公开(公告)号：US07307492B2

公开(公告)日：2007-12-11

申请号：US10306418

申请日：2002-11-27

Applicant: Alok Tripathi ,  Dennis J. Miller

Inventor： Alok Tripathi ,  Dennis J. Miller

IPC: H01P5/00 ,  H01P5/18 ,  G06F17/50

CPC classification number: H05K1/0245 ,  H05K1/023 ,  H05K1/0239 ,  H05K2201/09236 ,  H05K2201/09627 ,  H05K2201/09727 ,  H05K2201/10022

Abstract: An apparatus that includes a first conducting strip having a narrowed width where the first conducting strip also acts as a first electrode for a first tapping capacitance. The first tapping capacitance has a second electrode that is: 1) parallel to the first conducting strip; and 2) closer to the first conducting strip than a second conducting strip. The second conducting strip is parallel to the first conducting strip and has a narrowed width where the second conducting strip also acts as a first electrode for a second tapping capacitance. The second tapping capacitance has a second electrode that is: 1) parallel to the second conducting strip; and 2) closer to the second conducting strip than the first conducting strip.

Abstract translation: 一种装置，其包括具有变窄宽度的第一导电条，其中所述第一导电条还用作用于第一分接电容的第一电极。 第一分接电容具有第二电极，第二电极是：1）平行于第一导电条; 和2）比第二导电带更靠近第一导电条。 第二导电带平行于第一导电带并且具有窄的宽度，其中第二导电带还用作第二分接电容的第一电极。 第二分接电容具有第二电极，该第二电极是：1）平行于第二导电带; 和2）比第一导电条更靠近第二导电条。

公开(公告)号：US20070229189A1

公开(公告)日：2007-10-04

申请号：US11723359

申请日：2007-03-19

Applicant: Masashi Iwata

Inventor： Masashi Iwata

IPC: H03H9/72

CPC classification number: H05K1/0243 ,  H03H7/463 ,  H03H9/725 ,  H03H2001/0085 ,  H04B1/0057 ,  H05K1/0298 ,  H05K1/112 ,  H05K1/181 ,  H05K2201/09627 ,  H05K2201/09636 ,  H05K2201/1003 ,  H05K2201/10083

Abstract: A high frequency module incorporates a layered substrate. The layered substrate has a bottom surface and a top surface. Terminals are disposed on the bottom surface. SAW filters and inductors are mounted on the top surface. The layered substrate incorporates: a first conductor layer connecting the SAW filters to the inductors; a second conductor layer connected to the terminals and disposed at a location closer to the bottom surface than the first conductor layer; and a plurality of parallel signal paths each of which is formed using at least one through hole provided inside the layered substrate and each of which connects the first and second conductor layers to each other.

Abstract translation: 高频模块结合了层状衬底。 层状基板具有底面和顶面。 端子设置在底面。 SAW滤波器和电感器安装在顶面上。 层状衬底包括：将SAW滤波器连接到电感器的第一导体层; 连接到端子并且设置在比第一导体层更靠近底表面的位置处的第二导体层; 以及多个并行信号路径，每个平行信号路径使用设置在分层基板内部的至少一个通孔形成，并且每个通孔将第一和第二导体层彼此连接。

公开(公告)号：US07259336B2

公开(公告)日：2007-08-21

申请号：US10861387

申请日：2004-06-07

Applicant: Aneta Wyrzykowska ,  Herman Kwong ,  Luigi Difilippo

Inventor： Aneta Wyrzykowska ,  Herman Kwong ,  Luigi Difilippo

IPC: H01R12/04

CPC classification number: H05K1/112 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/09227 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09627 ,  H05K2201/10734

Abstract: A technique for improving power/ground flooding is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for improving power and ground flooding in a multilayer circuit board, the multilayer circuit board having a plurality of signal layers. The method may comprise forming a plurality of electrically conductive vias, wherein each of the plurality of electrically conductive vias extends through one or more of the plurality of signal layers. The method may also comprise routing signals associated with the plurality of electrically conductive vias, thereby creating at least one power/ground flooding channel. The method may additionally comprise forming at least one power/ground connection within the at least one power/ground flooding channel.

Abstract translation: 公开了一种改善电力/地面淹没的技术。 在一个特定的示例性实施例中，该技术可以被实现为用于改进多层电路板中的功率和地面淹没的方法，所述多层电路板具有多个信号层。 该方法可以包括形成多个导电通孔，其中多个导电通孔中的每一个延伸穿过多个信号层中的一个或多个。 该方法还可以包括与多个导电通孔相关联的路由信号，从而产生至少一个电力/地面淹没通道。 该方法可以另外包括在至少一个电力/地面淹没通道内形成至少一个电力/接地连接。

公开(公告)号：US20070007034A1

公开(公告)日：2007-01-11

申请号：US11474921

申请日：2006-06-26

Applicant: Arash Behziz ,  Roya Yaghmai

Inventor： Arash Behziz ,  Roya Yaghmai

IPC: H05K1/11 ,  H05K3/42

CPC classification number: H05K1/115 ,  G01R31/2889 ,  H05K3/3421 ,  H05K3/4602 ,  H05K2201/049 ,  H05K2201/09472 ,  H05K2201/09481 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09627 ,  H05K2201/10189 ,  Y10T29/49165

Abstract: In one embodiment, a laminated printed circuit board translator is provided. In some embodiments, the translator includes a receiving board adapted to receive a pin, the receiving board includes a plated via extending through the receiving board and has a hole for receiving a pin. An interface board laminated with the receiving board has a controlled depth via extending through it to contact a conductive trace. The conductive trace extends between the receiving board and the interface board to connect the plated via of the receiving board with the controlled depth via of the interface board. The controlled depth via is configured so that it is capable of being plated through a single sided drilled opening in the interface board. Some embodiments have a pad on the interface board connected to the controlled depth via.

Abstract translation: 在一个实施例中，提供了层压印刷电路板转换器。 在一些实施例中，翻译器包括适于接收销的接收板，接收板包括延伸穿过接收板的电镀通孔，并具有用于接收销的孔。 与接收板层压的接口板具有通过其延伸的受控深度以接触导电迹线。 导电迹线在接收板和接口板之间延伸，以将接收板的电镀通孔与接口板的受控深度通孔连接。 受控深度通孔被配置成能够通过接口板中的单面钻孔而进行电镀。 一些实施例在接口板上具有连接到受控深度通孔的垫。

公开(公告)号：US07148429B2

公开(公告)日：2006-12-12

申请号：US10877111

申请日：2004-06-25

Applicant: Samuel A. Carswell

Inventor： Samuel A. Carswell

IPC: H01R12/14 ,  H05K1/11

CPC classification number: H05K1/0218 ,  H05K1/0298 ,  H05K1/112 ,  H05K1/181 ,  H05K5/069 ,  H05K2201/09627 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2203/1147 ,  H05K2203/1572 ,  Y02P70/611

Abstract: A system for communicating with an electronic device within a sealed vessel comprises a generally enclosed housing having an opening. A printed circuit board is provided for covering the housing opening to create a fully enclosed sealed vessel. An electronic device is located within the interior of the sealed vessel and an external device is located outside the sealed vessel. At least one conductive path comprised of at least one conductive trace and at least one conductive via extends through the printed circuit board from the first surface located on the outside of the sealed vessel to a second surface located on the inside of the sealed vessel. The conductive path has a first end on the first surface which is connected to the external device and a second end on the second surface which is connected to the electronic device. In this manner, a communication path is established between the external device and the electronic device within the interior of the sealed vessel utilizing the at least one conductive path.

Abstract translation: 用于与密封容器内的电子设备通信的系统包括具有开口的大致封闭的壳体。 提供印刷电路板以覆盖壳体开口以形成完全封闭的密封容器。 电子设备位于密封容器的内部，外部设备位于密封容器外部。 由至少一个导电迹线和至少一个导电通孔组成的至少一个导电路径从位于密封容器外部的第一表面延伸穿过印刷电路板到位于密封容器内部的第二表面。 导电路径具有连接到外部装置的第一表面上的第一端和连接到电子装置的第二表面上的第二端。 以这种方式，利用至少一个导电路径在密封容器内部的外部设备和电子设备之间建立通信路径。

公开(公告)号：US20060254810A1

公开(公告)日：2006-11-16

申请号：US11488799

申请日：2006-07-19

Applicant: Herman Kwong ,  Luigi Difilippo ,  Guy Duxbury ,  Larry Marcanti

Inventor： Herman Kwong ,  Luigi Difilippo ,  Guy Duxbury ,  Larry Marcanti

IPC: H05K1/03 ,  H05K1/11

CPC classification number: H05K1/112 ,  H05K1/0231 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/0005 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09627 ,  H05K2201/10545 ,  H05K2201/10734 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A technique for accommodating electronic components on a multilayer signal routing device is disclosed. In one particular exemplary embodiment, the technique may be realized as a multilayer signal routing device comprising a primary surface and a secondary surface. The primary surface may have a plurality of electrically conductive pads formed thereon, wherein a group of the plurality of electrically conductive pads is in respective electrical connection with a group of electrically conductive micro-vias formed in the multilayer signal routing device. The secondary surface may have a channel formed thereon coinciding with the location of the group of electrically conductive micro-vias, wherein the channel has a channel area on the secondary surface for accommodating an electronic component mounted on the secondary surface.

Abstract translation: 公开了一种用于在多层信号路由设备上容纳电子部件的技术。 在一个特定的示例性实施例中，该技术可以被实现为包括主表面和次表面的多层信号路由设备。 主表面可以具有形成在其上的多个导电焊盘，其中一组多个导电焊盘与形成在多层信号路由装置中的一组导电微通孔分别电连接。 次表面可以具有与导电微通孔组的位置重合的通道，其中通道在次表面上具有用于容纳安装在次表面上的电子部件的通道区域。

公开(公告)号：US20060237843A1

公开(公告)日：2006-10-26

申请号：US11410560

申请日：2006-04-24

Applicant: Masaaki Yanaka

Inventor： Masaaki Yanaka

IPC: H01L23/48

CPC classification number: H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16195 ,  H05K1/114 ,  H05K3/4602 ,  H05K2201/09627 ,  H05K2201/10734 ,  H01L2224/0401

Abstract: Provided is a BGA-type multilayer circuit wiring board which is mounted on a printed wiring board directly via a solder ball with the electrode pad for solder ball connection formed thereon and in which the electric connection reliability of the filled via connected to the electrode pad for solder ball connection is not worsened. A wiring layer is formed on both surfaces of an insulating substrate; an electrode pad for solder bump for mounting a semiconductor chip thereon is formed on one surface of the substrate via an insulating layer; and an electrode pad for solder ball for connecting the structure to a printed wiring board is formed on the other surface thereof. The electrode pad for solder ball is electrically connected to the filled via; and the filled via is disposed in the intermediate position between the neighboring electrode pads for solder ball connection.

Abstract translation: 提供了一种BGA型多层电路布线板，其通过焊球直接安装在印刷布线板上，形成有用于焊球连接的电极焊盘，其中连接到电极焊盘的填充通孔的电连接可靠性 焊球连接不会恶化。 布线层形成在绝缘基板的两面上; 通过绝缘层在基板的一个表面上形成用于将半导体芯片安装在其上的用于焊料凸块的电极焊盘; 并且在其另一个表面上形成用于将结构连接到印刷线路板的用于焊球的电极焊盘。 用于焊球的电极焊盘与填充的通孔电连接; 并且填充的通孔设置在用于焊球连接的相邻电极焊盘之间的中间位置。

公开(公告)号：US20060237225A1

公开(公告)日：2006-10-26

申请号：US10546620

申请日：2004-02-05

Applicant: Takashi Kariya ,  Akiyoshi Tsuda

Inventor： Takashi Kariya ,  Akiyoshi Tsuda

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H01L24/06 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48235 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/144 ,  H05K1/183 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09627 ,  H05K2203/049 ,  H05K2203/0733 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

Abstract: In a multi-layer printed wiring board 100 comprising single side circuit boards A, B and for accommodating an IC chip 70, BGAs 56 are disposed on its front and rear faces, so that with an IC module 120 mounted through the BGA 56 on the front face, this board can be connected to a printed wiring board through the BGA 56 on the rear face. Thus, freedom in the configuration of the IC module mounted increases so that various kinds of the IC modules can be loaded.

Abstract translation: 在包括单侧电路板A，B并且用于容纳IC芯片70的多层印刷线路板100中，在其前表面和后表面上布置有BGA 56，使得通过在BGA 56上安装的IC模块120 正面，该板可以通过后面的BGA 56连接到印刷电路板。 因此，安装的IC模块的结构自由度增加，从而可以加载各种IC模块。

公开(公告)号：US07119285B2

公开(公告)日：2006-10-10

申请号：US10790310

申请日：2004-03-01

Applicant: Deok-heung Kim ,  Bong-hui Lee

Inventor： Deok-heung Kim ,  Bong-hui Lee

IPC: H05K1/00 ,  H05K1/03

CPC classification number: H05K1/028 ,  H05K3/28 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09627 ,  H05K2201/0979 ,  H05K2201/10666

Abstract: A flexible printed circuit board (FPCB) which prevents a short circuit due to a crack in a bending portion is provided. The FPCB includes an end portion, a bending portion extended from the end portion, and a circuit portion extended from the bending portion. The improved FPCB includes a base film which is flexible and comprises a first via-hole formed adjacent to the end portion and the bending portion and a second via-hole formed adjacent to the bending portion and the circuit portion, a first conductive layer formed on an outer surface of at least the end portion and the bending portion, a cover layer formed on the first conductive layer, a second conductive layer which is formed on an inner surface of the end portion and is electrically connected to the first conductive layer through the first via-hole, and a third conductive layer which is formed on an inner surface of the extension circuit portion and is electrically connected to the first conductive layer through the second via-hole.

Abstract translation: 提供一种柔性印刷电路板（FPCB），其防止由于弯曲部分的裂纹引起的短路。 FPCB包括端部，从端部延伸的弯曲部和从弯曲部延伸的电路部。 改进的FPCB包括柔性的基膜，包括邻近端部和弯曲部分形成的第一通孔和邻近弯曲部分和电路部分形成的第二通孔，形成在第一导电层上的第一导电层 至少所述端部和所述弯曲部的外表面，形成在所述第一导电层上的覆盖层，形成在所述端部的内表面上并通过所述第一导电层电连接到所述第一导电层的第二导电层 第一导电孔和第三导电层，其形成在延伸电路部分的内表面上，并通过第二通孔与第一导电层电连接。

公开(公告)号：US20060180917A1

公开(公告)日：2006-08-17

申请号：US11345626

申请日：2006-02-02

Applicant: Srdjan Djordjevic ,  Wolfgang Hoppe

Inventor： Srdjan Djordjevic ,  Wolfgang Hoppe

IPC: H01L23/52

CPC classification number: H05K1/115 ,  H05K1/0216 ,  H05K1/0298 ,  H05K1/181 ,  H05K3/429 ,  H05K2201/09227 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09627 ,  H05K2201/10689 ,  H05K2203/1572

Abstract: A circuit board includes a first group of layers located close to a top side of the circuit board, and a second group of layers located close to an underside of the circuit board. Signals which are fed to input and output contact terminals on the top side of the circuit board are passed along at least one of the layers of the group. Signals which are fed to input and output contact terminals on the underside of the circuit board are passed along at least one of the layers of the second group. The contact-making holes for connecting the input and output contact terminals to the layers of the first and second groups are preferably formed as blind contact-making holes.

Abstract translation: 电路板包括位于电路板的顶侧附近的第一组层，以及位于电路板的下侧附近的第二组层。 馈送到电路板顶部的输入和输出接触端子的信号沿着该组的至少一个层通过。 馈送到电路板下侧的输入和输出接触端子的信号沿着第二组的至少一层传送。 用于将输入和输出接触端子连接到第一和第二组的层的接触孔优选地形成为盲接触形成孔。