公开(公告)号：US20150144985A1

公开(公告)日：2015-05-28

申请号：US14607993

申请日：2015-01-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Stefan Groetsch

IPC: H05K1/18 ,  H01L31/0203 ,  H01L33/48

CPC classification number: H05K1/181 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/16057 ,  H01L2224/16105 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10106 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic device includes a base body, which has a top side and also an underside lying opposite the top side. The base body has connection locations at its underside. An electronic component is arranged at the base body at the top side of the base body. The base body has at least one side area having at least one point of inspection having a first region and second region. The second region is embodied as an indentation in the first region. The first and the second region contain different materials.

Abstract translation: 电子设备包括基体，该基体具有顶侧，并且还具有与顶侧相对的下侧。 基体在其下侧具有连接位置。 在基体的顶侧设置有电子部件。 基体具有至少一个具有至少一个检查点的侧面区域，具有第一区域和第二区域。 第二个地区体现为第一个地区的缩进。 第一和第二区域包含不同的材料。

公开(公告)号：US20110199744A1

公开(公告)日：2011-08-18

申请号：US13024348

申请日：2011-02-10

Applicant: Yoshihiro YAMAGUCHI ,  Tomonori ITO

Inventor： Yoshihiro YAMAGUCHI ,  Tomonori ITO

IPC: H05K7/02

CPC classification number: H05K3/3426 ,  H05K1/111 ,  H05K3/341 ,  H05K2201/09381 ,  H05K2201/10371 ,  H05K2201/1084 ,  H05K2203/046 ,  Y02P70/613

Abstract: A circuit module includes a substrate, a component land provided on the substrate, an electronic component bonded to the component land, a case land provided on the substrate, and a case bonded to the case land so as to cover the electronic component. The case includes a top plate, and a leg that extends from a peripheral edge of the top plate in a direction substantially perpendicular to the top plate and that includes a groove in an end surface thereof that is bonded to the case land.

Abstract translation: 电路模块包括基板，设置在基板上的部件焊盘，接合到部件焊盘的电子部件，设置在基板上的壳体焊盘，以及覆盖电子部件的壳体。 壳体包括顶板和腿部，其从顶板的周缘沿基本上垂直于顶板的方向延伸，并且在其端面中包括接合到壳体平台的凹槽。

公开(公告)号：US07960740B2

公开(公告)日：2011-06-14

申请号：US12012379

申请日：2008-02-01

Applicant: Sheng-Jia Sheu ,  Chien-Chang Pei

Inventor： Sheng-Jia Sheu ,  Chien-Chang Pei

IPC: H01L33/00

CPC classification number: H05K3/326 ,  H01L33/62 ,  H01L2924/0002 ,  H05K3/202 ,  H05K2201/0382 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/1084 ,  Y10T29/41 ,  H01L2924/00

Abstract: A structure of a light emitting diode is provided. The light emitting diode comprises a light emitting diode die; two conductive frames electronically and respectively connecting to the cathode and anode of the light emitting diode die, and two substrates. Each conductive frame has a fixing hole and each substrate has a protrusive pillar. The upper opening of the fixing hole is broader than the bottom opening. The protrusive pillar is inserted into the fixing hole and the shape of the protrusive pillar is deformed for fitting and binding with the fixing hole.

Abstract translation: 提供发光二极管的结构。 发光二极管包括发光二极管管芯; 电子地分别连接到发光二极管管芯的阴极和阳极的两个导电框架和两个基板。 每个导电框架具有固定孔，并且每个基板具有突出支柱。 固定孔的上部开口比底部开口宽。 突出柱插入到固定孔中，突出柱的形状变形以与固定孔嵌合。

公开(公告)号：US07948007B2

公开(公告)日：2011-05-24

申请号：US11403169

申请日：2006-04-12

Applicant: Jürgen Steger ,  Yvonne Manz

Inventor： Jürgen Steger ,  Yvonne Manz

IPC: H01L23/02

CPC classification number: H01L25/072 ,  H01L23/492 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K1/142 ,  H05K3/0061 ,  H05K3/222 ,  H05K3/3426 ,  H05K2201/10818 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A power semiconductor module includes a housing, terminal elements leading to the outside of the housing, an electrically insulated substrate arranged inside the housing, with the substrate being comprised of an insulating body and having on the first main face facing away from the base plate a plurality of connecting tracks electrically insulated from each other. The terminal and connecting elements are arranged on a connecting track in with contact faces contacting connecting tracks or power semiconductor components, with the individual contact faces having a plurality of partial contact faces. In one optional embodiment, each partial contact face has a maximum area of 20 mm2. In another embodiment, partial contact faces each are arranged at a distance of approximately 5 mm with regard to each other and the connection of the partial faces to the connecting tracks or the power semiconductor components is flush.

Abstract translation: 功率半导体模块包括壳体，通向壳体外部的端子元件，布置在壳体内部的电绝缘基板，其中基板由绝缘体构成，并且在第一主面上背离基板a 多个连接轨道彼此电绝缘。 端子和连接元件布置在连接轨道上，接触面接触连接轨道或功率半导体部件，各个接触面具有多个部分接触面。 在一个可选实施例中，每个部分接触面的最大面积为20mm 2。 在另一个实施例中，部分接触面各自相对于彼此以大约5mm的距离布置，并且部分面与连接轨道或功率半导体部件的连接是齐平的。

公开(公告)号：US20100304625A1

公开(公告)日：2010-12-02

申请号：US12446432

申请日：2007-10-30

Applicant: Yuji Nakamura

Inventor： Yuji Nakamura

IPC: H01R4/02 ,  B23K31/02 ,  B23K1/20

CPC classification number: G01R1/07342 ,  G01R1/06727 ,  G01R3/00 ,  H05K3/3426 ,  H05K2201/1031 ,  H05K2201/1084 ,  H05K2201/10984 ,  H05K2203/0278 ,  H05K2203/041 ,  Y02P70/611 ,  Y02P70/613

Abstract: There are provided the steps of preparing a contact (10, 20), which is formed from a metallic sheet including a base portion (11, 21), an elastic deformation portion (12, 22), and a contact portion (13, 23), and in which a recess (15, 25) is formed on a bottom surface of the base portion and a plurality of through-holes (16, 26, 27) are formed to be arranged above the recess and in parallel to the bottom surface of the base portion to extend through the base portion, and holding solder on the through-holes formed on the contact. A desired, solder-attached contact (10a, 20a) is fabricated by the manufacturing method. Further, the solder is a solder ball (90) and the step of holding solder includes the step of preparing the solder ball and the step of press fitting the solder ball into the through-hole.

Abstract translation: 提供了制备由包括基部（11,21），弹性变形部（12,22）和接触部（13,23）的金属板形成的触点（10,20）的步骤 ），并且其中在所述基部的底表面上形成有凹部（15,25），并且多个通孔（16,26,27）形成为布置在所述凹部上方并且平行于所述底部 基部的表面延伸穿过基部，并且将焊料保持在形成在触点上的通孔上。 通过该制造方法制造所需的焊料附着接触件（10a，20a）。 此外，焊料是焊球（90），保持焊料的步骤包括制备焊球的步骤和将焊球压入通孔的步骤。

公开(公告)号：US20100261359A1

公开(公告)日：2010-10-14

申请号：US12752127

申请日：2010-04-01

Applicant: MING-CHIH CHAN ,  XIAO-QIN JIANG

Inventor： MING-CHIH CHAN ,  XIAO-QIN JIANG

IPC: H01R12/00

CPC classification number: H05K9/0035 ,  H05K3/341 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/1084 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electro-magnetic interference device attached to a surface of an object by soldering is disclosed. The device comprises a base comprising a surface defining at least one recessed portion. The at least one recessed portion comprises a side wall. An angle between the side wall and the surface of the base is equal to or greater than 90 degrees.

Abstract translation: 公开了一种通过焊接附着到物体表面的电磁干扰装置。 该装置包括基部，该基部包括限定至少一个凹部的表面。 所述至少一个凹部包括侧壁。 侧壁与基座表面之间的角度等于或大于90度。

公开(公告)号：US20100172114A1

公开(公告)日：2010-07-08

申请号：US12669220

申请日：2008-06-30

Applicant: Tsuyoshi Sato ,  Yasunori Morimoto

Inventor： Tsuyoshi Sato ,  Yasunori Morimoto

IPC: H05K7/02

CPC classification number: H01F27/292 ,  H01F41/04 ,  H01F41/10 ,  H01F2005/046 ,  H01L2924/0002 ,  H05K3/3426 ,  H05K2201/1084 ,  H05K2201/10924 ,  Y02P70/613 ,  H01L2924/00

Abstract: There may be provided a surface mounting component in which a shock with respect to constitution members thereof in a manufacturing process can be reduced and also, in which solder joining strength after the surface mounting is made to be adequate.At least a portion of an end surface, of an external terminal, of the surface mounting component which is joined with a mounting board is a cut surface formed by cutting off a connected member which is connected to the external terminal, in a manufacturing process of the surface mounting component, and on the external terminal, there is formed a concave portion recessed from the end surface.

Abstract translation: 可以提供一种表面安装部件，其中可以减少制造过程中相对于其构成部件的冲击，并且使得表面安装之后的焊接接合强度足够。 与安装基板接合的表面安装部件的外部端子的端面的至少一部分是通过切断与外部端子连接的连接部件而形成的切断面，该连接部件的制造工序 表面安装部件，并且在外部端子上形成有从端面凹陷的凹部。

公开(公告)号：US20100147558A1

公开(公告)日：2010-06-17

申请号：US12316532

申请日：2008-12-12

Applicant: Harry Pon

Inventor： Harry Pon

IPC: H05K1/02 ,  H05K3/34

CPC classification number: H05K3/3426 ,  H01L2924/0002 ,  H05K2201/10689 ,  H05K2201/1084 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00

Abstract: In some embodiments, a surface mount component includes a housing and one or more leads extending from the housing, wherein the one or more leads define respective voids through respective ends of the one or more leads. For example, the one or more leads may define a through-hole at respective ends of the one or more leads. For example, the fixing material may include solder. For example, the solder may form a pin which helps secure the surface mount component to the printed circuit board. Other embodiments are disclosed and claimed.

Abstract translation: 在一些实施例中，表面安装部件包括壳体和从壳体延伸的一个或多个引线，其中所述一个或多个引线通过所述一个或多个引线的相应末端限定相应的空隙。 例如，一个或多个引线可以在一个或多个引线的相应端部处限定通孔。 例如，固定材料可以包括焊料。 例如，焊料可以形成有助于将表面安装部件固定到印刷电路板的引脚。 公开和要求保护其他实施例。

公开(公告)号：US20100133693A1

公开(公告)日：2010-06-03

申请号：US12405420

申请日：2009-03-17

Applicant: Mohamad Ashraf Mohd ARSHAD

Inventor： Mohamad Ashraf Mohd ARSHAD

IPC: H01L23/488 ,  H01L21/50

CPC classification number: H01L23/49548 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3426 ,  H05K3/3442 ,  H05K2201/10727 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A packaged semiconductor device (100) has a first (110) and a second (111) side, the second side including a plurality of metal terminals (120) extending to the first side. Each terminal includes an oblong groove (122) extending to the first side and ending in an orifice (123) at the first side. The terminals are made of a base metal and may have a solder-wettable surface except for the terminal surface (121) exposed at the first device side.

Abstract translation: 封装半导体器件（100）具有第一（110）和第二（111）侧，第二侧包括延伸到第一侧的多个金属端子（120）。 每个端子包括延伸到第一侧并终止于第一侧的孔口（123）的长圆形槽（122）。 端子由贱金属制成，除了在第一器件侧露出的端子表面（121）之外，可具有可焊接润湿表面。

公开(公告)号：US20100124665A1

公开(公告)日：2010-05-20

申请号：US12617016

申请日：2009-11-12

Applicant: Akihito Maegawa ,  Shinyu Nagashima

Inventor： Akihito Maegawa ,  Shinyu Nagashima

IPC: B32B15/04

CPC classification number: H05K3/325 ,  F16H61/0006 ,  H05K3/202 ,  H05K5/0034 ,  H05K5/0082 ,  H05K2201/0394 ,  H05K2201/09118 ,  H05K2201/0969 ,  H05K2201/10401 ,  H05K2201/1084 ,  Y10T428/31678

Abstract: A sensor unit 10 is provided with a metal plate 20 and a resin molded article 30 is formed integral to the metal plate 20. Busbars 50 are arranged in the resin molded article 30 and include exposed end portions 52 exposed from the resin molded article 30. Connecting portions 52A are provided at the leading ends of the exposed end portions 52 and are riveted to an oil temperature sensor 41 on the metal plate 20. Opposite lateral sides of the exposed end portions 52 are partly in contact with the resin molded article 30.

Abstract translation: 传感器单元10设置有金属板20，并且树脂模制品30与金属板20一体形成。在树脂模制品30中布置有母线50，并且包括从树脂模制品30露出的暴露端部52。 连接部分52A设置在暴露端部52的前端，并铆接在金属板20上的油温传感器41上。露出端部52的相对侧面部分地与树脂模塑制品30接触。