Abstract:
A spectrometer module comprising a plurality of separate electronic circuit modules is disclosed. Each separate electronic module comprises an integrated sensor circuit including a light sensitive area occupying part of an area of the integrated sensor circuit, the integrated sensor circuit being arranged to detect incident light. In one aspect, the plurality of separate electronic circuit modules includes a group of adjacent electronic circuit modules. The light sensitive areas of the electronic circuit modules in the group are so arranged on the respective integrated sensor circuits that the group of adjacent electronic circuit modules is mounted so that the light sensitive areas thereof are arranged in vicinity to each other. The spectrometer module includes an optical module, which is common to said plurality of separate electronic circuit modules and arranged to direct incident light towards the light sensitive areas of each of said electronic circuit modules.
Abstract:
An optical sensor includes an array of pixels configured to convert photons into electrons for forming an image. A tunable filter assembly is optically connected to the array of pixels for passing an adjustable bandwidth of photons to the array of pixels. The tunable filter assembly includes a first mirror defining an optical axis and a second mirror spaced apart from the first mirror along the optical axis. A first electrode is mechanically connected to the first mirror and a second electrode is fixed relative to the second mirror. The first and second electrodes are positioned relative to one another to adjust the position of the first mirror with respect to the second mirror when a voltage is applied across the first and second electrodes to tune the spectral bands being passed through the filter assembly to the array of pixels.
Abstract:
A system includes a focal plane array (FPA), support structure, optical assembly, flexing structure, and drive actuator. The FPA includes multiple pixels. The FPA captures an image as image data during an integration time interval. The optical assembly is fixed to the support structure and forms an image of a scene at the FPA. The flexing structure is mechanically coupled to both the support structure and the FPA, and allows the FPA to move relative to the support structure. The actuator is mechanically coupled to the FPA, and drives the FPA to move relative to the support structure. Some FPA have all readout elements arranged in a first regular grid with constant spacing, while some detector elements are on that grid and other detector elements are on a different grid offset by less than the constant spacing to provide sub-pixel resolution.
Abstract:
A plurality of photodiodes arrayed in a one-dimensional form are divided into a plurality of groups. The structure of an antireflection coating is changed for each group so that all the surfaces of the photodiodes belonging to each group are covered with an antireflection coating having a transmittance characteristic which shows a maximum transmittance within a range of wavelengths of light to be received by those photodiodes. In particular, a SiO2 coating layer on the silicon substrate and an Al2O3 coating layer are common to all the photodiodes, while the structure of the upper layers are modified with respect to the wavelength. Within an ultraviolet wavelength region, the coating structure is more finely changed with respect to the wavelength. By such a design, the transmittance can be improved while making the best efforts to avoid a complex manufacturing process.
Abstract:
A spectral characteristic obtaining apparatus including a light irradiation unit configured to emit light onto a reading object; a spectroscopic unit configured to separate at least a part of diffused reflected light from the light emitted onto the reading object by the light irradiation unit into a spectrum; and a light receiving unit configured to receive the diffused reflected light separated into the spectrum by the spectroscopic unit and to obtain a spectral characteristic. The light receiving unit is configured to be a spectroscopic sensor array including plural spectroscopic sensors arranged in a direction, and the spectroscopic sensors include a predetermined number of pixels arranged in the direction to receive lights with different spectral characteristics from each other.
Abstract:
Provided is an imaging device (1) having: a front optical system (10) that transmits light from an object; a spectral filter array (20) that transmits light from the front optical system (10) via a plurality of spectral filters; a small lens array (30) that transmits the light from the plurality of spectral filters via a plurality of small lenses respectively, and forms a plurality of object images; a picture element (50) that captures the plurality of object images respectively; and an image processor (60) that determines two-dimensional spectral information on the object images based on image signals output from the picture element (50). The front optical system (10) is configured to transmit the light from the focused object to collimate the light into a parallel luminous flux.
Abstract:
A spectral characteristic obtaining apparatus including a light irradiation unit configured to emit light onto a reading object; a spectroscopic unit configured to separate at least a part of diffused reflected light from the light emitted onto the reading object by the light irradiation unit into a spectrum; and a light receiving unit configured to receive the diffused reflected light separated into the spectrum by the spectroscopic unit and to obtain a spectral characteristic. In at least one example embodiment, the light receiving unit is configured to be a spectroscopic sensor array including plural spectroscopic sensors arranged in a direction, and the spectroscopic sensors include a predetermined number of pixels arranged in the direction to receive lights with different spectral characteristics from each other.
Abstract:
The present disclosure generally relates to hyperspectral spectroscopy, and in particular, to systems, methods and devices enabling a single-sensor hyperspectral imaging device. Hyperspectral (also known as “multispectral”) spectroscopy is an imaging technique that integrates multiples images of an object resolved at different narrow spectral bands (i.e., narrow ranges of wavelengths) into a single data structure, referred to as a three-dimensional hyperspectral data cube. Data provided by hyperspectral spectroscopy allow for the identification of individual components of a complex composition through the recognition of spectral signatures of individual components within the three-dimensional hyperspectral data cube.
Abstract:
An apparatus and corresponding method for line-scan imaging includes a 2D array of light-sensitive detector elements divided into a plurality of sub-arrays. An electrical circuit can be configured to determine a correction for parallax based on detector element values from at least two rows of parallax detecting elements to enable images captured by the sub-arrays to be co-aligned with each other. The 2D array and parallax detecting elements can be located on the same substrate chip. Image data from sub-arrays can be co-aligned with each other based on parallax data from the parallax detecting elements and used to produce hyperspectral images corrected for parallax.
Abstract:
A plurality of photodiodes arrayed in a one-dimensional form are divided into a plurality of groups. The structure of an antireflection coating is changed for each group so that all the surfaces of the photodiodes belonging to each group are covered with an antireflection coating having a transmittance characteristic which shows a maximum transmittance within a range of wavelengths of light to be received by those photodiodes. In particular, a SiO2 coating layer on the silicon substrate and an Al2O3 coating layer are common to all the photodiodes, while the structure of the upper layers are modified with respect to the wavelength. Within an ultraviolet wavelength region, the coating structure is more finely changed with respect to the wavelength. By such a design, the transmittance can be improved while making the best efforts to avoid a complex manufacturing process.