公开(公告)号：US5453582A

公开(公告)日：1995-09-26

申请号：US396867

申请日：1995-03-01

Applicant: Toshiaki Amano ,  Kazuhito Hikasa ,  Seishi Kumamoto ,  Takahiro Fujiwara

Inventor： Toshiaki Amano ,  Kazuhito Hikasa ,  Seishi Kumamoto ,  Takahiro Fujiwara

IPC: B23K35/00 ,  B23K35/34 ,  H05K1/11 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K3/3421 ,  B23K35/34 ,  H05K1/111 ,  B23K35/007 ,  H05K2201/09381 ,  H05K2201/097 ,  H05K2201/10689 ,  H05K2203/042 ,  H05K2203/1157 ,  H05K2203/125 ,  H05K3/3484 ,  Y02P70/611 ,  Y02P70/613

Abstract: A large number of pads, to which component leads are to be soldered, are formed on an insulating substrate so as to constitute a pad array. Colder layers are precoated on the pads. Each of the pads has a component lead mounting portion where a component lead is to be mounted, and a component lead non-mounting portion where no component lead is to be mounted. The component lead non-mounting portion includes a wide part having a width greater than that of the component lead mounting portion.

Abstract translation: 为了构成焊盘阵列，在绝缘基板上形成有要焊接有组分引线的大量焊盘。 更硬的层预涂在垫上。 每个焊盘具有要安装部件引线的部件引线安装部分和不安装部件引线的部件引线非安装部分。 部件引线非安装部分包括具有大于部件引线安装部分的宽度的宽部分。

公开(公告)号：US5397862A

公开(公告)日：1995-03-14

申请号：US115175

申请日：1993-08-31

Applicant: David E. Bockelman ,  Douglas H. Weisman

Inventor： David E. Bockelman ,  Douglas H. Weisman

IPC: H05K1/11 ,  H01L23/498 ,  H01L23/538 ,  H04B3/32 ,  H05K1/02 ,  H05K9/00 ,  H05K1/00

CPC classification number: H05K9/0039 ,  H01L23/49838 ,  H01L23/5386 ,  H04B3/32 ,  H05K1/0228 ,  H01L2223/6638 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0245 ,  H05K2201/097 ,  H05K2201/10689

Abstract: A twisted-pair conductor line structure is formed on a substrate (22) having insulated conductive layers (10, 11). The conductive layers are used to form first, second, third, and fourth conductive planar segments (16). A first conductive link (17) joins the first and second planar conductive segments to provide a first signal path. Similarly, a second conductive link (17) joins the third and fourth planar conductive segments to provide a second signal path. The first and second conductive links are operatively arranged to form a twist (17)in the first and second signal paths, such that the resulting magnetic fields (57, 59) around the twisted conductive segments will be opposite to each other for cancelling each other out, in order to reduce the magnetic field radiation to the surrounding environment.

Abstract translation: 在具有绝缘导电层（10,11）的基板（22）上形成双绞导体线结构。 导电层用于形成第一，第二，第三和第四导电平面段（16）。 第一导电连接（17）连接第一和第二平面导电段以提供第一信号路径。 类似地，第二导电连接（17）连接第三和第四平面导电段以提供第二信号路径。 第一和第二导电连接件被可操作地布置成在第一和第二信号路径中形成扭转（17），使得围绕扭转的导电段的所得到的磁场（57,59）将彼此相对以抵消彼此 出来，以减少对周围环境的磁场辐射。

公开(公告)号：US5397861A

公开(公告)日：1995-03-14

申请号：US964346

申请日：1992-10-21

Applicant: David H. Urquhart, II

Inventor： David H. Urquhart, II

IPC: H05K1/00 ,  H05K1/02

CPC classification number: H05K1/0228 ,  H05K1/0219 ,  H05K1/0245 ,  H05K1/0298 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09672 ,  H05K2201/097

Abstract: An electrical interconnection board (e.g., a backplane) in which connection positions are spaced along one dimension of the board. Each connection position includes holes for making electrical connections. Layers of the board each have a pattern of conductive path segments connecting holes at each connection position with corresponding holes at other connection positions. The path segments together define continuous conductive routes along the length of the board. Each conductive route includes path segments which respectively lie on different layers. This arrangement increases the distance along which any two pairs of the conductive routes are adjacent each other on a layer, thus reducing interference (e.g., mutual coupling and crosstalk) and improving signal transmission characteristics.

Abstract translation: 电连接板（例如，背板），其中连接位置沿着板的一个尺寸间隔开。 每个连接位置包括用于进行电气连接的孔。 板的层每个都具有导电路径段的图案，其在每个连接位置处连接孔，在其它连接位置连接相应的孔。 路径段一起定义沿着板的长度的连续导电路线。 每个导电路径包括分别位于不同层上的路段。 这种布置增加了任何两对导电路线在层上彼此相邻的距离，从而减少干扰（例如，互耦合和串扰）并改善信号传输特性。

公开(公告)号：US5061190A

公开(公告)日：1991-10-29

申请号：US567123

申请日：1990-08-14

Applicant: James A. Medeiors ,  R. A. Beverly ,  Ty F. Safreno

Inventor： James A. Medeiors ,  R. A. Beverly ,  Ty F. Safreno

IPC: H05K1/11

CPC classification number: H05K1/117 ,  H01R12/721 ,  H05K2201/097

Abstract: A printed circuit card and card edge connector for use with a 32-bit bus include respectively a pattern of conductive fingers and pins in the connector that render the card electrically compatible with existing 8-bit STD connectors and that render the card edge connector electrically compatible with existing 8-bit STD cards. the latter compatibility makes it possible to use in 32-bit systems any of the more than a thousand existing 8-bit circuits without modification; while the former compatibility makes available to 8-bit systems an easy path to growth and the expanded computational power of a 32-bit system.

Abstract translation: 用于32位总线的印刷电路卡和卡缘连接器分别包括连接器中的导电指状物和引脚的图案，使得卡与现有的8位STD连接器电气兼容，并使卡边缘连接器电气兼容 与现有的8位STD卡。 后者的兼容性使得可以在32位系统中使用任何一千多个现有的8位电路，无需修改; 而前者的兼容性使得8位系统成为一个简单的增长之路和32位系统的扩展计算能力。

公开(公告)号：US5036160A

公开(公告)日：1991-07-30

申请号：US432472

申请日：1989-11-07

Applicant: Joseph M. Jackson

Inventor： Joseph M. Jackson

IPC: H05K1/02 ,  H05K7/14 ,  H05K9/00

CPC classification number: H05K7/1459 ,  H05K1/0228 ,  H05K9/0039 ,  H05K1/0245 ,  H05K2201/044 ,  H05K2201/097

Abstract: A backplane having a layer of insulation material, a plurality of lead segments arranged in line and spaced from one another on a first surface of the insulation material, a plurality of cooperating lead segments arranged in line and spaced from one another on a second surface of the insulation material, and connectors for interconnecting the ends of alternate segments on the first and second surfaces to form a first continuous line alternating between lead segments on the first and second surfaces. Connectors are also provided for connecting the ends of alternate segments on the first and second surfaces to form a second continuous line separate from the first line, the first and second lines twisting along the axis of signal propagation to produce a twisted pair in the backplane.

Abstract translation: 一种具有绝缘材料层的背板，在绝缘材料的第一表面上彼此排列并彼此间隔开的多个引线段，多个协作引线段，其彼此排列并彼此间隔开，第二表面 绝缘材料和连接器，用于将第一和第二表面上的交替段的端部互连，以形成在第一和第二表面上的引线段之间交替的第一连续线。 还提供连接器，用于连接第一和第二表面上的交替段的端部以形成与第一线分离的第二连续线，第一和第二线沿着信号传播的轴线扭转以在背板中产生双绞线。

公开(公告)号：US4785135A

公开(公告)日：1988-11-15

申请号：US72833

申请日：1987-07-13

Applicant: Mario E. Ecker ,  Leonard T. Olson

Inventor： Mario E. Ecker ,  Leonard T. Olson

IPC: H05K1/02 ,  H05K1/00 ,  H05K3/00

CPC classification number: H05K1/0228 ,  H01R13/6461 ,  H01R13/6474 ,  H05K1/0245 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/097 ,  Y10T29/49124

Abstract: Arrangement for reducing cross talk between electrical circuit conductors wherein the conductors lie within individual parallel channels within the same plane or different parallel planes within the induced voltage or cross talk region of an energized and a quiet conductor and either converge or diverge with respect to each other. The amount of relative convergence or divergence, preferably mor than six degrees and less than 15 degrees, is that required to attenuate the magnitude of any signal induced by the activated conductor in a neighboring or quiet conductor to maintain an acceptable and desired signal-to-noise ratio.

公开(公告)号：US4538210A

公开(公告)日：1985-08-27

申请号：US479996

申请日：1983-03-29

Applicant: Werner Schaller

Inventor： Werner Schaller

IPC: H01L23/50 ,  H01R33/74 ,  H05K1/18 ,  H05K3/32 ,  H05K3/40 ,  H05K7/10 ,  H05K1/16

CPC classification number: H05K1/184 ,  H05K3/326 ,  H05K7/1053 ,  H01R12/52 ,  H05K2201/0397 ,  H05K2201/097 ,  H05K2201/10681 ,  H05K3/4046 ,  H05K3/4092

Abstract: A circuit board having a window for receiving an electronic device substantially in the form of a plate is provided with elastic holding tabs of at least two different lengths which project into the window, the tabs forming the ends of conductor runs on the circuit board. Upon a pushing of the plate through the window, the short holding tabs snap back and the plate becomes clamped to the circuit board by the holding tabs, these tabs also serving to complete the electrical coupling between the conductor runs of the circuit board and contacts on the plate.

Abstract translation: 具有用于接收基本上为板形式的电子设备的窗口的电路板设置有突出到窗口中的至少两个不同长度的弹性保持突片，形成导体端部的突片在电路板上延伸。 当板通过窗口推动时，短的保持片卡扣后退，并且板通过固定突片夹紧到电路板上，这些接片还用于完成电路板的导体连接和电路板上的触点之间的电耦合 碟子。

公开(公告)号：US4253231A

公开(公告)日：1981-03-03

申请号：US868581

申请日：1978-01-11

Applicant: Christian Nouet

Inventor： Christian Nouet

IPC: G02B6/35 ,  H01F5/00 ,  H01F17/00 ,  H01F41/02 ,  H01F41/04 ,  H01F41/14 ,  H05K1/05 ,  H05K1/16

CPC classification number: G02B6/3572 ,  H01F17/0033 ,  H01F41/02 ,  H01F41/046 ,  H01F41/14 ,  H05K1/165 ,  G02B6/353 ,  G02B6/3552 ,  H05K1/056 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/097 ,  H05K2201/10053 ,  Y10T29/4902 ,  Y10T29/4913 ,  Y10T29/49146

Abstract: A planar support member for an electric circuit, e.g. a printed circuit board, wherein at least a region of the support member includes magnetic material through at least a part of its thickness. A magnetic circuit is made in this material by forming at least one opening through it. The support member is then coated with insulative material and conductor paths are made on both faces of the support member by conventional techniques for such members. These paths include a winding disposed around a core part of the magnetic circuit with alternate half turns being formed on opposite faces and interconnected by through plating. The inductive circuit thus formed may constitute an inductor, a transformer or a relay.

Abstract translation: 用于电路的平面支撑构件，例如， 印刷电路板，其中所述支撑构件的至少一个区域包括通过其厚度的至少一部分的磁性材料。 通过在其中形成至少一个开口，在该材料中形成磁路。 然后用绝缘材料涂覆支撑构件，并且通过这种构件的常规技术在支撑构件的两个面上形成导体路径。 这些路径包括设置在磁路的核心部分周围的绕组，在相对的两个面上形成交替的半圈并通过电镀互相连接。 由此形成的感应电路可以构成电感器，变压器或继电器。

公开(公告)号：US4082394A

公开(公告)日：1978-04-04

申请号：US756227

申请日：1977-01-03

Applicant: Ronald Walker Gedney ,  Robert Richard Rodite

Inventor： Ronald Walker Gedney ,  Robert Richard Rodite

IPC: H01L23/32 ,  H01L23/50 ,  H01L23/52 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36 ,  H05K1/12

CPC classification number: H01R12/58 ,  H05K1/141 ,  H01L2224/16225 ,  H05K2201/09063 ,  H05K2201/096 ,  H05K2201/097 ,  H05K2201/09709 ,  H05K2201/10303 ,  H05K2201/10659 ,  H05K2201/10704 ,  H05K2201/10939 ,  H05K3/3447 ,  H05K3/368

Abstract: A package assembly which combines metallized ceramic technology and printed circuit board multilayer technology. A plurality of modules on a metallized ceramic substrate have closely spaced pins, for example, on 50 mil centers or grid, are plugged into a complex high precision multilayer printed circuit carrier. The pins are staggered in height with the longer pins having a relatively wide spacing, for example, on 100 mil centers or grid. The longer pins protrude through the high precision carrier and plug into a normal relatively simple and low cost printed circuit card or planar package.

公开(公告)号：US3876822A

公开(公告)日：1975-04-08

申请号：US42729473

申请日：1973-12-21

Applicant: HONEYWELL BULL SA

Inventor： DAVY GERALD ALBERT ,  LE GOVIC BERNARD LOUIS ,  LAGRANGE JEAN-PAUL ,  PROUIN JEAN-CLAUDE ADRIEN ,  SANDOZ JEAN LOUIS

IPC: H05K3/46 ,  H01R12/50 ,  H05K1/02 ,  H05K3/42 ,  H05K1/04

CPC classification number: H05K1/0219 ,  H01R12/721 ,  H01R12/737 ,  H05K1/0228 ,  H05K1/0237 ,  H05K1/0245 ,  H05K3/429 ,  H05K2201/044 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/09609 ,  H05K2201/09618 ,  H05K2201/09672 ,  H05K2201/097

Abstract: An electrical connection board containing a number of planes of conducting elements, with each pair of planes attached to the two faces of an insulating plate, arranged so that the conducting elements of one plane do not overlap those of other planes, with regularly spaced rows and columns of metallized connecting holes interposed therethrough. The conducting elements are capable of transmitting high-frequency pulses exhibiting steep edges without undesirable cross-talk phenomena resulting.