公开(公告)号：US5673484A

公开(公告)日：1997-10-07

申请号：US465760

申请日：1995-06-06

Applicant: Inaba Masaichi ,  Matsumoto Hirofumi ,  Tanaka Yasuyuki

Inventor： Inaba Masaichi ,  Matsumoto Hirofumi ,  Tanaka Yasuyuki

IPC: G11B5/49 ,  G11B5/48 ,  G11B5/60 ,  H05K1/05 ,  H05K3/00 ,  H05K3/28 ,  H05K3/44 ,  G04D3/00

CPC classification number: G11B5/486 ,  H05K3/28 ,  H05K3/44 ,  H05K1/056 ,  H05K2201/0187 ,  H05K2201/0919 ,  H05K2203/0554 ,  H05K3/002 ,  H05K3/0032 ,  H05K3/0041 ,  Y10T29/49615

Abstract: A magnetic head suspension assembly, wherein a wiring member for connecting a magnetic head element with a read/write amplifier circuit board is integrally formed with the suspension for supporting the magnetic head element. The suspension is equipped integrally with a circuit wiring pattern via a flexible insulating base material. The flexible insulating base material is made as wide as the circuit wiring pattern. The top surface of the circuit wiring pattern has a surface protecting layer which is wider than the circuit wiring pattern.

Abstract translation: 一种磁头悬挂组件，其中用于将磁头元件与读/写放大器电路板连接的布线构件与用于支撑磁头元件的悬架一体地形成。 悬架通过柔性绝缘基材与电路布线图形整体配合。 柔性绝缘基材制成与电路布线图形一样宽。 电路布线图案的顶表面具有比电路布线图形更宽的表面保护层。

公开(公告)号：US5619018A

公开(公告)日：1997-04-08

申请号：US415413

申请日：1995-04-03

Applicant: Markku J. Rossi

Inventor： Markku J. Rossi

IPC: H05K1/00 ,  H05K1/09 ,  H05K3/30 ,  H05K3/40 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K3/308 ,  H01R12/523 ,  H05K3/4046 ,  H05K3/4641 ,  H05K1/0272 ,  H05K1/09 ,  H05K2201/0352 ,  H05K2201/09063 ,  H05K2201/0919 ,  H05K2201/10295 ,  H05K2201/10409 ,  H05K2201/1059 ,  H05K2201/10818 ,  H05K2201/10909 ,  H05K3/4676 ,  H05K3/4697

Abstract: A multilayer printed circuit board comprising conducting layers of a first material and conducting layers of a second material includes noncorrosive low resistance electrical contacts between conducting layers of the first and second material. The noncorrosive low resistance contacts allow the use of light weight conducting materials for particular layers of the circuit board to produce a light weight multilayer circuit board.

Abstract translation: 包括第一材料的导电层和第二材料的导电层的多层印刷电路板包括在第一和第二材料的导电层之间的非腐蚀性低电阻电接触。 非腐蚀性低电阻触点允许使用用于电路板的特定层的重量轻的导电材料来制造重量轻的多层电路板。

公开(公告)号：US5493769A

公开(公告)日：1996-02-27

申请号：US284150

申请日：1994-08-02

Applicant: Norio Sakai ,  Kenji Kubota

Inventor： Norio Sakai ,  Kenji Kubota

IPC: H01F17/00 ,  H01C1/14 ,  H01G4/232 ,  H01G4/30 ,  H01L23/498 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46 ,  H01R43/00

CPC classification number: H01G4/232 ,  H01C1/14 ,  H01L23/49805 ,  H01L23/49822 ,  H05K3/403 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/0919 ,  H05K3/0052 ,  Y10T29/435 ,  Y10T29/49004 ,  Y10T29/4902 ,  Y10T29/49169

Abstract: A method of manufacturing a multilayer electronic component having one major surface which can be completely used as a mounting surface for another electronic component to form a composite component includes the steps of forming a groove in the mother laminate along a cutting line, forming external electrodes on side surfaces of the groove and then dividing the mother laminate along the cutting line to divide the groove thereby forming a plurality of multilayer electronic components that are independent of each other. The method of forming the electronic components allows for measuring electrical characteristics of the individual multilayer electronic components while the components are still part of the mother laminate.

Abstract translation: 一种具有一个主表面的多层电子部件的制造方法，其可以完全用作另一电子部件的安装面以形成复合部件，包括以下步骤：沿着切割线在母体层叠体中形成凹槽，形成外部电极 然后沿着切割线分割母体层叠体以分割凹槽，从而形成彼此独立的多个多层电子部件。 形成电子部件的方法允许测量各个多层电子部件的电特性，同时部件仍然是母层压板的一部分。

公开(公告)号：US5276963A

公开(公告)日：1994-01-11

申请号：US839501

申请日：1992-02-21

Applicant: Michael W. Flanders

Inventor： Michael W. Flanders

IPC: H01L21/48 ,  H01L23/498 ,  H05K1/09 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46 ,  H01K3/10 ,  H05K1/00

CPC classification number: H01L23/49805 ,  H01L21/486 ,  H05K3/403 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/092 ,  H05K2201/0919 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061 ,  H05K3/4685 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: A process for the formation of side metallization in ceramic sheets is provided by the present invention. The process includes the steps of forming a via within the ceramic sheet and splitting the via to expose the metallization contained therein. The process is particularly useful for forming wraparound metallization on feedthroughs utilized in hermetic packages.

Abstract translation: 通过本发明提供了在陶瓷片中形成侧面金属化的方法。 该方法包括以下步骤：在陶瓷片内形成通孔并分开通孔以暴露其中所含的金属化。 该方法对于在气密封装中使用的馈通上形成环绕金属化特别有用。

公开(公告)号：US5099395A

公开(公告)日：1992-03-24

申请号：US522814

申请日：1990-05-14

Applicant: Katsumi Sagisaka ,  Sadahisa Furuhashi

Inventor： Katsumi Sagisaka ,  Sadahisa Furuhashi

IPC: H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  H05K3/20 ,  H05K3/32 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K5/00

CPC classification number: H01R12/523 ,  H05K3/202 ,  H05K3/4092 ,  H05K3/4641 ,  H05K5/0091 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0203 ,  H05K1/0207 ,  H05K1/05 ,  H05K1/056 ,  H05K2201/0352 ,  H05K2201/0391 ,  H05K2201/0919 ,  H05K2201/09754 ,  H05K2201/10924 ,  H05K3/429 ,  H05K3/4611

Abstract: In a circuit board wherein a plurality of leads 21 electrically independent of one another protrude from a base member 10, and the respective leads 21 are electrically connected with connection portions 31 of an electronic component 30 mounted on the base member 10; an electronic component mounting circuit board 100 characerized in that internal connection portions 22 are unitarily formed on inner sides of metal members 20 constructing said respective leads 21, that the base members 10 are integrally disposed on both surfaces of said internal connection portions 22, that the electronic components 30 are mounted on said base members 10, and that said electronic components 30 and said internal connection portions 22 are electrically connected. Thus, according to the present invention, it is possible to provide a simply constructed electronic component mounting circuit board which facilitates the design of circuits, which dispenses with the resin molding of the connected portions between the electronic components and the respective leads and affords excellent connection reliability, which can readily form a heat radiating structure, and in which the thermal matching with the electronic components is excellent.

Abstract translation: 在彼此电独立的多个引线21从基体10突出的电路板中，各引线21与安装在基座部件10上的电子部件30的连接部31电连接。 在内部连接部分22的整体上形成有构成所述各个引线21的金属部件20的内侧上的电子部件安装电路板100，即基部部件10一体设置在所述内部连接部分22的两个表面上， 电子部件30安装在所述基座部件10上，电子部件30和内部连接部22电连接。 因此，根据本发明，可以提供一种简单构造的电子部件安装电路板，其有助于电路的设计，其省去了电子部件和各个引线之间的连接部分的树脂模制，并且提供了良好的连接 可靠性，其可以容易地形成散热结构，并且其中与电子部件的热匹配是优异的。

公开(公告)号：US5032006A

公开(公告)日：1991-07-16

申请号：US404547

申请日：1989-09-08

Applicant: Joachim Grupp ,  Yves Ruedin

Inventor： Joachim Grupp ,  Yves Ruedin

IPC: B60R1/04 ,  G02F1/13 ,  G02F1/1345 ,  G09F9/00 ,  H05K3/32 ,  H05K3/34

CPC classification number: G02F1/13452 ,  G02F1/1345 ,  H05K3/321 ,  H05K2201/0919 ,  H05K2201/10287 ,  H05K2201/1034 ,  H05K2201/10386 ,  H05K2201/10962 ,  H05K3/3405

Abstract: An electrooptical cell has electrical connection means between electrodes and a control unit which comprise a contact block of a synthetic adhesive material having conducting particles applied on the edge of each plate in contact zones which are provided flush with said edge, the contact block constituting both the electrical connection and the mechanical bond with at least one other element of said connection.

Abstract translation: 电光电池在电极和控制单元之间具有电连接装置，该控制单元包括具有施加在与所述边缘齐平的接触区中每个板的边缘上的导电颗粒的合成粘合材料的接触块，所述接触块构成 电连接和与所述连接的至少一个其它元件的机械结合。

公开(公告)号：US3875479A

公开(公告)日：1975-04-01

申请号：US35806973

申请日：1973-05-07

Applicant: JAGGAR GILBERT R

Inventor： JAGGAR GILBERT R

IPC: H05K1/00 ,  H05K1/11 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K3/308 ,  H05K1/0298 ,  H05K1/112 ,  H05K2201/0919 ,  H05K2201/09472 ,  H05K2201/10295 ,  H05K2201/10333 ,  H05K2201/1059 ,  H05K2201/10871 ,  H05K2201/10962

Abstract: Internal printed circuits on multi-layer or laminated circuit boards are electrically connected to resistors, capacitors and the like circuit components by connector pins that abut the internal printed circuit at an end extremity and are frictionally held in a hole in the board that to the exterior of the board only at the component mounting side of the board. The pins have a shoulder that limits the penetration during assembly procedures and another hole in which the lead wire of the circuit component is frictionally engaged.

Abstract translation: 多层或层压电路板上的内部印刷电路通过连接器引脚电连接到电阻器，电容器和类似的电路部件，连接器引脚在端部端部与内部印刷电路相接触，并摩擦地保持在板上的孔中 仅在板的元件安装侧。 销具有限制装配过程中的穿透的肩部，以及电路部件的引线摩擦接合的另一个孔。

公开(公告)号：US3546775A

公开(公告)日：1970-12-15

申请号：US3546775D

申请日：1968-03-04

Applicant: SANDERS ASSOCIATES INC

Inventor： LALMOND HAROLD ,  GOODY LEWIS B

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/18 ,  H05K3/46 ,  H02G15/00

CPC classification number: H05K3/4644 ,  H05K1/118 ,  H05K3/181 ,  H05K3/4611 ,  H05K3/4691 ,  H05K2201/09109 ,  H05K2201/0919 ,  H05K2201/09509 ,  H05K2203/063 ,  H05K2203/107 ,  Y10T29/49126 ,  Y10T29/49155

公开(公告)号：US3400210A

公开(公告)日：1968-09-03

申请号：US54541466

申请日：1966-04-26

Applicant: AUTOMATIC ELECT LAB

Inventor： REIMER WILLIAM A

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/40

CPC classification number: H05K1/115 ,  H05K3/0082 ,  H05K3/403 ,  H05K2201/0919 ,  H05K2201/09509 ,  H05K2201/09581 ,  H05K2201/09645 ,  H05K2201/09845

公开(公告)号：US20190148856A1

公开(公告)日：2019-05-16

申请号：US15812756

申请日：2017-11-14

Applicant: Amazon Technologies, Inc.

Inventor： William Mische

IPC: H01R12/71 ,  H01R12/73 ,  H01R13/52 ,  H01R43/00 ,  H05K1/03 ,  H05K1/11

CPC classification number: H01R12/716 ,  H01R12/721 ,  H01R12/722 ,  H01R12/73 ,  H01R13/52 ,  H01R43/002 ,  H05K1/036 ,  H05K1/115 ,  H05K1/142 ,  H05K1/144 ,  H05K1/148 ,  H05K1/184 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/09145 ,  H05K2201/0919 ,  H05K2201/10189 ,  H05K2201/10409

Abstract: Printed circuit boards (PCBs) may include embedded lateral connectors. The embedded lateral connectors may be configured to enable components to quickly couple to or plug into a PCB, thus saving time to form connections. The embedded lateral connectors may also reduce weight and/or size by avoiding need for bulky tradition collections with conventional components (e.g., solders, external pin connectors, etc.). The connectors may include male connectors, female connectors, and/or mounting connectors. The connectors may be configured to connect multiple PCBs together, such as using a stacked configuration, which may enable reducing a volume of space needed in a housing for the PCBs.