公开(公告)号：US20040229070A1

公开(公告)日：2004-11-18

申请号：US10841080

申请日：2004-05-07

Inventor： Masato Takami

IPC: B32B015/00

CPC classification number: C23C30/00 ,  H05K3/0038 ,  H05K3/384 ,  H05K2201/0112 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12 ,  Y10T428/12493 ,  Y10T428/12528 ,  Y10T428/12715 ,  Y10T428/12903 ,  Y10T428/12917

Abstract: It is an object of the present invention to provide a surface-treated copper foil wherein a surface layer which is situated on a side being not bonded to a resin in a copper foil for a printed-wiring board and on which a copper direct drilling process by carbon dioxide laser is easily applied is prepared with a small amount of a covering material in accordance with a simple manner. In the copper foil used for a direct drilling process by laser of the present invention, 50 to 1000 mg/m2of a covering layer consisting of iron and tin, or a covering layer made of an alloy prepared from iron, tin, and at least one member selected from the group consisting of nickel, cobalt, zinc, chromium, and phosphorous is provided on at least one side of the copper foil.

Abstract translation: 本发明的目的是提供一种表面处理铜箔，其中位于不与印刷电路板的铜箔中的树脂结合的一侧的表面层，并且在其上进行铜直接钻孔工艺 通过二氧化碳激光容易地涂敷，按照简单的方式用少量的覆盖材料制备。 在用于本发明的激光的直接钻孔工艺的铜箔中，由铁和锡组成的覆盖层为50〜1000mg / m 2，或由铁，锡， 并且在铜箔的至少一面上设置选自镍，钴，锌，铬和磷中的至少一种。

公开(公告)号：US20040188263A1

公开(公告)日：2004-09-30

申请号：US10480298

申请日：2003-12-11

Inventor： Akiko Sugimoto ,  Junshi Yoshioka ,  Makoto Dobashi ,  Kenjirou Izutani ,  Youzo Itagaki ,  Osamu Nakano

IPC: B32B015/08

CPC classification number: H05K3/0038 ,  H05K1/09 ,  H05K3/025 ,  H05K3/384 ,  H05K3/4652 ,  H05K2201/0112 ,  H05K2201/0323 ,  H05K2203/0307 ,  Y10T428/12472 ,  Y10T428/12569

Abstract: The object is to provide carrier foil-incorporated copper foil which permits drilling by a carbon dioxide laser when on the surface of outer-layer copper foil of a copper-clad laminate there is no nickel assist metal layer or an organic material film to increase the absorption of laser light. For this purpose, there is used, for example, carrier foil-incorporated copper foil in which copper foil for printed wiring board manufacturing having a nodular-treated surface on the side of one surface of a bulk copper layer and carrier foil are laminated via an adhesive interface layer on a side opposite to the nodular-treated surface of the bulk copper layer, the bulk copper layer being formed from a high-carbon copper with a carbon content of 0.03 wt % to 0.40 wt %.

Abstract translation: 本发明的目的是提供载体箔结合的铜箔，其允许在覆铜层压板的外层铜箔的表面上由二氧化碳激光器进行钻孔，不存在镍辅助金属层或有机材料膜以增加 吸收激光。 为此，例如使用载体箔引入铜箔，其中在本体铜层和载体箔的一个表面侧具有结节处理表面的印刷线路板制造用铜箔经由 粘结界面层在与本体铜层的结节处理表面相对的一侧上，该块铜层由碳含量为0.03重量％至0.40重量％的高碳铜形成。

公开(公告)号：US06689543B2

公开(公告)日：2004-02-10

申请号：US10073558

申请日：2002-02-11

Applicant: John S. Kresge ,  John M. Lauffer ,  David J. Russell

Inventor： John S. Kresge ,  John M. Lauffer ,  David J. Russell

IPC: G03C556

CPC classification number: H05K3/0032 ,  B23K2103/42 ,  B23K2103/50 ,  B41M5/24 ,  H05K1/0326 ,  H05K1/0373 ,  H05K2201/0112 ,  Y10S430/146

Abstract: An epoxy based resin which exhibits good laser ablation and good adherence to a substrate such a copper is provided by adding to the resin a dye or dyes having substantial energy absorption at the emission wave lengths of lasers used to laser ablate the resin. The resin with the dye or dyes included is coated onto a substrate and cured, or laminated onto a substrate in the cured condition. The required openings are formed in the cured film by laser ablation. This allows for the use of optimum techniques to be used to form micro vias.

Abstract translation: 通过向树脂中添加染料或染料，在用于激光烧蚀树脂的激光器的发射波长处具有显着的能量吸收，提供了表现出良好的激光烧蚀和对衬底的良好粘合性的环氧树脂。 将含有染料或染料的树脂涂覆在基材上并固化，或在固化条件下层压到基材上。 通过激光烧蚀在所述固化膜中形成所需的开口。 这允许使用最佳技术来形成微通孔。

公开(公告)号：US20030188428A1

公开(公告)日：2003-10-09

申请号：US10401607

申请日：2003-03-31

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Fumio Echigo ,  Hideki Higashitani ,  Daizo Andoh ,  Noritake Fukuda ,  Yasuhiro Nakatani ,  Tadashi Nakamura

IPC: H01K003/10 ,  B29C035/08 ,  C08J007/04

CPC classification number: H05K3/4069 ,  H05K3/0032 ,  H05K3/20 ,  H05K3/386 ,  H05K2201/0112 ,  H05K2201/0116 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49172

Abstract: Removable mask films 303 are formed on the both sides of the substrate having the adhesive layer 302 by applying and drying a resin varnish 304 including a ultraviolet-absorbing agent, and fine through holes 306 are formed by using a third harmonics YAG solid-state laser light with a relatively short wavelength not longer than that in the ultraviolet range in such a way that the effects of such a residual strain as the conventional embodiment forming a removable mask film by a laminating process may be decreased as well as the more fine hole drilling compared with conventional embodiment using the carbon dioxide gas laser with a relatively long wavelength may be performed.

公开(公告)号：US06546624B2

公开(公告)日：2003-04-15

申请号：US09734593

申请日：2000-12-13

Applicant: Fumio Echigo ,  Hideki Higashitani ,  Daizo Andoh ,  Noritake Fukuda ,  Yasuhiro Nakatani ,  Tadashi Nakamura

Inventor： Fumio Echigo ,  Hideki Higashitani ,  Daizo Andoh ,  Noritake Fukuda ,  Yasuhiro Nakatani ,  Tadashi Nakamura

IPC: H01K310

CPC classification number: H05K3/4069 ,  H05K3/0032 ,  H05K3/20 ,  H05K3/386 ,  H05K2201/0112 ,  H05K2201/0116 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49172

Abstract: Removable mask films 303 are formed on the both sides of the substrate having the adhesive layer 302 by applying and drying a resin varnish 304 including a ultraviolet-absorbing agent, and fine through holes 306 are formed by using a third harmonics YAG solid-state laser light with a relatively short wavelength not longer than that in the ultraviolet range in such a way that the effects of such a residual strain as the conventional embodiment forming a removable mask film by a laminating process may be decreased as well as the more fine hole drilling compared with conventional embodiment using the carbon dioxide gas laser with a relatively long wavelength may be performed.

公开(公告)号：US20030041455A1

公开(公告)日：2003-03-06

申请号：US10161472

申请日：2002-06-03

Applicant: Hewlett Packard Company

Inventor： Mohammad Akhavain ,  Ghassem Azdasht

IPC: B23P017/00 ,  H05K003/34 ,  B23K026/00

CPC classification number: H01L24/80 ,  B23K26/22 ,  B23K2101/42 ,  B23K2103/08 ,  B23K2103/12 ,  B23K2103/14 ,  B23K2103/56 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1643 ,  B41J2/1646 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01R43/02 ,  H01R43/0221 ,  H05K3/328 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2201/10681 ,  H05K2203/107 ,  Y10T29/49083 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49401 ,  H01L2924/00

Abstract: This disclosure describes a method for the solderless electrical connection of two contact elements by using a laser light beam attached to a fiber optic system which directs the light to the spot to be bonded. By using a fiber optic system the laser beam is optimally converted into thermal energy and bad connections due to underheating or destruction of the contacts due to overheating does not occur. The method and apparatus provides rapid, reproducible bonding even for the smallest of contact geometries. For example, the method of the invention results in solderless gold to gold compression bonding of conductive leads contained in a polymer flex circuit tape, such as a polyimide, without damaging the tape. A strong solderless gold to gold bond can be formed between the gold plated copper lead on the flex circuit tape and a gold plated pad on a semiconductor chip without the need for a window in the flex circuit and without any damage to the tape. In the application of the present invention to the bonding of conductive leads on a TAB circuit to the silicon substrate of an inkjet printhead the need for a window in the TAB circuits is eliminated. The elimination of the window results in elimination of the need for an encapsulation material to cover the conductive leads in the TAB circuit. This in turn results in die size reduction, or increased number of nozzles with the same die size, ease of assembly, higher yields, improved reliability, ease of nozzle serviceability, and overall material and manufacturing cost reduction.

Abstract translation: 本公开描述了通过使用连接到将光引导到待结合点的光纤系统的激光束来实现两个接触元件的无焊接电连接的方法。 通过使用光纤系统，激光束被最佳地转换成热能，并且不会由于过热而导致由于过热或触点的破坏导致的不良连接。 该方法和装置即使对于最小的接触几何形状也提供了快速，可再现的结合。 例如，本发明的方法导致包含在聚合物柔性电路带（例如聚酰亚胺）中的导电引线的无金与金压接，而不会损坏带。 可以在柔性电路胶带上的镀金铜引线和半导体芯片上的镀金焊盘之间形成牢固的无焊金到金键，而不需要在柔性电路中的窗口并且不会对磁带造成任何损坏。 在本发明的应用中，将TAB电路上的导电引线与喷墨打印头的硅衬底接合，消除了TAB电路中的窗口的需要。 消除窗口导致消除了需要封装材料以覆盖TAB电路中的导电引线。 这又导致模具尺寸减小或具有相同模具尺寸，易于组装，更高产量，改进的可靠性，易于喷嘴可使用性以及整体材料和制造成本降低的喷嘴的数量增加。

公开(公告)号：US06476346B2

公开(公告)日：2002-11-05

申请号：US09862686

申请日：2001-05-21

Applicant: Mohammad Akhavain ,  Say-Teng Lai ,  Robert-Scott Melendrino Lopez

Inventor： Mohammad Akhavain ,  Say-Teng Lai ,  Robert-Scott Melendrino Lopez

IPC: B23K2600

CPC classification number: B23K26/22 ,  B23K2101/42 ,  B23K2103/12 ,  B23K2103/14 ,  B23K2103/18 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1643 ,  B41J2/1646 ,  H01L24/80 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01R43/02 ,  H01R43/0221 ,  H05K3/328 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2201/10681 ,  H05K2203/107 ,  H01L2924/00

Abstract: The disclosure describes a method for predicting and avoiding bad bonds or connections when performing electrical connection of two electrical conductors by using a laser light beam attached to an optical fiber system which directs the light to the spot to be bonded. The method provides for rapid detection of damaged optical fibers before bad bonds or connections occur. Disclosed is a method for predicting and avoiding bad bonds or connections when performing solderless electrical connection of two contact elements by using a laser light beam attached to a optical fiber system which directs the light to the spot to be bonded.

Abstract translation: 本公开描述了一种用于通过使用连接到将光引导到待粘合点的光纤系统的激光束来执行电连接两个电导体时预测和避免不良键或连接的方法。 该方法提供在发生坏的连接或连接之前快速检测损坏的光纤。 公开了一种用于通过使用附接到将光导向待结合点的光纤系统的激光束来执行两个接触元件的无焊接电连接来预测和避免不良键合或连接的方法。

公开(公告)号：US06414263B1

公开(公告)日：2002-07-02

申请号：US09627308

申请日：2000-07-27

Applicant: Yuichi Uchida ,  Masao Kubo ,  Kenichiro Tanaka ,  Isamu Miyamoto

Inventor： Yuichi Uchida ,  Masao Kubo ,  Kenichiro Tanaka ,  Isamu Miyamoto

IPC: B23K2600

CPC classification number: H05K3/0035 ,  B23K26/03 ,  B23K26/032 ,  B23K26/082 ,  H05K1/0269 ,  H05K2201/0112 ,  H05K2201/0209 ,  H05K2201/0323 ,  H05K2203/0315 ,  H05K2203/163

Abstract: To form a hole for electrically connecting an upper conductor layer 11 of an insulating layer 10 of a printed wiring board 1 and a lower conductor layer 12 of the insulating layer 10 in the insulating layer 10 to expose the lower conductor layer 12 to the hole bottom, when laser processing is executed for making the hole 13 in the insulating layer 10 using the printed wiring board 1 comprising a treatment layer 14 being placed between the lower conductor layer 12 and the insulating layer 10 for emitting an electromagnetic wave having a wavelength different from the wavelength of processing laser during the laser processing, change in a signal emitted from the treatment layer 14 of the printed wiring board 1 is measured to determine the remaining state of the insulating layer 10. The electromagnetic wave emitted in laser processing from the treatment layer 14 placed between the lower conductor layer 12 and the insulating layer 10 rather than the reflection of laser of laser is used, so that the hole 13 piercing the insulating layer can be detected precisely.

Abstract translation: 为了形成用于将绝缘层10中的印刷电路板1的绝缘层10的上导体层11和绝缘层10的下导体层12电连接的孔，以将下导体层12暴露于孔底 当使用包括处理层14的印刷布线板1在绝缘层10中进行激光加工来进行激光加工时，该处理层14位于下导体层12和绝缘层10之间，用于发射波长不同于 测量激光处理期间的处理激光的波长，从印刷布线板1的处理层14发射的信号的变化，以确定绝缘层10的剩余状态。激光加工中从处理层发射的电磁波 因此，使用放置在下导体层12和绝缘层10之间而不是激光的激光的反射 可以精确地检测穿透绝缘层的孔13。

公开(公告)号：US06361923B1

公开(公告)日：2002-03-26

申请号：US09375957

申请日：1999-08-17

Applicant: John S. Kresge ,  John M. Lauffer ,  David J. Russell

Inventor： John S. Kresge ,  John M. Lauffer ,  David J. Russell

IPC: G03C173

CPC classification number: H05K3/0032 ,  B23K2103/42 ,  B23K2103/50 ,  B41M5/24 ,  H05K1/0326 ,  H05K1/0373 ,  H05K2201/0112 ,  Y10S430/146

Abstract: An epoxy based resin which exhibits good laser ablation and good adherence to a substrate such a copper is provided by adding to the resin a dye or dyes having substantial energy absorption at the emission wave lengths of lasers used to laser ablate the resin. The resin with the dye or dyes included is coated onto a substrate and cured, or laminated onto a substrate in the cured condition. The required openings are formed in the cured film by laser ablation. This allows for the use of optimum techniques to be used to form micro vias.

公开(公告)号：US5407557A

公开(公告)日：1995-04-18

申请号：US201325

申请日：1994-02-24

Applicant: Atsuko Iida ,  Hiroshi Odaira ,  Yoshizumi Sato ,  Yuichi Yamamoto

Inventor： Atsuko Iida ,  Hiroshi Odaira ,  Yoshizumi Sato ,  Yuichi Yamamoto

IPC: H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K1/05 ,  H05K3/02 ,  H05K3/20 ,  H05K3/24 ,  H05K3/38 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  C25D5/02

CPC classification number: H01L21/4857 ,  H01L23/49866 ,  H01L23/5387 ,  H05K1/056 ,  H05K3/027 ,  H05K3/242 ,  H05K3/388 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K2201/0112 ,  H05K2201/0326 ,  H05K2201/0347 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2203/107 ,  H05K3/205 ,  H05K3/423 ,  H05K3/4614 ,  H05K3/4635 ,  Y10S205/917

Abstract: A multi-layer wiring board where a plurality of wiring boards are laminated. The wiring board comprises a flexible insulating layer having a through hole and a wiring pattern formed on the flexible insulating layer. The wiring pattern is composed at least of two conductive layers. The first conductive layer formed on the insulating layer is made of a non-metallic conductor and the first wiring pattern is formed by a laser beam. The second conductive layer is an electroplated layer formed on the first wiring pattern. The first and second conductive layers have different reflectance for a beam. The wiring board is manufactured by integrally laminating a plastic conductive supporting plate wound in a roll shape and an insulating film similarly wound in a roll shape; forming a through hole in a predetermined position of the insulating film; forming the first conductive layer on the laminated body provided with the through hole; forming the first wiring pattern by a laser beam; and forming the electroplated layer on the first wiring pattern.

Abstract translation: 叠层有多个布线基板的多层布线基板。 布线板包括具有通孔的柔性绝缘层和形成在柔性绝缘层上的布线图案。 布线图案至少由两个导电层组成。 形成在绝缘层上的第一导电层由非金属导体制成，并且第一布线图案由激光束形成。 第二导电层是形成在第一布线图案上的电镀层。 第一和第二导电层对于束具有不同的反射率。 通过将卷绕成卷状的塑料导电支撑板和类似地卷绕成卷状的绝缘膜整体地层叠而制造布线板; 在绝缘膜的预定位置形成通孔; 在设置有通孔的层叠体上形成第一导电层; 通过激光束形成第一布线图案; 以及在所述第一布线图案上形成所述电镀层。