公开(公告)号：US09631279B2

公开(公告)日：2017-04-25

申请号：US14297516

申请日：2014-06-05

Applicant: Kenneth S. Bahl ,  Konstantine Karavakis ,  Steve Carney

Inventor： Kenneth S. Bahl ,  Konstantine Karavakis ,  Steve Carney

IPC: H05K3/10 ,  C23C18/16 ,  C23C18/38 ,  C23C18/20 ,  H05K3/18 ,  H05K3/46

CPC classification number: C23C18/1608 ,  C23C18/204 ,  C23C18/38 ,  H05K3/185 ,  H05K3/4602 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2203/025 ,  H05K2203/0716 ,  H05K2203/107 ,  Y10T29/49165

Abstract: A printed circuit board includes a laminate substrate. The laminate substrate includes catalytic core material that resists metal plating except where a surface of the catalytic material is ablated. Metal traces are formed within in trace channels within the laminate substrate. The channels extend below the surface of the catalytic material.

公开(公告)号：US20160353575A1

公开(公告)日：2016-12-01

申请号：US15232808

申请日：2016-08-10

Applicant: IBIS Innotech Inc.

Inventor： Wen-Chun Liu

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/0218 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/113 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/188 ,  H05K3/4007 ,  H05K3/4697 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10674

Abstract: A package structure includes a substrate, a sensor, a base, a lead frame, conductive vias and patterned circuit layer. The substrate includes a component-disposing region and electrode contacts. The sensor is disposed at the component-disposing region and electrically connected to the electrode contacts. The base covers the substrate with its bonding surface and includes a receiving cavity, a slanted surface extended between a bottom surface of the receiving cavity and the bonding surface, and electrodes disposed on the bonding surface and electrically connected to the electrode contacts respectively. The sensor is located in the receiving cavity. The lead frame is disposed at the base. The conductive vias penetrates the base and electrically connected to the lead frame. The patterned circuit layer is disposed on the slanted surface and electrically connected to the conductive vias and the electrodes.

Abstract translation: 封装结构包括基板，传感器，基座，引线框架，导电通孔和图案化电路层。 基板包括部件布置区域和电极触点。 传感器设置在部件布置区域处并电连接到电极触点。 基座覆盖基板与其接合表面，并且包括接收腔，在接收腔的底表面和接合表面之间延伸的倾斜表面，以及设置在接合表面上并电连接到电极触头的电极。 传感器位于接收腔中。 引线框架设置在基座上。 导电通孔穿透基座并电连接到引线框架。 图案化电路层设置在倾斜表面上并电连接到导电通孔和电极。

公开(公告)号：US20160295704A1

公开(公告)日：2016-10-06

申请号：US14778539

申请日：2014-04-17

Applicant: LG CHEM, LTD.

Inventor： Chee-Sung P PARK ,  Han Nah JEONG ,  Sang Yun JUNG ,  Cheol-Hee PARK ,  Chan Yeup CHUNG ,  Jae Hyun KIM ,  Shin Hee JUN

IPC: H05K3/10 ,  C08K3/22 ,  H05K3/00 ,  H05K1/09 ,  H05K1/02

CPC classification number: H05K3/105 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2003/2248 ,  C23C18/1608 ,  C23C18/161 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1658 ,  C23C18/204 ,  C23C18/405 ,  H01B1/22 ,  H05K1/0296 ,  H05K1/0373 ,  H05K1/09 ,  H05K3/0014 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/107 ,  C08L69/00

Abstract: The present invention relates to a composition for forming a conductive pattern, which is able to form a fine conductive pattern onto a variety of polymer resin products or resin layers by a very simple process, a method for forming the conductive pattern using the same, and a resin structure having the conductive pattern. The composition for forming the conductive pattern, including a polymer resin; and a non-conductive metal compound containing a first metal and a second metal, in which the non-conductive metal compound has a three-dimensional structure containing a plurality of first layers that contains at least one metal of the first and second metals and has edge-shared octahedrons two-dimensionally connected to each other, and a second layer that contains a metal different from that of the first layer and is arranged between the neighboring first layers; and a metal core containing the first or second metal or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.

Abstract translation: 本发明涉及一种用于形成导电图案的组合物，其能够通过非常简单的工艺在各种聚合物树脂产品或树脂层上形成精细的导电图案，使用其形成导电图案的方法，以及 具有导电图案的树脂结构。 用于形成导电图案的组合物，包括聚合物树脂; 以及含有第一金属和第二金属的非导电金属化合物，其中非导电金属化合物具有包含多个第一层的三维结构，所述第一层包含至少一种第一和第二金属的金属并具有 二维二极管相互连接的第二层，以及包含不同于第一层的金属的第二层，并配置在相邻的第一层之间; 并且通过电磁辐射由非导电金属化合物形成包含第一或第二金属或其离子的金属芯。

公开(公告)号：US20160219708A1

公开(公告)日：2016-07-28

申请号：US15000432

申请日：2016-01-19

Applicant: Koito Manufacturing Co., Ltd.

Inventor： Yoshiaki Aiso ,  Koji Uchino ,  Hiromi Nakamura ,  Takayuki Otsubo

IPC: H05K1/18 ,  B60Q1/34 ,  H05K1/02 ,  H05K3/02 ,  H05K1/11

CPC classification number: H05K3/105 ,  B60Q1/2696 ,  B60Q1/34 ,  F21S43/13 ,  F21S43/14 ,  F21S43/195 ,  F21S43/31 ,  F21S45/47 ,  H05K1/0206 ,  H05K1/0209 ,  H05K3/0014 ,  H05K3/182 ,  H05K2201/0236 ,  H05K2201/09018 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2203/107

Abstract: Provided is a light source unit including a base unit formed on a front surface thereof with a first circuit pattern by irradiating laser light to a resin molded article, and a light emitting element mounted on the base unit and electrically connected to the first circuit pattern. The base unit includes a mounting surface portion directed in a prescribed direction such that the light emitting element is mounted thereon, and a sidewall surface portion connected to the mounting surface portion in a plane intersection state, and the sidewall surface portion is formed as an inclined surface intersecting with the mounting surface portion at an obtuse angle.

Abstract translation: 提供了一种光源单元，其包括：通过向树脂模制品照射激光而在其前表面上形成有第一电路图案的基座单元和安装在基座单元上并电连接到第一电路图案的发光元件。 基座单元包括以规定方向指向安装在其上的发光元件的安装表面部分和在平面交叉状态下连接到安装表面部分的侧壁表面部分，并且侧壁表面部分形成为倾斜 表面以钝角与安装表面部分相交。

公开(公告)号：US09398703B2

公开(公告)日：2016-07-19

申请号：US14281802

申请日：2014-05-19

Applicant: Konstantine Karavakis ,  Kenneth S. Bahl

Inventor： Konstantine Karavakis ,  Kenneth S. Bahl

IPC: H05K1/03 ,  H05K3/38 ,  H05K3/42

CPC classification number: H05K3/426 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/387 ,  H05K2201/0221 ,  H05K2201/0236 ,  H05K2203/0709 ,  Y10T29/49167

Abstract: A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material that has been covered with catalytic adhesive material on both faces of the dielectric laminate material. The layer of catalytic adhesive coats a portion of the dielectric laminate material around the hole. The patterned metal layer is placed over the catalytic adhesive material on both faces of the dielectric laminate material and within the hole.

Abstract translation: 印刷电路板中的通孔由延伸穿过电介质层压材料中的孔的图案化金属层组成，该电介质层压材料已经在介电层压材料的两个表面上被催化粘合剂材料覆盖。 催化粘合剂层将电介质层叠材料的一部分涂覆在孔周围。 图案化的金属层放置在介电层压材料的两个表面上和孔内的催化粘合剂材料上。

公开(公告)号：US20160068964A1

公开(公告)日：2016-03-10

申请号：US14943861

申请日：2015-11-17

Applicant: BYD COMPANY LIMITED

Inventor： Qing GONG ,  Wei ZHOU ,  Weifeng MIAO

IPC: C23C18/16 ,  C23C18/38 ,  C23C18/28 ,  C09D11/03 ,  C08K3/22

CPC classification number: C23C18/1608 ,  B29C37/0025 ,  B29C2035/0838 ,  B29C2035/0872 ,  B29C2035/0877 ,  C01G19/006 ,  C01G19/02 ,  C01G30/002 ,  C01G31/00 ,  C01G39/00 ,  C01P2002/50 ,  C01P2002/52 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/64 ,  C08K3/22 ,  C08K2003/2231 ,  C08K2003/2255 ,  C09D11/03 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/285 ,  C23C18/38 ,  H05K1/0373 ,  H05K3/107 ,  H05K3/185 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0236 ,  H05K2203/107

Abstract: Embodiments of the present disclosure are directed to a doped tin oxide. The doped tin oxide includes a tin oxide and at least one oxide of a doping element. The doping element includes at least one of vanadium and molybdenum. The doped tin oxide includes an amount of the tin oxide ranging from 90 mol % to 99 mol %, and an amount of the at least one oxide ranging from 1 mol % to 10 mol %.

Abstract translation: 本公开的实施方案涉及掺杂的氧化锡。 掺杂的氧化锡包括氧化锡和掺杂元素的至少一种氧化物。 掺杂元素包括钒和钼中的至少一种。 掺杂的氧化锡包括氧化锡的量为90mol％至99mol％，并且至少一种氧化物的量为1mol％至10mol％。

公开(公告)号：US20150279731A1

公开(公告)日：2015-10-01

申请号：US14229777

申请日：2014-03-28

Applicant: Yonggang Yong LI ,  Aritra DHAR ,  Dilan SENEVIRATNE ,  Jon M. WILLIAMS

Inventor： Yonggang Yong LI ,  Aritra DHAR ,  Dilan SENEVIRATNE ,  Jon M. WILLIAMS

IPC: H01L21/768 ,  H01L23/522

CPC classification number: H01L21/4857 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/38 ,  H01L21/288 ,  H01L21/486 ,  H01L21/4864 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/17 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/0032 ,  H05K3/045 ,  H05K3/107 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2203/072 ,  H05K2203/107

Abstract: Embodiments describe the selective electroless plating of dielectric layers. According to an embodiment, a dielectric layer is patterned to form one or more patterned surfaces. A seed layer is then selectively formed along the patterned surfaces of the dielectric layer. An electroless plating process is used to deposit metal only on the patterned surfaces of the dielectric layer. According to an embodiment, the dielectric layer is doped with an activator precursor. Laser assisted local activation is performed on the patterned surfaces of the dielectric layer in order to selectively form a seed layer only on the patterned surfaces of the dielectric layer by reducing the activator precursor to an oxidation state of zero. According to an additional embodiment, a seed layer is selectively formed on the patterned surfaces of the dielectric layer with a colloidal or ionic seeding solution.

Abstract translation: 实施例描述了介电层的选择性无电镀。 根据实施例，对电介质层进行图案化以形成一个或多个图案化表面。 然后沿着电介质层的图案化表面选择性地形成晶种层。 使用化学镀方法仅将金属沉积在电介质层的图案化表面上。 根据实施例，电介质层掺杂有活化剂前体。 在电介质层的图案化表面上进行激光辅助局部激活，以便通过将活化剂前体还原为零的氧化态来选择性地在电介质层的图案化表面上形成晶种层。 根据另外的实施方案，在电介质层的图案化表面上用胶体或离子种子溶液选择性地形成晶种层。

公开(公告)号：US20150274965A1

公开(公告)日：2015-10-01

申请号：US14526561

申请日：2014-10-29

Applicant: Ticona LLC

Inventor： Kamlesh P. Nair ,  Paul C. Yung ,  Yi Li ,  Xinyu Zhao

IPC: C08L67/04

CPC classification number: C08L67/04 ,  H05K1/0373 ,  H05K3/185 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0236 ,  H05K2203/107 ,  Y10T428/266

Abstract: A laminate that contains a film on which one or more conductive elements are disposed is provided. The film is formed from a polymer composition that contains an aromatic polyester and an additive that is “laser-activatable” in the sense that it can be activated by a laser direct structuring (“LDS”) process. By selectively controlling the nature of the polymer composition and its respective components, the present inventors have discovered that a film can be readily formed that has good heat resistance, yet is also capable of exhibiting good adhesion to the conductive elements due to the fact that such elements can be integrally formed on the film using an LDS process.

Abstract translation: 提供包含其上设置有一个或多个导电元件的膜的层压体。 该膜由含有芳族聚酯和“激光可激活”的添加剂的聚合物组合物形成，其可以通过激光直接结构化（“LDS”）工艺激活。 通过选择性地控制聚合物组合物及其各自组分的性质，本发明人已经发现，可以容易地形成具有良好耐热性的膜，但是由于这样的事实，也能够显示出对导电元件的良好粘合性 元件可以使用LDS工艺一体地形成在膜上。

公开(公告)号：US20140255600A1

公开(公告)日：2014-09-11

申请号：US14350971

申请日：2012-10-10

Applicant: ENTHONE INC.

Inventor： Edwin W. Bastenbeck ,  Harald Orschel ,  Ulrich Prinz

IPC: H05K3/18

CPC classification number: H05K3/182 ,  B05D3/005 ,  B05D5/12 ,  C23C18/1607 ,  C23C18/1641 ,  C23C18/166 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C23C18/38 ,  C23C18/42 ,  H05K3/185 ,  H05K2201/0236

Abstract: The invention disclosed relates to an aqueous activator solution and a method for the electroless deposition of copper on a laser direct structured substrate surface. By the invention, an aqueous activator solution comprising a strong reducing agent is proposed to enhance the catalytic activity of the irradiated surface area of a LDS substrate.

Abstract translation: 所公开的本发明涉及水激活剂溶液和用于在激光直接结构化的衬底表面上无电沉积铜的方法。 通过本发明，提出了含有强还原剂的水活化剂溶液，以提高LDS基材的照射表面积的催化活性。

公开(公告)号：US20140002311A1

公开(公告)日：2014-01-02

申请号：US14005692

申请日：2012-03-16

Applicant: Takahiro Takano ,  Takahiko Sumino ,  Kentarou Ishihara ,  Bernardus Antonius Gerardus Schrauwen

Inventor： Takahiro Takano ,  Takahiko Sumino ,  Kentarou Ishihara ,  Bernardus Antonius Gerardus Schrauwen

IPC: C08K13/04 ,  H01Q1/38

CPC classification number: C08K13/04 ,  B41M5/265 ,  C08G69/265 ,  C08J5/043 ,  C08J2377/00 ,  C08K3/2279 ,  C08K7/04 ,  C08K9/02 ,  C08L77/06 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/38 ,  H01Q1/38 ,  H05K1/0366 ,  H05K3/185 ,  H05K2201/0129 ,  H05K2201/0236 ,  H05K2201/0293 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2203/107 ,  C08L77/00

Abstract: Provided is a thermoplastic resin molded article excellent in bending strength, flexural modulus and Charpy impact strength, on which the plated layer may be formed in a successful manner. The thermoplastic resin composition for laser direct structuring comprising, per 100 parts by weight of the thermoplastic resin, 10 to 150 parts by weight of an inorganic fiber and 1 to 30 parts by weight of a laser direct structuring additive, the laser direct structuring additive containing at least one of copper, antimony and tin, and having a Mohs hardness 1.5 or more smaller than the Mohs hardness of the inorganic fiber.

Abstract translation: 提供了弯曲强度，弯曲模量和夏氏冲击强度优异的热塑性树脂成型体，其上可以成功地形成镀层。 用于激光直接结构的热塑性树脂组合物包括：相对于100重量份的热塑性树脂，10至150重量份的无机纤维和1至30重量份的激光直接结构化添加剂，所述激光直接结构化添加剂包含 铜，锑和锡中的至少一种，并且具有比无机纤维的莫氏硬度小1.5或更大的莫氏硬度。