公开(公告)号：US20170118835A1

公开(公告)日：2017-04-27

申请号：US15296435

申请日：2016-10-18

Applicant: Valeo Vision

Inventor： Olivier Badia

IPC: H05K1/02 ,  B60Q1/04 ,  H05K1/03

CPC classification number: H05K1/0281 ,  B60Q1/0088 ,  B60Q1/04 ,  B60Q1/076 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/046 ,  H05K2201/09009 ,  H05K2201/10121 ,  H05K2201/2009

Abstract: A flexible printed circuit board, configured to receive electronic components, comprising an electrically insulating flexible element, configured to bear conductive component-connecting tracks, the flexible element being further configured to be bent according to a curvature, the board further comprising an electrically insulating reinforcing element, mechanically secured to the flexible element, extending on one side of the curvature, and comprising two parts: a first part being substantially planar and a second part exhibiting a predefined curvature, arranged on the side of the curvature of the flexible element, the reinforcing element being arranged so as to leave a free part for the flexible element to be bent according to the curvature.

公开(公告)号：US09256026B2

公开(公告)日：2016-02-09

申请号：US14540651

申请日：2014-11-13

Applicant: Oracle International Corporation

Inventor： Hiren D. Thacker ,  Ashok V. Krishnamoorthy ,  Robert David Hopkins, II ,  Jon Lexau ,  Ronald Ho ,  John E. Cunningham

IPC: G02B6/12 ,  G02B6/42

CPC classification number: G02B6/12 ,  G02B6/42 ,  G02B6/4274 ,  G02B6/428 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/1703 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06534 ,  H01L2225/06548 ,  H01L2225/06565 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K1/141 ,  H05K2201/046 ,  H05K2201/10121

Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each other on the same side of a substrate in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. In addition, an input/output (I/O) integrated circuit is coupled to the optical integrated circuit between the substrate and the optical integrated circuit. This I/O integrated circuit includes high-speed I/O circuits and energy-efficient driver and receiver circuits and communicates with optical devices on the optical integrated circuit. By integrating the optical integrated circuit, the integrated circuit and the I/O integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects.

Abstract translation: 芯片封装包括在芯片封装中的基板的相同侧上彼此相邻的光学集成电路（例如混合集成电路）和集成电路。 集成电路包括诸如存储器或处理器的电路，并且光学集成电路传送具有非常高带宽的光信号。 此外，输入/输出（I / O）集成电路耦合到基板和光学集成电路之间的光学集成电路。 该I / O集成电路包括高速I / O电路和节能驱动器和接收器电路，并与光学集成电路上的光学器件进行通信。 通过将集成电路，集成电路和I / O集成电路集成在一起，与具有电互连的芯片封装相比，芯片封装可以有助于提高性能。

公开(公告)号：US09078361B2

公开(公告)日：2015-07-07

申请号：US13575036

申请日：2011-01-31

Applicant: Gerardus Titus Van Heck ,  Margaretha Maria De Kok ,  Jeroen Van Den Brand

Inventor： Gerardus Titus Van Heck ,  Margaretha Maria De Kok ,  Jeroen Van Den Brand

IPC: H05K1/02 ,  H01L27/32 ,  H01L51/52 ,  H01R4/70 ,  H05K3/36 ,  H05B33/08 ,  H05B33/10 ,  H05K13/04 ,  H01L31/0392 ,  H01L31/042 ,  G09F9/00 ,  G09F19/22 ,  H01R4/04 ,  H01R12/70 ,  H05K1/03 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K1/0277 ,  G09F9/00 ,  G09F19/22 ,  H01L27/3293 ,  H01L31/0392 ,  H01L31/042 ,  H01L51/5203 ,  H01L2251/5338 ,  H01L2251/5361 ,  H01R4/04 ,  H01R4/70 ,  H01R12/7076 ,  H05B33/0896 ,  H05B33/10 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/147 ,  H05K1/189 ,  H05K3/321 ,  H05K3/325 ,  H05K3/365 ,  H05K13/04 ,  H05K2201/029 ,  H05K2201/0311 ,  H05K2201/046 ,  H05K2201/083 ,  H05K2201/09081 ,  H05K2201/09281 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10484 ,  Y02E10/50 ,  Y10T29/4913

Abstract: An assembly is provided of an electro-physical transducer (10) on a flexible foil (20) with a carrier (40). The flexible foil (20) has a first main surface (22) provided with at least a first electrically conductive track (24) connected to the electro-physical transducer and opposite said first main surface a second main surface (23) facing towards the carrier. At least a first incision (25a) extends through the flexible foil alongside said at least a first electrically conductive track, therewith defining a strip shaped portion (27) of the flexible foil that carries a portion of the at least a first electrically conductive track. The at least a first electrically conductive track is electrically connected to an electrical conductor (421) of the carrier, and the flexible foil is attached to the carrier with its strip shaped portion.

Abstract translation: 在具有载体（40）的柔性箔（20）上提供由电 - 物理传感器（10）组成的组件。 柔性箔（20）具有第一主表面（22），第一主表面（22）设置有至少第一导电轨道（24），第一导电轨道（24）连接到电物理换能器并与所述第一主表面相对，第二主表面（23）面向载体 。 至少第一切口（25a）沿着所述至少第一导电轨道延伸穿过柔性箔片，从而限定柔性箔片的带状部分（27），其承载至少第一导电轨道的一部分。 至少第一导电轨道电连接到载体的电导体（421），并且柔性箔片与其带状部分连接到载体上。

公开(公告)号：US20150173180A1

公开(公告)日：2015-06-18

申请号：US14568544

申请日：2014-12-12

Applicant: LG INNOTEK CO., LTD.

Inventor： Man Hue CHOI ,  Min Jae KIM ,  Se Woong NA ,  Hyun Gyu PARK ,  In Hee CHO ,  Seung Kwon HONG

IPC: H05K1/02

CPC classification number: H05K1/0281 ,  G02F1/133615 ,  G02F2001/133612 ,  H05K1/0278 ,  H05K1/181 ,  H05K1/189 ,  H05K3/28 ,  H05K2201/046 ,  H05K2201/10106

Abstract: Provided is a printed circuit board, including: a support substrate including a first region in which light emitting elements are mount, a second region extending from the first region, and a bending portion between the first region and the second region, an insulating substrate on the support substrate, wiring portions on the insulating substrate, and a protective layer on the wiring portions.

Abstract translation: 提供一种印刷电路板，包括：支撑基板，包括其中安装有发光元件的第一区域，从第一区域延伸的第二区域和在第一区域和第二区域之间的弯曲部分，绝缘基板 支撑基板，绝缘基板上的布线部分和布线部分上的保护层。

公开(公告)号：US20150098677A1

公开(公告)日：2015-04-09

申请号：US14540651

申请日：2014-11-13

Applicant: Oracle International Corporation

Inventor： Hiren D. Thacker ,  Ashok V. Krishnamoorthy ,  Robert David Hopkins, II ,  Jon Lexau ,  Ronald Ho ,  John E. Cunningham

IPC: G02B6/12 ,  G02B6/42

CPC classification number: G02B6/12 ,  G02B6/42 ,  G02B6/4274 ,  G02B6/428 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/1703 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06534 ,  H01L2225/06548 ,  H01L2225/06565 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K1/141 ,  H05K2201/046 ,  H05K2201/10121

Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each other on the same side of a substrate in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. In addition, an input/output (I/O) integrated circuit is coupled to the optical integrated circuit between the substrate and the optical integrated circuit. This I/O integrated circuit includes high-speed I/O circuits and energy-efficient driver and receiver circuits and communicates with optical devices on the optical integrated circuit. By integrating the optical integrated circuit, the integrated circuit and the I/O integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects.

Abstract translation: 芯片封装包括在芯片封装中的基板的相同侧上彼此相邻的光学集成电路（例如混合集成电路）和集成电路。 集成电路包括诸如存储器或处理器的电路，并且光学集成电路传送具有非常高带宽的光信号。 此外，输入/输出（I / O）集成电路耦合到基板和光学集成电路之间的光学集成电路。 该I / O集成电路包括高速I / O电路和节能驱动器和接收器电路，并与光学集成电路上的光学器件进行通信。 通过将集成电路，集成电路和I / O集成电路集成在一起，与具有电互连的芯片封装相比，芯片封装可以有助于提高性能。

公开(公告)号：US20140353010A1

公开(公告)日：2014-12-04

申请号：US13905078

申请日：2013-05-29

Applicant: Cheng Uei Precision Industry Co., Ltd.

Inventor： Chih Wei Wang

IPC: H05K1/02 ,  H05K3/22

CPC classification number: H05K1/0281 ,  H05K1/02 ,  H05K1/118 ,  H05K3/00 ,  H05K2201/0129 ,  H05K2201/046 ,  H05K2203/1327

Abstract: An electronic component includes a flexible printed circuit board which has a main body, a fixing portion and a connecting portion, and an insulating portion integrally molded to the fixing portion. In the process of the insulating portion being molded to the fixing portion, a filling mold fixture is sleeved around and spaced from outsides of the fixing portion. A method of manufacturing the electronic component is described hereinafter. Sleeve the filling mold fixture around the fixing portion and apart from the outsides of the fixing portion. Place the flexible printed circuit board together with the filling mold fixture in a mold. Inject liquid rubber into the filling mold fixture. Close the mold. Cool the electronic component and the filling mold fixture. Open the mold to take out the electronic component and the filling mold fixture, and then separate the filling mold fixture from the electronic component smoothly.

Abstract translation: 电子部件包括具有主体，固定部和连接部的柔性印刷电路板，以及与固定部一体成形的绝缘部。 在绝缘部分被模制到固定部分的过程中，填充模具固定件围绕着固定部分的外侧并与之隔开。 下面描述制造电子部件的方法。 将填充模具夹具围绕固定部分并且与固定部分的外侧分开。 将柔性印刷电路板与填充模具夹具一起放在模具中。 将液体橡胶注入灌装模具夹具。 关闭模具。 冷却电子元件和灌装模具夹具。 打开模具取出电子元件和灌装模具夹具，然后平滑地将填充模具夹具与电子元件分开。

公开(公告)号：US08845131B2

公开(公告)日：2014-09-30

申请号：US13409064

申请日：2012-02-29

Applicant: Timothy Drew Ferrie ,  Aaron Meyer ,  Bruce Quaal

Inventor： Timothy Drew Ferrie ,  Aaron Meyer ,  Bruce Quaal

IPC: F21V21/00 ,  F21V29/00 ,  G09F13/04 ,  F21V21/08 ,  F21V3/04 ,  F21V8/00 ,  F21S4/00 ,  F21K99/00 ,  F21Y101/02

CPC classification number: F21V3/04 ,  F21K9/00 ,  F21S4/10 ,  F21S4/20 ,  F21V17/007 ,  F21V21/0808 ,  F21Y2107/70 ,  F21Y2115/10 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0083 ,  G02B6/009 ,  G09F13/0409 ,  H05K1/0278 ,  H05K3/0061 ,  H05K2201/046 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2203/1327

Abstract: A lighting system comprising a light box housing, a plurality of lighting units including a housing, a plurality of light emitting elements mounted on a PCB within the housing. The light emitting elements arranged on an angled surface such that the light emitting elements emit light in a sideways direction from the lighting units. The lighting units can also be interconnected in a daisy-chain configuration, such that the lighting units form a row of lighting units. The row of lighting units adapted to be mounted within the light box housing, wherein the light box housing comprises one or more rows of lighting units.

Abstract translation: 一种照明系统，包括灯箱壳体，多个照明单元，包括壳体，安装在所述壳体内的PCB上的多个发光元件。 发光元件布置在倾斜的表面上，使得发光元件沿着来自照明单元的侧向方向发光。 照明单元还可以以菊花链配置互连，使得照明单元形成一排照明单元。 适于安装在灯箱壳体内的一排照明单元，其中灯箱壳体包括一排或多排照明单元。

公开(公告)号：US20140160692A1

公开(公告)日：2014-06-12

申请号：US14098166

申请日：2013-12-05

Applicant: PC CONCEPTS LIMITED

Inventor： Ping Cheung Michael Lau

IPC: H05K7/00 ,  H05K3/36

CPC classification number: H05K3/366 ,  B41M3/006 ,  H05K1/028 ,  H05K1/0284 ,  H05K1/0386 ,  H05K3/36 ,  H05K2201/046 ,  H05K2201/047 ,  H05K2201/10098 ,  Y10T29/49155 ,  Y10T29/49826

Abstract: The present invention provides a method for surface decoration of a three-dimensional object with ease. In one embodiment of the invention, a planar construction article that is foldable into the object is utilized. In another embodiment of the invention, multiple angle plates that are assembled into the object are utilized. The surface decoration process is carried out before the planar construction article is folded or before the angle panels are assembled together thereby to significantly simplify the decoration process of object faces in different orientations. The invention also provides a three-dimensional object obtained from the methods of the invention.

Abstract translation: 本发明提供一种三维物体的表面装饰方法。 在本发明的一个实施例中，利用可折叠到物体中的平面构造物品。 在本发明的另一个实施例中，利用组装到物体中的多个角板。 表面装饰处理在平面构造制品折叠之前或在角板组装在一起之前进行，从而大大简化了不同取向的物体面的装饰过程。 本发明还提供了从本发明的方法获得的三维物体。

公开(公告)号：US20130201636A1

公开(公告)日：2013-08-08

申请号：US13574630

申请日：2011-01-31

Applicant: Jeroen Van Den Brand ,  Gerardus Titus Van Heck ,  Margaretha Maria De Kok

Inventor： Jeroen Van Den Brand ,  Gerardus Titus Van Heck ,  Margaretha Maria De Kok

IPC: H05K1/02 ,  H05K13/04

CPC classification number: H05K1/0277 ,  G09F9/00 ,  G09F19/22 ,  H01L27/3293 ,  H01L31/0392 ,  H01L31/042 ,  H01L51/5203 ,  H01L2251/5338 ,  H01L2251/5361 ,  H01R4/04 ,  H01R4/70 ,  H01R12/7076 ,  H05B33/0896 ,  H05B33/10 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/147 ,  H05K1/189 ,  H05K3/321 ,  H05K3/325 ,  H05K3/365 ,  H05K13/04 ,  H05K2201/029 ,  H05K2201/0311 ,  H05K2201/046 ,  H05K2201/083 ,  H05K2201/09081 ,  H05K2201/09281 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10484 ,  Y02E10/50 ,  Y10T29/4913

Abstract: An assembly of a plurality of tiles (1) with a carrier (40). The tiles (1) comprise a foil (20) with an electro-physical transducer (10) and electrical connectors (24, 28) to said transducer. The tiles are mechanically and electrically coupled to the carrier in a connection portion (1c) of said tiles.

Abstract translation: 具有载体（40）的多个瓦片（1）的组件。 瓦片（1）包括具有电物理换能器（10）的箔（20）和到所述换能器的电连接器（24,28）。 所述瓦片在所述瓦片的连接部分（1c）中机械地和电耦合到所述载体。

公开(公告)号：US20090290347A1

公开(公告)日：2009-11-26

申请号：US12137337

申请日：2008-06-11

Applicant: Pervaiz Lodhie

Inventor： Pervaiz Lodhie

IPC: F21V21/00

CPC classification number: H05K1/14 ,  F21K9/00 ,  F21W2131/103 ,  F21Y2115/10 ,  H05K2201/046 ,  H05K2201/10106

Abstract: An angled LED light module comprising at least two boards arranged at an angle relative to each other; and a plurality of LED bulbs mounted on the at least two boards, wherein the at least two boards and the plurality of LED bulbs form a single light source. In one aspect, the at least two boards are printed circuit boards. In one aspect, the angled LED light module comprises two stages.

Abstract translation: 一种倾斜的LED灯模块，包括至少两个相对于彼此成角度布置的板; 以及安装在所述至少两个板上的多个LED灯泡，其中所述至少两个板和所​​述多个LED灯泡形成单个光源。 一方面，所述至少两个板是印刷电路板。 在一个方面，倾斜的LED灯模块包括两个阶段。