公开(公告)号：US20040253862A1

公开(公告)日：2004-12-16

申请号：US10864318

申请日：2004-06-10

Applicant: YAMAICHI ELECTRONICS CO., LTD.

Inventor： Hiroaki Masaki ,  Takuma Utsumi ,  Noriyuki Matsuoka

IPC: H01R013/64

CPC classification number: H01R12/58 ,  H01R12/7023 ,  H01R13/24 ,  H05K3/306 ,  H05K3/308 ,  H05K2201/10325 ,  H05K2201/10424 ,  H05K2201/10568 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2201/10787

Abstract: A method is provided, comprising the steps of inserting the contact terminal section of the contact provided in a socket into a hole provided in the substrate, sliding the socket relative to a surface of the substrate on which the hole is formed, while maintaining the state in which the contact terminal section is inserted into the hole provided in the substrate, and fixing the socket and the contact terminal section to the substrate, while maintaining the state in which the socket and the contact terminal section are made to slide.

Abstract translation: 提供了一种方法，包括以下步骤：将设置在插座中的触点的接触端子部分插入到设置在基板中的孔中，相对于其上形成有孔的基板的表面滑动插座，同时保持状态 其中接触端子部分插入到设置在基板中的孔中，并且将插座和接触端子部分固定到基板，同时保持插座和接触端子部分滑动的状态。

公开(公告)号：US5462444A

公开(公告)日：1995-10-31

申请号：US382545

申请日：1995-02-02

Applicant: Iosif Korsunsky ,  Tod M. Harlan ,  Joanne E. Shipe

Inventor： Iosif Korsunsky ,  Tod M. Harlan ,  Joanne E. Shipe

IPC: H01R13/648 ,  H01R12/50 ,  H01R13/6585 ,  H01R13/6594 ,  H05K3/30 ,  H05K7/12 ,  H01R13/652 ,  H01R13/73

CPC classification number: H05K7/12 ,  H01R12/58 ,  H01R13/6585 ,  H01R23/6873 ,  H05K3/308 ,  H01R13/648 ,  H01R13/6594 ,  H05K2201/10189 ,  H05K2201/10787 ,  H05K2201/10878

Abstract: An electrical connector (10) of the type having an array of signal contacts (22) surface mountable to pads of a circuit board (20), with at least one ground bus (40) having a plurality of post sections (44,50,52) insertable into through holes (34) of the circuit board. At least two of the post sections (50,52) include protuberances (54,56) proximate free ends thereof adapted to bear against side walls of the respective through holes upon insertion thereinto, for deflection of the shanks (62,64) of the post sections in the opposite direction. The protuberance of each of the at least two post sections extends in opposed directions along the row of posts, thus cooperating to act as a clamp of modest force to retain the connector to the board prior to contact soldering. The deflectable shank (62,64) preferably has a reduced cross-sectional area at root (66,68) facilitating deflection in the plastic region.

公开(公告)号：US5076804A

公开(公告)日：1991-12-31

申请号：US618549

申请日：1990-11-27

Applicant: Dominique Bertho ,  Richard Donnelly ,  Patrick Kirby

Inventor： Dominique Bertho ,  Richard Donnelly ,  Patrick Kirby

IPC: H01R12/58 ,  H01R12/83 ,  H01R24/00 ,  H05K3/30

CPC classification number: H01R12/58 ,  H01R12/83 ,  H05K3/308 ,  H05K2201/10189 ,  H05K2201/10787 ,  H05K2201/10878

Abstract: An electrical connector assembly is provided for mounting on a printed circuit board which includes at least a pair of mounting post-receiving holes and at least one solder tail-receiving aperture. The assembly includes a housing having at least a pair of mounting posts for positioning in the holes in the printed circuit board. At least one contact member is mounted on the housing and includes a solder tail for positioning in the aperture in the printed circuit board. The solder tail has a generally straight side and a projecting hook on an opposite side for retaining the connector assembly on the printed circuit board. The width of the solder tail between the straight side and the outermost point of the hook on the opposite side is no greater than the width of the aperture, and the centerline of the solder tail between its sides is offset, in the direction of the hook, relative to the centerline of the aperture when the mounting posts are aligned with the holes in the printed circuit board.

公开(公告)号：US5045976A

公开(公告)日：1991-09-03

申请号：US598569

申请日：1990-10-15

Applicant: Pierre Guilleminot

Inventor： Pierre Guilleminot

IPC: F16B21/00 ,  F16B21/08 ,  H05K1/18 ,  H05K3/30

CPC classification number: F16B21/088 ,  H05K3/308 ,  H05K2201/10568 ,  H05K2201/10598 ,  H05K2201/10787 ,  H05K2201/10878

Abstract: A device for mounting an element (10) on a board (20) which element (10) comprises at least one fixing lug (11) which is to engage in a slot (21) formed in the said board (20). According to the invention, the fixing lug (11) comprises a projection (12) engaging the board (20) inside the slot, and having a thickness which is at least equal to the width (1) of the slot (21). The invention is used to mount housings on printed circuit boards.

Abstract translation: 一种用于将元件（10）安装在板（20）上的装置，该元件（10）包括至少一个固定凸耳（11），所述固定凸耳（11）与形成在所述板（20）中的槽（21）啮合。 根据本发明，固定凸耳（11）包括在槽内部与板（20）接合并且具有至少等于槽（21）的宽度（1）的厚度的突起（12）。 本发明用于将外壳安装在印刷电路板上。

公开(公告)号：US3193788A

公开(公告)日：1965-07-06

申请号：US19823362

申请日：1962-05-28

Applicant: SPERRY RAND CORP

Inventor： BROWN WILLIAM C

IPC: H01R12/58 ,  H01R13/04 ,  H05K3/30 ,  H05K3/36 ,  H05K3/46 ,  H05K7/08

CPC classification number: H01R12/523 ,  H05K3/308 ,  H05K3/368 ,  H05K3/4611 ,  H05K7/08 ,  H05K2201/10787 ,  H05K2201/10856

公开(公告)号：US2903516A

公开(公告)日：1959-09-08

申请号：US63388057

申请日：1957-01-14

Applicant: MOTOROLA INC

Inventor： BIEDERMANN WILLIAM C ,  GUTSCHICK LESTER C

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/306 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/09063 ,  H05K2201/09854 ,  H05K2201/10083 ,  H05K2201/10787 ,  H05K2201/10863 ,  H05K2201/10878

公开(公告)号：US20180331170A1

公开(公告)日：2018-11-15

申请号：US15553266

申请日：2017-05-25

Applicant: Wuhan China Star Optoelectronics Technology Co., Ltd.

Inventor： Kui XU

IPC: H01L27/32 ,  H01L23/00 ,  H01L23/498 ,  H01L25/18 ,  H05K1/18 ,  H05K1/14 ,  H05K1/11

CPC classification number: H01L27/3276 ,  H01L23/4985 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L25/18 ,  H01L2224/1145 ,  H01L2224/11614 ,  H01L2224/11622 ,  H01L2224/13019 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13166 ,  H01L2224/1318 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/29028 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2227/323 ,  H01L2924/0635 ,  H01L2924/07025 ,  H01L2924/2064 ,  H05K1/111 ,  H05K1/147 ,  H05K1/189 ,  H05K3/027 ,  H05K3/4007 ,  H05K2201/10128 ,  H05K2201/1078 ,  H05K2201/10787 ,  H05K2201/10977

Abstract: The present invention discloses a connection component, connector, manufacturing method for the same and panel component. The connection component includes a first connector and a second connector electrically connected to the first connector, wherein, between the first connector and the second connector, a connection adhesive is provided, the first connector and/or the second connector both include a base body and multiple connection terminals, wherein the multiple connection terminals are disposed on the base body, a terminal portion of each connection terminal has a protrusion, the protrusion has a saw-tooth shape, and the saw-tooth shape has a regular pattern or a non-regular pattern, Accordingly, the present invention can enhance the reliability of the connection and increase the production yield.

公开(公告)号：US09980364B2

公开(公告)日：2018-05-22

申请号：US15077211

申请日：2016-03-22

Applicant: YAZAKI CORPORATION

Inventor： Akira Harao ,  Mototatsu Matsunaga ,  Yasuhiro Sugiura ,  Minoru Kubota

IPC: H05K1/00 ,  H05K1/02 ,  H01R12/72 ,  H05K3/36 ,  H05K1/11 ,  H05K3/10 ,  H01L23/498 ,  H05K7/10 ,  H05K1/05 ,  H05K3/20 ,  H05K3/34 ,  H05K1/14

CPC classification number: H05K1/0204 ,  H01L23/49861 ,  H01L2224/05571 ,  H01L2224/48091 ,  H01L2225/1094 ,  H01R12/728 ,  H05K1/0203 ,  H05K1/05 ,  H05K1/056 ,  H05K1/11 ,  H05K1/14 ,  H05K3/10 ,  H05K3/202 ,  H05K3/3447 ,  H05K3/368 ,  H05K7/1046 ,  H05K2201/09009 ,  H05K2201/09063 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2203/025 ,  Y10T29/49147 ,  Y10T29/49155

Abstract: Disclosed is wiring substrate, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.

公开(公告)号：US20160205763A1

公开(公告)日：2016-07-14

申请号：US15077211

申请日：2016-03-22

Applicant: YAZAKI CORPORATION

Inventor： Akira HARAO ,  Mototatsu MATSUNAGA ,  Yasuhiro SUGIURA ,  Minoru KUBOTA

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/05

CPC classification number: H05K1/0204 ,  H01L23/49861 ,  H01L2224/05571 ,  H01L2224/48091 ,  H01L2225/1094 ,  H01R12/728 ,  H05K1/0203 ,  H05K1/05 ,  H05K1/056 ,  H05K1/11 ,  H05K1/14 ,  H05K3/10 ,  H05K3/202 ,  H05K3/3447 ,  H05K3/368 ,  H05K7/1046 ,  H05K2201/09009 ,  H05K2201/09063 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2203/025 ,  Y10T29/49147 ,  Y10T29/49155

Abstract: Disclosed is wiring substrate, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.

Abstract translation: 公开了布线基板，该布线基板包括具有高导热层的基板，其中基板的前表面和后表面中的至少一个是用于各种部件的安装表面; 形成在所述基板中的窗部; 以及从所述窗部的内表面部分延伸并在垂直于所述基板的表面的方向上弯曲的连接端子。

公开(公告)号：US20160183384A1

公开(公告)日：2016-06-23

申请号：US15055859

申请日：2016-02-29

Applicant: Presidio Components. Inc.

Inventor： Hung Van Trinh

IPC: H05K3/34 ,  C22C13/00 ,  B23K35/26 ,  H01G2/06 ,  B23K1/00

CPC classification number: H05K3/3426 ,  B23K1/0016 ,  B23K35/262 ,  C22C13/00 ,  H01G2/06 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/38 ,  H01L23/495 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/498 ,  H01L23/562 ,  H05K2201/10015 ,  H05K2201/10628 ,  H05K2201/10787 ,  H05K2203/047 ,  H05K2203/1173 ,  H05K2203/1377 ,  Y02P70/613

Abstract: An electrical device for soldering to a circuit board with a solder includes a capacitor, a lead frame including a solder dam, and a solder joint electrically coupling the capacitor to the lead frame. The solder dam includes one of a physical barrier to flow or an area of reduced wettability to the solder. The solder dam is between the solder joint and the circuit board. The solder dam is on one or both of a lead portion and main portion of the lead frame. In one embodiment, the first solder dam extends substantially the full width of the first lead portion. The solder dam may be a barrier and/or include a metal oxide. A method of manufacturing the device includes soldering a lead frame to a capacitor with a solder and modifying a surface on the lead frame to include a physical barrier and/or an area of reduced wettability.