公开(公告)号：US20120168221A1

公开(公告)日：2012-07-05

申请号：US13343450

申请日：2012-01-04

Applicant: Takeshi Okuyama ,  Tohru Yamakami

Inventor： Takeshi Okuyama ,  Tohru Yamakami

IPC: H05K1/11

CPC classification number: H05K3/3405 ,  H05K1/0219 ,  H05K1/113 ,  H05K2201/10189 ,  H05K2201/10287

Abstract: A relay board for relaying plurality of electric wires to a transmission connector, the relay board provided with first and second front ground pads 12a, 12b which are arranged on a front surface, first and second back ground pads 13a, 13b which are arranged on a back surface, signal pads 14a to 15b which are arranged between the ground pads, a first via hole 17a which connected the first front ground pad 12a and the first back ground pad 13a, and a second via holes 17b which connects the second front ground pad 12b and second back ground pad 13b, the first via hole 17a and the second via hole 17b being arranged at the both sides of the signal pads. It is possible to provide an inexpensive relay board with excellent transmission characteristics and grounding characteristics.

Abstract translation: 一种用于将多根电线中继到传输连接器的继电器板，设置有布置在前表面上的第一和第二前接地焊盘12a，12b的中继板，布置在其上的第一和第二后接地焊盘13a，13b 布置在接地焊盘之间的信号焊盘14a至15b，连接第一前接地焊盘12a和第一后接地焊盘13a的第一通孔17a和连接第二前接地焊盘的第二通孔17b 12b和第二背面接地焊盘13b，第一通孔17a和第二通孔17b布置在信号焊盘的两侧。 可以提供具有优异的传输特性和接地特性的便宜的继电器板。

公开(公告)号：US08199518B1

公开(公告)日：2012-06-12

申请号：US12708033

申请日：2010-02-18

Applicant: Jong Ok Chun ,  Nozad Karim ,  Richard Chen ,  Giuseppe Selli ,  Michael Kelly

Inventor： Jong Ok Chun ,  Nozad Karim ,  Richard Chen ,  Giuseppe Selli ,  Michael Kelly

IPC: H05K7/10

CPC classification number: H01L24/49 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0215 ,  H05K1/0218 ,  H05K1/115 ,  H05K1/165 ,  H05K7/10 ,  H05K2201/09436 ,  H05K2201/09481 ,  H05K2201/10287 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.

Abstract translation: 电子部件封装包括基板和安装到基板的电子部件，电子部件包括接合焊盘。 第一天线端子电连接到接合焊盘，第一天线端子电连接到衬底的第二天线端子。 封装体包围电子部件，封装主体具有主表面。 通过施加导电涂层在主表面上形成天线。 嵌入式互连件在基板和主表面之间延伸穿过封装主体并将第二天线端子电连接到天线。 施加导电涂层以形成天线相对简单，从而使整体封装制造成本最小化。 此外，天线相对较薄，从而使整体封装尺寸最小化。

公开(公告)号：US20120120644A1

公开(公告)日：2012-05-17

申请号：US13386440

申请日：2010-06-21

Applicant: Thomas Rieger

Inventor： Thomas Rieger

IPC: F21S4/00 ,  B24B1/00 ,  B23P11/00

CPC classification number: F21S4/00 ,  F21S4/24 ,  F21V23/06 ,  F21V31/04 ,  F21Y2115/10 ,  H05K3/3405 ,  H05K3/403 ,  H05K2201/10287 ,  Y10T29/49821

Abstract: A lighting module includes a strip-shaped carrier. At least one light source, and at least one electrical contact element that can be contacted at the edge, are present on the strip-shaped carrier. The at least one light source may be a semiconductor lighting element. The at least one electrical contact element is designed as a material volume element.

Abstract translation: 照明模块包括带状载体。 至少一个光源以及可在边缘处接触的至少一个电接触元件存在于带状载体上。 所述至少一个光源可以是半导体照明元件。 所述至少一个电接触元件被设计为材料体积元件。

公开(公告)号：US20110240091A1

公开(公告)日：2011-10-06

申请号：US13133116

申请日：2009-12-01

Applicant: Ulrich Forster ,  Jan-Helge Zimmermann

Inventor： Ulrich Forster ,  Jan-Helge Zimmermann

IPC: H01L31/042 ,  D05B23/00 ,  D05C5/02 ,  H05K13/00 ,  B32B37/12 ,  B05D5/06 ,  B05D1/02 ,  B05D1/28

CPC classification number: D05B23/00 ,  H01L31/042 ,  H01L31/0504 ,  H05K1/038 ,  H05K1/189 ,  H05K3/28 ,  H05K3/325 ,  H05K2201/10143 ,  H05K2201/10287 ,  Y02E10/50

Abstract: The invention relates to a method for attaching a flat electronic component (2, 2a; 12; 22; 32; 42), in particular a photovoltaic cell, onto a flexible surface structure (1; 11; 21; 31), to the use of a programmable embroidering machine, to a flexible surface structure (1; 11; 21; 31; 41) comprising at least one electronic component (2, 2a; 12; 22; 32; 42) and to a solar module. At least one conduction path (4, 5; 14, 15; 24, 25; 34, 35; 44, 45) is embroidered onto the flexible surface structure, wherein a first conduction path (4; 14; 24; 34; 44) only contacts a first surface segment, in particular the bottom side (16; 36; 46), of the component (2, 2a; 12; 22; 32; 42) and a second conduction path (5; 15; 25; 35; 45) only contacts a second surface segment, in particular the top side (7; 17), of the same component (2, 2a; 12; 22; 32; 42).

Abstract translation: 本发明涉及一种用于将扁平电子部件（2,2a; 12; 22; 32; 42）（特别是光伏电池）附接到柔性表面结构（1; 11; 21; 31）上的方法， 包括至少一个电子部件（2,2a; 12; 22; 32; 42）的柔性表面结构（1; 11; 21; 31; 41）和太阳能模块。 至少一个传导路径（4,5; 14,15; 24,25; 34,35; 44,45）被绣在柔性表面结构上，其中第一传导路径（4; 14; 24; 34; 44） 仅接触组件（2,2a; 12; 22; 32; 42）的第一表面段，特别是底部侧（16; 36; 46）和第二传导路径（5; 15; 25; 35; 45）仅接触同一部件（2,2a; 12; 22; 32; 42）的第二表面段，特别是顶侧（7; 17）。

公开(公告)号：US20110213443A1

公开(公告)日：2011-09-01

申请号：US12861729

申请日：2010-08-23

Applicant: Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

Inventor： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

IPC: A61F9/08

CPC classification number: A61N1/375 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3758 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  Y10T29/49155

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得到的电子封装，其适于植入生物组织中，用于视网膜或皮质电极阵列，以使视力恢复到某些非 - 有个人 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US20110117755A1

公开(公告)日：2011-05-19

申请号：US12619958

申请日：2009-11-17

Applicant: ALVARO GINO DE LA REZA ,  MARK WAYNE SMITH ,  ERICK A. RODRIGUEZ

Inventor： ALVARO GINO DE LA REZA ,  MARK WAYNE SMITH ,  ERICK A. RODRIGUEZ

IPC: H01R12/00

CPC classification number: H05K3/32 ,  B60R16/0238 ,  H01R11/15 ,  H01R13/512 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10409 ,  H05K2201/10962 ,  Y10S439/949

Abstract: A bussed electrical center has a power cable for feeding electrical power to the bussed electrical center. A printed circuit board subassembly is interposed between a first housing member and a second housing member that are connectable together. An electrically conductive connector has a prong end and a distal end. The prong end is operably connected to the printed circuit board subassembly. A first fastener and a second fastener are positioned on opposite sides of the first and second housing members. When the first and second fasteners are tightened together to a draw the first and second housing members together to mechanically fasten the bussed electrical center together, the distal end and the terminal end are pressed against each other for electrical connection to each other to electrically connect the power cable to the printed circuit board subassembly.

Abstract translation: 总线电气中心具有用于向总线电气中心供电的电力电缆。 印刷电路板子组件插入在可连接在一起的第一壳体构件和第二壳体构件之间。 导电连接器具有尖端和远端。 尖端可操作地连接到印刷电路板子组件。 第一紧固件和第二紧固件定位在第一和第二壳体构件的相对侧上。 当第一和第二紧固件一起被拉紧到一起以将第一和第二壳体构件拉紧在一起以将总线的电气中心机械地紧固在一起时，远端和终端被彼此压靠以彼此电连接以电连接 电源线到印刷电路板子组件。

公开(公告)号：US20110116248A1

公开(公告)日：2011-05-19

申请号：US13006222

申请日：2011-01-13

Applicant: Tsugio AMBO ,  Satoru Fujiwara ,  Yoshikatsu Hasegawa ,  Chihiro Nakagawa ,  Takeshi Ono ,  Atsushi Urushidani ,  Tooru Kashioka ,  Katsuji Shimazawa

Inventor： Tsugio AMBO ,  Satoru Fujiwara ,  Yoshikatsu Hasegawa ,  Chihiro Nakagawa ,  Takeshi Ono ,  Atsushi Urushidani ,  Tooru Kashioka ,  Katsuji Shimazawa

IPC: H05K7/00

CPC classification number: H05K3/202 ,  H01R9/2466 ,  H01R12/523 ,  H05K3/041 ,  H05K3/222 ,  H05K3/308 ,  H05K3/326 ,  H05K3/328 ,  H05K3/4046 ,  H05K3/4611 ,  H05K13/0061 ,  H05K2201/0376 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/091 ,  H05K2201/096 ,  H05K2201/10287 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2203/081 ,  H05K2203/082 ,  H05K2203/167 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T428/24917

Abstract: A circuit board includes a foil circuit provided on a synthetic resin plate formed by injection molding, made of a copper foil, and having a pattern different for the circuit board. Anchor pins projecting upward are provided on the resin plate and passed through pinholes made in the foil circuit. The foil circuit is positioned and secured to the resin plate. In a required portion of the resin plate, a terminal insertion hole is provided, and a receiving terminal is secured to the required portion of the terminal insertion hole and connected to the foil circuit.

Abstract translation: 电路板包括设置在通过注射成型形成的合成树脂板上的箔电路，由铜箔制成并且具有不同于电路板的图案。 在树脂板上设置向上突出的定位销，并穿过箔片电路中制成的针孔。 箔片电路定位并固定到树脂板上。 在树脂板的所需部分中，设置有端子插入孔，并且接收端子固定到端子插入孔的所需部分并连接到箔片电路。

公开(公告)号：US20110108959A1

公开(公告)日：2011-05-12

申请号：US13007743

申请日：2011-01-17

Applicant: David R. Hembree

Inventor： David R. Hembree

IPC: H01L23/48 ,  H01L21/44 ,  H01L21/50

CPC classification number: H01L25/0657 ,  B23K20/004 ,  B23K20/005 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48145 ,  H01L2224/48455 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48992 ,  H01L2224/78301 ,  H01L2224/8121 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2224/9202 ,  H01L2225/06506 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K3/4046 ,  H05K2201/10287 ,  H05K2203/049 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49169 ,  Y10T29/53213 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2924/2075 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for fabricating a semiconductor component with a through wire interconnect includes the step of providing a substrate having a circuit side, a back side, and a through via. The method also includes the steps of: threading a wire through the via, forming a contact on the wire on the back side, forming a bonded contact on the wire on the circuit side, and then severing the wire from the bonded contact. The through wire interconnect includes the wire in the via, the contact on the back side and the bonded contact on the circuit side. The contact on the back side, and the bonded contact on the circuit side, permit multiple components to be stacked with electrical connections between adjacent components. A system for performing the method includes the substrate with the via, and a wire bonder having a bonding capillary configured to thread the wire through the via, and form the contact and the bonded contact. The semiconductor component can be used to form chip scale components, wafer scale components, stacked components, or interconnect components for electrically engaging or testing other semiconductor components.

Abstract translation: 用于通过导线互连制造半导体部件的方法包括提供具有电路侧，背面和通孔的基板的步骤。 该方法还包括以下步骤：将导线穿过通孔，在背面的导线上形成接触，在电路侧的导线上形成接合接触，然后将线从接合接触件断开。 通线互连包括通孔中的导线，背侧的触点和电路侧的接合触点。 背面的触点和电路侧的接合触点允许多个部件与相邻部件之间的电连接层叠。 用于执行该方法的系统包括具有通孔的基板和具有接合毛细管的引线接合器，所述接合毛细管被配置为使线穿过通孔，并形成接触和接合接触。 半导体部件可用于形成用于电接合或测试其它半导体部件的芯片级部件，晶片级部件，堆叠部件或互连部件。

公开(公告)号：US07937822B2

公开(公告)日：2011-05-10

申请号：US12454967

申请日：2009-05-27

Applicant: Eiji Misaizu ,  Makoto Hiramoto

Inventor： Eiji Misaizu ,  Makoto Hiramoto

IPC: G01R3/00

CPC classification number: H05K3/3405 ,  G01L1/2287 ,  H05K1/118 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/10287 ,  H05K2201/1034 ,  Y10T29/49007 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A method is for connecting a tab pattern formed on a base sheet and a lead wire, wherein the tab pattern includes: a tab main portion; and a connecting portion formed to continue from one edge line of the tab main portion and to extend from the tab main portion along an extension line that is substantially orthogonal to the edge line, and wherein the method includes: connecting the lead wire on the tab main portion by bonding the lead wire at a position being displaced from the extension line of the connecting portion for more than a given offset amount where the extension line is identical to a center line of the connecting portion, the position being within a given distance from the edge line of the tab main portion.

Abstract translation: 一种用于连接形成在基片和引线上的突片图案的方法，其中突片图案包括：突片主体部分; 以及连接部，其形成为从所述突片主体的一个边缘线延伸并且从所述突片主体部分沿着与所述边缘线大致正交的延伸线延伸，并且其中所述方法包括：将所述引线连接到所述突片 主要部分通过将引线接合在从连接部分的延伸线偏移超过给定偏移量的位置处，其中延伸线与连接部分的中心线相同，该位置在距离 突片主体部分的边缘线。

公开(公告)号：US07872869B2

公开(公告)日：2011-01-18

申请号：US12425111

申请日：2009-04-16

Applicant: Tae Soo Lee ,  Yun Hwi Park

Inventor： Tae Soo Lee ,  Yun Hwi Park

IPC: H05K7/20

CPC classification number: H01L23/3677 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0206 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/10287 ,  H01L2924/00

Abstract: Provided is an electron chip module having a heat sink that can increase heat dissipation efficiency. A bottom surface of a module circuit board and an upper surface of a heat sink are in direct contact with each other by using a metal wire, such that heat generated during the operation of a heat-generating device chip mounted onto the module circuit board can be effectively dissipated to the outside.

Abstract translation: 提供一种具有能够提高散热效率的散热器的电子芯片模块。 模块电路板的底面和散热器的上表面通过使用金属线彼此直接接触，使得在安装到模块电路板上的发热装置芯片的操作期间产生的热可以 有效地消散到外面。