Abstract:
An apparatus is disclosed that comprises an integrated circuit and a thermal detector array configured to detect thermal radiation from the integrated circuit. A method is disclosed that comprises providing an integrated circuit and disposing a thermal detector array so as to detect thermal radiation from the integrated circuit. Another apparatus is disclosed that comprises means for processing and means for detecting thermal radiation from the means for processing.
Abstract:
A method and apparatus for processing a semiconductor substrate is described. The apparatus is a process chamber having an optically transparent upper dome and lower dome. Vacuum is maintained in the process chamber during processing. The upper dome is thermally controlled by flowing a thermal control fluid along the upper dome outside the processing region. Thermal lamps are positioned proximate the lower dome, and thermal sensors are disposed among the lamps. The lamps are powered in zones, and a controller adjusts power to the lamp zones based on data received from the thermal sensors.
Abstract:
A turbine engine optical system includes a plurality of viewing ports in an engine case that are circumferentially spaced from one-another. At least one optical device is optically coupled to the ports for viewing an internal chamber defined by the engine case and for depicting at least spatial temperature distributions. The chamber may be an exhaust chamber and the controller may have the capability to correlate events in the exhaust chamber to events in an upstream combustor chamber and may thereby adjust operating parameters of a fuel system of the combustor.
Abstract:
Methods, systems, and apparatus, for an infrared detector are provided. In one aspect, an infrared detector is provided that includes a pyroelectric sensor; a controller for receiving a trigger signal outputted by the pyroelectric sensor; a thermopile sensor, wherein the controller starts the thermopile sensor after receiving the trigger signal output by the pyroelectric sensor; and an alarm, wherein the controller controls the alarm to generate an alarm signal in response to a determination that a difference between a current temperature and a background temperature detected by the thermopile sensor is larger than a threshold value and a determination that the areas of the thermopile sensor activated correspond to a human being.
Abstract:
A first substrate having an array of emitters or detectors may be joined by bump bonding with a second substrate having read-in (RIIC) or read-out (ROIC) circuitry. After the two substrates are joined, the resulting assembly may be singulated to form sub-arrays such as tiles sub-arrays having pixel elements which may be arranged on a routing layer or carrier to form a larger array. Edge features of the tiles may provide for physical alignment, mechanical attachment and chip-to-chip communication. The pixel elements may be thermal emitter elements for IR image projectors, thermal detector elements for microbolometers, LED-based emitters, or quantum photon detectors such as those found in visible, infrared and ultraviolet FPAs (focal plane arrays), and the like.
Abstract:
A bolometric detector including an absorption membrane, for converting an incident electromagnetic radiation into heat; and a reflector, for reflecting to the absorption membrane part of the incident electromagnetic radiation having passed there through, is provided. The bolometric detector includes a non-metallic layer, situated between the absorption membrane and the reflector, having a series of index jumps, so as to form a network resonating at a wavelength of interest λ0; the mean pitch of the network is less than λ0; and the optical distance between the absorption membrane and the reflector is substantially equal to a multiple of λ0/2.
Abstract:
Dislosed is a device for up-conversion of Short Wavelength Infra-Red (SWIR) images into visible images. The device comprises a sub micrometer thickness structure that is composed of several sub-layers, each having a typical thickness of tens to hundreds of nanometers. The device is composed of two main sections one on top of the other: (a) a highly efficient SWIR absorption thin layer and (b) a highly efficient organic light emitted diode (OLED). The generated visible image is emitted from the OLED through a top transparent cathode, which is deposited on the OLED.
Abstract:
A temperature sensing apparatus configured to measure a temperature distribution of a surface to be measured is provided. The temperature sensing apparatus includes a lens set, a filtering module, a plurality of sensor arrays, and a processing unit. The lens set is configured to receive radiation from the surface to be measured. The filtering module is configured to filter the radiation from the lens set into a plurality of radiation portions respectively having different wavelengths. The sensor arrays are configured to respectively sense the radiation portions. The processing unit is configured to calculate an intensity ratio distribution of the radiation between the different wavelengths according to the radiation portions respectively sensed by the sensor arrays and determine the temperature distribution according to the intensity ratio distribution. A laser processing system and a temperature measuring method are also provided.
Abstract:
A gas detector includes: an infrared camera that images a gas; and a controller including at least an electronic component, wherein the controller determines a temperature range of the infrared camera in which the gas can be imaged, and detects the gas from moving infrared images taken for a predetermined period of time in the temperature range determined.
Abstract:
Apparatus and method for thermally mapping a component in a high temperature environment. An optical probe (10) has a field of view (14) arranged to encompass a surface of a component (15) to be mapped. The probe (10) captures infrared (IR) emissions in the near or mid IR band. An optical fiber (16) has a field of view to encompass a spot location (18) on the surface of the component within the field of view (14) of the probe (12). The fiber (16) captures emissions in the long IR band. The emissions in the long IR band are indicative of an emittance value at the spot location. This information may be used to calibrate a radiance map of the component generated from the emissions in the near or mid IR band and thus map the absolute temperature of the component regardless of whether the component includes a TBC.