申请日：2002-02-07

Inventor： Rebecca A. Jessep ,  David W. Boggs ,  Carolyn McCormick ,  John H. Dungan ,  Daryl A. Sato

IPC: H01L023/52 ,  H05K003/30

CPC classification number: H01L24/81 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/1319 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/145 ,  H05K3/303 ,  H05K3/308 ,  H05K2201/09809 ,  H05K2201/10022 ,  H05K2201/10303 ,  H05K2201/1053 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10734 ,  H05K2201/10871 ,  H05K2201/2036 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: Standoff arrangements to control distance and provide electrical function.

Abstract translation: 隔离布置来控制距离并提供电气功能

公开(公告)号：US20020176230A1

公开(公告)日：2002-11-28

申请号：US10191701

申请日：2002-07-08

Inventor： Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

IPC: H05K007/20

CPC classification number: H05K3/303 ,  H01L23/3675 ,  H01L23/4334 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10659 ,  H05K2201/10696 ,  Y02P70/613 ,  H01L2924/00

Abstract: A high density vertical surface mount package and thermal carrier therefor including a heat sink.