公开(公告)号：US5417577A

公开(公告)日：1995-05-23

申请号：US96880

申请日：1993-07-26

Applicant: Albert Holliday ,  Maureen B. Schmidt ,  Fred W. Verdi

Inventor： Albert Holliday ,  Maureen B. Schmidt ,  Fred W. Verdi

IPC: H05K3/32 ,  H05K3/36 ,  H01R4/58

CPC classification number: H05K3/368 ,  H01R12/714 ,  H05K2201/09418 ,  H05K2201/10378 ,  H05K3/325 ,  Y10T29/49126

Abstract: An improved electrical connection between each of a set of metallized areas (16) on a first substrate (11 ) and those on a second substrate (12), via a layer of anisotropically conductive material (22) sandwiched therebetween, is obtained by arraying the metallized areas in concentric rings about each of a plurality of fasteners (28) extending through both substrates and the material. By arraying the metallized areas in concentric rings about each fastener, the anisotropically conductive material in contact with the metallized areas arrayed in each ring will advantageously be subjected to a uniform pressure by the fastener, improving the conductivity of the material.

Abstract translation: 通过排列夹在其间的各向异性导电材料层（22），在第一基板（11）上的一组金属化区域（16）和第二基板（12）之间的金属化区域（16）中的每一个之间的改进的电连接 围绕延伸穿过两个基板和材料的多个紧固件（28）中的每一个的同心环的金属化区域。 通过将金属化区域围绕每个紧固件排列在同心环中，与每个环中排列的金属化区域接触的各向异性导电材料将有利地被紧固件承受均匀的压力，从而提高材料的导电性。

公开(公告)号：US4807794A

公开(公告)日：1989-02-28

申请号：US149189

申请日：1988-01-27

Applicant: Fritz Hess

Inventor： Fritz Hess

IPC: B23K1/08 ,  H05K3/34 ,  B23K37/04

CPC classification number: B23K1/085 ,  H05K3/3468 ,  H05K2201/09418 ,  Y10S269/903

Abstract: To match the soldering of an assembled printed-circuit board (13) to its assembly configuration, the circuit board (13) is brought in contact with a soldering wave (21) for a first time along a predetermined path (57, 58), and thereupon the circuit board is rotated about a vertical axis and is brought into contact, preferably with the same soldering save (21), a second time, along predetermined paths from the same direction during its motion along the paths (57, 58). The printed circuit board (13) may be rotated by an angle (.alpha.) depending on the assembly configuration relative to the direction of flow (56) of the soldering wave (21).

Abstract translation: 为了将组装的印刷电路板（13）的焊接与其组装结构相匹配，电路板（13）沿着预定路径（57,58）首次与焊接波（21）接触， 并且随后电路板围绕垂直轴线旋转，并且在其沿着路径（57,58）的运动期间，沿着相同方向沿预定路径，优选地以相同的焊接保存（21）接触第二次。 印刷电路板（13）可以相对于焊接波（21）的流动方向（56）的组装结构旋转角度（α）。

公开(公告)号：US4764848A

公开(公告)日：1988-08-16

申请号：US934297

申请日：1986-11-24

Applicant: John P. Simpson

Inventor： John P. Simpson

IPC: H01R12/04 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K3/3426 ,  H05K1/0271 ,  H05K2201/09418 ,  H05K2201/10704 ,  H05K2201/10757 ,  Y02P70/613

Abstract: An electrical assembly having an integrated circuit package which has a plurality of electrical conductors fixed thereto. The electrical conductors form mechanical and electrical connections. Each of the electrical conductors has a root at one end and a tip at the other end. The root of each conductor is attached to the integrated circuit package to form a fixed electrical and mechanical connection. The tip of each conductor is adapted to be connected to a surface at a predetermined location. Each of the electrical conductors has at least two bends between the root and the tip for providing strain relief when the tip is connected to a surface.

Abstract translation: 一种具有集成电路封装的电气组件，其具有固定到其上的多个电导体。 电导体形成机械和电气连接。 每个电导体在一端具有根部，在另一端具有尖端。 每个导体的根部连接到集成电路封装以形成固定的电气和机械连接。 每个导体的尖端适于在预定位置处连接到表面。 每个电导体在根部和尖端之间具有至少两个弯曲部，用于当尖端连接到表面时提供应变消除。

公开(公告)号：US3911569A

公开(公告)日：1975-10-14

申请号：US52502274

申请日：1974-11-18

Applicant: GEN MOTORS CORP

Inventor： HARTLEROAD RONALD J ,  GRABOWSKI JAMES P

IPC: H05K1/18 ,  H05K3/34 ,  H05K13/04

CPC classification number: H05K3/3421 ,  H05K1/182 ,  H05K13/0421 ,  H05K13/0465 ,  H05K2201/09418 ,  H05K2201/10924 ,  H05K2203/0195 ,  Y02P70/613 ,  Y10T29/49121 ,  Y10T29/49133

Abstract: A method and apparatus for transferring miniature semiconductor device pill-type components from a temporary carrier lead frame and directly bonding them to a printed circuit board. Each pilltype component has a semiconductor device chip encapsulated in a plastic body and a radial array of leads extending from the body. The circuit board has an opening in it to receive the pill body, and a plurality of conductors converging on the opening in a pattern corresponding to the pill leads. A pill on the lead frame is registered closely over a circuit board opening and its converging conductors. A combination transfer and soldering tool is registered over the pill. The bottom end of the tool is metal and has a periphery corresponding to and slightly smaller than the periphery of the pill leads. A heat insulating insert in the tool bottom end corresponds to the pill body. The tool is lowered, with the insert engaging the pill body, to separate the pill from the lead frame and press the pill body into the circuit board opening. The tool is heated to concurrently solder the pill leads to the circuit board conductors.

Abstract translation: 一种用于从临时载体引线框架传送微型半导体器件药片型部件并将其直接接合到印刷电路板的方法和装置。 每个药丸型组件具有封装在塑料体中的半导体器件芯片和从身体延伸的引线的径向阵列。 电路板在其中具有开口以接收药丸体，并且多个导体以对应于药丸引线的图案会聚在开口上。 引线框架上的药丸紧密地注册在电路板开口及其会聚导体上。 在药丸上注册了组合转移和焊接工具。 刀具的底端是金属的，并且具有对应于并且略小于药丸引线周边的周边。 工具底端的隔热插入物对应于药丸体。 工具降低，插入物与药丸体接合，以将药丸与引线框架分开，并将药丸体压入电路板开口。 该工具被加热以将药丸引线同时焊接到电路板导体。

公开(公告)号：US2904772A

公开(公告)日：1959-09-15

申请号：US43113354

申请日：1954-05-20

Applicant: ADMIRAL CORP

Inventor： ARTZ CHARLES A

IPC: H01R33/76 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/303 ,  H01R33/7628 ,  H05K3/3426 ,  H05K2201/09418 ,  H05K2201/10568 ,  H05K2201/10598 ,  Y02P70/613

公开(公告)号：US2897474A

公开(公告)日：1959-07-28

申请号：US47393054

申请日：1954-12-08

Applicant: UNITED CARR FASTENER CORP

Inventor： WILLANS HEATH CLARENCE

IPC: H01R33/76 ,  H05K3/30 ,  H05K7/12

CPC classification number: H01R33/7635 ,  H05K3/306 ,  H05K7/12 ,  H05K2201/09418 ,  H05K2201/10568 ,  H05K2201/10598

公开(公告)号：US11967597B2

公开(公告)日：2024-04-23

申请号：US17391036

申请日：2021-08-02

Applicant: Samsung Display Co., Ltd.

Inventor： Dae Geun Lee

IPC: H01L23/00 ,  G02F1/1345 ,  H01L27/12 ,  H05K1/11 ,  H05K1/18 ,  H10K59/131

CPC classification number: H01L27/124 ,  G02F1/13458 ,  H01L24/05 ,  H01L24/06 ,  H01L24/81 ,  H05K1/111 ,  H01L2224/05552 ,  H01L2224/06152 ,  H01L2224/81132 ,  H01L2924/3511 ,  H05K1/189 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/09709 ,  H05K2201/09954 ,  H05K2201/10128 ,  H05K2203/166 ,  H10K59/131 ,  Y02P70/50 ,  Y10T29/49005

Abstract: An electronic device, including an array substrate, a pad portion disposed on the array substrate, and an integrated circuit disposed on the pad portion and comprising a bump portion. The pad portion includes a first sub-pad unit including a first pad having an inclined shape and a second sub-pad unit including a second pad having an inclined shape. The first pad and the second pad are symmetrically arranged with respect to an imaginary line that divides the pad portion. The pad portion is electrically connected with the bump portion.

公开(公告)号：US20230156916A1

公开(公告)日：2023-05-18

申请号：US17938403

申请日：2022-10-06

Applicant: InnoLux Corporation

Inventor： Shang-Ru WU ,  Hua-Pin CHEN ,  Shuai WANG ,  Chien-Hao KUO

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/10128 ,  H05K2201/094 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/10287

Abstract: An electronic device is provided, including a working area and a peripheral area. The peripheral area is adjacent to the working area. The peripheral area includes a bonding area. The bonding area includes a first bonding pad area. The first bonding pad area includes a plurality of first bonding pads. A part of the first bonding pads are arranged along a first direction, and another part of the first bonding pads are arranged along a second direction. There is an included angle between the first direction and the second direction, and the included angle is greater than 0 degrees and less than 90 degrees.

公开(公告)号：US09894792B2

公开(公告)日：2018-02-13

申请号：US14048213

申请日：2013-10-08

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Han Sung Bae ,  Won Kyu Kwak

IPC: H05K1/00 ,  G02F1/1345 ,  H05K7/06 ,  H05K1/11 ,  H01L23/00 ,  H01L23/495 ,  H05K3/36

CPC classification number: H05K7/06 ,  G02F1/13458 ,  H01L23/49572 ,  H01L24/50 ,  H01L2224/50 ,  H01L2224/79 ,  H01L2224/86 ,  H01L2225/06579 ,  H01L2225/107 ,  H05K1/117 ,  H05K1/118 ,  H05K3/361 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2201/10128 ,  H05K2201/10681

Abstract: A display panel includes a display configured to display an image by receiving a drive signal, and a pad region including first and second pads groups configured to receive the drive signal from an external and to provide the received drive signal to the display, wherein the first pad group includes a plurality of first pads extending along a plurality of first imaginary lines, wherein the second pad group includes a plurality of second pads extending along a plurality of second imaginary lines, and wherein the plurality of first imaginary lines converges into a first point and the plurality of second imaginary lines converges into a second point, the first point and the second point are located at different positions.

公开(公告)号：US09877393B2

公开(公告)日：2018-01-23

申请号：US15107175

申请日：2014-12-24

Applicant: KYOCERA Corporation

Inventor： Michiaki Nishimura

IPC: H01G2/06 ,  H01K1/18 ,  H05K1/18 ,  H01G4/30 ,  H01G4/12 ,  H01G4/228 ,  H01G4/232 ,  H05K1/11 ,  H05K1/02 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34

CPC classification number: H05K1/181 ,  H01G2/06 ,  H01G4/12 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30 ,  H05K1/0271 ,  H05K1/111 ,  H05K3/305 ,  H05K3/321 ,  H05K3/3442 ,  H05K2201/09418 ,  H05K2201/10015 ,  Y02P70/611

Abstract: A laminated electronic component includes a main body composed of a stacked body in which dielectric layers and internal electrode layers are alternately laminated, and an external electrode disposed on an outer surface of the stacked body so as to make electrical connection with the internal electrode layers; and a first joining member and a second joining member which are provided on a first face side located in a stacking direction of the dielectric layers and the inner electrode layers. The first joining member and the second joining member are provided on a first side and second side which constitute the first face, respectively, and located in a region which includes midpoints thereof but does not include a vertex of the main body. By mounting such a laminated electronic component to a substrate via the joining members, acoustic noise can be suppressed.