公开(公告)号：US20130329378A1

公开(公告)日：2013-12-12

申请号：US13869010

申请日：2013-04-23

Applicant: GERARD TECHNOLOGIES (SUZHOU) CO., LTD.

Inventor： Jian-Fei Hou ,  Jian Xu

IPC: H05K7/00 ,  H05K3/36 ,  H05K3/34

CPC classification number: H05K7/00 ,  H05K1/117 ,  H05K1/144 ,  H05K1/181 ,  H05K3/284 ,  H05K3/34 ,  H05K3/36 ,  H05K2201/0338 ,  H05K2201/041 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10075 ,  H05K2201/10159 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/49144

Abstract: A Universal Serial Bus device includes a PCB module, a plastic package shell and a power module. The PCB module includes a PCB, and a storage chip and a control chip both arranged on the PCB module. The PCB includes opposite front end and rear end, and opposite upper surface and lower surface. The upper surface has a number of contacting portions, and the storage chip and the control chip being arranged on the lower surface. The plastic package shell at least encapsulates the lower surface of the PCB to encapsulate the storage chip and the control chip. The power module is electrically connected to the part of the PCB module where is not encapsulated by the plastic package shell.

Abstract translation: 通用串行总线设备包括PCB模块，塑料封装外壳和电源模块。 PCB模块包括PCB，以及布置在PCB模块上的存储芯片和控制芯片。 PCB包括相对的前端和后端，以及相对的上表面和下表面。 上表面具有多个接触部分，并且存储芯片和控制芯片布置在下表面上。 塑料封装外壳至少封装PCB的下表面以封装存储芯片和控制芯片。 电源模块电连接到PCB模块的未被塑料封装外壳封装的部分。

公开(公告)号：US20130319271A1

公开(公告)日：2013-12-05

申请号：US13963806

申请日：2013-08-09

Applicant: Jun Sakamoto

Inventor： Koji SAKAMOTO

IPC: B41F7/08

CPC classification number: B41F7/08 ,  B41F3/36 ,  B41F17/26 ,  H01L31/022425 ,  H01L31/022433 ,  H05K3/1275 ,  H05K2201/0338 ,  Y02E10/50

Abstract: A printer according to the present invention includes a transfer roll and a plurality of the printing rolls. At least one printing roll of the plurality of the printing rolls transfers ink containing a conductive material to the transfer roll. Preferably, the at least one printing roll includes a printing roll configured to transfer ink containing a conductive material to the transfer roll and a printing roll configured to transfer ink containing a conductive material to the transfer roll.

Abstract translation: 根据本发明的打印机包括转印辊和多个印刷辊。 多个印刷辊中的至少一个印刷辊将含有导电材料的油墨转印到转印辊上。 优选地，所述至少一个印刷辊包括印刷辊，所述印刷辊被配置为将含有导电材料的油墨转印到所述转印辊上，以及印刷辊，其被配置为将含有导电材料的油墨转印到所述转印辊上。

公开(公告)号：US20130269749A1

公开(公告)日：2013-10-17

申请号：US13911974

申请日：2013-06-06

Applicant: Jun SAKAMOTO

Inventor： Jun SAKAMOTO

IPC: H01L31/0224 ,  H01L31/18

CPC classification number: H01L31/022425 ,  B05C1/0813 ,  B05C1/0817 ,  B41F9/063 ,  B41F13/008 ,  B41F17/24 ,  B41J2202/04 ,  H01L31/022466 ,  H01L31/1884 ,  H05K1/0289 ,  H05K1/092 ,  H05K3/1241 ,  H05K3/4007 ,  H05K2201/0108 ,  H05K2201/0338 ,  H05K2203/1476 ,  H05K2203/1545 ,  Y02E10/50

Abstract: A panel of the present invention includes a substrate, an electrode provided on the substrate, and a transparent conductive layer provided on the substrate along a side of the electrode. The electrode includes a contact region in contact with the transparent conductive layer and a non-contact region out of contact with the transparent conductive layer. Preferably, a part of the electrode is exposed through the transparent conductive layer. Preferably, the conductive layer is separated into one side and the other side of the electrode extending a predetermined direction.

Abstract translation: 本发明的面板包括基板，设置在基板上的电极和沿着电极侧设置在基板上的透明导电层。 电极包括与透明导电层接触的接触区域和与透明导电层不接触的非接触区域。 优选地，电极的一部分通过透明导电层而露出。 优选地，导电层被分离成一侧，电极的另一侧延伸预定方向。

公开(公告)号：US08541096B2

公开(公告)日：2013-09-24

申请号：US12654446

申请日：2009-12-18

Applicant: Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

Inventor： Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

IPC: H05K1/03 ,  H05K7/02

CPC classification number: H05K3/10 ,  H05K1/0271 ,  H05K1/09 ,  H05K3/4602 ,  H05K2201/0338 ,  H05K2201/0352 ,  H05K2201/068 ,  H05K2201/09136

Abstract: There is provided a printed circuit board. The printed circuit board may be configured to include: a core layer in which a bending prevention portion of at least two layers is interposed between a plurality of insulating members and includes metal layers having different thermal expansion coefficients is disposed; a circuit pattern that is formed so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and an insulating layer that is formed on the core layer and includes an opening portion that exposes the circuit pattern, and a method of manufacturing the printed circuit board. According to the above-described printed circuit board and the method of manufacturing the printed circuit board, by disposing a bending prevention portion inside the printed circuit board, a printed circuit board capable of improving the progress rate and the productivity and a method of manufacturing the printed circuit board can be provided.

Abstract translation: 提供了印刷电路板。 印刷电路板可以被构造为包括：芯层，其中至少两层的弯曲防止部分插入在多个绝缘构件之间并且包括具有不同热膨胀系数的金属层; 形成为在芯层的内部和芯层的外表面中的至少一个上具有期望图案的电路图案; 以及形成在芯层上并包括露出电路图案的开口部分的绝缘层，以及制造印刷电路板的方法。 根据上述印刷电路板和印刷电路板的制造方法，通过在印刷电路板内设置弯曲防止部，能够提高进度和生产率的印刷电路板，以及制造印刷电路板的方法 可以提供印刷电路板。

公开(公告)号：US20130223001A1

公开(公告)日：2013-08-29

申请号：US13685076

申请日：2012-11-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hwang-bok Ryu ,  Jun-young Ko ,  Young-ja Kim ,  Dae-young Jeong

IPC: H05K7/06 ,  G06F1/16

CPC classification number: H05K7/06 ,  G06F1/16 ,  G06F1/185 ,  H05K1/114 ,  H05K3/366 ,  H05K3/421 ,  H05K3/4652 ,  H05K2201/0338 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10159 ,  H05K2201/10189

Abstract: A printed circuit board (PCB) comprises an internal wiring layer, an insulating layer on the internal wiring layer, a via hole extending through the insulating layer, and an external wiring layer on the insulating layer. The internal wiring layer comprises at least one metal wiring layer. The via hole exposes the internal wiring layer. The external wiring layer is electrically connected to the internal wiring layer. The external wiring layer includes a mounting area on which a semiconductor chip is disposed and a non-mounting area on which a semiconductor chip is not disposed. A thickness of the mounting area is less than a thickness of the non-mounting area.

Abstract translation: 印刷电路板（PCB）包括内部布线层，内部布线层上的绝缘层，延伸穿过绝缘层的通孔以及绝缘层上的外部布线层。 内部布线层包括至少一个金属布线层。 通孔露出内部布线层。 外部布线层电连接到内部布线层。 外部布线层包括其上设置有半导体芯片的安装区域和不设置半导体芯片的非安装区域。 安装面积的厚度小于非安装区域的厚度。

公开(公告)号：US20130032384A1

公开(公告)日：2013-02-07

申请号：US13565249

申请日：2012-08-02

Applicant: Won Hee Yoo ,  Byeung Gyu Chang ,  Taek Jung Lee ,  Yun Hwi Park

Inventor： Won Hee Yoo ,  Byeung Gyu Chang ,  Taek Jung Lee ,  Yun Hwi Park

IPC: H05K1/03 ,  H05K3/22

CPC classification number: H05K3/243 ,  H05K1/0306 ,  H05K3/107 ,  H05K3/108 ,  H05K2201/0338

Abstract: Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; a thin film electrode pattern formed on the ceramic substrate; and a plating layer formed on the thin film electrode pattern, wherein the plating layer is formed above the thin film electrode pattern and on both lateral surfaces of the thin film electrode pattern. According to the present invention, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented, by forming a plating layer above the thin film electrode pattern or on both lateral surfaces of the thin film electrode pattern, or forming an intaglio type anti-etching metal layer in the surface of the ceramic substrate.

Abstract translation: 本文公开了一种薄膜电极陶瓷基板及其制造方法。 薄膜电极陶瓷基板包括：陶瓷基板; 形成在陶瓷基板上的薄膜电极图案; 以及形成在所述薄膜电极图案上的镀层，其中所述镀层形成在所述薄膜电极图案的上方以及所述薄膜电极图案的两个侧面上。 根据本发明，通过在薄膜电极图案上方形成镀层，可以防止在陶瓷基板的表面与薄膜电极图案之间以及由于蚀刻剂引起的薄膜电极图案之间发生的底切缺陷，或 在薄膜电极图案的两个侧表面上，或在陶瓷基板的表面中形成凹版型的抗蚀刻金属层。

公开(公告)号：US20120300416A1

公开(公告)日：2012-11-29

申请号：US13331306

申请日：2011-12-20

Applicant: Tetsuo SAJI ,  Gohki NISHIMURA ,  Naoyuki TASAKA

Inventor： Tetsuo SAJI ,  Gohki NISHIMURA ,  Naoyuki TASAKA

IPC: H05K1/18 ,  H01P5/12 ,  H01F5/00 ,  H05K1/02

CPC classification number: H05K1/0284 ,  H01F2017/0046 ,  H01F2017/0073 ,  H01P1/213 ,  H01P3/003 ,  H05K1/0219 ,  H05K1/0253 ,  H05K1/162 ,  H05K1/165 ,  H05K1/185 ,  H05K3/4608 ,  H05K2201/0338 ,  H05K2201/09745

Abstract: A multilayer substrate is configured by stacking conductive layers and insulation layers. The multilayer substrate includes a core that is one of the conductive layers and is thicker than any of other conductive layers, and a first signal line that is included in the conductive layers and is adjacent to the core so that a first insulation layer that is one of the insulation layers is interposed between the core and the first signal line, the first signal line being used for transmission of an RF signal. The core has a recess portion so as to face the first signal line.

Abstract translation: 通过堆叠导电层和绝缘层来构成多层基板。 多层基板包括作为导电层之一并且比任何其它导电层更厚的芯以及包含在导电层中并且与芯相邻并且与第一绝缘层为一体的第一信号线 的绝缘层插入在芯和第一信号线之间，第一信号线用于发射RF信号。 芯部具有面向第一信号线的凹部。

公开(公告)号：US08266794B2

公开(公告)日：2012-09-18

申请号：US12662108

申请日：2010-03-31

Applicant: Jun Ishii ,  Yasunari Ooyabu

Inventor： Jun Ishii ,  Yasunari Ooyabu

IPC: H05K3/02 ,  H05K3/10

CPC classification number: H05K1/056 ,  G11B5/484 ,  G11B5/486 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0317 ,  H05K2201/0338 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board to have a thickness of less than 2.0 μm, a first insulating layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the first insulating layer.

Abstract translation: 布线电路板具有金属支撑板，金属箔形成在金属支撑板上以具有小于2.0μm的厚度，形成在金属支撑板上以覆盖金属箔的第一绝缘层和形成的导电图案 在第一绝缘层上。

公开(公告)号：US20120000695A1

公开(公告)日：2012-01-05

申请号：US13227523

申请日：2011-09-08

Applicant: Shunsuke CHISAKA

Inventor： Shunsuke CHISAKA

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  H05K1/09 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/0338 ,  H05K2201/068

Abstract: A resin circuit board includes a layered structure of resin layers and conductor layers, has significantly reduced and minimized warping and distortion, and has a precise shape. A second conductor layer is disposed between a resin layer and a first conductor layer made of a metal. The resin layer and the second conductor layer have a higher thermal expansion coefficient than the first conductor layer such that the thermal expansion coefficient changes gradually, allowing a stress resulting from a difference in thermal expansion coefficient to be relieved.

Abstract translation: 树脂电路板包括树脂层和导体层的层状结构，具有显着减小并且最小化翘曲和变形，并且具有精确的形状。 第二导体层设置在树脂层和由金属制成的第一导体层之间。 树脂层和第二导体层具有比第一导体层更高的热膨胀系数，使得热膨胀系数逐渐变化，从而可以减轻由热膨胀系数的差引起的应力。

公开(公告)号：US08088658B2

公开(公告)日：2012-01-03

申请号：US12431298

申请日：2009-04-28

Applicant: Juan Carlos Figueroa ,  Damien Francis Reardon

Inventor： Juan Carlos Figueroa ,  Damien Francis Reardon

IPC: H01L21/8242 ,  H01L21/20

CPC classification number: H01G4/008 ,  H01G4/085 ,  H01G4/12 ,  H01G4/33 ,  H01L28/40 ,  H05K1/09 ,  H05K1/162 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2203/0361 ,  Y10T29/43

Abstract: Methods for fabricating a capacitor are provided. In the methods, a dielectric may be formed on a metal (e.g. nickel) substrate, and a copper electrode is formed thereon, followed by the thinning of the metal substrate from its non-coated face, and subsequently forming a copper electrode on the thinned, non-coated face of the substrate.

Abstract translation: 提供制造电容器的方法。 在这些方法中，可以在金属（例如镍）基板上形成电介质，并在其上形成铜电极，随后从其未涂覆面减薄金属基板，随后在薄的 ，未涂覆的基材面。