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    LED structure
    61.
    发明授权
    LED structure 有权
    LED结构

    公开(公告)号：US08809899B2

    公开(公告)日：2014-08-19

    申请号：US14082663

    申请日：2013-11-18

    Applicant: TSMC Solid State Lighting Ltd.

    Inventor： Shouli Steve Hsia ,  Chih-Kuang Yu ,  Ken Wen-Chien Fu ,  Hung-Yi Kuo ,  Hung-Chao Kao ,  Ming-Feng Wu ,  Fu-Chih Yang

    IPC: H01L33/00

    CPC classification number: H01L33/0008 ,  H01L27/15 ,  H01L33/0004 ,  H01L33/005 ,  H01L33/62

    Abstract: A light emitting diode (LED) structure comprises a first dopant region, a dielectric layer on top of the first dopant region, a bond pad layer on top of a first portion the dielectric layer, and an LED layer having a first LED region and a second LED region. The bond pad layer is electrically connected to the first dopant region. The first LED region is electrically connected to the bond pad layer.

    Abstract translation: 一种发光二极管（LED）结构包括第一掺杂区域，位于第一掺杂区域顶部的电介质层，介电层第一部分顶部的接合焊盘层，以及具有第一LED区域和 第二LED区域。 接合焊盘层电连接到第一掺杂区域。 第一LED区域电连接到接合焊盘层。

    Light Emitting Devices with Textured Active Layer
    62.
    发明申请
    Light Emitting Devices with Textured Active Layer 有权
    具有纹理活动层的发光设备

    公开(公告)号：US20140191191A1

    公开(公告)日：2014-07-10

    申请号：US14210522

    申请日：2014-03-14

    Applicant: TSMC Solid State Lighting Ltd.

    Inventor： Hsin-Chieh Huang

    IPC: H01L33/22 ,  H01L33/04

    CPC classification number: H01L33/22 ,  H01L33/04 ,  H01L33/24

    Abstract: A device includes a textured substrate having a trench extending from a top surface of the textured substrate into the textured substrate, wherein the trench comprises a sidewall and a bottom. A light-emitting device (LED) includes an active layer over the textured substrate. The active layer has a first portion parallel to the sidewall of the trench and a second portion parallel to the bottom of the trench.

    Abstract translation: 一种器件包括纹理化衬底，其具有从纹理化衬底的顶表面延伸到纹理衬底中的沟槽，其中沟槽包括侧壁和底部。 发光器件（LED）包括纹理衬底上的有源层。 有源层具有平行于沟槽侧壁的第一部分和平行于沟槽底部的第二部分。

    Method and Apparatus for Packaging Phosphor-Coated LEDS
    65.
    发明申请
    Method and Apparatus for Packaging Phosphor-Coated LEDS 有权
    包装磷光LEDS的方法和装置

    公开(公告)号：US20140054619A1

    公开(公告)日：2014-02-27

    申请号：US13788536

    申请日：2013-03-07

    Applicant: TSMC Solid State Lighting Ltd.

    Inventor： Chi-Xiang Tseng ,  Hsiao-Wen Lee ,  Min-Sheng Wu ,  Tien-Min Lin

    IPC: H01L33/50

    CPC classification number: H01L33/504 ,  H01L33/46 ,  H01L33/505 ,  H01L2933/0041

    Abstract: The present disclosure involves a method of packaging light-emitting diodes (LEDs). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is disposed on a substrate. In some embodiments, the substrate may be a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated over the plurality of LEDs. The phosphor layer is then cured. The tape and the substrate are removed after the curing of the phosphor layer. A replacement tape is then attached to the plurality of LEDs. A dicing process is then performed to the plurality of LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process.

    Abstract translation: 本公开涉及封装发光二极管（LED）的方法。 根据该方法，在胶带上设置多个LED。 粘合带设置在基板上。 在一些实施例中，衬底可以是玻璃衬底，硅衬底，陶瓷衬底和氮化镓衬底。 磷光体层被涂覆在多个LED上。 然后将磷光体层固化。 在荧光体层固化之后去除胶带和基材。 然后将替代胶带附接到多个LED。 然后在去除衬底之后，对多个LED进行切割处理。 然后可以将去除的衬底重新用于将来的LED封装工艺。

    Omnidirectional reflector
    66.
    发明授权
    Omnidirectional reflector 有权
    全向反射器

    公开(公告)号：US08609448B2

    公开(公告)日：2013-12-17

    申请号：US13857678

    申请日：2013-04-05

    Applicant: TSMC Solid State Lighting Ltd.

    Inventor： Ding-Yuan Chen ,  Chen-Hua Yu ,  Wen-Chih Chiou

    IPC: H01L33/46

    CPC classification number: H01L33/60 ,  H01L33/0079 ,  H01L33/10 ,  H01L33/46 ,  H01L2933/0083

    Abstract: A system and method for manufacturing an LED is provided. A preferred embodiment includes a substrate with a distributed Bragg reflector formed over the substrate. A photonic crystal layer is formed over the distributed Bragg reflector to collimate the light that impinges upon the distributed Bragg reflector, thereby increasing the efficiency of the distributed Bragg reflector. A first contact layer, an active layer, and a second contact layer are preferably either formed over the photonic crystal layer or alternatively attached to the photonic crystal layer.

    Abstract translation: 提供了一种用于制造LED的系统和方法。 优选的实施例包括在衬底上形成分布式布拉格反射器的衬底。 在分布式布拉格反射器上形成光子晶体层，使入射到分布式布拉格反射器上的光准直，从而提高分布式布拉格反射器的效率。 优选地，在光子晶体层上形成第一接触层，有源层和第二接触层，或者替代地附着到光子晶体层。

    LED LAMP AND METHOD OF MAKING THE SAME
    67.
    发明申请
    LED LAMP AND METHOD OF MAKING THE SAME 有权
    LED灯及其制作方法

    公开(公告)号：US20130314915A1

    公开(公告)日：2013-11-28

    申请号：US13858779

    申请日：2013-04-08

    Applicant: TSMC Solid State Lighting Ltd.

    Inventor： Chih-Hsuan Sun ,  Wei-Yu Yeh ,  Tien-Ming Lin

    IPC: F21V29/00

    CPC classification number: F21V29/74 ,  F21K9/232 ,  F21K9/90 ,  F21V3/02 ,  F21Y2101/00 ,  F21Y2115/10 ,  Y10T29/49002

    Abstract: A lighting device includes a multi-faceted heat sink with facets in a center portion facing outward. The facets form a central enclosed portion, and the heat sink further has a plurality of fins, where each of the fins is placed between adjacent facets and protrudes outwardly from the heat sink. The lighting device also has a plurality of circuit boards with semiconductor emitters mounted thereon. Each of the circuit boards is mounted on a respective facet of the heat sink. The lighting device also has a light-diffusion housing covering the plurality of circuit boards, a power module in communication with the circuit boards and operable to convert power to be compatible with the semiconductor emitters, and a power connector assembly in electrical communication with the power module.

    Abstract translation: 照明装置包括具有朝向外侧的中心部分的小面的多面散热器。 小面形成中央封闭部分，并且散热器还具有多个翅片，其中每个翅片放置在相邻小面之间并从散热器向外突出。 照明装置还具有安装有半导体发射体的多个电路板。 每个电路板安装在散热器的相应面上。 所述照明装置还具有覆盖所述多个电路板的光扩散壳体，与所述电路板连通并可操作以将功率转换为与所述半导体发射体兼容的功率模块，以及与所述电力电连通的电源连接器组件 模块。

    Thermal protection structure for multi-junction LED module
    69.
    发明授权
    Thermal protection structure for multi-junction LED module 有权
    多结LED模块的热保护结构

    公开(公告)号：US09504120B2

    公开(公告)日：2016-11-22

    申请号：US14556318

    申请日：2014-12-01

    Applicant: TSMC Solid State Lighting Ltd.

    Inventor： Wei-Yu Yeh

    IPC: H05B37/00 ,  H05B33/08

    CPC classification number: H05B33/089 ,  H05B33/0851 ,  Y02B20/341

    Abstract: A system includes a plurality of light-emitting devices electrically coupled together. A temperature of each of the light-emitting devices is correlated with a voltage of said light-emitting device. The system includes a current driver configured to control an amount of current through at least a subset of the light-emitting devices. The system includes electronic circuitry that is electrically coupled to the subset of the light-emitting devices. The electronic circuitry is configured to: measure a voltage of the subset of the light-emitting devices while the light-emitting devices are in operation; determine, based on the measured voltage, whether the subset of the light-emitting devices is hotter than an acceptable temperature threshold; and instruct the current driver to reduce the amount of current through the subset of the light-emitting devices if the subset of the light-emitting devices has been determined to be hotter than the acceptable temperature threshold.

    Abstract translation: 一种系统包括电耦合在一起的多个发光器件。 每个发光器件的温度与所述发光器件的电压相关。 该系统包括被配置为控制通过至少一个发光器件子集的电流量的电流驱动器。 该系统包括电耦合到发光器件的子集的电子电路。 电子电路被配置为：在发光装置运行时测量发光装置的子集的电压; 基于测量的电压确定发光器件的子集是否比可接受的温度阈值更热; 并且如果已经确定发光装置的子集比可接受的温度阈值更热，则指示当前的驱动器减少通过发光装置的子集的电流量。

    LED with IC integrated lighting module
    70.
    发明授权
    LED with IC integrated lighting module 有权
    LED与IC集成照明模块

    公开(公告)号：US09449954B2

    公开(公告)日：2016-09-20

    申请号：US13955353

    申请日：2013-07-31

    Applicant: TSMC Solid State Lighting Ltd.

    Inventor： Chih-Chia Lin ,  Hsing-Kuo Hsia ,  Ching-Hui Chen ,  Jacob C. Tarn

    IPC: H01L33/00 ,  H01L25/16 ,  H05K1/18

    CPC classification number: H01L25/167 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/181 ,  H05K2201/10106 ,  H05K2201/10545 ,  H05K2203/1316 ,  H05K2203/1327 ,  Y02P70/611 ,  H01L2924/00014

    Abstract: The present disclosure involves a method of packaging light-emitting diodes (LEDs). A carrier having a first side and a second opposite the first side is provided. The carrier includes a plurality of conductive interconnect elements. An integrated circuit (IC) die is bonded to the first side of the carrier. A packaging material having light-reflective properties is molded over the first and second sides of the carrier such that the IC die is sealed by the packaging material. A portion of the packaging material is molded into a reflective cap structure. A light-emitting diode (LED) is bonded to the second side of the carrier. Sidewalls of the reflective cap structure circumferentially surround the LED. The LED and the IC die are electrically coupled together through the conductive interconnect elements in the carrier. A lens is then formed over the LED.

    Abstract translation: 本公开涉及封装发光二极管（LED）的方法。 提供具有第一侧和与第一侧相对的第二侧的载体。 载体包括多个导电互连元件。 集成电路（IC）管芯结合到载体的第一侧。 具有光反射特性的包装材料被模制在载体的第一和第二侧上，使IC芯片被包装材料密封。 包装材料的一部分被模制成反射盖结构。 发光二极管（LED）结合到载体的第二侧。 反射盖结构的侧壁周向地围绕LED。 LED和IC管芯通过载体中的导电互连元件电耦合在一起。 然后在LED上形成透镜。

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