公开(公告)号：US20070298287A1

公开(公告)日：2007-12-27

申请号：US11679975

申请日：2007-02-28

Applicant: Osamu Tajima ,  Yoshiaki Miyamoto

Inventor： Osamu Tajima ,  Yoshiaki Miyamoto

IPC: H01M14/00

CPC classification number: H01M2/34 ,  H01M10/425 ,  H05K3/328 ,  H05K3/3405 ,  H05K3/4015 ,  H05K2201/09172 ,  H05K2201/1034 ,  H05K2201/10818 ,  H05K2201/10962

Abstract: A circuit board device is disclosed that is able to be made thin. The a circuit board device includes a substrate having a notch at one end thereof, plural electrical parts mounted on an upper surface of the substrate, a resin portion burying the electrical parts, a metal plate arranged at an end portion of the upper surface of the substrate to cover the notch, and a lead connected to the metal plate and extending from the end of the substrate to the outside. One end of the lead is fit into the notch and is welded to a back side of the metal plate for connection to the metal plate.

Abstract translation: 公开了能够变薄的电路板装置。 一种电路板装置，包括在其一端具有缺口的基板，安装在基板的上表面上的多个电气部件，埋入电气部件的树脂部分，布置在所述基板的上表面的端部的金属板 衬底以覆盖缺口，以及引线，其连接到金属板并从衬底的端部延伸到外部。 引线的一端装配到凹口中并且焊接到金属板的背面，用于连接到金属板。

公开(公告)号：US20070194428A1

公开(公告)日：2007-08-23

申请号：US11670645

申请日：2007-02-02

Applicant: Kunikazu Sato ,  Kazuhiro Maeno ,  Takamasa Nodo ,  Satoshi Ito

Inventor： Kunikazu Sato ,  Kazuhiro Maeno ,  Takamasa Nodo ,  Satoshi Ito

IPC: H01L23/02

CPC classification number: H05K3/363 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/09172

Abstract: A main substrate is provided with a wiring pattern on its surface and in the inner layer. A wiring pattern for connecting the signal line or power line of the main substrate to an external circuit is formed on the flexible printed circuit. A connection terminal to which a corresponding wiring pattern is connected is formed at the tip of the flexible printed circuit. A through-hole is formed between the wiring patterns. Potting resin is potted in each through-hole and around it. When the resin hardens, the potting resin joints the main substrate and the flexible printed circuit.

Abstract translation: 主基板在其表面和内层中设置有布线图案。 在柔性印刷电路上形成用于将主基板的信号线或电源线连接到外部电路的布线图案。 在柔性印刷电路的末端形成连接相应布线图案的连接端子。 在布线图案之间形成通孔。 灌封树脂浸在每个通孔和周围。 当树脂硬化时，灌封树脂接合主基板和柔性印刷电路。

公开(公告)号：US07253808B2

公开(公告)日：2007-08-07

申请号：US10701638

申请日：2003-11-06

Applicant: Hee Jung Hong

Inventor： Hee Jung Hong

IPC: G09G5/00

CPC classification number: H05K3/361 ,  G06F3/045 ,  G06F3/0488 ,  H05K3/323 ,  H05K3/403 ,  H05K2201/09172 ,  H05K2201/10992

Abstract: A touch screen system includes a touch panel to input image signals, a touch controller to drive the touch panel, an extension between the touch panel and the touch controller, and an anisotropic conductive film electrically interconnecting the extension to the touch controller.

Abstract translation: 触摸屏系统包括用于输入图像信号的触摸面板，用于驱动触摸面板的触摸控制器，触摸面板和触摸控制器之间的延伸部分，以及使延伸部与触摸控制器电连接的各向异性导电膜。

公开(公告)号：US20070017697A1

公开(公告)日：2007-01-25

申请号：US11510300

申请日：2006-08-25

Applicant: Chi-Hsing Hsu

Inventor： Chi-Hsing Hsu

IPC: H05K1/11

CPC classification number: H05K1/115 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0237 ,  H05K3/0047 ,  H05K3/403 ,  H05K3/4602 ,  H05K2201/09172 ,  H05K2201/09236 ,  H05K2201/09645 ,  H05K2201/09981 ,  H05K2203/1476

Abstract: A circuit substrate and a method of manufacturing a slot-shaped plated through slot thereon are provided. The circuit substrate has a linear slot. A slot-shaped plated through hole with a multiple transmission paths is formed in the linear slot so that a multiple of signals can be transmitted through the linear slot at one time. The circuit substrate and the method of manufacturing the slot-shaped plated through hole thereon can increase the level of integration of the circuit, decrease the average routing length of the circuit, boost the production efficiency and lower the production cost.

Abstract translation: 提供电路基板及其上形成槽形电镀通孔的方法。 电路基板具有线性槽。 在线性槽中形成具有多个传输路径的槽形电镀通孔，以便一次可以通过线性槽传输多个信号。 电路基板和其上形成槽形电镀通孔的方法可以增加电路的集成度，降低电路的平均布线长度，提高生产效率并降低生产成本。

公开(公告)号：US07145779B2

公开(公告)日：2006-12-05

申请号：US11009250

申请日：2004-12-10

Applicant: Shih-Hsiung Lien

Inventor： Shih-Hsiung Lien

IPC: H05K7/10 ,  H05K7/02

CPC classification number: H05K1/142 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/09963 ,  H05K2201/10159 ,  H05K2201/209

Abstract: A memory module includes a plurality of memory units and an assembling holder. Each of the memory units includes a memory substrate, at least a memory chipset having a predetermined memory capacity mounted on the memory substrate, and an electric terminal provided at a lower edge portion of the memory substrate. The assembling holder includes an elongated unit housing having an elongated receiving slot extended therealong and a signal terminal provided along the unit housing, wherein the electric terminals of the memory substrates are detachably inserted into the receiving slot of the unit housing to electrically connect the electric terminals with the signal terminal, such that the memory units are alignedly and detachably mounted along the receiving slot in an edge to edge manner.

Abstract translation: 存储器模块包括多个存储器单元和组装保持器。 每个存储器单元包括存储器基板，至少存储器芯片组具有安装在存储器基板上的预定存储器容量，以及设置在存储器基板的下边缘部分处的电端子。 组装保持器包括细长单元壳体，其具有沿其延伸的细长接收槽和沿单元壳体设置的信号端子，其中存储器基板的电端子可拆卸地插入到单元壳体的接收槽中，以电连接电端子 信号端子，使得存储器单元沿着接收槽以边缘到边缘的方式对齐地和可拆卸地安装。

公开(公告)号：US20050248010A1

公开(公告)日：2005-11-10

申请号：US11080545

申请日：2005-03-16

Applicant: Takao Ono ,  Tomohiko Sato ,  Hironori Iwasaki

Inventor： Takao Ono ,  Tomohiko Sato ,  Hironori Iwasaki

IPC: H01L23/12 ,  H01L23/02 ,  H01L23/13 ,  H01L23/498 ,  H01L25/10 ,  H01L25/11 ,  H01L25/18 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L23/49816 ,  H01L23/13 ,  H01L25/105 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H05K1/0271 ,  H05K3/3436 ,  H05K2201/09172 ,  H05K2201/10159 ,  H05K2201/10515 ,  Y02P70/613 ,  H01L2924/00

Abstract: A thermal expansion coefficient of a module substrate 8 is different from that of a package substrate. There is not any place where stresses generated in Interfaces between soldering balls 5 and the substrate are released. These stresses are largely applied to soldering bond, the soldering balls are strained, deformed, or cracked, and there has been a problem in long-time reliability. Slits are disposed on opposite sides of each soldering ball in a vertical direction to a side in an outer peripheral side of the package substrate, accordingly the stresses applied to the soldering balls are weakened, and the soldering balls are prevented from being strained, deformed, or cracked. When soldering strains are reduced in this manner, there can be provided a surface mounting type semiconductor package and system module having high reliability, low cost, and satisfactory electric characteristics such as low capacitance and low inductance.

Abstract translation: 模块基板8的热膨胀系数与封装基板的热膨胀系数不同。 没有任何地方在焊球5和基板之间的接口中产生应力释放。 这些应力主要用于焊接，焊球变形，变形或破裂，长时间的可靠性存在问题。 在每个焊球的相对侧，在与封装基板的外周侧的一侧的垂直方向上配置有狭缝，因此施加于焊球的应力变弱，防止焊球发生变形， 或破裂。 当以这种方式减小焊接应变时，可以提供具有高可靠性，低成本和令人满意的电特性如低电容和低电感的表面安装型半导体封装和系统模块。

公开(公告)号：US20050135067A1

公开(公告)日：2005-06-23

申请号：US10892441

申请日：2004-07-16

Applicant: Sang-Wook Park ,  Joong-Hyun Baek

Inventor： Sang-Wook Park ,  Joong-Hyun Baek

IPC: H05K7/20 ,  H01L23/36 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01L25/00 ,  H01L25/065 ,  H01L25/10 ,  H01L25/11 ,  H01L25/18 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36

CPC classification number: H01L23/49805 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2225/06551 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/181 ,  H05K1/18 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/10454 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor module with vertically arranged semiconductor packages may include a module board with a plurality of insertion holes. A plurality of semiconductor packages may be inserted in a vertical direction into corresponding insertion holes. The module may include a heat sink composed of a base plate and a plurality of protrusions. The protrusion may extend downward from the base plate.

Abstract translation: 具有垂直布置的半导体封装的半导体模块可以包括具有多个插入孔的模块板。 多个半导体封装可以沿垂直方向插入相应的插入孔中。 模块可以包括由基板和多个突起组成的散热器。 突起可以从基板向下延伸。

公开(公告)号：US20040262785A1

公开(公告)日：2004-12-30

申请号：US10791718

申请日：2004-03-04

Inventor： Seok Taek Jun

IPC: H01L029/40

CPC classification number: H05K3/3442 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/48227 ,  H01L2924/09701 ,  H05K2201/09172 ,  H05K2201/10727 ,  Y02P70/613

Abstract: Disclosed is a terminal structure of a multi-layer substrate and a method for forming the same. In the terminal structure, a plurality of terminals are formed on at least two adjacent substrate layers, each of the terminals being spaced from adjacent ones to a predetermined interval. Openings are formed in at least one of the substrate layers. Each of the openings is formed between each adjacent ones of first terminals in the at least one substrate layer, and spaced from the each first terminals to a predetermined gap, and has a size same as that of the first terminals. The substrate layers are stacked one atop another and compressed together so that second terminals formed on at least one corresponding substrate layer are projected to a plane of an outermost substrate layer on which corresponding terminals are formed. The terminal structure and the method can secure a predetermined interval to a plurality of terminals in a package when the terminals are formed as well as simplify formation thereof.

Abstract translation: 公开了多层基板的端子结构及其形成方法。 在端子结构中，在至少两个相邻的基板层上形成多个端子，每个端子与相邻的基板间隔开至预定间隔。 开口形成在至少一个基板层中。 每个开口形成在至少一个基板层中的每个相邻的第一端子之间，并且与每个第一端子间隔开至预定的间隙，并且具有与第一端子的尺寸相同的尺寸。 将基板层叠在一起并压缩在一起，使形成在至少一个对应基板层上的第二端子突出到形成相应端子的最外层基板层的平面上。 当端子形成时，端子结构和方法可以确保封装中的多个端子的预定间隔，并且简化其形成。

公开(公告)号：US06646884B1

公开(公告)日：2003-11-11

申请号：US09980382

申请日：2002-04-04

Applicant: Michael Frisch ,  Bernd Winkens

Inventor： Michael Frisch ,  Bernd Winkens

IPC: H05K700

CPC classification number: H05K3/366 ,  H01L25/162 ,  H01L2924/0002 ,  H05K1/144 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/09645 ,  H01L2924/00

Abstract: The power substrate is inserted in a housing (1) as base plate and together with the same forms a standardized power part from whose top side (11) there are projecting terminal pins (5) which are soldered by through-soldering to via holes of the board (4). The circuit board (4), in a strip portion (6) thereof that remains free, has contact pads (7) as control and power terminals by means of which the module can be soldered directly into the slot-like opening of a system circuit board (8).

Abstract translation: 电源基板作为基板插入壳体（1）中，并与其一起形成标准化的动力部件，其顶侧（11）上有突出的端子销（5），其通过焊接焊接到通孔 板（4）。 电路板（4）在其保持空闲的带状部分（6）中具有作为控制和电源端子的接触焊盘（7），通过该接触焊盘将模块直接焊接到系统电路的槽状开口中 板（8）。

公开(公告)号：US06369445B1

公开(公告)日：2002-04-09

申请号：US09670107

申请日：2000-09-26

Applicant: Theodore A. Khoury

Inventor： Theodore A. Khoury

IPC: H01L2304

CPC classification number: G01R1/06716 ,  G01R1/045 ,  G01R1/07307 ,  H01L23/13 ,  H01L2224/49175 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01R13/2407 ,  H01R13/514 ,  H05K1/142 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/10446 ,  H05K2201/10568 ,  H05K2203/041 ,  H05K2203/049 ,  H05K2203/167 ,  H01L2924/00

Abstract: An integrated circuit (IC) having a plurality of IC modules, each IC module having attachment surfaces to which elements of the IC are attached, and each IC module having interlocking edges adjacent to the attachment surface. The interlocking edges of adjacent IC modules are interlocked to form a structural connection between the IC modules. The interlocking edges are a plurality of teeth and recesses, which are arranged in rows. The teeth are securely received by a respective recess in an adjacent interlocking edge to create a structural connection between adjacent IC modules. In addition, the interlocking edges can be a ridge member or a ridge recess, where the ridge member or ridge recess is securely received by a respective ridge recess or ridge member of an adjacent IC module to create a structural connection between the IC modules. The interconnection edge can also be a combination of the ridge member, ridge recess, and/or the rows of teeth and recesses. The attachment surfaces of adjacent IC modules can be co-planar and non-planar, depending on the shape desired. The elements on the IC modules communicate using external pathways and/or internal pathways using conventional wire-bond techniques or using conductive layers within the IC module. The IC module is formed of conventional Si wafers. Using this configuration, an IC can be constructed that utilizes less real estate, fits in non-planar spaces in a housing, and has improved speed due to reduced pathway lengths.