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公开(公告)号：US07596649B2
公开(公告)日：2009-09-29
申请号：US11759238
申请日：2007-06-07
Applicant: Shou-Kuo Hsu , Cheng-Shien Li
Inventor： Shou-Kuo Hsu , Cheng-Shien Li
IPC: G06F13/00
CPC classification number: G06F13/4068 , G06F2213/0024 , H05K1/029 , H05K1/0295 , H05K2201/10363
Abstract: A motherboard includes a chipset, a first connector pad suitable for receiving a first type of PCI connector, a second connector pad suitable for receiving a second type of PCI connector, a plurality of first transmission lines, a plurality of second transmission lines, and a plurality of areas for mounting switches. One end of each first transmission line is connected to the chipset, another end of each first transmission line is connected to an end of a corresponding area, one end of each second transmission line is connected to another end of the corresponding area, another end of each second transmission line is connected to the second connector pad, the first connector pad is connected to the plurality of first transmission lines, and the switches are selectively mounted on the plurality of areas.
Abstract translation: 主板包括芯片组，适于接收第一类型的PCI连接器的第一连接器焊盘，适于接收第二类型的PCI连接器的第二连接器焊盘，多个第一传输线，多条第二传输线，以及 多个安装开关的区域。 每个第一传输线的一端连接到芯片组，每个第一传输线的另一端连接到相应区域的一端，每个第二传输线的一端连接到相应区域的另一端，另一端 每个第二传输线连接到第二连接器焊盘，第一连接器焊盘连接到多个第一传输线，并且开关选择性地安装在多个区域上。
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公开(公告)号：US20080144299A1
公开(公告)日：2008-06-19
申请号：US11998229
申请日：2007-11-29
Applicant: Frank E. Redmond
Inventor： Frank E. Redmond
CPC classification number: H05K1/142 , H01R9/2458 , H05K1/0286 , H05K2201/09145 , H05K2201/09963 , H05K2201/10287 , H05K2201/10363 , H05K2201/10401 , H05K2201/2018 , H05K2201/209 , H05K2203/167
Abstract: A printed circuit board having only one circuit element, said circuit element having one or more leads and each lead being in electrical communication to one end of a trace on the printed circuit board, wherein said trace has a second end terminating at a pad, wherein said pad is in electrical communication with a receptacle capable of receiving and retaining a wire. A printed circuit board selected from the group consisting of a printed circuit board having only two traces, a printed circuit board having only three traces, a printed circuit board having only four traces, a printed circuit board having only six traces, a printed circuit board having only eight traces, a printed circuit board having only ten traces, a printed circuit board having only twelve traces, a printed circuit board having only fourteen traces and a printed circuit board having only sixteen traces, wherein each trace has two ends, one end being a receptacle pad connected to a receptacle capable of receiving and retaining a wire, and the second end of said trace being a lead-pad electrically connected to a lead-receptacle, wherein said lead-receptacle is capable of receiving and retaining a lead or pin from a circuit element.
Abstract translation: 一种仅具有一个电路元件的印刷电路板，所述电路元件具有一个或多个引线，并且每个引线与印刷电路板上的迹线的一端电连通，其中所述迹线具有终止于焊盘的第二端，其中 所述垫与能够接收和保持电线的插座电连通。 一种印刷电路板，其选自由只有两条迹线的印刷电路板组成的印刷电路板，仅具有三条迹线的印刷电路板，仅具有四条迹线的印刷电路板，仅具有六条迹线的印刷电路板，印刷电路板 只有八条迹线，只有十条迹线的印刷电路板，只有十二条迹线的印刷电路板，只有十四条迹线的印刷电路板和只有十六条迹线的印刷电路板，其中每条迹线有两端，一端 作为连接到能够接收和保持线的插座的插座焊盘，并且所述迹线的第二端是电连接到引线插座的引线焊盘，其中所述引线插座能够接收和保持引线或 引脚从电路元件。
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公开(公告)号：US20070155251A1
公开(公告)日：2007-07-05
申请号：US11606467
申请日：2006-11-29
Applicant: Akifumi Arai
Inventor： Akifumi Arai
IPC: H01R24/00
CPC classification number: H05K3/222 , H05K1/147 , H05K3/308 , H05K3/3447 , H05K2201/10287 , H05K2201/10363 , H05K2201/10757
Abstract: A parallel wire is installed on a board. Wire parts of strip-off margins at both ends of the parallel wire are bent so as to form bent portions before the wire parts are inserted into the board. The wire parts inserted into the board are prevented from being removed from the board by the bent portions and soldered to the board, while being moved in a dip bath. The bent portions are respectively formed into substantially U-shapes so that the substantially U-shaped bent portions are oriented opposite each other in a case where the parallel wire is in a flat state before the wire parts are inserted into the board and the substantially U-shaped bent portions are oriented in the same direction after the wire parts are inserted into the board, whereby solder uniformly accumulates on the wire parts to fix the wire parts to the board when the wire parts inserted into the board are moved in the dip bath in said direction.
Abstract translation: 平行线安装在电路板上。 平行线的两端的剥离边缘的线部分被弯曲，以在线部分插入板之前形成弯曲部分。 插入板中的线部分被防止被弯曲部分从板上移除并焊接到板上，同时在浸浴中移动。 弯曲部分分别形成为大致U形，使得在线部件插入板之前平行线处于平坦状态的情况下，基本上U形的弯曲部分彼此相对定向，并且基本上为U 在将线材插入板中之后，将相同方向的方向取向，由此当插入板中的导线部件在浸渍槽中移动时，焊料均匀地积聚在线材部分上，以将线部分固定在基板上 在这个方向。
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64.发明授权Electrical connector housing having a bridging piece between circuit boards connected to a receiving unit 失效电连接器壳体，在连接到接收单元的电路板之间具有桥接件公开(公告)号：US06984133B2
公开(公告)日：2006-01-10
申请号：US10865852
申请日：2004-06-14
Applicant: Tsutomu Naitou , Tatsuya Oka
Inventor： Tsutomu Naitou , Tatsuya Oka
CPC classification number: H05K7/026 , H01R12/52 , H01R12/523 , H05K1/144 , H05K1/145 , H05K3/3447 , H05K3/368 , H05K2201/09063 , H05K2201/10189 , H05K2201/10363 , Y10S439/949
Abstract: The invention relates to an electrical connector housing having a first casing, a second casing and a sidewall, and including a first printed circuit board and a second printed circuit board superposed with a given space. The first printed circuit board includes at least a first conductor and the second printed circuit board includes at least a second conductor. The electrical connector housing further includes a connector-receiving portion projecting from the sidewall and placed at a position between the first and second printed circuit boards. The first conductor on the first printed circuit board is connected to a first terminal device, while the second conductor on the second printed circuit board is connected to a second terminal device, and the first and second terminal devices protrude at the connector-receiving portion, so that they are adapted to connect to a terminal of an outside connector to be inserted into the connector-receiving portion.
Abstract translation: 本发明涉及具有第一壳体，第二壳体和侧壁的电连接器壳体，并且包括叠置有给定空间的第一印刷电路板和第二印刷电路板。 第一印刷电路板包括至少第一导体，第二印刷电路板包括至少第二导体。 电连接器壳体还包括从侧壁突出并放置在第一和第二印刷电路板之间的位置的连接器接收部分。 第一印刷电路板上的第一导体连接到第一终端装置，而第二印刷电路板上的第二导体连接到第二终端装置，并且第一和第二终端装置在连接器接收部分突出， 使得它们适于连接到要插入到连接器接收部分中的外部连接器的端子。
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公开(公告)号：US06902097B2
公开(公告)日：2005-06-07
申请号：US10817824
申请日：2004-04-06
Applicant: Eddy W. Vanhoutte , Gilbert De Clercq
Inventor： Eddy W. Vanhoutte , Gilbert De Clercq
IPC: H01R11/01 , B23K1/20 , B23K31/02 , B23K35/14 , H01L23/02 , H01L23/48 , H01R4/00 , H01R4/02 , H01R12/52 , H01R43/02 , H05K1/11 , H05K1/18 , H05K3/34 , H05K3/40 , B23K35/12
CPC classification number: H01R12/526 , H01R4/02 , H05K3/3447 , H05K3/3468 , H05K3/3489 , H05K3/4046 , H05K2201/10363 , H05K2201/10984 , Y10T29/4913 , Y10T29/49144
Abstract: A method of soldering comprises disposing first and second balls of solder adjacent one another on a wire; disposing flux on the wire between and in contact with both of the first and second balls and so as to substantially fill a space between the first and second balls; disposing the wire on a substrate so that the first and second balls of solder contact a single conductor on the substrate; and melting the first and second balls of solder and flux and soldering the wire to the conductor.
Abstract translation: 焊接方法包括将第一和第二焊料球彼此相邻放置在线上; 在所述第一和第二球两者之间并且与所述第一和第二球二者接触并且基本上填充所述第一和第二球之间的空间; 将导线布置在基板上，使得第一和第二焊料球与基板上的单个导体接触; 并且熔化第一和第二焊料球和焊剂，并且将焊丝焊接到导体上。
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Patent Agency Ranking
公开(公告)号：US20040253851A1
公开(公告)日：2004-12-16
申请号：US10865879
申请日：2004-06-14
Applicant: SUMITOMO WIRING SYSTEMS, LTD.
Inventor： Tsutomu Naitou , Tatsuya Oka
IPC: H01R012/00
CPC classification number: H01R9/2458 , H01R12/52 , H01R12/523 , H01R31/08 , H05K3/3447 , H05K3/368 , H05K2201/09063 , H05K2201/10189 , H05K2201/10363 , H05K2201/10424
Abstract: The invention relates to a terminal piece for making connections between a first conductor element and a second conductor element superposed with a given distance. The terminal piece is formed by stamping out a substantially U-shaped piece from a conductive metal sheet and includes a first leg portion with a first contact section, a shoulder portion and a second leg portion with a second contact section, the first leg portion being longer than the second leg portion. The first conductor element includes a terminal path hole and a terminal-fixing hole. The first leg portion is passed through the terminal path hole and the first contact section is connected to the second conductor element by a first fixing device, and the second contact section is connected to the first conductor element by a second fixing device.
Abstract translation: 本发明涉及一种用于在第一导体元件和与给定距离重叠的第二导体元件之间进行连接的端子件。 端子片通过从导电金属片冲压出大致U字形的片而形成，并且包括具有第一接触部分的第一腿部，肩部和具有第二接触部的第二腿部，第一腿部为 比第二腿部长。 第一导体元件包括端子通孔和端子固定孔。 第一腿部穿过终端通道孔，第一接触部分通过第一固定装置连接到第二导体元件，第二接触部分通过第二固定装置连接到第一导体元件。
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公开(公告)号：US20020040804A1
公开(公告)日：2002-04-11
申请号：US10011741
申请日：2001-12-11
Inventor： Eddy W. Vanhoutte , Gilbert De Clercq
IPC: H01R004/00
CPC classification number: H01R12/526 , H01R4/02 , H05K3/3447 , H05K3/3468 , H05K3/3489 , H05K3/4046 , H05K2201/10363 , H05K2201/10984 , Y10T29/4913 , Y10T29/49144
Abstract: The invention relates to an electrically conductive wire (1) comprising two spaced solder balls (2) thereon and flux (4) in the space (3) between the solder balls for making a circuit connection between electrically conductive members on opposite surfaces of a substrate. The wire (1) is inserted in a through-hole of the substrate and soldered by a customary soldering process, like wave soldering.
Abstract translation: 本发明涉及一种导电线（1），其上包括两个间隔开的焊球（2）和焊球之间的空间（3）中的焊剂（4），用于在衬底的相对表面上的导电构件之间形成电路连接 。 将导线（1）插入到基板的通孔中，并通过焊接方式进行焊接，如波峰焊。
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公开(公告)号：US06370030B1
公开(公告)日：2002-04-09
申请号：US09113314
申请日：1998-07-10
Applicant: Leif Roland Bergstedt , Bo Roland Carlberg
Inventor： Leif Roland Bergstedt , Bo Roland Carlberg
IPC: H05K100
CPC classification number: H05K3/222 , H05K1/024 , H05K3/3442 , H05K2201/09036 , H05K2201/09781 , H05K2201/10363 , H05K2201/10636 , Y02P70/611 , Y10T29/49126 , Y10T29/49128 , Y10T29/49144 , Y10T29/49169
Abstract: The present invention relates to a device and a method at a printed board for obtaining good transmission qualities in transmission conductors on a predetermined area (10) of the printed board (11). A separate component (1) for signal transmission comprises a conductor (5). The component (1) is mounted, with the conductor facing the printed board (11), over the area (10) of the printd board, which requires good transmissions qualities, whereby an air gap (L) is obtained between the conductor (5) and the printed board (11). Soldering joints (21) connect each one of the outer parts (7a, 7b) of the conductor (5) of the component (1) to corresponding pattern conductors (17a, 17b) on the printed board (11). The thickness of the soldering connections and the thickness of the pattern conductors form the air gap (L) be the conductor (5) and the printed board (11). In an alternative embodiment according to the invention, a groove (23) is milled out of the printed board (11) under the conductor (5), obtaining an enlarged air gap between the conductor (5) and the printed board (1).
Abstract translation: 本发明涉及一种用于在印刷电路板（11）的预定区域（10）上的发送导体中获得良好的传输质量的印刷电路板上的装置和方法。 用于信号传输的单独部件（1）包括导体（5）。 组件（1）安装成导体面向印刷电路板（11），位于印刷电路板的区域（10）上，这需要良好的传输质量，从而在导体（5）之间获得气隙（L） ）和印刷电路板（11）。 焊接接头（21）将部件（1）的导体（5）的外部部分（7a，7b）中的每一个连接到印刷板（11）上的相应图案导体（17a，17b）。 焊接连接的厚度和图案导体的厚度形成空气间隙（L）为导体（5）和印刷电路板（11）。 在根据本发明的替代实施例中，在导体（5）下面的印刷板（11）中铣出槽（23），从而在导体（5）和印刷板（1）之间获得扩大的气隙。
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公开(公告)号：US5639994A
公开(公告)日：1997-06-17
申请号：US562157
申请日：1995-11-22
Applicant: Kazuhisa Tanaka
Inventor： Kazuhisa Tanaka
CPC classification number: H05K1/118 , H05K1/0393 , H05K1/11 , H05K2201/053 , H05K2201/055 , H05K2201/10363 , H05K3/363
Abstract: A bypass piece is formed at a forward end of a extension part. Three bypass Cu wiring patterns, which cannot be formed at a extension part, are formed at the bypass piece. The bypass piece is bent from the forward end of the extension part towards the main body so as to overlap the extension part. Connecting portions of the bypass Cu wiring patterns of the bypass piece are soldered to end portions of wiring patterns of the main body.
Abstract translation: 在延伸部的前端形成旁路片。 在旁路片上形成有不能在延伸部形成的三个旁路Cu布线图案。 旁路片从延伸部的前端向主体弯曲，以与延伸部重叠。 旁路片的旁路Cu布线图案的连接部分被焊接到主体的布线图案的端部。
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公开(公告)号：US4339785A
公开(公告)日：1982-07-13
申请号：US138438
申请日：1980-04-08
Applicant: Mitsuo Ohsawa
Inventor： Mitsuo Ohsawa
CPC classification number: H05K1/0269 , H05K3/305 , H05K2201/09772 , H05K2201/10363 , H05K2201/10583 , H05K2201/10636 , H05K2203/161 , H05K2203/168 , H05K3/3452 , H05K3/3468 , Y02P70/611 , Y02P70/613
Abstract: In an electronic circuit arrangement mounted on a printed circuit board in which leadless circuit parts are attached to the printed circuit board with adhesive. A white paint is applied onto a region to which adhesive is applied, and an adhesive containing pigment contrastable to the white paint is applied onto the paint.
Abstract translation: 在安装在印刷电路板上的电子电路装置中，其中无引线电路部分用粘合剂附接到印刷电路板。 将白色涂料施加到施加有粘合剂的区域上，并将与白色涂料对比的含有颜料的粘合剂施加到涂料上。
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