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    MICROELECTRONIC PACKAGES HAVING HERMETIC CAVITIES AND METHODS FOR THE PRODUCTION THEREOF
    72.
    发明申请
    MICROELECTRONIC PACKAGES HAVING HERMETIC CAVITIES AND METHODS FOR THE PRODUCTION THEREOF 审中-公开
    具有渗透性的微电子封装及其生产方法

    公开(公告)号：US20160167952A1

    公开(公告)日：2016-06-16

    申请号：US14230975

    申请日：2014-03-31

    Applicant: PHILIP H. BOWLES ,  STEPHEN R. HOOPER

    Inventor： PHILIP H. BOWLES ,  STEPHEN R. HOOPER

    IPC: B81B7/02 ,  B81C1/00

    CPC classification number: B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/0023 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: Microelectronic packages having hermetic cavities are provided, as are methods for producing such packages. In one embodiment, the microelectronic package includes a sensor die having first and second Microelectromechanical Systems (MEMS) transducer structures formed thereon. First and second cap pieces are coupled to the sensor die by, for example, direct or indirect bonding. A first hermetic cavity encloses the first MEMS transducer structure and is at least partially defined by the first cap piece and the sensor die. Similarly, a second hermetic cavity encloses the second MEMS transducer structure and at least partially defined by the second cap piece and the sensor die. A vent hole is fluidly coupled to the first hermetic cavity and is sealed by the second cap piece.

    Abstract translation: 提供具有密封腔的微电子封装，以及用于制造这种封装的方法。 在一个实施例中，微电子封装包括具有形成在其上的第一和第二微机电系统（MEMS）换能器结构的传感器管芯。 第一和第二盖片通过例如直接或间接粘合而耦合到传感器管芯。 第一密封腔包围第一MEMS换能器结构，并且至少部分地由第一盖片和传感器芯片限定。 类似地，第二密封腔封闭第二MEMS换能器结构，并且至少部分地由第二盖片和传感器芯片限定。 通气孔流体地联接到第一密封腔并被第二盖片密封。

    MEMS AND CMOS INTEGRATION WITH LOW-TEMPERATURE BONDING
    74.
    发明申请
    MEMS AND CMOS INTEGRATION WITH LOW-TEMPERATURE BONDING 有权
    MEMS和CMOS集成与低温接合

    公开(公告)号：US20160137492A1

    公开(公告)日：2016-05-19

    申请号：US14639492

    申请日：2015-03-05

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Chun-Wen Cheng ,  Chia-Hua Chu ,  Jung-Huei Peng

    IPC: B81C1/00 ,  B81B7/00 ,  B81B3/00

    CPC classification number: B81C1/00238 ,  B81B3/001 ,  B81B7/007 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2203/0315 ,  B81B2207/012 ,  B81B2207/07 ,  B81C2201/0132 ,  B81C2203/035 ,  B81C2203/037 ,  B81C2203/0792 ,  H01L2224/16

    Abstract: The present disclosure relates to method of forming a MEMS device that mitigates the above mentioned difficulties. In some embodiments, the present disclosure relates to a method of forming a MEMS device, which forms one or more cavities within a first side of a carrier substrate. The first side of the carrier substrate is then bonded to a dielectric layer disposed on a micro-electromechanical system (MEMS) substrate, and the MEMS substrate is subsequently patterned to define a soft mechanical structure over the one or more cavities. The dielectric layer is then selectively removed, using a dry etching process, to release the one or more soft mechanical structures. A CMOS substrate is bonded to a second side of the MEMS substrate, by way of a bonding structure disposed between the CMOS substrate and the MEMS substrate, using a low-temperature bonding process.

    Abstract translation: 本公开涉及形成减轻上述困难的MEMS器件的方法。 在一些实施例中，本公开涉及一种形成MEMS器件的方法，所述MEMS器件在载体衬底的第一侧内形成一个或多个空腔。 然后将载体衬底的第一侧接合到布置在微机电系统（MEMS）衬底上的电介质层，随后将MEMS衬底图案化以限定一个或多个空腔上的软机械结构。 然后使用干蚀刻工艺选择性地去除电介质层以释放一个或多个软机械结构。 通过使用低温接合工艺，通过设置在CMOS衬底和MEMS衬底之间的接合结构将CMOS衬底结合到MEMS衬底的第二侧。

    PACKAGE STRUCTURE INCLUDING A CAVITY COUPLED TO AN INJECTION GAS CHANNEL COMPOSED OF A PERMEABLE MATERIAL
    75.
    发明申请
    PACKAGE STRUCTURE INCLUDING A CAVITY COUPLED TO AN INJECTION GAS CHANNEL COMPOSED OF A PERMEABLE MATERIAL 有权
    封装结构包括与渗透材料组成的注射气体通道相连的空腔

    公开(公告)号：US20160137487A1

    公开(公告)日：2016-05-19

    申请号：US14938118

    申请日：2015-11-11

    Applicant: Commissariat a l'energie atomique et aux energies alternatives

    Inventor： Stephane NICOLAS

    IPC: B81B7/00 ,  B81C1/00

    CPC classification number: B81B7/0038 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/097 ,  B81C1/00285 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/0145 ,  H01L2224/11

    Abstract: A packing structure including: a cap secured to at least one first substrate and forming at least one cavity between the cap and the first substrate; a layer of at least one first material permeable to a gas, arranged in the cap and/or in the first substrate and/or at the interface between the cap and the first substrate, and forming at least one part of a wall of the cavity; a portion of at least one second material non-permeable to said gas, the thickness of which is higher than or equal to that of the layer of the first material, and surrounding at least one first part of the layer of the first material forming said part of the wall of the cavity; an aperture passing through the cap or the first substrate and opening onto or into said part of the layer of the first material.

    Abstract translation: 一种包装结构，包括：盖固定到至少一个第一基底并在盖和第一基底之间形成至少一个空腔; 至少一种可渗透气体的第一材料层，布置在盖和/或第一基底中和/或在帽和第一基底之间的界面处，并且形成腔的壁的至少一部分 ; 至少一种第二材料的一部分，对所述气体不可渗透，其厚度高于或等于第一材料层的厚度，并且包围形成所述第一材料的第一材料层的至少一个第一部分 空腔壁的一部分; 穿过所述盖或所述第一基板并且打开到所述第一材料层的所述部分中的孔的孔。

    METHOD OF IMPROVING GETTER EFFICIENCY BY INCREASING SUPERFICIAL AREA
    77.
    发明申请
    METHOD OF IMPROVING GETTER EFFICIENCY BY INCREASING SUPERFICIAL AREA 有权
    通过增加超级区域提高效率的方法

    公开(公告)号：US20160101976A1

    公开(公告)日：2016-04-14

    申请号：US14967663

    申请日：2015-12-14

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Yuan-Chih Hsieh ,  Li-Cheng Chu ,  Hung-Hua Lin ,  Chih-Jen Chan ,  Lan-Lin Chao

    IPC: B81B7/00

    CPC classification number: B81B7/0038 ,  B81B7/0025 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0315 ,  B81C1/00285 ,  B81C2203/0118 ,  H01L21/3223 ,  H01L23/26 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: In some embodiments, the present disclosure relates to a MEMs (micro-electromechanical system) package device having a getter layer. The MEMs package includes a first substrate having a cavity located within an upper surface of the first substrate. The cavity has roughened interior surfaces. A getter layer is arranged onto the roughened interior surfaces of the cavity. A bonding layer is arranged on the upper surface of the first substrate on opposing sides of the cavity, and a second substrate bonded to the first substrate by the bonding layer. The second substrate is arranged over the cavity. The roughened interior surfaces of the cavity enables more effective absorption of residual gases, thereby increasing the efficiency of a gettering process.

    Abstract translation: 在一些实施例中，本公开涉及具有吸气剂层的MEM（微机电系统）包装装置。 MEM包装包括具有位于第一衬底的上表面内的空腔的第一衬底。 腔内表面粗糙。 吸气剂层布置在空腔的粗糙化的内表面上。 在空腔的相对侧的第一基板的上表面上配置有接合层，通过接合层与第一基板接合的第二基板。 第二基板布置在空腔上方。 空腔的粗糙化的内表面能够更有效地吸收残留气体，从而提高吸气过程的效率。

    MEMS multi-axis gyroscope Z-axis electrode structure
    78.
    发明授权
    MEMS multi-axis gyroscope Z-axis electrode structure 有权
    MEMS多轴陀螺仪Z轴电极结构

    公开(公告)号：US09278845B2

    公开(公告)日：2016-03-08

    申请号：US13755953

    申请日：2013-01-31

    Applicant: Fairchild Semiconductor Corporation

    Inventor： Cenk Acar

    IPC: G01C19/56 ,  B81B3/00 ,  G01C19/5712 ,  B81C1/00

    CPC classification number: B81B3/0018 ,  B81B3/0059 ,  B81B2201/0242 ,  B81B2203/0154 ,  B81C1/00134 ,  G01C19/56 ,  G01C19/5712

    Abstract: Various examples include microelectromechanical die for sensing motion that includes symmetrical proof-mass electrodes interdigitated with asymmetrical stator electrodes. Some of these examples include electrodes that are curved around an axis orthogonal to the plane in which the electrodes are disposed. An example provides vertical flexures coupling an inner gimbal to a proof-mass in a manner permitting flexure around a horizontal axis.

    Abstract translation: 各种示例包括用于感测运动的微机电模具，其包括与不对称定子电极相互指向的对称的证明质量电极。 这些示例中的一些包括围绕垂直于其中布置电极的平面的轴线弯曲的电极。 一个例子提供垂直弯曲，其以允许围绕水平轴线弯曲的方式将内万向架耦合到校验块。

    Method of improving getter efficiency by increasing superficial area
    80.
    发明授权
    Method of improving getter efficiency by increasing superficial area 有权
    通过增加表面积来提高吸气效率的方法

    公开(公告)号：US09242853B2

    公开(公告)日：2016-01-26

    申请号：US14053751

    申请日：2013-10-15

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Yuan-Chih Hsieh ,  Li-Cheng Chu ,  Hung-Hua Lin ,  Chih-Jen Chan ,  Lan-Lin Chao

    IPC: H01L23/31 ,  B81C1/00 ,  H01L23/26 ,  H01L21/322 ,  B81B7/00

    CPC classification number: B81B7/0038 ,  B81B7/0025 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0315 ,  B81C1/00285 ,  B81C2203/0118 ,  H01L21/3223 ,  H01L23/26 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The present disclosure relates to a method of gettering that provides for a high efficiency gettering process by depositing a gettering material on a roughened substrate surface, and an associated apparatus. In some embodiments, the method is performed by providing a substrate into a processing chamber having residual gases. One or more cavities are formed in the substrate at locations between bonding areas on a top surface of the substrate. Respective cavities have roughened interior surfaces that vary in a plurality of directions. A getter layer is deposited into the one or more cavities. The roughened interior surfaces of the one or more cavities enable the substrate to more effectively absorb the residual gases, thereby increasing the efficiency of the gettering process.

    Abstract translation: 本公开涉及一种吸气方法，其通过在粗糙化的基底表面上沉积吸气材料和相关联的装置来提供高效吸气过程。 在一些实施例中，通过将衬底提供到具有残留气体的处理室中来执行该方法。 在衬底的顶部表面上的结合区域之间的位置处形成一个或多个空腔。 相应的空腔具有在多个方向上变化的内表面的粗糙化。 吸气剂层沉积到一个或多个空腔中。 一个或多个空腔的粗糙化的内表面使得基底能够更有效地吸收残余气体，从而提高吸气过程的效率。

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