公开(公告)号：US09434166B2

公开(公告)日：2016-09-06

申请号：US14316487

申请日：2014-06-26

Applicant: STMicroelectronics, Inc.

Inventor： Ming Fang ,  Fuchao Wang

IPC: F24H1/18 ,  F24H1/20 ,  B41J2/05 ,  B41J2/16 ,  B41J2/14

CPC classification number: B81C1/00119 ,  B41J2/14056 ,  B41J2/14072 ,  B41J2/14137 ,  B41J2/16 ,  B41J2/1601 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1639 ,  B81B1/006 ,  B81B2201/052 ,  B81B2201/058 ,  B81C2201/013 ,  B81C2203/075 ,  H01L28/20 ,  Y10T29/41 ,  Y10T29/49401 ,  Y10T29/49826

Abstract: An integrated semiconductor heating assembly includes a semiconductor substrate, a chamber formed therein, and an exit port in fluid communication with the chamber, allowing fluid to exit the chamber in response to heating the chamber. The integrated heating assembly includes a first heating element adjacent the chamber, which can generate heat above a selected threshold and bias fluid in the chamber toward the exit port. A second heating element is positioned adjacent the exit port to generate heat above a selected threshold, facilitating movement of the fluid through the exit port away from the chamber. Addition of the second heating element reduces the amount of heat emitted per heating element and minimizes thickness of a heat absorption material toward an open end of the exit port. Since such material is expensive, this reduces the manufacturing cost and retail price of the assembly while improving efficiency and longevity thereof.

公开(公告)号：US20160208394A1

公开(公告)日：2016-07-21

申请号：US14913771

申请日：2013-08-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Roger A. McKay Jr ,  Patrick Sadik

IPC: C23F1/16

CPC classification number: C23F1/16 ,  B41J2/1609 ,  B41J2/1629 ,  B41J2/1631 ,  B81B2201/052 ,  B81C1/00119

Abstract: An example provides a method including providing a substrate including an area having a plurality of pores and etching the area of the substrate to remove the plurality of pores to form a recess in the substrate. In some examples, the recess may form, at least in part, a device.

Abstract translation: 一个实例提供了一种方法，包括提供包括具有多个孔的区域的基板并蚀刻基板的区域以去除多个孔以在基板中形成凹部。 在一些示例中，凹部至少部分地形成设备。

公开(公告)号：US08834966B2

公开(公告)日：2014-09-16

申请号：US13381791

申请日：2010-07-02

Applicant: Wolfgang Andreas Bauer ,  Wilhelm T. S. Huck ,  Martin Fischlechner

Inventor： Wolfgang Andreas Bauer ,  Wilhelm T. S. Huck ,  Martin Fischlechner

IPC: B81C1/00 ,  B05D7/22 ,  B05C7/04 ,  B01L3/00

CPC classification number: B01L3/502707 ,  B01F17/00 ,  B01J2219/00511 ,  B01J2219/0059 ,  B01J2219/00637 ,  B01J2219/00783 ,  B01J2219/00788 ,  B01J2219/00831 ,  B01J2219/00833 ,  B01J2219/00837 ,  B01J2219/0097 ,  B01L2200/0636 ,  B01L2300/0867 ,  B01L2300/16 ,  B01L2300/161 ,  B05C7/04 ,  B05D7/22 ,  B05D7/222 ,  B81B2201/0214 ,  B81B2201/05 ,  B81B2201/052 ,  B81B2201/058 ,  B81C1/00119 ,  B81C1/00206 ,  Y10T137/8593

Abstract: We describe a method of layer-by-layer deposition of a plurality of layers of material onto the wall or walls of a channel of a microfluidic device, the method comprising: loading a tube with a series of segments of solution, a said segment of solution bearing a material to be deposited; coupling said tube to said microfluidic device; and injecting said segments of solution into said microfluidic device such that said segments of solution pass, in turn, through said channel depositing successive layers of material to perform said layer-by-layer deposition onto said wall or walls of said channel. Embodiments of the methods are particularly useful for automated surface modification of plastic, for example PDMS (Poly(dimethylsiloxane)), microchannels. We also describe methods and apparatus for forming double-emulsions.

Abstract translation: 我们描述了将多层材料层逐层沉积到微流体装置的通道的壁或壁上的方法，该方法包括：将具有一系列溶液段的管装载， 含有待沉积材料的溶液; 将所述管连接到所述微流体装置; 以及将所述溶液段注射到所述微流体装置中，使得所述溶液段又通过所述通道沉积连续的材料层，以在所述通道的所述壁或壁上执行所述逐层沉积。 该方法的实施方案对于塑料的自动表面改性特别有用，例如PDMS（聚（二甲基硅氧烷）），微通道。 我们还描述了形成双重乳液的方法和设备。

公开(公告)号：US08685763B2

公开(公告)日：2014-04-01

申请号：US13802603

申请日：2013-03-13

Applicant: Fujifilm Corporation

Inventor： Shuji Takahashi

IPC: H01L21/00 ,  B41J2/14 ,  B41J2/16 ,  G01D15/00 ,  G11B5/127

CPC classification number: H01L21/30604 ,  B41J2/14233 ,  B41J2/1433 ,  B41J2/162 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1642 ,  B41J2/1645 ,  B41J2/1646 ,  B81B2201/052 ,  B81C1/00626 ,  H01L21/30608

Abstract: A method of manufacturing a nozzle plate includes: a mask pattern layer forming step of, with respect to a laminated substrate constituted of a first silicon substrate having a (111) surface orientation and a second silicon substrate having a (100) surface orientation, forming a frame-shaped mask pattern layer on the second silicon substrate; a non-through hole forming step of forming a straight section of the nozzle in the first silicon substrate; a protective film forming step of forming a protective film over a first portion on the second silicon substrate that is not covered with the mask pattern layer, and over inner surfaces of the first and second silicon substrates defining the non-through hole; and an anisotropic etching step of anisotropically etching the second silicon substrate so as to form a tapered section of the nozzle defined with {111} surfaces exposed in the second silicon substrate by the anisotropic etching.

Abstract translation: 制造喷嘴板的方法包括：掩模图案层形成步骤，相对于由具有（111）表面取向的第一硅衬底和具有（100）表面取向的第二硅衬底构成的层叠衬底，形成 第二硅衬底上的框状掩模图案层; 非通孔形成步骤，在所述第一硅衬底中形成所述喷嘴的直线部分; 保护膜形成步骤，在未被掩模图案层覆盖的第二硅基板上的第一部分上形成保护膜，以及在限定非通孔的第一和第二硅基板的内表面上; 以及各向异性蚀刻步骤，各向异性蚀刻第二硅衬底，以便通过各向异性蚀刻形成在第二硅衬底中露出的{111}表面限定的喷嘴的锥形部分。

公开(公告)号：US20130192993A1

公开(公告)日：2013-08-01

申请号：US13878205

申请日：2010-10-21

Applicant: Peter Mardilovich ,  Anthony M. Fuller ,  Qingqiao Wei ,  Rio Rivas ,  David Kamp

Inventor： Peter Mardilovich ,  Anthony M. Fuller ,  Qingqiao Wei ,  Rio Rivas ,  David Kamp

IPC: B82B3/00 ,  C25D11/02

CPC classification number: B82B3/0014 ,  B81B2201/052 ,  B81B2203/0353 ,  B81C1/00206 ,  C25D11/022 ,  C25D11/045 ,  C25D11/26

Abstract: An article is provided, the article including a substrate having a surface with a first wettability characteristic. A nano-structure array is formed on the surface of the substrate to provide a nano-structured surface having a second wettability characteristic. A thin-layer surface coating is formed on the nano-structured surface, the thin-layer surface coating being configured to tune the nano-structured surface to a target wettability characteristic.

Abstract translation: 提供了一种制品，该制品包括具有第一润湿特性的表面的基材。 在衬底的表面上形成纳米结构阵列以提供具有第二润湿特性的纳米结构表面。 在纳米结构化表面上形成薄层表面涂层，薄层表面涂层被配置为将纳米结构表面调谐到目标润湿性。

公开(公告)号：US20130040094A1

公开(公告)日：2013-02-14

申请号：US13651103

申请日：2012-10-12

Applicant: PANASONIC CORPORATION

Inventor： Masaya NAKATANI ,  Hiroshi USHIO ,  Soichiro HIRAOKA ,  Akiyoshi OSHIMA ,  Makoto TAKAHASHI

IPC: B32B5/02

CPC classification number: G01N33/48728 ,  B81B2201/0214 ,  B81B2201/052 ,  B81C1/00206 ,  Y10T428/23943

Abstract: A silicon structure of the present invention is provided with a silicon substrate (1) to become a base, and a plurality of fibrous projections (2) made of silicon dioxide and directly joined to a silicon-made surface (1a) of the silicon substrate (1). By arbitrarily constructing an area where these fibrous projections (2) are formed in a predetermined area, it is possible to render the area to have at least either hydrophilicity or water retentivity, so as to provide a silicon structure useful for a variety of devices.

Abstract translation: 本发明的硅结构设置有成为基底的硅基板（1）和由二氧化硅制成的直接接合到硅基板的硅制表面（1a）的多个纤维突起（2） （1）。 通过任意构造这些纤维状突起（2）形成在预定区域的区域，可以使该区域具有至少亲水性或保水性，以提供可用于各种装置的硅结构。

公开(公告)号：US07971971B2

公开(公告)日：2011-07-05

申请号：US12786268

申请日：2010-05-24

Applicant: Gregory John McAvoy ,  Vincent Patrick Lawlor ,  Kia Silverbrook

Inventor： Gregory John McAvoy ,  Vincent Patrick Lawlor ,  Kia Silverbrook

IPC: B41J2/05

CPC classification number: B41J2/14427 ,  B41J2002/14435 ,  B41J2202/03 ,  B41J2202/15 ,  B81B3/0024 ,  B81B2201/032 ,  B81B2201/052

Abstract: An inkjet nozzle assembly includes: a nozzle chamber having a nozzle opening and an ink inlet; and a thermal bend actuator for ejecting ink through the nozzle opening. The actuator includes: an active beam for connection to drive circuitry; a first passive beam fused to the active beam; and a second passive beam fused to the second first passive beam. The first passive beam is sandwiched between the active beam and the second passive beam such that when a current is passed through the active beam, the active beam expands relative to the passive beams, resulting in bending of the actuator and ejection of ink through the nozzle opening.

Abstract translation: 喷墨喷嘴组件包括：具有喷嘴开口和墨入口的喷嘴室; 以及用于通过喷嘴开口喷射墨水的热弯曲致动器。 致动器包括：用于连接到驱动电路的主动梁; 与激活光束融合的第一被动束; 和与第二第一无源光束融合的第二无源光束。 第一无源光束夹在有源光束和第二无源光束之间，使得当电流通过有源光束时，有源光束相对于被动光束扩展，导致致动器弯曲并通过喷嘴喷射墨水 开放

公开(公告)号：US07938975B2

公开(公告)日：2011-05-10

申请号：US11780234

申请日：2007-07-19

Applicant: John W. Krawczyk ,  James M. Mrvos ,  Girish S. Patil ,  Jason T. Vanderpool ,  Brian C. Hart ,  Christopher J. Money ,  Jeanne M. Saldanha Singh ,  Karthik Vaideeswaran

Inventor： John W. Krawczyk ,  James M. Mrvos ,  Girish S. Patil ,  Jason T. Vanderpool ,  Brian C. Hart ,  Christopher J. Money ,  Jeanne M. Saldanha Singh ,  Karthik Vaideeswaran

IPC: G11B5/127

CPC classification number: B41J2/1603 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1645 ,  B81B2201/052 ,  B81C1/00531

Abstract: A method of etching a semiconductor substrate. The method includes the steps of applying a photoresist etch mask layer to a device surface of the substrate. A select first area of the photoresist etch mask is masked, imaged and developed. A select second area of the photoresist etch mask layer is irradiated to assist in post etch stripping of the etch mask layer from the select second area. The substrate is etched to form fluid supply slots through a thickness of the substrate. At least the select second area of the etch mask layer is removed from the substrate, whereby mask layer residue formed from the select second area of the etch mask layer is significantly reduced.

Abstract translation: 蚀刻半导体衬底的方法。 该方法包括以下步骤：将光致抗蚀剂蚀刻掩模层施加到衬底的器件表面。 光刻胶蚀刻掩模的选择第一区被掩蔽，成像和显影。 照射光致抗蚀剂蚀刻掩模层的选择的第二区域以辅助蚀刻掩模层从选择的第二区域的后蚀刻剥离。 蚀刻基板以形成通过基板的厚度的流体供给槽。 至少蚀刻掩模层的选择第二区域从衬底去除，由此从蚀刻掩模层的选择的第二区域形成的掩模层残留物显着减少。

公开(公告)号：US07923379B2

公开(公告)日：2011-04-12

申请号：US12347250

申请日：2008-12-31

Applicant: Jiou-Kang Lee ,  Ting-Hau Wu ,  Shang-Ying Tsai ,  Jung-Huei Peng ,  Chun-Ren Cheng

Inventor： Jiou-Kang Lee ,  Ting-Hau Wu ,  Shang-Ying Tsai ,  Jung-Huei Peng ,  Chun-Ren Cheng

IPC: H01L21/31

CPC classification number: B81C1/00071 ,  B81B2201/052 ,  B81B2201/058 ,  H01L21/76898

Abstract: A method of forming an integrated circuit structure includes forming an opening in a substrate, with the opening extending from a top surface of the substrate into the substrate. The opening is filled with a filling material until a top surface of the filling material is substantially level with the top surface of the substrate. A device is formed over the top surface of the substrate, wherein the device includes a storage opening adjoining the filling material. A backside of the substrate is grinded until the filling material is exposed. The filling material is removed from the channel until the storage opening of the device is exposed.

Abstract translation: 形成集成电路结构的方法包括在衬底中形成开口，其中开口从衬底的顶表面延伸到衬底中。 开口填充有填充材料，直到填充材料的顶表面基本上与基板的顶表面平齐。 在衬底的顶表面上形成器件，其中该器件包括与填充材料相邻的存储开口。 研磨衬底的背面，直到填充材料暴露。 将填充材料从通道中取出直到设备的存储开口露出。

公开(公告)号：US07878628B2

公开(公告)日：2011-02-01

申请号：US12391962

申请日：2009-02-24

Applicant: Kia Silverbrook

Inventor： Kia Silverbrook

IPC: B41J2/14

CPC classification number: B41J2/1606 ,  B41J2/1433 ,  B81B3/001 ,  B81B2201/052

Abstract: An inkjet printer with a nozzle plate that has an exterior surface with formations for reducing its co-efficient of static friction. By reducing the co-efficient of static friction, there is less likelihood that paper dust or other contaminants will clog the nozzles in the nozzle plate. Static friction, or “stiction” as it has become known, allows dust particles to “stick” to nozzle plates and thereby clog nozzles. By patterning the exterior of the nozzle plate with raised formations, dust particles can only contact the outer extremities of each formation. This reduces friction between the particles and the nozzle plate so that any particles that contact the plate are less likely to attach, and if they do attach, they are more likely to be removed by printhead maintenance cleaning cycles.

Abstract translation: 具有喷嘴板的喷墨打印机，其具有用于降低其静摩擦系数的结构的外表面。 通过降低静摩擦的有效性，纸屑或其他污染物将堵塞喷嘴板中的喷嘴的可能性较小。 静摩擦或“静摩擦”已经知道，使得灰尘颗粒“粘”到喷嘴板上，从而阻塞喷嘴。 通过用凸起的地层图案化喷嘴板的外部，灰尘颗粒只能接触每个地层的外端。 这减少了颗粒和喷嘴板之间的摩擦，使得接触板的任何颗粒不太可能附着，并且如果它们附着，则它们更可能通过打印头维护清洁循环被去除。