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公开(公告)号：US07480994B2
公开(公告)日：2009-01-27
申请号：US11707731
申请日：2007-02-16
Applicant: Benjamin H. Wood, III , Joseph E. Scheffelin , Noah Lassar , Mohammad Akhavain
Inventor： Benjamin H. Wood, III , Joseph E. Scheffelin , Noah Lassar , Mohammad Akhavain
CPC classification number: B41J2/1623 , B41J2/1601 , B41J2202/20 , Y10T29/49114 , Y10T29/49155 , Y10T29/49401
Abstract: A fluid ejection head of a fluid ejection device is provided, the fluid ejection head having a substrate, a fluid ejection die coupled with the substrate, an electromagnetic radiation-curable adhesive disposed on the substrate, and a cover coupled with the substrate via the electromagnetic radiation-curable adhesive, wherein the cover includes an opening configured to pass fluids ejected from the fluid ejection die, and wherein the cover is made at least partially of a material transparent to electromagnetic radiation.
Abstract translation: 提供了一种流体喷射装置的流体喷射头，所述流体喷射头具有基底，与所述基底耦合的流体喷射模具，设置在所述基底上的电磁辐射固化粘合剂，以及经由所述电磁线圈与所述基底结合的盖 可辐射固化的粘合剂，其中所述盖包括被配置为使流体从所述流体喷射模头喷射出的流体的开口，并且其中所述盖至少部分地由对电磁辐射透明的材料制成。
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公开(公告)号：US07211736B2
公开(公告)日：2007-05-01
申请号：US10698604
申请日：2003-10-31
Applicant: Noah Lassar , Mohammad Akhavain , Michael Martin
Inventor： Noah Lassar , Mohammad Akhavain , Michael Martin
IPC: H05K1/00
CPC classification number: H05K1/111 , H01L2924/00013 , H05K1/0306 , H05K2201/09418 , H05K2201/09427 , H05K2201/09709 , H05K2201/10674 , Y02P70/611 , Y10T29/49147 , Y10T29/49149 , Y10T29/49165 , H01L2224/29099
Abstract: In an implementation of connection pad layouts, a connection assembly includes a substrate assembly and connection pads disposed thereon. The connection pads form a configuration such that each connection pad is configured to align with a different terminal of an interconnect that is warped or otherwise has a non-linear alignment of terminals.
Abstract translation: 在连接焊盘布局的实现中，连接组件包括衬底组件和设置在其上的连接焊盘。 连接焊盘形成这样的配置，使得每个连接焊盘被配置成与被弯曲的互连的不同端子对齐或者具有端子的非线性对准。
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3.发明授权Method of forming an electrical connection between electrical leads of a tab circuit and electrical contact bumps 失效在接片电路的电引线和电接触凸块之间形成电连接的方法公开(公告)号：US06983539B2
公开(公告)日：2006-01-10
申请号：US10161472
申请日：2002-06-03
Applicant: Mohammad Akhavain , Ghassem Azdasht
Inventor： Mohammad Akhavain , Ghassem Azdasht
CPC classification number: H01L24/80 , B23K26/22 , B23K2101/42 , B23K2103/08 , B23K2103/12 , B23K2103/14 , B23K2103/56 , B41J2/1603 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1634 , B41J2/1643 , B41J2/1646 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01057 , H01L2924/01058 , H01L2924/0106 , H01L2924/01068 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01R43/02 , H01R43/0221 , H05K3/328 , H05K2201/0108 , H05K2201/0112 , H05K2201/10681 , H05K2203/107 , Y10T29/49083 , Y10T29/49128 , Y10T29/49144 , Y10T29/49149 , Y10T29/49179 , Y10T29/49401 , H01L2924/00
Abstract: In one form of the invention, a laser beam propagates directly through bulk material of a TAB tape or base, to heat and form a bond between electrical leads formed on the base and aligned contact bumps. In another form, a chromium seed-metal layer is formed on a TAB tape or base, and leads are in turn formed on the chromium; the chromium absorbs a laser beam to heat the leads. In both forms, an optical fiber preferably presses copper leads and gold bumps together with over 300 g force, without aid by a gas stream—and then also conducts the beam to the bond site, forming a bond of shear strength over 200 g. Also preferably gold contacts are plated on the leads; and the method makes an inkjet printhead—with the bumps formed on a die or other printhead component, and nozzles formed through the base.
Abstract translation: 在本发明的一种形式中，激光束直接通过TAB带或基底的材料传播，以加热并形成在基底上形成的电引线和对准的接触凸块之间的结合。 在另一种形式中，在TAB带或基底上形成铬种子金属层，并在铬上形成引线; 铬吸收激光束以加热引线。 在两种形式中，光纤优选地将铜引线和金凸起与超过300g的力一起压制，而不用气流的帮助，然后还将梁传导到结合位置，形成剪切强度超过200g的粘结。 金触点也优选镀在引线上; 并且该方法制造喷墨打印头，其中凸起形成在模具或其它打印头部件上，以及通过基部形成的喷嘴。
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公开(公告)号：US20050248617A1
公开(公告)日：2005-11-10
申请号：US11166301
申请日：2005-06-24
Applicant: Mohammad Akhavain , Joseph Scheffelin , Noah Lassar , Conrad Lepe
Inventor： Mohammad Akhavain , Joseph Scheffelin , Noah Lassar , Conrad Lepe
CPC classification number: H05K3/284 , B41J2/16 , B41J2/1623 , B41J2002/14491 , B41J2202/20 , H05K3/3421 , H05K2201/10977 , H05K2203/0126
Abstract: The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.
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公开(公告)号：US20050094382A1
公开(公告)日：2005-05-05
申请号：US10698604
申请日：2003-10-31
Applicant: Noah Lassar , Mohammad Akhavain , Michael Martin
Inventor： Noah Lassar , Mohammad Akhavain , Michael Martin
CPC classification number: H05K1/111 , H01L2924/00013 , H05K1/0306 , H05K2201/09418 , H05K2201/09427 , H05K2201/09709 , H05K2201/10674 , Y02P70/611 , Y10T29/49147 , Y10T29/49149 , Y10T29/49165 , H01L2224/29099
Abstract: In an implementation of connection pad layouts, a connection assembly includes a substrate assembly and connection pads disposed thereon. The connection pads form a configuration such that each connection pad is configured to align with a different terminal of an interconnect that is warped or otherwise has a non-linear alignment of terminals.
Abstract translation: 在连接焊盘布局的实现中，连接组件包括衬底组件和设置在其上的连接焊盘。 连接焊盘形成这样的配置，使得每个连接焊盘被配置成与被弯曲的互连的不同端子对齐或者具有端子的非线性对准。
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Patent Agency Ranking
公开(公告)号：US06843552B2
公开(公告)日：2005-01-18
申请号：US10429617
申请日：2003-05-05
Applicant: David McElfresh , Noah Carl Lassar , Mohammad Akhavain , Brian J. Keefe , Joseph E. Scheffelin , Janis Horvath , Dale Dean Timm, Jr.
Inventor： David McElfresh , Noah Carl Lassar , Mohammad Akhavain , Brian J. Keefe , Joseph E. Scheffelin , Janis Horvath , Dale Dean Timm, Jr.
CPC classification number: B41J2/14072 , B41J2/155 , B41J2202/20
Abstract: A printhead assembly includes a carrier having a first side and a second side contiguous with the first side, a plurality of printhead dies each mounted on the first side of the carrier, an electrical circuit including a first portion disposed on the first side of the carrier and a second portion disposed on the second side of the carrier, and a plurality of electrical connectors each electrically coupled to the first portion of the electrical circuit and one of the printhead dies. The electrical circuit has a plurality of openings defined in the first portion thereof such that each of the openings are sized to accommodate one of the printhead dies, and has a first side facing the carrier and a second side opposite the first side thereof such that each of the electrical connectors are electrically coupled to the second side of the electrical circuit and one of the printhead dies.
Abstract translation: 打印头组件包括具有与第一侧邻接的第一侧和第二侧的载体，每个安装在载体的第一侧上的多个打印头模具，电路包括设置在载体的第一侧上的第一部分 以及设置在所述载体的第二侧上的第二部分，以及多个电连接器，每个电连接器电耦合到所述电路的所述第一部分和所述打印头芯之一。 电路具有限定在其第一部分中的多个开口，使得每个开口的尺寸适于容纳一个打印头模具，并且具有面向托架的第一侧和与其第一侧相对的第二侧，使得每个 的电连接器电耦合到电路的第二侧和打印头之一中。
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公开(公告)号：US06428141B1
公开(公告)日：2002-08-06
申请号：US09840785
申请日：2001-04-23
Applicant: David K. Mc Elfresh , Mohammad Akhavain , Joseph E. Scheffelin
Inventor： David K. Mc Elfresh , Mohammad Akhavain , Joseph E. Scheffelin
IPC: B41J215
CPC classification number: B41J2/14024 , B41J2/16 , B41J2/1623 , B41J2/1632 , B41J2202/03 , B41J2202/20
Abstract: A carrier adapted to support at least one printhead die includes a substrate having at least one surface and at least one datum attached to the at least one surface of the substrate. The substrate includes a first material and the at least one datum is formed from a blank including a second material. As such, the at least one datum is adapted to position the carrier in at least one dimension.
Abstract translation: 适于支撑至少一个打印头芯片的载体包括具有至少一个表面的基底和至少一个连接到该基底的至少一个表面的基准。 衬底包括第一材料，并且所述至少一个基准由包括第二材料的坯件形成。 因此，至少一个数据适于将载体定位在至少一个维度上。
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公开(公告)号：US20070169342A1
公开(公告)日：2007-07-26
申请号：US11690595
申请日：2007-03-23
Applicant: Noah Lassar , Mohammad Akhavain , Michael Martin
Inventor： Noah Lassar , Mohammad Akhavain , Michael Martin
IPC: H05K3/00
CPC classification number: H05K1/111 , H01L2924/00013 , H05K1/0306 , H05K2201/09418 , H05K2201/09427 , H05K2201/09709 , H05K2201/10674 , Y02P70/611 , Y10T29/49147 , Y10T29/49149 , Y10T29/49165 , H01L2224/29099
Abstract: In an implementation of connection pad layouts, a connection assembly includes a substrate assembly and connection pads disposed thereon. The connection pads form a configuration such that each connection pad is configured to align with a different terminal of an interconnect that is warped or otherwise has a non-linear alignment of terminals.
Abstract translation: 在连接焊盘布局的实现中，连接组件包括衬底组件和设置在其上的连接焊盘。 连接焊盘形成这样的配置，使得每个连接焊盘被配置成与被弯曲的互连的不同端子对齐或者具有端子的非线性对准。
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公开(公告)号：US20050168513A1
公开(公告)日：2005-08-04
申请号：US10769429
申请日：2004-01-30
Applicant: Benjamin Wood , Joseph Scheffelin , Noah Lassar , Mohammad Akhavain
Inventor： Benjamin Wood , Joseph Scheffelin , Noah Lassar , Mohammad Akhavain
CPC classification number: B41J2/1623 , B41J2/1601 , B41J2202/20 , Y10T29/49114 , Y10T29/49155 , Y10T29/49401
Abstract: A fluid ejection head of a fluid ejection device is provided, the fluid ejection head having a substrate, a fluid ejection die coupled with the substrate, an electromagnetic radiation-curable adhesive disposed on the substrate, and a cover coupled with the substrate via the electromagnetic radiation-curable adhesive, wherein the cover includes an opening configured to pass fluids ejected from the fluid ejection die, and wherein the cover is made at least partially of a material transparent to electromagnetic radiation.
Abstract translation: 提供了一种流体喷射装置的流体喷射头，所述流体喷射头具有基底，与所述基底耦合的流体喷射模具，设置在所述基底上的电磁辐射固化粘合剂，以及经由所述电磁线圈与所述基底结合的盖 可辐射固化的粘合剂，其中所述盖包括被配置为使流体从所述流体喷射模头喷射出的流体的开口，并且其中所述盖至少部分地由对电磁辐射透明的材料制成。
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公开(公告)号：US06698092B2
公开(公告)日：2004-03-02
申请号：US10001679
申请日：2001-10-31
Applicant: Frank J. Bretl , Gary Powell , Donald L. Michael , Jefferson P. Ward , Joseph E. Scheffelin , Mohammad Akhavain
Inventor： Frank J. Bretl , Gary Powell , Donald L. Michael , Jefferson P. Ward , Joseph E. Scheffelin , Mohammad Akhavain
IPC: H05K330
CPC classification number: H05K3/284 , B41J2/17513 , B41J2/1752 , Y10T29/49117 , Y10T29/49121 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49171
Abstract: The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep the interface areas free of an insulative material. The method distributes a flowable insulative material around portions of the die assembly.
Abstract translation: 所描述的实施例涉及用于形成管芯封装的方法和系统。 在一个示例性实施例中，用于形成模具组件的方法与模具组件的接合区域接触以保持界面区域不含绝缘材料。 该方法围绕模具组件的部分分布可流动的绝缘材料。
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