Abstract:
Embodiments pin connections, electronic devices, and methods are shown that include pin configurations to reduce voids and pin tilting and other concerns during pin attach operations, such as attachment to a chip package pin grid array. Pin head are shown that include features such as convex surfaces, a number of legs, and channels in pin head surfaces.
Abstract:
The present invention discloses a fixing means for installing a plurality of output cables onto a circuit board and a method thereof. The method comprises steps of providing a fixing means that includes a fixing housing and interposing terminals, wherein the fixing housing is provided with inserting through holes which are located to correspond to output cable receiving holes on the circuit board, and respectively fixing the output cable inserting end(s) of the output cable(s) to be inserted into one of the output cable receiving holes together with one interposing terminal and forming electric connection; inserting each of the interposing terminals connected with the output cables into the corresponding inserting through hole in the fixing housing and fixing each of the interposing terminals in place; and installing the fixing means onto the circuit board, wherein each interposing terminal is inserted into the corresponding output cable receiving hole.
Abstract:
An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that covers and is contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.
Abstract:
A leadframe employed by a leadless package comprises a plurality of package units and an adhesive tape. Each of the package units has a die pad with a plurality of openings and a plurality of pins disposed in the plurality of openings. The adhesive tape is adhered to the surfaces of the plurality of package units and fixes the die pad and the plurality of pins.
Abstract:
A surface mount contact includes a conducting pin having a shank, a first end at one end of the shank and second end at the other end of the shank, a first annular flange extending around the periphery of the shank and spaced between the first end and the second end and a second annular flange extending around the periphery of the shank and spaced between the second end and the first annular flange, and a thermoplastic connection member joined to the second end of the conducting pin and spaced from the second annular flange at a predetermined distance so that there is a room for the user to judge the connection status and quality between the conducting pin and the thermoplastic connection member during surface mounting, assuring bonding stability.
Abstract:
A switch system for use with a printed circuit board is provided. The switch system includes: a switch base; an anti-overstress member or feature formed in the switch base; a plurality of retention legs formed in the base for retaining a printed circuit board, wherein a first via is in electrical communication with one of the plurality of retention legs; a spring-loaded contact formed in the base for contacting the anti-overstress feature, and wherein a second via is in electrical communication with the spring-loaded contact. A printed circuit board may be mounted in and attached to the plurality of retention legs.
Abstract:
An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that covers and is contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.
Abstract:
An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.
Abstract:
An electronic device includes a printed circuit board having lands and an electronic element having a body and terminals. First and second lands provide a zigzag pattern. Each first land is coupled with the first terminal, and each second land is coupled with the second terminal. The second terminal includes a first parallel member, a first connection member, a second parallel member and a first mounting member. The first parallel member is completely embedded in the body, or another part of the first parallel member exposed from the body is shorter than the second parallel member. A second height between the second parallel member and the printed circuit board is smaller than a first height between the first parallel member and the printed circuit board.
Abstract:
A pressfit terminal is to be inserted into a through hole defined in a substrate for electrically contacting with the through hole. The pressfit terminal includes a terminal main body and at least three protrusion portions. The at least three protrusion portions protrude outwardly from a surface of the terminal main body. At least part of the protrusion portions are arranged at intervals in a direction intersecting with an insertion direction of the terminal main body.