公开(公告)号：US08005355B2

公开(公告)日：2011-08-23

申请号：US12429719

申请日：2009-04-24

Applicant: Masaaki Fukuhara ,  Norio Koike

Inventor： Masaaki Fukuhara ,  Norio Koike

IPC: G03B17/28 ,  H04N5/335

CPC classification number: H04N5/2253 ,  G02B5/201 ,  G02B5/223 ,  H04N5/2257 ,  H05K1/0203 ,  H05K1/0271 ,  H05K3/3447 ,  H05K2201/0133 ,  H05K2201/10121 ,  H05K2201/10553

Abstract: In a camera unit having a lens and an imaging device, the imaging device is fixed by means of a base plate, an elastic material, and a printed circuit board. The imaging device abuts on a first plane of the base plate, and the elastic material is sandwiched between the printed circuit board and a second plane opposite to the first plane of the base plate.

Abstract translation: 在具有透镜和成像装置的相机单元中，成像装置通过基板，弹性材料和印刷电路板固定。 成像装置抵接在基板的第一平面上，并且弹性材料夹在印刷电路板和与基板的第一平面相对的第二平面之间。

公开(公告)号：US07968196B2

公开(公告)日：2011-06-28

申请号：US11841582

申请日：2007-08-20

Applicant: Itsuo Watanabe ,  Tohru Fujinawa ,  Motohiro Arifuku ,  Houko Kanazawa ,  Atsushi Kuwano

Inventor： Itsuo Watanabe ,  Tohru Fujinawa ,  Motohiro Arifuku ,  Houko Kanazawa ,  Atsushi Kuwano

IPC: B32B27/38 ,  B32B27/20 ,  B32B27/26 ,  B32B27/30 ,  C09J133/00 ,  C09J163/00

CPC classification number: H01L24/83 ,  C08G18/0823 ,  C08G18/2865 ,  C08G18/3206 ,  C08G18/3821 ,  C08G18/672 ,  C08K5/14 ,  C08K5/1515 ,  C08K5/521 ,  C08L9/02 ,  C08L13/00 ,  C09D5/24 ,  C09D175/16 ,  H01B1/20 ,  H01L23/293 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05669 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01061 ,  H01L2924/01067 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0133 ,  Y10T428/10 ,  Y10T428/2852 ,  Y10T428/31504 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31855 ,  Y10T428/31935 ,  Y10T428/31942 ,  C08G18/8016 ,  C08L2666/16 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A circuit-connecting material interposed between mutually-facing circuit electrodes, and electrically connecting the electrodes, either by direct contact, or via conductive particles present in the material. The circuit-connecting material features: (1) a curing agent capable of generating free radicals upon heating; (2) a radical-polymerizable substance, and two or more microscopically separated phases. The two or more microscopically separated phases include an elastomer phase of carboxyl-group-containing elastomer and a phenoxy resin phase of a phenoxy resin having a weight average molecular weight of 10,000 or more.

Abstract translation: 插入相互面对的电路电极之间的电路连接材料，或通过直接接触或通过存在于材料中的导电颗粒电连接电极。 电路连接材料的特征在于：（1）能够在加热时产生自由基的固化剂; （2）可自由基聚合的物质，以及两个或多个微观分离相。 两个以上的微观分离相包括含羧基弹性体的弹性体相和重均分子量为10000以上的苯氧基树脂的苯氧基树脂相。

公开(公告)号：US20110139496A1

公开(公告)日：2011-06-16

申请号：US12967344

申请日：2010-12-14

Applicant: Shigeo NAKAMURA

Inventor： Shigeo NAKAMURA

IPC: H05K1/03 ,  C08L71/12 ,  C08L63/00 ,  C08L69/00 ,  C08L25/08 ,  B32B7/12

CPC classification number: C08J5/24 ,  B32B7/12 ,  B32B2559/00 ,  B32B2605/08 ,  C08G59/245 ,  C08G59/4215 ,  C08G59/4276 ,  C08J2363/00 ,  C08J2379/04 ,  C08L63/00 ,  H05K1/0373 ,  H05K3/4676 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0212 ,  Y10T428/287 ,  C08L79/04 ,  C08L67/00

Abstract: A resin composition which is low in a roughness of an insulating layer surface and capable of forming thereon a plated conductor layer having a sufficient peel strength in a wet roughing step and which is excellent in dielectric characteristics and a coefficient of thermal expansion, is disclosed. The resin composition contains a cyanate ester resin and a specified epoxy resin.

Abstract translation: 公开了一种树脂组合物，其具有绝缘层表面粗糙度并且能够在湿粗粗化步骤中形成具有足够剥离强度的电镀导体层，并且其介电特性和热膨胀系数优异。 树脂组合物含有氰酸酯树脂和特定的环氧树脂。

公开(公告)号：US20110114893A1

公开(公告)日：2011-05-19

申请号：US13013169

申请日：2011-01-25

Applicant: Itsuo Watanabe ,  Tohru Fujinawa ,  Motohiro Arifuku ,  Houko Kanazawa ,  Atsushi Kuwano

Inventor： Itsuo Watanabe ,  Tohru Fujinawa ,  Motohiro Arifuku ,  Houko Kanazawa ,  Atsushi Kuwano

IPC: H01B1/20 ,  C08G65/48 ,  C08L71/00

CPC classification number: H01L24/83 ,  C08G18/0823 ,  C08G18/2865 ,  C08G18/3206 ,  C08G18/3821 ,  C08G18/672 ,  C08K5/14 ,  C08K5/1515 ,  C08K5/521 ,  C08L9/02 ,  C08L13/00 ,  C09D5/24 ,  C09D175/16 ,  H01B1/20 ,  H01L23/293 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05669 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01061 ,  H01L2924/01067 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0133 ,  Y10T428/10 ,  Y10T428/2852 ,  Y10T428/31504 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31855 ,  Y10T428/31935 ,  Y10T428/31942 ,  C08G18/8016 ,  C08L2666/16 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

Abstract translation: 一种电路连接材料，其插入在彼此面对的电路电极之间，并且通过将相对的电极彼此相压来使按压方向的电极电连接; 电路连接材料作为必要成分（1）含有能够在加热时产生自由基的固化剂，（2）分子量为10,000以上的含羟基树脂和（3）自由基聚合性物质。 还提供了使用这种材料的电路端子连接结构和电路端子连接方法。

公开(公告)号：US20110104505A1

公开(公告)日：2011-05-05

申请号：US12999213

申请日：2009-06-04

Applicant: Kunio Mori ,  Yusuke Matsuno

Inventor： Kunio Mori ,  Yusuke Matsuno

IPC: B32B7/12 ,  B32B15/06 ,  B32B25/04 ,  B32B37/12

CPC classification number: B32B7/12 ,  B32B15/06 ,  B32B15/08 ,  B32B25/04 ,  B32B25/14 ,  B32B27/06 ,  B32B27/32 ,  C09J121/02 ,  H05K3/386 ,  H05K3/389 ,  H05K2201/0133 ,  Y10T428/31663

Abstract: Provided is a laminated body which solves, all at once, the issues of conventional methods, such as adhesiveness to a board having low surface roughness, stress concentration relaxing, reliability improvement, high adhesiveness (especially, that of a conductor layer), heat resistance, almighty characteristics (being adherable irrespective of the type of an adhesive), in manufacture of laminated bodies. The laminated body is formed by having an entropically elastic molecular adhesive layer between two boards, and the entropically elastic molecular adhesive layer is composed of an entropically elastic material layer, and a layer of a molecular adhesive having a group which can be bonded to the entropically elastic material layer.

Abstract translation: 提供一种能够一次解决诸如对具有低表面粗糙度的板的粘合性，应力集中放松，可靠性改进，高粘合性（特别是导体层的粘合性），耐热性的常规方法的问题的层压体 全能的特性（与粘合剂的类型无关）可以粘合在层压体的制造中。 层叠体通过在两个板之间具有弹性分子粘合剂层而形成，并且该弹性分子粘合剂层由具有弹性的材料层构成，并且具有可以与熵共聚的基团的分子粘合剂层 弹性材料层。

公开(公告)号：US07931065B2

公开(公告)日：2011-04-26

申请号：US12385895

申请日：2009-04-23

Applicant: Satoshi Takeuchi ,  Atusi Sakaida ,  Toshihisa Taniguchi ,  Toshikazu Harada ,  Maki Chiba

Inventor： Satoshi Takeuchi ,  Atusi Sakaida ,  Toshihisa Taniguchi ,  Toshikazu Harada ,  Maki Chiba

IPC: B32B37/00

CPC classification number: B30B15/061 ,  B30B15/024 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2203/065 ,  H05K2203/068

Abstract: In a printed circuit board manufacturing equipment, a pressing die includes a first pressing part, a second pressing part, and a frame part. A buffer member is disposed between a first surface of a laminated body and the first pressing part. The second pressing part has a portion facing a second surface of the laminated body and a portion facing the buffer member. The frame part surrounds a whole area of a side surface of the buffer member. Before pressing and heating, the laminated body, the second pressing part, and the buffer member define an escape space therebetween for escaping the buffer member deformed due to the pressing. A lip protrudes from the frame part toward the laminated body. The lip is deformed following the deformation of the buffer member and comes in contact with a surface of the second pressing part facing the buffer member.

Abstract translation: 在印刷电路板制造装置中，压模包括第一按压部，第二按压部和框部。 缓冲构件设置在层叠体的第一表面和第一按压部之间。 第二按压部具有面向层叠体的第二面的部分和面向缓冲部件的部分。 框架部分围绕缓冲构件的侧表面的整个区域。 在加压之前，层叠体，第二按压部和缓冲部件在其间限定了由于按压而变形的缓冲部件的逸出空间。 唇缘从框架部分朝向层叠体突出。 在缓冲构件的变形之后唇部变形，并且与第二按压部的面向缓冲构件的表面接触。

公开(公告)号：US07909657B1

公开(公告)日：2011-03-22

申请号：US12616905

申请日：2009-11-12

Applicant: Shadi A. Abughazaleh ,  Joseph E. Dupuis ,  Christopher W. Gribble ,  Naved S. Khan ,  Douglas P. O'Connor

Inventor： Shadi A. Abughazaleh ,  Joseph E. Dupuis ,  Christopher W. Gribble ,  Naved S. Khan ,  Douglas P. O'Connor

IPC: H01R24/00

CPC classification number: H01R24/64 ,  H01R13/24 ,  H01R13/2442 ,  H01R13/405 ,  H01R13/6466 ,  H01R13/6625 ,  H01R13/6658 ,  H01R24/62 ,  H01R43/20 ,  H01R43/205 ,  H01R2107/00 ,  H05K1/18 ,  H05K1/182 ,  H05K3/325 ,  H05K3/4015 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/10424 ,  H05K2201/10446 ,  Y02P70/611 ,  Y10S439/941 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151

Abstract: An electrical connector adapted to receive a mating plug utilizes low-profile jack terminal contacts that can flex in their PCB-anchored base portions, which are substantially parallel to the PCB. Any bend in the distal connecting portion or in the intermediate transition portion of each terminal contact is gradual and forms an obtuse angle, thus minimizing stress concentrations. The contacts preferably are arranged in two oppositely facing and interdigitating rows of four contacts each. In one embodiment, the terminal contacts are anchored to the PCB by a contact cradle that constrains the base portion of each terminal contact at two spaced anchoring locations, allowing the base portion to flex therebetween. In another embodiment, the base portions of the terminal contacts are embedded in at least one elastomeric member, which is fitted to the PCB.

公开(公告)号：US20110063811A1

公开(公告)日：2011-03-17

申请号：US12948894

申请日：2010-11-18

Applicant: Takashi KARIYA ,  Akira Mochida

Inventor： Takashi KARIYA ,  Akira Mochida

IPC: H05K1/16

CPC classification number: H05K1/162 ,  H05K1/0231 ,  H05K1/0271 ,  H05K1/113 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/09763 ,  H05K2201/10522 ,  H05K2201/10734

Abstract: A printed wiring board includes a main body having a mounting portion and ground and power supply pads in the mounting portion such that a ground line of a semiconductor device is connected to a ground pad and a power supply line of the device is connected to a power supply pad, and a layered capacitor disposed in the main body and having a high dielectric constant layer and first and second layer electrodes sandwiching the dielectric layer. One of the electrodes is connected to the power supply line and the other electrode is connected to the ground line, the first electrode has a solid pattern including passage holes through which second rod terminals connected to the second electrode pass in a non-contacting manner, and the second electrode has a solid pattern including passage holes through which first rod terminals connected to the first electrode pass in a non-contacting manner.

Abstract translation: 一种印刷电路板，包括具有安装部分的主体和安装部分中的接地和电源焊盘，使得半导体器件的接地线连接到接地焊盘，并且该设备的电源线连接到电源 供电焊盘和设置在主体中并具有高介电常数层的层状电容器和夹着介电层的第一和第二层电极。 电极中的一个连接到电源线，另一个电极连接到接地线，第一电极具有固体图案，其包括通孔，第二电极与第二电极连接，第二电极以非接触的方式通过， 并且第二电极具有固体图案，其包括通孔，通过该通孔与第一电极连接的第一杆端子以非接触方式通过。

公开(公告)号：US07893532B2

公开(公告)日：2011-02-22

申请号：US11520035

申请日：2006-09-13

Applicant: Michael Bauer ,  Irmgard Escher-Poeppel ,  Edward Fuergut ,  Simon Jerebic ,  Bernd Rakow ,  Peter Strobel ,  Holger Woerner

Inventor： Michael Bauer ,  Irmgard Escher-Poeppel ,  Edward Fuergut ,  Simon Jerebic ,  Bernd Rakow ,  Peter Strobel ,  Holger Woerner

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/49816 ,  B23K35/262 ,  C21D9/50 ,  H01L23/49866 ,  H01L23/49883 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0116 ,  H05K2201/0133 ,  H05K2201/0212 ,  H05K2203/087 ,  H05K2203/1163 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An external contact material for external contacts of a semiconductor device and a method for producing the same are described. The external contact material includes a lead-free solder material. Provided in the solder material is a filler which forms a plurality of gas pores and/or has plastic particles which are arranged in the volume of the solder material.

Abstract translation: 描述了用于半导体器件的外部触点的外部接触材料及其制造方法。 外部接触材料包括无铅焊料。 在焊料材料中提供的是形成多个气孔的填​​料和/或具有布置在焊料材料的体积中的塑料颗粒。

公开(公告)号：US07871661B2

公开(公告)日：2011-01-18

申请号：US11827612

申请日：2007-07-11

Applicant: Mariam N. Maghribi ,  Peter A. Krulevitch ,  Thomas S. Wilson ,  Julie K. Hamilton ,  Christina Park

Inventor： Mariam N. Maghribi ,  Peter A. Krulevitch ,  Thomas S. Wilson ,  Julie K. Hamilton ,  Christina Park

IPC: B05D5/12 ,  B05D3/12

CPC classification number: C08J5/18 ,  A61B5/04001 ,  A61B2562/02 ,  A61B2562/164 ,  A61N1/0452 ,  A61N1/0476 ,  A61N1/0492 ,  A61N1/05 ,  A61N1/0531 ,  A61N1/0534 ,  A61N1/0541 ,  A61N1/0543 ,  A61N1/0551 ,  A61N1/0553 ,  C08J2383/04 ,  H05K1/0283 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/09263 ,  H05K2203/0271 ,  Y10T428/24917 ,  Y10T428/31663 ,  Y10T428/31707

Abstract: A stretchable electronic apparatus and method of producing the apparatus. The apparatus has a central longitudinal axis and the apparatus is stretchable in a longitudinal direction generally aligned with the central longitudinal axis. The apparatus comprises a stretchable polymer body, and at least one circuit line operatively connected to the stretchable polymer body, the at least one circuit line extending in the longitudinal direction and having a longitudinal component that extends in the longitudinal direction and having an offset component that is at an angle to the longitudinal direction, the longitudinal component and the offset component allowing the apparatus to stretch in the longitudinal direction while maintaining the integrity of the at least one circuit line.

Abstract translation: 一种可拉伸电子设备及其制造方法。 该装置具有中心纵向轴线，并且该装置在大致与中心纵向轴线对准的纵向方向上是可拉伸的。 该装置包括可拉伸的聚合物主体，以及至少一个可操作地连接到可拉伸聚合物主体的电路线，所述至少一个电路线在纵向上延伸并且具有沿纵向方向延伸的纵向部件，并且具有偏移部件， 与纵向方向成一角度，纵向分量和偏移分量允许装置在纵向方向上拉伸，同时保持至少一条电路线的完整性。