Method for enhancing corrosion resistance of a metallic coating on a steel strip or plate
    72.
    发明授权
    Method for enhancing corrosion resistance of a metallic coating on a steel strip or plate 有权
    提高钢带或板上金属涂层的耐腐蚀性的方法

    公开(公告)号:US09115428B2

    公开(公告)日:2015-08-25

    申请号:US14001939

    申请日:2012-01-02

    Abstract: The invention relates to a method for enhancing a metallic coating on a steel strip or steel plate, the coating being melted by heating to a temperature above the melting temperature of the material of the coating, the heating taking place by irradiation of the surface of the coating with electromagnetic radiation having a high power density over a limited irradiation time of not more than 10 μs, and the mandated irradiation time and the energy density introduced into the coating by the electromagnetic radiation being selected such that the coating melts completely over its entire thickness down to the boundary layer with the steel strip, thereby forming a thin alloy layer at the boundary layer between the coating and the steel strip. The invention further relates to a steel strip or steel plate having a metallic coating, more particularly a coating of tin, zinc or nickel, in which, at the boundary layer between the steel and the coating, an alloy layer which is thin—compared with the thickness of the coating—and at the same time is dense, and is composed of iron atoms and atoms of the coating material, is formed, the thickness of the alloy layer corresponding to an alloy-layer add-on of less than 0.3 g/m2.

    Abstract translation: 本发明涉及一种用于增强钢带或钢板上的金属涂层的方法,该涂层通过加热熔化至高于涂层材料的熔融温度的温度,通过照射该涂层的表面进行加热 在不超过10μs的有限的照射时间内用具有高功率密度的电磁辐射进行涂覆,并且通过选择电磁辐射来引入到涂层中的强制照射时间和能量密度使得涂层在整个厚度上完全熔化 直到钢带的边界层,从而在涂层和钢带之间的边界层处形成薄的合金层。 本发明还涉及一种具有金属涂层的钢带或钢板,特别是锡,锌或镍的涂层,其中在钢和涂层之间的边界层处,与 涂层的厚度 - 同时是致密的,由铁原子和涂层材料的原子组成,合金层的厚度对应于合金层附着量小于0.3g / m2。

    Method and apparatus for curing thin films on low-temperature substrates at high speeds
    73.
    发明授权
    Method and apparatus for curing thin films on low-temperature substrates at high speeds 有权
    用于在低温基板上高速固化薄膜的方法和装置

    公开(公告)号:US09095874B2

    公开(公告)日:2015-08-04

    申请号:US14171298

    申请日:2014-02-03

    Applicant: NCC NANO, LLC

    Abstract: A curing apparatus for thermally processing thin films on low-temperature substrates at high speeds is disclosed. The curing apparatus includes a strobe head, a strobe control module and a conveyor control module. The strobe control module controls the power, duration and repetition rate of a set of pulses generated by a flash lamp on the strobe head. The conveyor control module along with the strobe control module provide real-time synchronization between the repetition rate of the set of pulses and the speed at which the substrate is being moved under the strobe head, according to the speed information.

    Abstract translation: 公开了一种用于在低温基板上高速热处理薄膜的固化装置。 固化设备包括闪光灯头,闪光灯控制模块和输送机控制模块。 选通控制模块控制由闪光灯在闪光灯头上产生的一组脉冲的功率,持续时间和重复率。 输送机控制模块与选通控制模块一起提供脉冲组的重复率与基板在频闪头之下的速度之间的实时同步,速度信息。

    Substrate laser oxide removal process followed by electro or immersion plating
    78.
    发明授权
    Substrate laser oxide removal process followed by electro or immersion plating 有权
    基板激光氧化物去除工艺,然后电镀或浸镀

    公开(公告)号:US08985050B2

    公开(公告)日:2015-03-24

    申请号:US12940703

    申请日:2010-11-05

    Abstract: Method of ablating the surface of a substrate including providing a dry substrate and an electrolyte source, ablating the surface of the dry substrate to at least partially remove a native oxide layer, and immersing the ablated dry substrate in the electrolyte source, in which the dry substrate is ablated prior to being introduced into the electrolyte source. Also provided is a method of ablating the surface of a substrate that includes providing a dry substrate and an electrolyte, depositing a portion of the electrolyte on the substrate at a thickness of less than 10 microns and ablating the surface of the substrate with the electrolyte applied thereon. System for use in the ablation of the surface of a substrate are also provided.

    Abstract translation: 消除基材表面的方法,包括提供干基质和电解质源,对干基质表面进行烧蚀以至少部分除去天然氧化物层,以及将消融的干基质浸入电解质源中,其中干燥 衬底在被引入电解质源之前被消融。 还提供了一种消除基底表面的方法,其包括提供干燥的基底和电解质,将电解质的一部分沉积在基底上,厚度小于10微米,并且用施加的电解质来烧蚀基底的表面 上。 还提供了用于消除基底表面的系统。

    PROCESS FOR APPLICATION OF METAL
    79.
    发明申请
    PROCESS FOR APPLICATION OF METAL 有权
    金属应用程序

    公开(公告)号:US20150056410A1

    公开(公告)日:2015-02-26

    申请号:US14533126

    申请日:2014-11-05

    Abstract: A process for application of metal on a substrate surface comprises applying a mixture of a solvent, a polymerizable monomer, and a photoinitiator on a substrate surface, wherein the photoinitiator does not form two phases together with the monomer and the solvent, i.e. it forms an amorphous mixture without any crystals. The monomer is able to polymerize to a polymer comprising at least one carboxylic group. Thereafter the solvent is evaporated. Polymerization is induced by irradiating the applied dried mixture. Ions are applied and reduced to metal and thereafter further metal can be deposited. The method can be used in industrial processes, both 2D and 3D surfaces can be coated with metal. Materials sensitive to standard grafting chemicals and/or polymers containing halogen atoms can be coated.

    Abstract translation: 在基材表面上施用金属的方法包括在基材表面上涂覆溶剂,可聚合单体和光引发剂的混合物,其中光引发剂与单体和溶剂一起不形成两相,即它形成 无定形混合物,无任何晶体。 单体能够聚合成包含至少一个羧基的聚合物。 然后蒸发溶剂。 通过照射施加的干燥混合物诱导聚合。 离子被施加并还原成金属,此后可以沉积更多的金属。 该方法可用于工业过程中,2D和3D表面均可镀金属。 对标准接枝化学品和/或含有卤素原子的聚合物敏感的材料可以被涂覆。

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