公开(公告)号：US20080220631A1

公开(公告)日：2008-09-11

申请号：US11915349

申请日：2006-05-25

Applicant: Masaaki Isoda ,  Kazuhiro Takamura ,  Tokushi Yamauchi ,  Katsuyuki Kiyozumi ,  Nobumichi Nishihama

Inventor： Masaaki Isoda ,  Kazuhiro Takamura ,  Tokushi Yamauchi ,  Katsuyuki Kiyozumi ,  Nobumichi Nishihama

IPC: H01R12/00

CPC classification number: F21V29/56 ,  F21K9/00 ,  F21S2/005 ,  F21V19/0025 ,  F21V23/06 ,  F21Y2115/10 ,  H01R13/22 ,  H01R13/514 ,  H05K1/0204 ,  H05K1/142 ,  H05K1/183 ,  H05K2201/09163 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2201/209 ,  Y10S439/928

Abstract: The present invention relates to a socket for electronic component which contains an electronic component. The socket for electronic component comprises a platy base, containers formed to be concaved on a front face of the base and to contain LED packages therein, connectors provided on side faces and connected to other members, supports each of which supports and fixes the LED package contained in the container and electrically connected to the LED package, heat conductors each of which is provided continuously from a bottom face side of the container to a rear face of the base and contacts the LED package contained in the container so as to conduct heat generated by the LED package, and terminals electrically connected to the other members coupled with the connectors and the supports. The heat generated by the LED package is conducted to the rear face of the base through the heat conductors, and effectively radiated to an installation member on which the socket for electronic component is mounted.

Abstract translation: 本发明涉及一种包含电子部件的电子部件用插座。 用于电子部件的插座包括板状基座，形成为凹陷在基座的前表面上并容纳LED封装的容器，设置在侧面上并连接到其它构件的连接器，每个支撑件支撑并固定LED封装 容纳在容器中并电连接到LED封装的导热体，每个热导体从容器的底面侧连续地设置到基座的后表面，并与容纳在容器中的LED封装体接触，以便产生热量 通过LED封装，以及电连接到与连接器和支撑件耦合的其它构件的端子。 由LED封装产生的热量通过导热体传导到基座的后表面，并有效地辐射到安装有用于电子部件的插座的安装部件上。

公开(公告)号：US07261569B2

公开(公告)日：2007-08-28

申请号：US10554741

申请日：2004-03-23

Applicant: Shinji Uchida ,  Yoshiyuki Nakai ,  Tadashi Inoue

Inventor： Shinji Uchida ,  Yoshiyuki Nakai ,  Tadashi Inoue

IPC: H01R12/00

CPC classification number: H05K3/365 ,  H01R12/728 ,  H05K1/117 ,  H05K2201/09163 ,  H05K2201/10189 ,  H05K2201/10265

Abstract: A connecting structure is for a printed wiring board to be electrically connected to a FPC. The FPC includes a substrate and electro-conductive portions. The printed wiring board includes an insertion opening provided on an edge surface thereof, and line connecting terminals formed on an inner wall face of the insertion opening. A dual in-line contact member including first contact members is fixed to the top end portion of the FPC. Each first contact member includes a main body, and a first arm and a second arm extending from the main body generally in parallel to each other. Furthermore, the first arm and the second arm are bent at bent portions so as to form curves protruding away from each other. With the present embodiment, at least one of the first arm and the second arm press the corresponding line connecting terminal provided within the insertion opening at the bent portion thereof by inserting the FPC to the insertion opening of the printed wiring board. Thus, the FPC is connected to the edge surface of the printed wiring board. This improves the freedom from the perspective of design of the wiring pattern as well as allowing mounting of circuit components with high circuit density.

Abstract translation: 连接结构用于印刷线路板与FPC电连接。 FPC包括基板和导电部分。 印刷电路板包括设置在其边缘表面上的插入开口和形成在插入开口的内壁面上的线连接端子。 包括第一接触构件的双列直线接触构件固定到FPC的顶端部分。 每个第一接触构件包括主体，并且第一臂和第二臂大体上彼此平行地从主体延伸。 此外，第一臂和第二臂在弯曲部弯曲，以形成彼此远离的曲线。 在本实施例中，通过将FPC插入印刷电路板的插入口，第一臂和第二臂中的至少一个通过将FPC设置在插入口内的相应的线连接端子的弯曲部分处。 因此，FPC连接到印刷线路板的边缘表面。 这提高了从布线图案的设计的角度的自由度以及允许安装具有高电路密度的电路部件。

公开(公告)号：US20070137886A1

公开(公告)日：2007-06-21

申请号：US11306266

申请日：2005-12-21

Applicant: Chen-Hsiang Yen

Inventor： Chen-Hsiang Yen

IPC: H05K1/00

CPC classification number: H05K3/0052 ,  H05K3/225 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09145 ,  H05K2201/09163 ,  H05K2203/0228 ,  H05K2203/167

Abstract: The present invention relates to a method for partial replacement of a circuit board, comprising: providing a first carrier board and a replaced board which has a second circuit board and a plurality of linkage arm which keeps the second circuit board at the replaced board; cutting a lifted board from the first carrier board to make a void part at the first carrier board; and combining the replaced board with the first carrier board at the void part. Base on the present invention said above, if the first carrier board related to the present invention has more first circuit boards, the method of the present invention still works and each first circuit board can be replaced with a second circuit board of the replaced board to make the first carrier board complete.

Abstract translation: 本发明涉及一种部分更换电路板的方法，包括：提供第一载板和替换的板，其具有第二电路板和将第二电路板保持在更换的板上的多个连杆臂; 从第一承载板切割提升的板，以在第一承载板处形成空隙部分; 以及将替换的板与第一载板组合在空隙部分。 基于上述本发明，如果与本发明相关的第一载板具有更多的第一电路板，则本发明的方法仍然可以工作，并且每个第一电路板可以被更换的板的第二电路板替换为 使第一个载板完成。

公开(公告)号：US20070126123A1

公开(公告)日：2007-06-07

申请号：US11606947

申请日：2006-12-01

Applicant: Youichi Sawachi

Inventor： Youichi Sawachi

IPC: H01L23/52

CPC classification number: H05K3/363 ,  H05K1/0212 ,  H05K3/3494 ,  H05K3/4691 ,  H05K2201/09063 ,  H05K2201/09163 ,  H05K2201/09781 ,  H05K2203/107 ,  H05K2203/163 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/53274

Abstract: The present invention provides a wiring board including a first board provided with a first wiring pattern and a second board provided with a second wiring pattern while the first wiring pattern and the second wiring pattern are electrically connected, wherein the first board includes: a board insertion opening in which the second board is inserted; and a first connection pattern provided inside the board insertion opening and electrically connected to the first wiring pattern, and the second board includes: an inserting portion to be inserted into the board insertion opening of the first board; and a second connection pattern provided at a position opposed to the first connection pattern and electrically connected to the second wiring pattern in the case where the inserting portion of the second board is inserted into the board insertion opening of the first board, and further comprising: solder or brazing filler metal applied at least to a surface of one of the first connection pattern and second connection pattern; and a heat generating device which generates heat by energization and melts the solder or the brazing filler metal to connect the first connection pattern with the second connection pattern.

Abstract translation: 本发明提供了一种布线板，其包括：第一布线图案的第一板和设置有第二布线图案的第二布线图案，同时第一布线图案和第二布线图案电连接，其中第一板包括：板插入 插入第二块板的开口; 以及第一连接图案，其设置在所述基板插入口的内部并电连接到所述第一布线图案，所述第二基板包括：插入到所述第一板的板插入口中的插入部; 以及第二连接图案，其设置在与所述第一连接图案相对的位置处并且在所述第二板的插入部插入到所述第一板的板插入口中的情况下电连接到所述第二布线图案，并且还包括： 至少施加到第一连接图案和第二连接图案中的一个的表面的焊料或钎料; 以及发热装置，其通过通电而产生热量并熔化所述焊料或所述钎料以将所述第一连接图案与所述第二连接图案连接。

公开(公告)号：US07210942B2

公开(公告)日：2007-05-01

申请号：US10554692

申请日：2004-04-23

Applicant: Shinji Uchida ,  Hiroshi Yamane ,  Wataru Sugihara

Inventor： Shinji Uchida ,  Hiroshi Yamane ,  Wataru Sugihara

IPC: H01R12/00

CPC classification number: H05K3/363 ,  H05K2201/09163 ,  H05K2201/10666

Abstract: The present invention relates to a connection structure for a printed wiring board to be electrically connected to a FPC. The FPC comprises a long substrate, a plurality of conductors laminated on the surface of the substrate and extending along an axial direction of the substrate. The printed wiring board comprises a planar main wiring board, an insertion opening, and a plurality of the through-hole terminals. Each of the conductors of the FPC abuts the through-hole terminal upon the insertion of the FPC into the insertion opening of the printed wiring board. According to the invention, a connector structure to be connected to FPC is provided inside the printed wiring board in order to mount circuit element in high density, and thus improve degree of freedom in designing wiring pattern.

Abstract translation: 本发明涉及一种与FPC电连接的印刷电路板的连接结构。 FPC包括长基板，层叠在基板的表面上并沿着基板的轴向延伸的多个导体。 印刷电路板包括平面主配线板，插入开口和多个通孔端子。 在将FPC插入印刷电路板的插入口中时，FPC的每个导体与通孔端子抵接。 根据本发明，为了安装高密度的电路元件，在印刷电路板的内部设置有连接到FPC的连接器结构，从而提高了布线图案的设计自由度。

公开(公告)号：US06992557B2

公开(公告)日：2006-01-31

申请号：US10737633

申请日：2003-12-15

Applicant: Toru Aoyagi

Inventor： Toru Aoyagi

IPC: H01F5/00

CPC classification number: H01F5/00 ,  H01F17/0033 ,  H05K1/0272 ,  H05K1/165 ,  H05K2201/086 ,  H05K2201/09163

Abstract: There is disclosed a printed inductor 1 having a spiral coil formed outside a cavity 2 by providing an insulating substrate 3 with the cavity 2 extending in a direction orthogonal to that of the thickness of the insulating substrate 3, forming a plurality of mutually independent printed wiring lines 4 on both the top and bottom faces of the insulating substrate 3 facing each other through the cavity 2, and sequentially and continuously connecting terminals of the printed wiring lines 4 on both the top and bottom faces to each other through a plurality of through holes 5.

Abstract translation: 公开了一种印刷电感器1，其具有通过提供绝缘基板3而形成在空腔2外部的螺旋线圈，空腔2沿垂直于绝缘基板3的厚度的方向延伸，形成多个相互独立的印刷布线 通过空腔2彼此面对的绝缘基板3的顶面和底面上的线4，并且通过多个通孔依次连续地连接印刷布线4的两个顶面和底面之间的端子 5。

公开(公告)号：US20030081387A1

公开(公告)日：2003-05-01

申请号：US10044055

申请日：2001-11-01

Inventor： Jurgen Schulz

IPC: H05K007/00

CPC classification number: H05K1/117 ,  H05K3/4611 ,  H05K2201/09163 ,  H05K2201/0919

Abstract: A module and a corresponding connector that include multiple rows of contacts is described. In one embodiment, the module may include a channel formed in a bottom edge of the module. A plurality of contacts may be disposed on the inner surface of the channel and the outer surface of the module. A complementary connector is also described.

Abstract translation: 描述了包括多行触点的模块和对应的连接器。 在一个实施例中，模块可以包括形成在模块的底部边缘中的通道。 多个触点可以设置在通道的内表面和模块的外表面上。 还描述了互补连接器。

公开(公告)号：US06421250B1

公开(公告)日：2002-07-16

申请号：US09405514

申请日：1999-09-23

Applicant: Jong-ryeul Kim ,  Jung-joon Lee ,  Bok-moon Kang

Inventor： Jong-ryeul Kim ,  Jung-joon Lee ,  Bok-moon Kang

IPC: H05K111

CPC classification number: H05K1/144 ,  G11C5/04 ,  H01R12/721 ,  H05K1/117 ,  H05K2201/09163 ,  H05K2201/0919

Abstract: A multi in-line module and an electronic component socket for the multi in-line module are provided. One embodiment of a multi in-line memory module includes a printed circuit board having at least two protrusions formed along one edge of the printed circuit board. Each of the protrusions has first and second surfaces for blocks of contact pins. Accordingly, the module can include three or more pin blocks on separate surfaces of the protrusions. The module provides a large number of pins without being significantly larger than a conventional SIMM or DIMM. Alternatively, physical and electrical attachment of multiple circuit boards provides three or more independent pin blocks on the various surfaces of the printed circuit boards. A socket for a module includes dielectric protrusions with two or more gaps between the protrusions and contact pins on side surfaces of the protrusions that are in the gaps. Inserting the protrusions of a multi in-line module into the gaps between the protrusions of the socket creates an electrical connection between contact pins on the module and contact pins of the socket.

Abstract translation: 提供了一种用于多直列模块的多直列模块和电子组件插座。 多列嵌入式存储器模块的一个实施例包括具有沿着印刷电路板的一个边缘形成的至少两个突起的印刷电路板。 每个突起具有用于接触销块的第一和第二表面。 因此，模块可以在突起的分开的表面上包括三个或更多个销块。 该模块提供大量引脚，而不会显着大于常规SIMM或DIMM。 或者，多个电路板的物理和电连接在印刷电路板的各个表面上提供三个或更多个独立的引脚块。 用于模块的插座包括在突起之间具有两个或更多间隙的电介质突起和位于间隙中的突起的侧表面上的接触销。 将多个在线模块的突起插入到插座的突起之间的间隙中，在模块上的接触销和插座的接触销之间形成电连接。

公开(公告)号：US5909012A

公开(公告)日：1999-06-01

申请号：US730618

申请日：1996-10-21

Applicant: Michael George Todd ,  Charles Frederick Schweitzer ,  Robert Edward Belke, Jr. ,  Tianmin Zheng

Inventor： Michael George Todd ,  Charles Frederick Schweitzer ,  Robert Edward Belke, Jr. ,  Tianmin Zheng

IPC: B29C45/00 ,  B29C45/17 ,  H05K1/00 ,  H05K1/02 ,  H05K3/18 ,  H05K3/40 ,  H05K1/11

CPC classification number: H05K3/403 ,  H05K1/0218 ,  H05K1/0272 ,  H05K3/187 ,  B29C2045/0079 ,  B29C45/0053 ,  B29C45/1704 ,  B29L2031/3493 ,  H05K1/0284 ,  H05K2201/09118 ,  H05K2201/09163 ,  H05K2201/09627 ,  H05K2201/09981

Abstract: A gas assisted injection molded part includes internal cavities extending between two surfaces of the part. The cavities are plated for electrical conductivity after a surface cleaning and etching process. The part may be an automobile instrument panel wherein the internal cavities are plated to create a series of "bus" conductor lines. These lines carry power, ground and/or electrical signals over relatively large distances, allowing other components to attach at points along the structure eliminating the need for discrete wiring and wire harness interconnect assemblies.

Abstract translation: 气体辅助注塑部件包括在部件的两个表面之间延伸的内部空腔。 在表面清洁和蚀刻工艺之后，这些空腔被电镀以获得导电性。 该部件可以是汽车仪表板，其中内部空腔被电镀以产生一系列“总线”导体线。 这些线路在相对较大的距离上承载电力，地面和/或电信号，允许其他部件在沿着结构的点处附接，消除对分立布线和线束互连组件的需要。

公开(公告)号：US5468909A

公开(公告)日：1995-11-21

申请号：US184614

申请日：1994-01-21

Applicant: Eduard Schonberger ,  Stefan Gruber ,  Hermann Kasowski ,  Heinz Schmidt

Inventor： Eduard Schonberger ,  Stefan Gruber ,  Hermann Kasowski ,  Heinz Schmidt

IPC: H01L23/28 ,  H01L23/34 ,  H05K1/00 ,  H05K1/02 ,  H05K7/20

CPC classification number: H05K7/205 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/0284 ,  H05K2201/09118 ,  H05K2201/09163 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10969

Abstract: An insulating part for an electronic device includes a first metallized outer surface capable of cooling one or more electronic components disposed on the insulating part. The insulating part also includes one or more additional metallized outer surfaces, such as a set of cooling ribs, to provide improved cooling for the electronic components. These additional outer surfaces are coupled electrically and thermally to the first metallized outer surface, and to each other by recesses containing a heat transfer element, such as a metallization or a soldered connection. Thus, heat transferred to the first outer surface is further dissipated among the several additional cooling surfaces.

Abstract translation: 电子器件的绝缘部件包括能够冷却设置在绝缘部件上的一个或多个电子部件的第一金属化外表面。 绝缘部件还包括一个或多个附加的金属化外表面，例如一组冷却肋，以为电子部件提供改进的冷却。 这些额外的外表面电和热耦合到第一金属化的外表面，并且通过包含诸如金属化或焊接连接的传热元件的凹部彼此耦合。 因此，传递到第一外表面的热量在多个额外的冷却表面之间进一步消散。