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    Multi-piece board and fabrication method therefor
    61.
    发明授权
    Multi-piece board and fabrication method therefor 有权
    多片板及其制造方法

    公开(公告)号：US08378237B2

    公开(公告)日：2013-02-19

    申请号：US12537713

    申请日：2009-08-07

    Applicant: Yasushi Hasegawa

    Inventor： Yasushi Hasegawa

    IPC: H01R13/502 ,  H01R43/20

    CPC classification number: H05K3/0097 ,  H05K3/0052 ,  H05K3/225 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/10598 ,  H05K2201/209 ,  H05K2203/0169 ,  H05K2203/162 ,  Y10T29/49126 ,  Y10T29/49208

    Abstract: A method for fabricating a multi-piece board includes: preparing a board main portion having a first coupling member and multiple piece portions connected to the first coupling member, the first coupling member forming a part of a coupling member of a multi-piece board, each of the piece portions having a printed wiring board; preparing a second coupling member which forms the coupling member together with the first coupling member; and adhering the second coupling member to the first coupling member of the board main portion, thereby yielding the multi-piece board.

    Abstract translation: 一种制造多片板的方法包括：制备具有第一联接构件的板主体和连接到第一联接构件的多个部分，第一联接构件形成多片板的联接构件的一部分， 每个片部分具有印刷线路板; 准备与第一联接构件一起形成联接构件的第二联接构件; 并且将第二联接构件粘合到板主要部分的第一联接构件，从而产生多片板。

    Hollow stem design for high density interconnects
    63.
    发明授权
    Hollow stem design for high density interconnects 有权
    空心杆设计用于高密度互连

    公开(公告)号：US07942687B1

    公开(公告)日：2011-05-17

    申请号：US12881379

    申请日：2010-09-14

    Applicant: Walter V. Werner ,  Earl W. Stromberg ,  Wit Cezary Bushko ,  George Hanna Ghanime

    Inventor： Walter V. Werner ,  Earl W. Stromberg ,  Wit Cezary Bushko ,  George Hanna Ghanime

    IPC: H01R25/00

    CPC classification number: H01R4/58 ,  H01R12/718 ,  H05K3/326 ,  H05K2201/209

    Abstract: An article includes a plurality of stems projecting from a surface thereof. Each stem includes a hollow stalk projecting orthogonally from the surface and a hollow head defined on a distal end of the hollow stalk. The head includes a flange section extending from the distal end of the hollow stalk and having an outer diameter greater than an outer diameter of the hollow stalk at the distal end. A cap section extends from the flange section, defines a distal end of the stem and has a generally convex contour. The cap section has a first wall thickness at the distal end of the stem, a second wall thickness at a junction of the cap section and the flange section and a third wall thickness at a circumferential section intermediate the distal end and the flange section. The third wall thickness is less than the first and second wall thicknesses.

    Abstract translation: 一种制品包括从其表面突出的多个杆。 每个杆包括从表面垂直伸出的中空杆和限定在空心杆的远端上的空心头。 头部包括从中空杆的远端延伸并具有大于远端处的中空杆的外径的外径的凸缘部分。 盖部分从凸缘部分延伸，限定杆的远端并且具有大体凸起的轮廓。 盖部分在杆的远端处具有第一壁厚，在盖部分和凸缘部分的接合处具有第二壁厚度，并且在远端和凸缘部分之间的圆周部分处具有第三壁厚度。 第三壁厚小于第一和第二壁厚。

    Panelizing Method for Printed Circuit Board Manufacturing
    64.
    发明申请
    Panelizing Method for Printed Circuit Board Manufacturing 审中-公开
    印刷电路板制造的面板化方法

    公开(公告)号：US20100263207A1

    公开(公告)日：2010-10-21

    申请号：US12743843

    申请日：2008-11-25

    Applicant: Kimmo Paananen

    Inventor： Kimmo Paananen

    IPC: H05K3/36

    CPC classification number: H05K3/0097 ,  H05K1/0269 ,  H05K2201/09145 ,  H05K2201/09918 ,  H05K2201/209 ,  H05K2203/0165 ,  H05K2203/166 ,  H05K2203/167 ,  Y10T29/49124

    Abstract: The invention relates to a method for connecting at least two printed circuit board modules to form a printed circuit board panel by means of a virtual panel. The method for connecting printed circuit board modules uses positioning tags and counterparts thereof, which align the printed circuit board modules to a target location on the printed circuit board panel.

    Abstract translation: 本发明涉及一种用于连接至少两个印刷电路板模块以通过虚拟面板形成印刷电路板面板的方法。 用于连接印刷电路板模块的方法使用定位标签及其对应物，其将印刷电路板模块对准印刷电路板面板上的目标位置。

    SUBMOUNT FOR ELECTRONIC COMPONENTS
    66.
    发明申请
    SUBMOUNT FOR ELECTRONIC COMPONENTS 有权
    电子元件的SUBMOUNT

    公开(公告)号：US20100238637A1

    公开(公告)日：2010-09-23

    申请号：US12303572

    申请日：2007-06-05

    Applicant: Rabin Bhattacharya ,  Pieter J. Snijder ,  Liesbeth Van Pieterson ,  Erich Zainzinger

    Inventor： Rabin Bhattacharya ,  Pieter J. Snijder ,  Liesbeth Van Pieterson ,  Erich Zainzinger

    IPC: H05K7/02

    CPC classification number: H05K3/301 ,  H05K1/038 ,  H05K3/308 ,  H05K3/321 ,  H05K2201/029 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/10825 ,  H05K2201/10962 ,  H05K2201/209 ,  H05K2203/1446

    Abstract: A submount for arranging electronic components on a substrate is provided. The submount comprises a head member and at least one substrate-engaging member protruding from the head member. The head member comprises at least two, from each other isolated, electrically conductive portions, where each electrically conductive portion comprises a component contact, adapted for connection of electronic components thereto, and a substrate contact on arranged on said substrate side, adapted for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate. The submount of the present invention may be used to attach electronic components, such as light-emitting diodes, to a textile substrate, without the need for soldering the electronic component directly on the substrate.

    Abstract translation: 提供了一种用于在基板上布置电子部件的基座。 底座包括头部构件和从头部构件突出的至少一个衬底接合构件。 头部构件包括彼此隔离的导电部分中的至少两个，其中每个导电部分包括适于将电子部件连接到其上的部件接触件和布置在所述基板侧上的基板接触件，适于使所述 与包括在所述衬底中的电路接触的导电部分。 本发明的基座可以用于将诸如发光二极管的电子部件附接到纺织品基板，而不需要将电子部件直接焊接在基板上。

    Electrical connection structure
    67.
    发明授权
    Electrical connection structure 有权
    电气连接结构

    公开(公告)号：US07785113B2

    公开(公告)日：2010-08-31

    申请号：US11885262

    申请日：2006-10-27

    Applicant: Masanori Mizoguchi

    Inventor： Masanori Mizoguchi

    IPC: H01R12/00

    CPC classification number: H01R12/592 ,  H01R12/58 ,  H01R12/613 ,  H01R12/62 ,  H01R12/777 ,  H01R12/778 ,  H01R12/78 ,  H01R12/79 ,  H05K1/118 ,  H05K3/326 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2201/0969 ,  H05K2201/1059 ,  H05K2201/209

    Abstract: An electrical connection structure allowing reduction in height and easy disassembly, wherein a first connecting member comprises a flexible substrate comprising a flexible insulating film, at least one conductive pad formed on at least one side thereof, a conductive circuit pattern extending from the rim of the pad, a through-hole formed through the thickness thereof at a planar position within the pad, and a small aperture formed at a planar position within the pad and communicating with the through-hole, and a second connecting member comprises a conductive projection formed at least one side thereof and electrically connected with a conductive circuit pattern formed inside or on the second connecting member, where the electrical connection is formed in the manner such that the conductive projection of the second connecting member is inserted in the through-hole of the first connecting member, through the small aperture in the pad, bending the pad and the portion of the insulating film under the pad, along the direction of insertion of the conductive projection, so that the pad is pressed onto the conductive projection due to elastic force of the pad and the insulating film bent.

    Abstract translation: 一种电连接结构，其允许降低高度并易于拆卸，其中第一连接构件包括柔性基底，该柔性基底包括柔性绝缘膜，至少一个导电垫在其至少一侧上形成，导电电路图案从 衬垫，在衬垫内的平面位置处形成通过其厚度的通孔，以及形成在衬垫内的平面位置并与通孔连通的小孔，第二连接构件包括形成在 至少一个侧面，与形成在第二连接构件的内部或第二连接构件上的导电电路图案电连接，其中电连接形成为使得第二连接构件的导电突起插入第一连接构件的通孔中 连接构件，通过垫中的小孔，弯曲垫和绝缘f的部分 沿着导电突起的插入方向在衬垫下面，使得由于焊盘的弹性力和绝缘膜弯曲而将焊盘压在导电突起上。

    Forming electrical cables
    70.
    发明授权
    Forming electrical cables 有权
    形成电缆

    公开(公告)号：US07670639B2

    公开(公告)日：2010-03-02

    申请号：US11286532

    申请日：2005-11-22

    Applicant: Christopher M. Gallant ,  Michel Labrecque ,  Mark A. Clarner ,  John Demain

    Inventor： Christopher M. Gallant ,  Michel Labrecque ,  Mark A. Clarner ,  John Demain

    IPC: B05D5/12 ,  B28B11/16 ,  B29C45/14 ,  A63B37/00

    CPC classification number: B29C43/28 ,  B29C43/222 ,  B29C2043/465 ,  B29L2031/729 ,  B60R16/0207 ,  B60R16/0215 ,  H01B7/08 ,  H01B7/40 ,  H05K1/0393 ,  H05K3/0014 ,  H05K3/0058 ,  H05K3/202 ,  H05K3/326 ,  H05K3/365 ,  H05K2201/09118 ,  H05K2201/209 ,  H05K2203/0113 ,  H05K2203/0143 ,  H05K2203/1545 ,  Y10T428/2933

    Abstract: An elongated electrical cable or flexible circuit board includes an electrically conductive path and an insulating body encompassing and electrically isolating the conductive path, the insulating body including an exposed surface having an array of fastener elements extending therefrom, the fastener elements arranged and constructed to engage mating fastener elements associated with a supporting surface to selectively secure the cable or flexible circuit board to the supporting surface. The fastener elements can be loop-engageable fasteners and/or loops. Such a cable or flexible circuit board is continuously formed by introducing an electrical insulating material including a thermoplastic resin into a gap formed adjacent a peripheral surface of a rotating mold roll, the mold roll defining an array of cavities therein, the insulating material being introduced under pressure and temperature conditions selected to cause the insulating material to at least partially fill the cavities to form fastener element stems integrally with and extending from one broad side of a strip of said insulation material; while introducing conductive wires and/or a conductive path formed on or within a substrate to the gap so as to cause the insulating material to envelop and electrically isolate the conductive path and/or to cause the conductive path to become an integral part of the strip of insulation material from which the fastener element stems extend.

    Abstract translation: 细长的电缆或柔性电路板包括导电路径和绝缘体，其包围并电绝缘导电路径，绝缘体包括具有从其延伸的紧固件元件阵列的暴露表面，所述紧固件元件被布置和构造成接合配合 与支撑表面相关联的紧固元件以选择性地将电缆或柔性电路板固定到支撑表面。 紧固件元件可以是可与圈接合的紧固件和/或环。 这种电缆或柔性电路板通过将包括热塑性树脂的电绝缘材料引入到邻近旋转模具辊的周边表面形成的间隙中而连续地形成，模具辊在其中限定一系列空腔，绝缘材料被引入到 选择的压力和温度条件使得绝缘材料至少部分地填充空腔以与所述绝缘材料的条带的一个宽侧一体地形成并从其延伸; 同时将导电线和/或形成在基板上或内部的导电路径引入到间隙，以便使绝缘材料包封并电绝缘导电路径和/或使导电路径成为带的整体部分 的绝缘材料，紧固件元件从其延伸。

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