公开(公告)号：US20150180107A1

公开(公告)日：2015-06-25

申请号：US14135131

申请日：2013-12-19

Applicant: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.

Inventor： Eric R. Ao ,  Donald R. Dignam ,  Stephen J. Flint ,  Jian Meng

IPC: H04B3/28

CPC classification number: H01P1/212 ,  H01P1/2039 ,  H01P3/085 ,  H01P3/10 ,  H05K1/0251 ,  H05K2201/09781

Abstract: Embodiments of the present invention provide for a transmission circuit that includes a transmission line and a conductive via. The transmission line is electrically coupled to a first conductive via and a second conductive via. The first conductive via includes a first via stub, wherein the transmission line is configured to transmit a signal that is coupled to the first conductive via, and wherein the first via stub extends beyond the transmission line. The second conductive via includes a second via stub, wherein the transmission line is configured to transmit a signal that is coupled to the second conductive via, and wherein the second via stub extends beyond the transmission line. A transmission line stub is electrically coupled to the transmission line or to at least one of the conductive vias, wherein the length of the transmission line stub is configured to suppress a preselected frequency.

Abstract translation: 本发明的实施例提供一种包括传输线和导电通孔的传输电路。 传输线电耦合到第一导电通孔和第二导电通孔。 第一导电通孔包括第一通孔短路，其中传输线被配置为传输耦合到第一导电通孔的信号，并且其中第一通路短路延伸超过传输线。 第二导电通孔包括第二通路短路，其中传输线被配置为传输耦合到第二导电通孔的信号，并且其中第二通路短线延伸超过传输线。 传输线短截线电耦合到传输线或至少一个导电通孔，其中传输线短截线的长度被配置为抑制预选频率。

公开(公告)号：US20150162886A1

公开(公告)日：2015-06-11

申请号：US14264756

申请日：2014-04-29

Applicant: Newlans, Inc.

Inventor： Bouchaib Cherif

IPC: H03H7/01

CPC classification number: H05K1/0292 ,  H01G5/14 ,  H01G5/16 ,  H01G5/18 ,  H01P1/20336 ,  H05K1/024 ,  H05K1/025 ,  H05K1/16 ,  H05K1/162 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2203/171

Abstract: A tunable filter design. The filter is implemented using transmission line sections as inductive and capacitive components. At least one capacitive component is a tunable capacitor. In some implementations, the tunable capacitor may be an interdigitated array of finger elements arranged so that the spacing between fingers may be adjusted. The design has a number of advantages including high capacitance for a given circuit area, small area for a given desired capacitance, mechanical stability, high self resonance frequency, and high quality factor.

Abstract translation: 可调滤波器设计。 滤波器使用传输线路段作为电感和电容分量来实现。 至少一个电容元件是可调电容器。 在一些实施方案中，可调谐电容器可以是布置成使得可以调整手指之间的间隔的指状元件的交叉指列阵列。 该设计具有许多优点，包括给定电路面积的高电容，给定期望电容的小面积，机械稳定性，高自谐振频率和高品质因数。

公开(公告)号：US09030512B2

公开(公告)日：2015-05-12

申请号：US13910852

申请日：2013-06-05

Applicant: Tom Marttila

Inventor： Tom Marttila

IPC: B41J2/47 ,  B41J2/045 ,  B23K26/03 ,  B23K26/08 ,  B41J11/46 ,  G01D15/14

CPC classification number: B41J2/04505 ,  B23K26/032 ,  B23K26/0846 ,  B41J11/46 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0097 ,  H05K3/046 ,  H05K2201/0355 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/0522 ,  H05K2203/107 ,  H05K2203/108 ,  H05K2203/1545

Abstract: A laser process alignment measuring method applicable to a reel-to-reel manufacturing process including a laser process stage, wherein before at least one laser process stage, marks, patterns or surfaces (4,9) are made with printing ink on the base or carrier material of the web (2), and on which the laser beam used can make a mark (7, 10), for example, by removing or changing the printing ink, whereby at the laser process stage, another mark is plotted with the laser beam on the mark et al. printed with printing ink, and the position of the mark et al. printed with printing ink (4, 9) and the mark plotted with the laser (7, 10) are read optically to measure the alignment of the printing ink stage and the laser process stage.

Abstract translation: 一种适用于包括激光处理台的卷对卷制造过程的激光工艺对准测量方法，其中在至少一个激光加工台，标记，图案或表面（4,9）之前用印刷油墨制成在基座上， 纤维网（2）的载体材料，并且其上使用的激光束可以通过例如去除或改变印刷油墨来形成标记（7,10），由此在激光处理阶段，绘制另一个标记 激光束在标记等 印有印刷油墨，标记等的位置。 用印刷油墨（4,9）印刷并用激光（7,10）绘制的标记被光学读出以测量印刷油墨台和激光加工台的对准。

公开(公告)号：US08994470B2

公开(公告)日：2015-03-31

申请号：US14113187

申请日：2012-04-25

Applicant: Jun Sakai

Inventor： Jun Sakai

IPC: H01P7/08 ,  H05K1/02 ,  H01P1/203 ,  H05K1/16

CPC classification number: H01P7/08 ,  H01P1/20345 ,  H01P7/082 ,  H05K1/0225 ,  H05K1/0243 ,  H05K1/0253 ,  H05K1/165 ,  H05K2201/09263 ,  H05K2201/09336 ,  H05K2201/09781

Abstract: A circuit substrate has three wiring layers, wherein a signal line is formed in a first wiring layer; a ground plane is formed in a second wiring layer; a resonant line is formed in a third wiring layer. A circumferential slit is formed in the ground plane, wherein an island electrode separated from the ground plane is formed inside the slit. The left end of the resonant line is connected to the island electrode through an interlayer-connecting via, while the right end of the resonant line is connected to the ground plane through an interlayer-connecting via. A transmission line (or a microstrip line) is formed using the signal line and the ground plane, and therefore a complex resonator is formed to embrace the transmission line. This achieves band elimination with regard to a signal component of a resonance frequency among signals propagating through the microstrip line. Thus, it is possible to form a noise suppression structure without mounting additional parts on the circuit substrate, and therefore it is possible to effectively eliminate power distribution noise and noise propagating through the signal line with a small and simple configuration.

Abstract translation: 电路基板具有三个布线层，其中信号线形成在第一布线层中; 在第二布线层中形成接地平面; 在第三布线层中形成谐振线。 在接地平面内形成有周向狭缝，在狭缝内部形成有与接地面分离的岛状电极。 谐振线路的左端通过层间连接通孔连接到岛状电极，而谐振线路的右端通过层间连接通孔连接到接地层。 使用信号线和接地层形成传输线（或微带线），因此形成复数谐振器以包围传输线。 这实现了通过微带线传播的信号中的谐振频率的信号分量的频带消除。 因此，可以形成噪声抑制结构而不在电路基板上安装附加部件，因此可以以简单的结构有效地消除通过信号线传播的功率分配噪声和噪声。

公开(公告)号：US08982112B2

公开(公告)日：2015-03-17

申请号：US13345842

申请日：2012-01-09

Applicant: Sung Gyu Kim ,  Jae Mo Jung

Inventor： Sung Gyu Kim ,  Jae Mo Jung

IPC: G06F3/038 ,  G09G5/00 ,  G02F1/1345 ,  H05K3/36 ,  H05K1/11 ,  H05K3/32

CPC classification number: G02F1/13452 ,  G02F1/13458 ,  H05K1/11 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09481 ,  H05K2201/09781 ,  H05K2201/0979 ,  H05K2201/10128

Abstract: Embodiments may be directed to a display panel includes a base substrate including a display region having a plurality of pixels and a non-display region adjacent to the display region, a connecting line in the non-display region and including at least a first input pad, a second input pad, and an output pad, and an insulating layer on the connecting line. The insulating layer includes at least one first contact hole exposing at least a portion of the first input pad, at least one second contact hole exposing at least a portion of the second input pad, and at least one third contact hole between the first contact hole and the second contact hole. A first contact electrode, a second contact electrode, and a dummy contact electrode are disposed at the first, second and third contact holes, respectively.

Abstract translation: 实施例可以涉及一种显示面板，包括：基底基板，包括具有多个像素的显示区域和与显示区域相邻的非显示区域;非显示区域中的连接线，并且至少包括第一输入焊盘 ，第二输入焊盘和输出焊盘，以及连接线上的绝缘层。 绝缘层包括暴露第一输入焊盘的至少一部分的至少一个第一接触孔，暴露第二输入焊盘的至少一部分的至少一个第二接触孔以及第一接触孔之间的至少一个第三接触孔 和第二接触孔。 第一接触电极，第二接触电极和虚拟接触电极分别设置在第一，第二和第三接触孔处。

公开(公告)号：US08963017B2

公开(公告)日：2015-02-24

申请号：US13595060

申请日：2012-08-27

Applicant: Gentaro Masuda ,  Kouji Kondoh ,  Kenji Kondoh ,  Hidetada Kajino

Inventor： Gentaro Masuda ,  Kouji Kondoh ,  Kenji Kondoh ,  Hidetada Kajino

IPC: H05K1/16 ,  H05K3/46 ,  H05K1/18 ,  H05K3/40

CPC classification number: H05K3/4626 ,  H01L2224/16225 ,  H05K1/186 ,  H05K3/4069 ,  H05K2201/0195 ,  H05K2201/09781 ,  H05K2203/061

Abstract: In a multilayer board, a stacked body includes thermoplastic resin films and low-fluidity resin films with conductive patterns, which are alternately stacked. The stacked body and a resin base film are integrated by hot pressing. The base film has a terminal-connecting through hole for receiving an electrode terminal of an electronic component to be connected to a conductive pattern of the low-fluidity resin film disposed at an end of the stacked body. An electronic component mounting section of the stacked body, which is an area corresponding to the electronic component mounted on the base film in a stacking direction, is configured such that a number of the conductive patterns located in a corresponding section that corresponds to the through hole in the stacking direction is greater than a number of the conductive patterns located in a non-corresponding section without corresponding to the through hole in the stacking direction.

Abstract translation: 在多层板中，层叠体包含交替层叠的热塑性树脂膜和具有导电图案的低流动性树脂膜。 层叠体和树脂基膜通过热压整合。 基膜具有端子连接通孔，用于接收要连接到布置在层叠体的端部的低流动性树脂膜的导电图案的电子部件的电极端子。 作为层叠体的电子部件安装部，其是与层叠方向上安装在基膜上的电子部件对应的区域，被配置为使得位于与通孔对应的对应部分中的多个导电图案 层叠方向上的导电图案的数量大于不对应于层叠方向上的通孔的非对应部的导体图案。

公开(公告)号：US20150014043A1

公开(公告)日：2015-01-15

申请号：US14311966

申请日：2014-06-23

Applicant: OMRON CORPORATION

Inventor： Akihiro HOZUMI

IPC: H05K1/11

CPC classification number: H05K1/116 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/09627 ,  H05K2201/09781 ,  H05K2201/0999 ,  H05K2201/2045

Abstract: A printed wiring board including a connection part that is connected to a projecting portion of an external member by soldering, the connection part including a first hole in which the projecting portion is inserted, a main land to which the projecting portion is soldered, a metallic pattern that is drawn from the main land, and a sub-land that is connected to the main land through the metallic pattern, wherein the main land is constructed with a metallic film configured to cover a peripheral region of the first hole in at least a front face of the printed wiring board including the front face and a back face, the front face to which the soldering is performed and the back face on a side opposite to the front face, and the metallic film is not formed on a sidewall forming the first hole, and where the sub-land is constructed with a metallic film configured to cover a sidewall formed by a second hole piercing the printed wiring board and a peripheral region of the second hole in both the front face and the back face of the printed wiring board.

Abstract translation: 一种印刷电路板，包括通过焊接连接到外部构件的突出部分的连接部分，所述连接部分包括突出部分被插入的第一孔，突出部分被焊接到的主区域，金属 以及通过金属图案连接到主焊盘的子地面，其中主焊盘构造有金属膜，该金属膜被构造成至少覆盖第一孔的周边区域 印刷电路板的前表面包括正面和背面，执行焊接的正面和与正面相反的一侧的背面，金属膜不形成在形成 第一孔，并且其中子区域被构造成金属膜，金属膜被构造成覆盖由穿过印刷线路板的第二孔和第二孔的外围区域形成的侧壁 e正面和印刷电路板的背面。

公开(公告)号：US08930083B2

公开(公告)日：2015-01-06

申请号：US12543113

申请日：2009-08-18

Applicant: Stephen Gillman ,  John R. Hoffman ,  Brian T. Murray ,  Wayne B. Thomas

Inventor： Stephen Gillman ,  John R. Hoffman ,  Brian T. Murray ,  Wayne B. Thomas

IPC: A01B69/00 ,  B62D6/00 ,  B62D12/00 ,  B62D11/00 ,  B63G8/20 ,  B63H25/04 ,  G05D1/00 ,  G06F7/00 ,  G06F17/00 ,  G06F19/00 ,  H05K1/02 ,  B62D5/04 ,  H05K5/06 ,  H05K3/28

CPC classification number: H05K1/0268 ,  B62D5/0406 ,  B62D5/0481 ,  H05K3/284 ,  H05K5/064 ,  H05K2201/09781 ,  H05K2201/0989 ,  H05K2203/163

Abstract: An electric power steering system is provided. It comprises a steering assist assembly and a motor assembly that actuates the steering assist assembly. A control module that provides steering assist commands to the motor assembly, the control module including a circuit board having a first portion having circuits thereon and a second portion that includes at least one sensor circuit that receives signals from at least one sensor subsystem. A potting material coats only the first portion of the circuit board.

Abstract translation: 提供电动助力转向系统。 其包括转向辅助组件和致动转向辅助组件的马达组件。 一种向所述电动机组件提供转向辅助命令的控制模块，所述控制模块包括电路板，所述电路板具有其上具有电路的第一部分和包括从至少一个传感器子系统接收信号的至少一个传感器电路的第二部分。 灌封材料仅覆盖电路板的第一部分。

公开(公告)号：US20140374596A1

公开(公告)日：2014-12-25

申请号：US14375065

申请日：2013-01-29

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Kazuyoshi Tari ,  Mototaka Ishikawa ,  Keiji Shirata ,  Kenzo Nakamura

IPC: G01J5/10 ,  G01J5/08

CPC classification number: G01J5/10 ,  G01J5/0022 ,  G01J5/06 ,  G01J5/0803 ,  G01J2005/103 ,  G01J2005/206 ,  G03G15/2039 ,  G03G2215/00772 ,  H01L27/144 ,  H01L37/02 ,  H05K1/0271 ,  H05K1/189 ,  H05K2201/068 ,  H05K2201/09136 ,  H05K2201/09781

Abstract: Provided is an infrared sensor which is capable of measuring a temperature of an object to be measured with high accuracy even when lead wires are connected to one side thereof. The infrared sensor includes an insulating film; a first and a second heat sensitive element which are provided on one face of the insulating film; a first and a second wiring film that are respectively connected to the first and the second heat sensitive element; an infrared reflecting film; a plurality of terminal electrodes; and a thermal resistance adjusting film which is provided on the other face of the insulating film, is in opposition to at least a portion of the longer one of the first or the second wiring film in wiring distance from the terminal electrodes, and is formed of a material with greater heat dissipation than the insulating film.

Abstract translation: 提供一种能够即使在将引线连接到其一侧时也能够以高精度测量被测量物体的温度的红外线传感器。 红外线传感器包括绝缘膜; 第一和第二热敏元件，设置在绝缘膜的一个面上; 分别连接到第一和第二热敏元件的第一和第二布线膜; 红外反射膜; 多个端子电极; 并且设置在所述绝缘膜的另一面上的热电阻调节膜与所述端子电极的布线距离处于与所述第一或第二布线膜中较长的一个的至少一部分相对，并且由所述热电阻调节膜形成为 具有比绝缘膜更大散热的材料。

公开(公告)号：US20140339695A1

公开(公告)日：2014-11-20

申请号：US14231163

申请日：2014-03-31

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Motoi YAMAUCHI ,  Osamu KAWACHI ,  Yasushi FUKUDA ,  Yoshinobu ISHIBASHI

IPC: H01L23/00

CPC classification number: H01L24/81 ,  H01L23/15 ,  H01L24/13 ,  H01L24/16 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/13111 ,  H01L2224/16238 ,  H01L2224/7598 ,  H01L2224/81007 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81206 ,  H01L2224/81207 ,  H01L2224/81815 ,  H01L2224/83007 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83815 ,  H01L2224/97 ,  H01L2924/351 ,  H03H9/059 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/3431 ,  H05K2201/09781 ,  H05K2201/2009 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/01047

Abstract: An electronic component includes: a substrate formed of ceramic and including one or more pads on an upper surface thereof; a component flip-chip mounted on the upper surface of the substrate with one or more bumps bonded to the one or more pads; and an additional film located on a lower surface of the substrate and overlapping with at least a part of a smaller one of the pad and the bump in each of one or more pad/bump pairs, the one or more pad/bump pairs being composed of the one or more pads and the one or more bumps bonded to each other.

Abstract translation: 电子部件包括：由陶瓷形成的基板，在其上表面上包括一个或多个焊盘; 安装在所述基板的上表面上的部件倒装芯片，其中一个或多个凸起焊接到所述一个或多个焊盘; 以及位于所述基板的下表面上并且与一个或多个垫/凸块对中的每一个中的所述焊盘和所述凸块中的较小一个的至少一部分重叠的附加膜，所述一个或多个焊盘/凸块对被组成 的一个或多个焊盘和一个或多个凸块彼此粘接。