公开(公告)号：US20110188207A1

公开(公告)日：2011-08-04

申请号：US13016908

申请日：2011-01-28

Applicant: Dongsu WON ,  Seunghwan JANG ,  Yongsang CHO

Inventor： Dongsu WON ,  Seunghwan JANG ,  Yongsang CHO

IPC: H05K7/20 ,  H01Q1/12

CPC classification number: H05K5/0278 ,  G06F1/20 ,  H01L23/3675 ,  H01L2924/0002 ,  H04B1/036 ,  H05K1/0203 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/2018 ,  H01L2924/00

Abstract: A mobile terminal is provided. The mobile terminal comprises at least one element, a connector selectively connected to another device to provide a data exchange path between the at least one element and the other device, and a thermal conduction frame having one side coming into contact with the at least one element and the other side coming into contact with the connector to transfer heat generated from the at least one element to the connector. The connector is connected to the element included in the mobile terminal and the other device through the thermal conduction frame to effectively transfer heat generated from the element to the other device through the connector.

Abstract translation: 提供移动终端。 移动终端包括至少一个元件，连接器选择性地连接到另一个设备，以提供至少一个元件与另一个元件之间的数据交换路径，以及导热框架，其一侧与至少一个元件接触 并且另一侧与连接器接触以将从至少一个元件产生的热量传递到连接器。 连接器通过导热框架连接到包括在移动终端中的元件和另一个设备，以通过连接器有效地将从元件产生的热量传递到另一个设备。

公开(公告)号：US20110171785A1

公开(公告)日：2011-07-14

申请号：US13052073

申请日：2011-03-20

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L21/60

CPC classification number: H05K1/021 ,  H01L21/486 ,  H01L23/3677 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K3/0061 ,  H05K3/4084 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/2018 ,  H05K2203/049 ,  H05K2203/063 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing a bump and a ledge, mounting an adhesive on the ledge including inserting the bump into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the bump with an aperture in the conductive layer, then flowing the adhesive between the bump and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, then mounting a semiconductor device on the bump opposite a cavity in the bump, wherein a heat spreader includes the bump and a base that includes a portion of the ledge adjacent to the bump, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 一种制造半导体芯片组件的方法包括提供凸块和凸缘，将粘合剂安装在凸缘上，包括将凸块插入粘合剂中的开口中，将导电层安装在粘合剂上，包括将凸块与导电 然后使粘合剂在凸起和导电层之间流动，使粘合剂固化，然后提供包括导电层的焊盘，端子和选定部分的导电迹线，然后将半导体器件安装在与空腔相对的凸块上 在凸块中，其中散热器包括凸块和包括邻近凸块的凸缘的一部分的基座，将半导体器件电连接到导电迹线并将半导体器件热连接到散热器。

公开(公告)号：US20110116003A1

公开(公告)日：2011-05-19

申请号：US13003019

申请日：2009-07-15

Applicant: Tadashi Inui

Inventor： Tadashi Inui

IPC: G02F1/1333 ,  H05K5/02 ,  H05K7/02

CPC classification number: G02F1/13452 ,  H04M1/0266 ,  H05K1/141 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/2018 ,  H05K2201/2045 ,  H05K2203/0191

Abstract: To provide an electric circuit structure with which the occurrence of sound generation caused by vibration of a circuit element mounted on a flexible substrate connected to a circuit board is suppressed. The electric circuit structure includes a mechanical member (9) in the form of a frame having a closed bottom; a circuit board (1) on the surface of which an electric circuit element is formed, the circuit board being accommodated in the mechanical member (9); a flexible substrate (10) that has a connecting terminal formed on one end (10a) thereof, the connecting terminal being connected to an electrode terminal (7) formed on the circuit board (1), and that is folded back and fixed to a rear face of the mechanical member (9) at the other end opposite to the one end (10a); and a circuit element mounted on a portion of the flexible substrate (10) that is folded back to the rear face of the mechanical member (9), wherein the flexible substrate (10) is fixed to the rear face of the mechanical member (9) via a nonwoven fabric adhesive tape employing a nonwoven fabric as a base material.

Abstract translation: 提供一种电路结构，其抑制了安装在与电路板连接的柔性基板上的电路元件的振动引起的声音产生的发生。 电路结构包括具有封闭底部的框架形式的机械构件（9） 在其表面上形成有电路元件的电路板（1），所述电路板容纳在所述机械构件（9）中; 柔性基板（10），其具有形成在其一端（10a）上的连接端子，所述连接端子与形成在所述电路板（1）上的电极端子（7）连接，并且被折回并固定到 在与一端（10a）相对的另一端处的机械构件（9）的后表面; 以及电路元件，其安装在所述柔性基板（10）的被折回到所述机械部件（9）的后表面的部分上，其中所述柔性基板（10）固定到所述机械部件（9）的后表面 ）通过使用无纺布作为基材的无纺布粘合带。

公开(公告)号：US07894013B2

公开(公告)日：2011-02-22

申请号：US12165265

申请日：2008-06-30

Applicant: Jaemo Chung ,  Byungjun Lee

Inventor： Jaemo Chung ,  Byungjun Lee

IPC: G02F1/1333

CPC classification number: H05K1/147 ,  G02B6/0083 ,  G02F1/13452 ,  H05K2201/056 ,  H05K2201/10136 ,  H05K2201/2018

Abstract: A liquid crystal display includes a frame having a coupling groove, an optical sheet adjacent the frame, and a flexible printed circuit on a side of the optical sheet, wherein the flexible printed circuit is coupled to the frame at the coupling groove. A manufacturing method for a liquid crystal display includes providing a frame having a coupling groove, providing an optical sheet adjacent the frame, and providing a flexible printed circuit on a side of the optical sheet and coupling the flexible printed circuit to the frame at the coupling groove.

Abstract translation: 液晶显示器包括具有耦合槽，邻近框架的光学片和在光学片的一侧的柔性印刷电路的框架，其中柔性印刷电路在耦合槽处联接到框架。 液晶显示器的制造方法包括提供具有耦合槽的框架，提供邻近框架的光学片，并且在光学片的一侧上提供柔性印刷电路，并将柔性印刷电路耦合到耦合器 槽。

公开(公告)号：US07884470B2

公开(公告)日：2011-02-08

申请号：US12317434

申请日：2008-12-23

Applicant: Kee Leong Cheah ,  Eu Soon Lee

Inventor： Kee Leong Cheah ,  Eu Soon Lee

IPC: H01L23/34

CPC classification number: H01L23/49833 ,  H01L23/16 ,  H01L23/49822 ,  H01L23/50 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/0002 ,  H01L2924/19105 ,  H05K1/023 ,  H05K3/325 ,  H05K2201/1059 ,  H05K2201/10962 ,  H05K2201/2009 ,  H05K2201/2018 ,  H01L2924/00

Abstract: Embodiments of the invention relate to semiconductor packages in which electrical power is delivered to die-side components removably installed in sockets formed between a package stiffener and an electrical conductor. To this purpose, the package stiffener and the electrical conductor may be electrically coupled to the power and ground terminals of the semiconductor package.

Abstract translation: 本发明的实施例涉及半导体封装，其中将电力输送到可拆卸地安装在形成在封装加强件和电导体之间的插座中的裸片侧部件。 为此，封装加强件和电导体可以电耦合到半导体封装的电源和接地端子。

公开(公告)号：US07876573B2

公开(公告)日：2011-01-25

申请号：US11784736

申请日：2007-04-09

Applicant: Hiroyuki Motohara ,  You Kondoh ,  Mikio Nakamura ,  Takanori Sekido ,  Shinji Yasunaga

Inventor： Hiroyuki Motohara ,  You Kondoh ,  Mikio Nakamura ,  Takanori Sekido ,  Shinji Yasunaga

IPC: H01R12/16

CPC classification number: H05K1/144 ,  H01L2224/16 ,  H05K3/3442 ,  H05K3/403 ,  H05K3/4685 ,  H05K2201/042 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T29/49126

Abstract: A stacked mounting structure includes a first substrate, a second substrate, and an intermediate substrate which has a space accommodating therein components to be mounted. A first contact (connecting) terminal and a second contact (connecting) terminal are formed on the first substrate and the second substrate, and have a wire which is formed on a side surface of the intermediate substrate. By formation of the intermediate substrate to be on an inner side than an edge surface of the substrates, a part of the two contact terminals respectively are exposed. One end of the wire is connected to an exposed portion of the first contact terminal, and the other end of the wire is connected to an exposed portion of the second contact terminal.

Abstract translation: 堆叠的安装结构包括第一基板，第二基板和中间基板，其具有容纳要安装的部件的空间。 第一接触（连接）端子和第二接触（连接）端子形成在第一基板和第二基板上，并且具有形成在中间基板的侧表面上的线。 通过形成位于比基板的边缘表面更内侧的中间基板，分别露出两个接触端子的一部分。 线的一端连接到第一接触端子的暴露部分，并且导线的另一端连接到第二接触端子的暴露部分。

公开(公告)号：US20110013368A1

公开(公告)日：2011-01-20

申请号：US12863175

申请日：2008-03-03

Applicant: Shotaro Nagaike

Inventor： Shotaro Nagaike

IPC: H05K7/00

CPC classification number: H05K9/0032 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/09972 ,  H05K2201/10371 ,  H05K2201/2018

Abstract: There are provided a circuit board module that can ease adverse effect due to radiation developing between a fragile circuit vulnerable to unwanted radiation and other circuits and that can diminish overall radiation to the outside of the module and an electronic device having the circuit board module.The circuit board module includes a board 1 having a mount surface; a first electronic component and a second electronic component 3 respectively mounted on the mount surface; a first frame element 4 that surrounds the first electronic component 2 and the second electronic component 3, that is mounted on the mount surface, and that exhibits conductivity; a second frame element 5 that surrounds the second electronic component 3, that is mounted on an inside of the first frame element 4 and on the mount surface, and that exhibits conductivity; a first resin portion 6 that is situated between the first frame element 4 and the second frame element 5 and that closely contacts the first electronic component, the mount surface, the first frame element 4, and the second frame element 5; a second resin portion 7 that is situated on an inside of the second frame element 5 and that closely contacts the mount surface of the second electronic component 3 and the second frame element 5; a first cover portion 8 that covers the first electronic component, the second electronic component 3, and the second frame element 5, that exhibits conductivity, and that is connected to the first frame element 4; and a second cover portion 9 that is connected by means of contact points of the second frame element 5 and that covers the second frame element 5.

Abstract translation: 提供了一种电路板模块，其可以减轻由于易受不想要的辐射的脆弱的电路之间的辐射的不利影响和其他电路，并且可以减少到模块的外部的整体辐射以及具有电路板模块的电子设备。 电路板模块包括具有安装表面的板1; 分别安装在安装表面上的第一电子部件和第二电子部件3; 围绕安装在安装表面上并且显示导电性的第一电子部件2和第二电子部件3的第一框架元件4; 围绕第二电子部件3的第二框架元件5，其安装在第一框架元件4的内部和安装表面上并且显示导电性; 第一树脂部分6，其位于第一框架元件4和第二框架元件5之间，并且紧密接触第一电子部件，安装表面，第一框架元件4和第二框架元件5; 第二树脂部分7，其位于第二框架元件5的内侧并且紧密接触第二电子部件3和第二框架元件5的安装表面; 覆盖第一电子部件的第一盖部8，显示导电性的第二电子部件3和第二框架元件5，并且连接到第一框架元件4; 以及通过第二框架元件5的接触点连接并覆盖第二框架元件5的第二盖部分9。

公开(公告)号：US20100328903A1

公开(公告)日：2010-12-30

申请号：US12863179

申请日：2008-10-16

Applicant: Shotaro Nagaike

Inventor： Shotaro Nagaike

IPC: H05K7/00

CPC classification number: H05K1/181 ,  G02F1/13452 ,  H01L23/04 ,  H01L23/24 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K3/284 ,  H05K2201/0382 ,  H05K2201/10128 ,  H05K2201/10371 ,  H05K2201/10515 ,  H05K2201/2018 ,  H05K2203/1316 ,  Y02P70/611 ,  H01L2924/00

Abstract: A circuit board module includes: a board having a mounting surface; an electronic component mounted on the mounting surface; a frame which is mounted on the mounting surface so as to surround the electronic component; a resin portion which is provided inside the frame and closely contacts the electronic component, the mounting surface, and the frame; and a lid portion which covers the electronic component, and which is connected to the frame. The lid portion includes a flat portion which is provided at a region containing an area corresponding to the electronic component not covered with the resin portion and which protrudes outward more than the other regions.

Abstract translation: 电路板模块包括：具有安装表面的板; 安装在安装表面上的电子部件; 框架，其安装在安装表面上以包围电子部件; 树脂部分，设置在框架内部并紧密接触电子部件，安装表面和框架; 以及覆盖电子部件并与框架连接的盖部。 盖部包括平坦部，该平坦部设置在包含与未被树脂部覆盖的电子部件相对应的区域的区域，并且比其他区域向外突出。

公开(公告)号：US07839645B2

公开(公告)日：2010-11-23

申请号：US12606136

申请日：2009-10-26

Applicant: Robert S. Pauley ,  Jayesh R. Bhakta ,  William M. Gervasi ,  Chi She Chen ,  Jose Delvalle

Inventor： Robert S. Pauley ,  Jayesh R. Bhakta ,  William M. Gervasi ,  Chi She Chen ,  Jose Delvalle

IPC: H05K7/20

CPC classification number: H05K1/0203 ,  H05K1/144 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/2018 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913

Abstract: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first surface and a first plurality of circuits coupled to the first surface. The first plurality of circuits is in electrical communication with the electrical contacts. The module further includes a second surface and a second plurality of circuits coupled to the second surface. The second plurality of circuits is in electrical communication with the electrical contacts. The second surface faces the first surface. The module further includes at least one thermally conductive layer positioned between the first surface and the second surface. The at least one thermally conductive layer is in thermal communication with the first plurality of circuits, the second plurality of circuits, and a first set of the plurality of electrical contacts.

Abstract translation: 模块可电连接到计算机系统。 模块包括可电连接到计算机系统的多个电触点。 模块还包括耦合到第一表面的第一表面和第一多个电路。 第一组多个电路与电触点电连通。 模块还包括耦合到第二表面的第二表面和第二多个电路。 第二组电路与电触点电连通。 第二表面面向第一表面。 模块还包括位于第一表面和第二表面之间的至少一个导热层。 所述至少一个导热层与所述第一多个电路，所述第二多个电路和所述多个电触头的第一组热连通。

公开(公告)号：US20100271788A1

公开(公告)日：2010-10-28

申请号：US12665701

申请日：2007-08-09

Applicant: Katsuhiro Inoue ,  Satoshi Sasaki

Inventor： Katsuhiro Inoue ,  Satoshi Sasaki

IPC: H05K1/18

CPC classification number: H05K3/284 ,  H05K2201/2018 ,  H05K2203/1316

Abstract: A circuit module of the present invention includes a circuit board, a plurality of electronic parts mounted on one face of the circuit board, a tubular body provided in an upstanding manner on the face in surrounding relation to the electronic parts, a turned-back portion turned back inwardly at a predetermined height position of the tubular body, and a resin portion formed by a sealing resin which is filled in the tubular body to a height reaching a distal end of the turned-back portion such that the resin covers at least part of the electronic parts. With this construction, the two surfaces of the sealing resin and the turned-back portion are joined together, so that the joining strength increases, and there can be provided the circuit module which is of the thin type and has a high strength. Further, through holes are provided at a region of the turned-back portion exposed from the sealing resin, and therefore a cavity within the turned-back portion (within a U-shaped portion), which is due to expansion of residual gas, can be eliminated, and besides the development of a convex portion formed on the upper surface of the resin by a cavity formed in the resin by gas moved from the interior of the turned-back portion into the resin and also the development of a crater-like irregularity portion formed on the upper surface of the resin portion when gas within the frame passes to the upper surface of the resin can be suppressed.

Abstract translation: 本发明的电路模块包括电路板，安装在电路板的一个面上的多个电子部件，以与电子部件相对的周围的方式以直立的方式设置的管状体，折回部 在管状体的预定高度位置处向内折回，并且由密封树脂形成的树脂部分，该树脂部分被填充到管状体中至达到折回部分的远端的高度，使得树脂覆盖至少部分 的电子零件。 通过这种结构，密封树脂和折回部分的两个表面被接合在一起，使得接合强度增加，并且可以提供薄型并且具有高强度的电路模块。 此外，在从密封树脂暴露的折回部分的区域处设置通孔，因此由于残余气体的膨胀而在折回部分（在U形部分内）的空腔可以 除了形成在树脂的上表面上的凸部的形成之外，还通过由从折回部分的内部移动到树脂中的气体形成在树脂中的空腔，并且还形成了火山口状 可以抑制在框架内的气体通过树脂的上表面时在树脂部分的上表面上形成的不规则部分。