公开(公告)号：US11696402B2

公开(公告)日：2023-07-04

申请号：US17951547

申请日：2022-09-23

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Han-Sung Bae ,  Wonkyu Kwak ,  Cheolgeun An

IPC: H05K1/18 ,  H05K1/11 ,  H01L23/00 ,  G02F1/1345 ,  H05K3/36 ,  H05K3/30 ,  H01L23/495

CPC classification number: H05K1/118 ,  G02F1/13458 ,  H01L24/06 ,  H05K1/111 ,  H01L23/49572 ,  H01L2224/50 ,  H01L2224/79 ,  H01L2224/86 ,  H01L2225/06579 ,  H01L2225/107 ,  H05K3/303 ,  H05K3/361 ,  H05K2201/05 ,  H05K2201/058 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2203/04 ,  Y02P70/50

Abstract: Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

公开(公告)号：US11672079B2

公开(公告)日：2023-06-06

申请号：US17444364

申请日：2021-08-03

Applicant: AT&S (China) Co. Ltd.

Inventor： Nick Xin ,  Mikael Tuominen

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K1/18 ,  H05K1/14

CPC classification number: H05K1/028 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/181 ,  H05K1/0277 ,  H05K1/0278 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/118 ,  H05K1/148 ,  H05K2201/046 ,  H05K2201/05 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/058

Abstract: A component carrier, wherein the component carrier includes: i) a layer stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, ii) a bendable portion which forms at least a part of the layer stack, and iii) a metal layer which forms at least a part of the bendable portion. Hereby, the metal layer extends over at least 75% of the area of the bendable portion.

公开(公告)号：US20230152606A1

公开(公告)日：2023-05-18

申请号：US18150785

申请日：2023-01-05

Applicant: SHENZHEN SHOKZ CO., LTD.

Inventor： Yueqiang WANG ,  Haofeng ZHANG ,  Yongjian LI ,  Yunbin CHEN ,  Fen YOU ,  Lei ZHANG

IPC: G02C11/00 ,  G02C5/22 ,  H04R1/02 ,  H04R1/10 ,  H04R9/06 ,  H04R1/06 ,  H04R9/02 ,  G02C5/14 ,  G02C11/06 ,  H04R1/28 ,  H05K1/02 ,  H04R25/00 ,  H04R1/04 ,  H05K1/18

CPC classification number: G02C11/10 ,  G02C5/22 ,  H04R1/028 ,  H04R1/1033 ,  H04R9/06 ,  H04R1/06 ,  H04R1/1008 ,  H04R1/1041 ,  H04R1/1075 ,  H04R9/025 ,  G02C5/14 ,  G02C11/06 ,  H04R9/02 ,  H04R1/02 ,  H04R1/10 ,  H04R1/28 ,  H05K1/028 ,  G02C5/2254 ,  H04R1/1083 ,  H04R25/65 ,  H04R1/04 ,  H05K1/189 ,  H04R2460/13 ,  H05K2201/05

Abstract: The present disclosure provides eyeglasses including: an eyeglass rim; an eyeglass temple, the eyeglass temple comprising a control circuit or a battery; a rotating shaft, the rotating shaft being configured to connect the eyeglass rim and the eyeglass temple, so that the eyeglass rim and the eyeglass temple are relatively rotated around the rotating shaft, and the rotating shaft being disposed with a rotating shaft wiring channel along an axial direction; and a speaker, the speaker comprising an earphone core, the speaker being connected to the eyeglass temple, the control circuit or battery in the eyeglass temple driving the earphone core to vibrate through the connection wire, wherein the earphone core vibrates to generate a driving force to drive a housing panel of the speaker to vibrate, and a straight line of the driving force being not parallel to a normal line of the housing panel.

公开(公告)号：US10076025B2

公开(公告)日：2018-09-11

申请号：US15436960

申请日：2017-02-20

Applicant: NIPPON MEKTRON, LTD.

Inventor： Masayuki Iwase

IPC: H05K1/02 ,  H05K3/38 ,  H05K1/09 ,  H05K3/40 ,  H05K3/46 ,  H05K1/03 ,  H05K3/12

CPC classification number: H05K1/0283 ,  H05K1/0393 ,  H05K1/095 ,  H05K3/1216 ,  H05K3/125 ,  H05K3/1275 ,  H05K3/38 ,  H05K3/4038 ,  H05K3/4617 ,  H05K2201/05 ,  H05K2201/09263 ,  H05K2201/09854 ,  H05K2203/0278 ,  H05K2203/0534 ,  H05K2203/1126 ,  H05K2203/30

Abstract: A stretchable circuit board includes plural stretchable bases, and plural stretchable wiring portions, at least one of which is provided on each of main surfaces, facing each other, of the plural stretchable bases, in which the stretchable wiring portions provided on the main surfaces are electrically continuous with each other through a connecting portion.

公开(公告)号：US20180220531A1

公开(公告)日：2018-08-02

申请号：US15422960

申请日：2017-02-02

Applicant: Chang Chun Petrochemical Co., Ltd.

Inventor： Tsang-Jin Juo ,  Kuei-Sen Cheng ,  Yao-Sheng Lai ,  Jui-Chang Chou

IPC: H05K1/09 ,  H05K3/00 ,  H05K3/18 ,  H05K3/28 ,  C25D3/38 ,  C25D5/48 ,  C25D7/00

CPC classification number: H05K1/09 ,  C25D3/38 ,  C25D5/48 ,  C25D7/00 ,  H05K3/007 ,  H05K3/188 ,  H05K3/28 ,  H05K2201/05 ,  H05K2203/0143 ,  H05K2203/1545

Abstract: A method and production of composite foils and thin copper foils peeled from said composite copper foils is disclosed for use in forming printed circuit boards (PCB). Either the composite foil or only the thin copper foil can be laminated to a polymer layer to form the printed circuit board, with the step of separating the thin copper foil from the composite copper foil is performed subsequent to said laminating step.

公开(公告)号：US10015880B1

公开(公告)日：2018-07-03

申请号：US14565227

申请日：2014-12-09

Applicant: Multek Technologies Ltd.

Inventor： Mark Bergman ,  Joan K. Vrtis

IPC: H05K1/02 ,  H05K3/22

CPC classification number: H05K1/0271 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/0386 ,  H05K1/0393 ,  H05K1/144 ,  H05K1/148 ,  H05K3/22 ,  H05K3/4691 ,  H05K2201/0137 ,  H05K2201/05 ,  H05K2201/058 ,  H05K2201/09945 ,  H05K2201/0999 ,  H05K2201/2009

Abstract: A rip stop material is attached at a stress area of a flexible circuit board in order to strengthen the flexible circuit board and minimize ripping and cracking in the polyimide and/or the copper conductors of the circuit. A rip stop transition layer is formed and deposited at a location on the flexible circuit in order to minimize, reduce, if not preventing cracking and ripping of the circuit as it is bent and flexed. The rip stop transition layer can be placed at different locations on and within the flexible circuit in order to minimize cracking and ripping as the flexible circuit is bent, flexed and twisted.

公开(公告)号：US10014565B2

公开(公告)日：2018-07-03

申请号：US15331677

申请日：2016-10-21

Applicant: KYOCERA Document Solutions Inc.

Inventor： Yuichiro Kurokawa

IPC: H01P3/08 ,  H05K1/02 ,  H01P3/02 ,  H05K1/14

CPC classification number: H01P3/08 ,  H01P3/02 ,  H01P3/088 ,  H05K1/0219 ,  H05K1/0245 ,  H05K1/0281 ,  H05K1/147 ,  H05K2201/0145 ,  H05K2201/05 ,  H05K2201/10189 ,  H05K2201/1028 ,  H05K2203/1572

Abstract: A signal transmission path includes a first cable, a second cable, and an interval regulation member. The first cable includes a plurality of signal lines arranged in parallel along one direction. The second cable includes a plurality of signal lines arranged in parallel along the one direction, and is laminated with the first cable. The interval regulation member forms a predetermined specific interval between the first cable and the second cable in a lamination direction in which the first cable and the second cable are laminated.

公开(公告)号：US10006787B2

公开(公告)日：2018-06-26

申请号：US15155764

申请日：2016-05-16

Applicant: ScienBiziP Consulting (Shenzhen) Co., Ltd.

Inventor： Tsung-Ju Wu ,  Jen-Tsorng Chang ,  Hsin-Pei Hsieh ,  Yi-Cheng Lin

IPC: G01D11/30 ,  H05K1/18 ,  H05K1/14

CPC classification number: G01D11/30 ,  G06F3/0414 ,  H05K1/0393 ,  H05K1/144 ,  H05K1/16 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/042 ,  H05K2201/05 ,  H05K2201/10151 ,  H05K2201/10242 ,  Y02P70/611

Abstract: A high density sensor module includes a first substrate, a plurality of first sensors positioned on the first substrate, a plurality of first conductive rods positioned on the corresponding first sensors, a first package resin member covering the first sensors and one end of each of the first conductive rods, a second substrate positioned on the first package resin member, a plurality of second sensors positioned on the second substrate, and a second package resin member covering the second sensors and another end of each of the first conductive rods. The first conductive rods pass through the first package resin member and the second substrate. The high density sensor module has a two-layer structure to increase the number of the sensors such that the sensing density and resolution of the high-density sensor module are increased.

公开(公告)号：US20180175065A1

公开(公告)日：2018-06-21

申请号：US15127139

申请日：2015-12-22

Applicant: BOE Technology Group Co., Ltd.

Inventor： Liping Liu ,  Wenxiang Yin ,  Yu Ai ,  Junqi Han

IPC: H01L27/12 ,  H05K1/18 ,  G02F1/1345 ,  G02F1/155 ,  G02F1/1362

CPC classification number: H01L27/124 ,  G02F1/1345 ,  G02F1/136286 ,  G02F1/155 ,  H05K1/189 ,  H05K2201/05

Abstract: An electrical connection structure, an array substrate and a display device. The electrical connection structure includes a first electrical connection component, which includes: a conductive structure; an insulating layer covering the conductive structure, where at least one first via hole and at least one second via hole are disposed separately in the insulating layer, each first via hole and each second via hole expose a respective part of a surface of the conductive structure; and a conductive connection layer disposed on the insulating layer and covering the at least one first via hole and the at least one second via hole, where the conductive connection layer and the conductive structure are electrically connected with each other through the at least one first via hole and the at least one second via hole. The electrical connection structure can reduce undercut phenomena that occur at via holes in the insulating layer.

公开(公告)号：US20180171446A1

公开(公告)日：2018-06-21

申请号：US15854015

申请日：2017-12-26

Applicant: Liquidmetal Coatings LLC

Inventor： James W. KANG

IPC: C22C45/00 ,  C22F1/18 ,  C22C33/00 ,  C22C45/02 ,  H05K1/18 ,  H01L51/00 ,  C22C1/00 ,  C22F1/00 ,  C22C45/10 ,  H01L51/52

CPC classification number: C22C45/00 ,  C22C1/002 ,  C22C33/003 ,  C22C45/02 ,  C22C45/10 ,  C22F1/00 ,  C22F1/18 ,  C22F1/183 ,  C22F1/186 ,  H01L51/0097 ,  H01L51/5237 ,  H01L2251/5338 ,  H05K1/189 ,  H05K2201/05

Abstract: One embodiment provides a structure, comprising: a display; at least one structural component disposed over a portion of the display, wherein the at least on structural component comprises at least one amorphous alloy; and wherein a portion of the display is foldable.