公开(公告)号：US08415771B1

公开(公告)日：2013-04-09

申请号：US13481592

申请日：2012-05-25

Applicant: Dariusz Golda ,  Andreas Bibl

Inventor： Dariusz Golda ,  Andreas Bibl

IPC: H01L29/66 ,  H01L21/683

CPC classification number: B81C99/0025 ,  B81C2201/0194 ,  H01L21/67144 ,  H01L24/75 ,  H01L2224/7598

Abstract: A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure.

Abstract translation: 描述了从SOI衬底形成微器件传输阵列的微器件转移头阵列和方法。 在一个实施例中，微器件传送头阵列包括基底衬底和基底衬底上的图案化硅层。 图案化硅层可以包括硅互连和与硅互连电连接的硅电极阵列。 每个硅电极包括突出在硅互连上方的台面结构。 介电层覆盖每个台面结构的顶面。

公开(公告)号：US20110075865A1

公开(公告)日：2011-03-31

申请号：US12870288

申请日：2010-08-27

Applicant: Kuang L. Yang ,  Li Chen ,  Thomas D. Chen

Inventor： Kuang L. Yang ,  Li Chen ,  Thomas D. Chen

IPC: H04R11/04 ,  H04R31/00

CPC classification number: H04R19/04 ,  B81B2201/0257 ,  B81C1/00182 ,  B81C2201/0194 ,  H04R19/005 ,  H04R2201/003 ,  Y10T29/43 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/4908

Abstract: A dual backplate MEMS microphone system includes a flexible diaphragm sandwiched between two single-crystal silicon backplates. Such a MEMS microphone system may be formed by fabricating each backplate in a separate wafer, and then transferring one backplate from its wafer to the other wafer, to form two separate capacitors with the diaphragm.

Abstract translation: 双背板MEMS麦克风系统包括夹在两个单晶硅背板之间的柔性隔膜。 这样的MEMS麦克风系统可以通过在单独的晶片中制造每个背板，然后将一个背板从其晶片传送到另一个晶片来形成，以与隔膜形成两个单独的电容器。

公开(公告)号：US20090320274A1

公开(公告)日：2009-12-31

申请号：US12488590

申请日：2009-06-22

Applicant: Ayako Kato ,  Chienliu Chang

Inventor： Ayako Kato ,  Chienliu Chang

IPC: H02K15/00

CPC classification number: B81C1/0038 ,  B81C2201/0194 ,  Y10T29/49005 ,  Y10T29/49007 ,  Y10T29/49009 ,  Y10T29/4908

Abstract: A groove is formed on a handling member, on a face to be fixed to an element, the groove making up a portion of a channel that externally communicates in the state of being fixed to the element. The handling member is fixed so that the cleavage direction of the vibrating membrane and the edge direction of the groove of the handling member intersect. Thus, the probability that a membrane will break during handling or processing of the substrate is reduced, and the handling member can be quickly removed from the substrate.

Abstract translation: 沟槽形成在处理构件上，待固定在元件上的表面上，沟槽构成固定在元件上的外部通道的一部分。 处理构件被固定成使得振动膜的解理方向和处理构件的槽的边缘方向相交。 因此，减少在处理或处理衬底期间膜会破裂的可能性，并且处理构件可以快速地从衬底移除。

公开(公告)号：US20180229235A1

公开(公告)日：2018-08-16

申请号：US15434043

申请日：2017-02-15

Applicant: International Business Machines Corporation

Inventor： Joshua T. Smith ,  Cornelia Tsang Yang ,  Benjamin H. Wunsch

IPC: B01L3/00 ,  B81B1/00 ,  B81C1/00

CPC classification number: B01L3/502707 ,  B01L3/502761 ,  B01L2200/0631 ,  B01L2200/0652 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0887 ,  B01L2300/12 ,  B81B2201/058 ,  B81C1/00119 ,  B81C2201/0132 ,  B81C2201/0194 ,  B81C2203/036

Abstract: An apparatus for sorting macromolecules includes a first chip including a channel formed in a first side of the first chip and having at least one monolithic sorting structure for sorting macromolecules from the sample fluid. A first set of vias formed in the first chip has openings in a second side of the first chip, the sample fluid being provided to the sorting structure through the first set of vias. A second set of vias formed in the first chip has openings in the second side for receiving macromolecules in the sample fluid greater than or equal to a prescribed dimension sorted by the sorting structure. A third set of vias formed in the first chip has openings in the second side for receiving macromolecules in the sample fluid less than the prescribed dimension. The apparatus includes first and second seals covering the first and second sides, respectively.

公开(公告)号：US20180073854A1

公开(公告)日：2018-03-15

申请号：US15473956

申请日：2017-03-30

Applicant: International Business Machines Corporation

Inventor： HUAN HU ,  NING LI ,  XIAO HU LIU ,  KATSUYUKI SAKUMA

IPC: G01B7/16

CPC classification number: G01B7/20 ,  B81B3/0097 ,  B81B2201/0214 ,  B81B2207/07 ,  B81C1/0038 ,  B81C2201/0194 ,  G01L1/2293

Abstract: Aspects include a method of manufacturing a flexible electronic structure that includes a metal or doped silicon substrate. Aspects include depositing an insulating layer on a silicon substrate. Aspects also include patterning a metal on a silicon substrate. Aspects also include selectively masking the structure to expose the metal and a portion of the silicon substrate. Aspects also include depositing a conductive layer including a conductive metal on the structure. Aspects also include plating the conductive material on the structure. Aspects also include spalling the structure.

公开(公告)号：US09550360B2

公开(公告)日：2017-01-24

申请号：US14926567

申请日：2015-10-29

Applicant: NLT Technologies, Ltd.

Inventor： Shigeru Mori ,  Setsuo Kaneko ,  Hideki Asada

IPC: B41J2/16 ,  B41J2/14 ,  B41J2/045 ,  C09K13/00 ,  B81C1/00

CPC classification number: B41J2/1601 ,  B41J2/0455 ,  B41J2/0458 ,  B41J2/14016 ,  B41J2/14129 ,  B41J2/1626 ,  B41J2/1634 ,  B41J2002/14387 ,  B81C1/00357 ,  B81C1/00817 ,  B81C2201/0194 ,  C09K13/00

Abstract: Provided are a manufacturing method of an inkjet print head, the inkjet print head and a drawing apparatus equipped with the inkjet print head. The manufacturing method includes: forming a separation assisting layer on a substrate; forming heating resistors, thin-film transistors and nozzles for ejecting liquid, on the separation assisting layer; separating the separation assisting layer from the substrate; forming a first heat-conductive layer on the opposite surface of the separation assisting layer from the nozzles; and forming an ink supply port for supplying ink to the nozzles from a first heat-conductive layer side of the inkjet print head.

Abstract translation: 提供了一种喷墨打印头，喷墨打印头和装备有喷墨打印头的绘图装置的制造方法。 该制造方法包括：在基板上形成分离辅助层; 在分离辅助层上形成用于喷射液体的加热电阻器，薄膜晶体管和喷嘴; 从所述基板分离所述分离辅助层; 在所述分离辅助层的与所述喷嘴相反的表面上形成第一导热层; 以及形成用于从喷墨打印头的第一导热层侧向喷嘴供墨的供墨口。

公开(公告)号：US20160380404A1

公开(公告)日：2016-12-29

申请号：US15140282

申请日：2016-04-27

Applicant: MASSACHUSETTS INSTITUTE OF TECHNOLOGY

Inventor： Vladimir BULOVIC ,  Jeffrey Hastings LANG ,  Apoorva MURARKA ,  Annie I-Jen WANG ,  Wendi CHANG

IPC: H01S3/105 ,  H01S3/0933 ,  G01L1/24 ,  H01S3/16 ,  B81C1/00 ,  H01S3/08 ,  H01S3/094

CPC classification number: H01S3/1053 ,  B81B2201/02 ,  B81B2201/042 ,  B81C1/00158 ,  B81C1/00634 ,  B81C2201/0194 ,  G01L1/24 ,  G01L9/0005 ,  G01L9/0072 ,  G01L11/02 ,  G02B26/001 ,  H01L29/84 ,  H01S3/07 ,  H01S3/08059 ,  H01S3/0933 ,  H01S3/094 ,  H01S3/0941 ,  H01S3/106 ,  H01S3/1305 ,  H01S3/16 ,  H01S3/1693

Abstract: The disclosure relates to method and apparatus for micro-contact printing of micro-electromechanical systems (“MEMS”) in a solvent-free environment. The disclosed embodiments enable forming a composite membrane over a parylene layer and transferring the composite structure to a receiving structure to form one or more microcavities covered by the composite membrane. The parylene film may have a thickness in the range of about 100 nm-2 microns; 100 nm-1 micron, 200-300 nm, 300-500 nm, 500 nm to 1 micron and 1-30 microns. Next, one or more secondary layers are formed over the parylene to create a composite membrane. The composite membrane may have a thickness of about 100 nm to 700 nm to several microns. The composite membrane's deflection in response to external forces can be measured to provide a contact-less detector. Conversely, the composite membrane may be actuated using an external bias to cause deflection commensurate with the applied bias. Applications of the disclosed embodiments include tunable lasers, microphones, microspeakers, remotely-activated contact-less pressure sensors and the like.

公开(公告)号：US20160311679A1

公开(公告)日：2016-10-27

申请号：US15138313

申请日：2016-04-26

Applicant: Infineon Technologies AG

Inventor： Dominic Maier ,  Alfons Dehe ,  Thomas Kilger ,  Markus Menath ,  Franz Xaver Muehlbauer ,  Daniel Porwol ,  Juergen Wagner

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00896 ,  B81C1/00269 ,  B81C1/00801 ,  B81C2201/0194 ,  B81C2201/053

Abstract: A method of producing a chip package is described. A plurality of chips is provided on a first wafer. Each chip has a cavity which opens to a first main face of the chip. The cavities are filled or covered temporarily. The chips are then singulated. The singulated chips are embedded in an encapsulation material, and then the cavities are re-exposed.

Abstract translation: 对芯片封装的制造方法进行说明。 多个芯片设置在第一晶片上。 每个芯片具有通向芯片的第一主面的空腔。 空腔被暂时填充或覆盖。 然后将芯片分开。 单片化芯片嵌入封装材料中，然后将空腔重新曝光。

公开(公告)号：US09359192B1

公开(公告)日：2016-06-07

申请号：US14593582

申请日：2015-01-09

Applicant: Freescale Semiconductor, Inc.

Inventor： Philip H. Bowles ,  Mamur Chowdhury ,  Vijay Sarihan

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/0023 ,  B81B7/008 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2207/07 ,  B81C1/00238 ,  B81C2201/0194 ,  B81C2203/0792

Abstract: The various embodiments described herein provide microelectromechanical systems (MEMS) sensor devices and methods of forming the same. In general, the embodiments provide MEMS sensor devices formed with two semiconductor die that are bonded together. Specifically, a sensor die includes at least one MEMS sensor fabricated thereon, such as MEMS gyroscope or MEMS accelerometer. A control-circuit die includes at least one integrated MEMS control circuit formed on an active area of the die. The control-circuit die is bonded to the sensor die with the active area and the integrated MEMS control circuits on the exterior side. The bonding defines and seals a cavity between the two die that encompasses the MEMS sensor and can be used to seal the MEMS sensor in a vacuum.

Abstract translation: 本文所述的各种实施例提供了微机电系统（MEMS）传感器装置及其形成方法。 通常，这些实施例提供了形成有两个结合在一起的两个半导体管芯的MEMS传感器器件。 具体地，传感器管芯包括其上制造的至少一个MEMS传感器，例如MEMS陀螺仪或MEMS加速度计。 控制电路管芯包括形成在管芯的有效区域上的至少一个集成的MEMS控制电路。 控制电路管芯与外部的有源区域和集成的MEMS控制电路结合到传感器管芯。 该结合限定和密封包围MEMS传感器的两个管芯之间的空腔，并可用于在真空中密封MEMS传感器。

公开(公告)号：US20160130138A1

公开(公告)日：2016-05-12

申请号：US14541065

申请日：2014-11-13

Applicant: MASSACHUSETTS INSTITUTE OF TECHNOLOGY

Inventor： Vladimir BULOVIC ,  Jeffrey Hastings LANG ,  Annie I-Jen WANG ,  Apoorva MURARKA ,  Wendi CHANG

IPC: B81C1/00 ,  H01S5/06 ,  H01S5/10 ,  B81C3/00 ,  H01S5/187

CPC classification number: B81C1/00158 ,  B81B2201/042 ,  B81C1/00182 ,  B81C1/00634 ,  B81C2201/0194 ,  G01L9/0005 ,  G01L9/0072 ,  G01L11/02 ,  G02B26/001 ,  G02B26/0825 ,  G02B26/0841 ,  H01L29/84 ,  H01S5/0607 ,  H01S5/1039 ,  H01S5/187

Abstract: The disclosure relates to method and apparatus for micro-contact printing of micro-electromechanical systems (“MEMS”) in a solvent-free environment. The disclosed embodiments enable forming a composite membrane over a parylene layer and transferring the composite structure to a receiving structure to form one or more microcavities covered by the composite membrane. The parylene film may have a thickness in the range of about 100 nm-2 microns; 100 nm-1 micron, 200-300 nm, 300-500 nm, 500 nm to 1 micron and 1-30 microns. Next, one or more secondary layers are formed over the parylene to create a composite membrane. The composite membrane may have a thickness of about 100 nm to 700 nm to several microns. The composite membrane's deflection in response to external forces can be measured to provide a contact-less detector. Conversely, the composite membrane may be actuated using an external bias to cause deflection commensurate with the applied bias. Applications of the disclosed embodiments include tunable lasers, microphones, microspeakers, remotely-activated contact-less pressure sensors and the like.