公开(公告)号：US20060256533A1

公开(公告)日：2006-11-16

申请号：US10908483

申请日：2005-05-13

Applicant: Brian Scigiel

Inventor： Brian Scigiel

IPC: H05K7/20 ,  H05K1/00

CPC classification number: H05K1/0204 ,  H05K1/0206 ,  H05K3/0061 ,  H05K3/386 ,  H05K3/4084 ,  H05K7/20854 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/10303

Abstract: An electronic device includes one or more active or passive electronic components, one or more metal coupons, and a printed circuit board. The one or more active electronic components are mounted on a first side of a printed circuit board while the one or more metal coupons are mounted on a second side of the printed circuit board. The electronic device further includes an adhesive that bonds at least a portion of the metal coupon to the second side of the printed circuit board. A method of making the electronic devices includes the steps of forming a metal coupon into a predetermined shape followed by adhering the metal coupon to a printed circuit board.

Abstract translation: 电子设备包括一个或多个有源或无源电子部件，一个或多个金属试样和印刷电路板。 一个或多个有源电子部件安装在印刷电路板的第一侧上，而一个或多个金属试样安装在印刷电路板的第二侧上。 电子设备还包括将金属试样的至少一部分粘合到印刷电路板的第二侧的粘合剂。 制造电子器件的方法包括以下步骤：将金属试样形成预定形状，然后将金属试样粘合到印刷电路板上。

公开(公告)号：US07122124B2

公开(公告)日：2006-10-17

申请号：US10906682

申请日：2005-03-02

Applicant: Dyi-Chung Hu ,  Chih-Kung Huang ,  Chien-Nan Wu

Inventor： Dyi-Chung Hu ,  Chih-Kung Huang ,  Chien-Nan Wu

IPC: B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00

CPC classification number: H05K1/028 ,  H01L21/4846 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K3/002 ,  H05K3/064 ,  H05K3/244 ,  H05K3/383 ,  H05K3/4092 ,  H05K2201/0133 ,  H05K2201/0166 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2203/0574 ,  H01L2924/00

Abstract: A method of fabricating a film carrier is provided. The method comprises the steps of providing a film; forming a metallic layer on the film, patterning the metallic layer by etching to form a plurality of metallic leads; and, patterning the film by etching to form a plurality of openings so that processing time and manufacturing cost are reduced.

Abstract translation: 提供了一种制造薄膜载体的方法。 该方法包括提供薄膜的步骤; 在所述膜上形成金属层，通过蚀刻图案化所述金属层以形成多个金属引线; 并且通过蚀刻来图案化膜以形成多个开口，从而减少了处理时间和制造成本。

公开(公告)号：US07120999B2

公开(公告)日：2006-10-17

申请号：US10668925

申请日：2003-09-23

Applicant: Robert L. Canella

Inventor： Robert L. Canella

IPC: H01R9/00 ,  H01L23/04

CPC classification number: H01L24/90 ,  G01R1/0408 ,  G01R1/0466 ,  H01L21/283 ,  H01L21/2885 ,  H01L21/4846 ,  H01L21/67121 ,  H01L23/49811 ,  H01L24/72 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/10734 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/49181 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A substrate assembly is disclosed including a substrate and a plurality of spring-biased electrical contacts formed thereon for establishing electrical contact with the lead elements of an IC device. The substrate assembly also comprises a layer of resilient conductive material formed on a surface of the substrate, the spring-biased electrical contacts being formed in the resilient conductive material layer in situ on the substrate. Each spring-biased electrical contact includes a surface or surfaces configured to bias against and electrically contact an IC device lead element. The present invention also encompasses methods of fabricating substrate assemblies according to the invention, including heat treating the substrate assembly after formation to achieve desired spring characteristics.

公开(公告)号：US20060175203A1

公开(公告)日：2006-08-10

申请号：US10548277

申请日：2004-03-08

Applicant: Timothy Davis ,  Breet Sexton

Inventor： Timothy Davis ,  Breet Sexton

IPC: H01R13/02 ,  C25D5/10

CPC classification number: B81C1/00666 ,  B81B2201/018 ,  B81B2203/0118 ,  B81C2201/0167 ,  C25D5/12 ,  H01H2059/0081 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0338 ,  H05K2201/0397 ,  H05K2203/0726

Abstract: Curved out of plane metal components are formed on PCB substrates (11) by electroplating two layers (13, 14) of the same metal such that each layer has a different internal stress. This produces as curvature of the layer (13, 14) which enables coils, curved cantilever beams and springs to be fabricated. The amplitude and direction of curvature can be controlled by controlling the stress and thickness of each layer. The stress is controlled by controlling the composition of the electroplating bath.

Abstract translation: 通过对相同金属的两层（13,14）进行电镀，使得每个层具有不同的内部应力，在PCB基板（11）上形成平面金属部件的弯曲。 这产生了能够制造线圈，弯曲悬臂梁和弹簧的层（13,14）的曲率。 可以通过控制各层的应力和厚度来控制曲率的振幅和方向。 通过控制电镀浴的组成来控制应力。

公开(公告)号：US07070418B1

公开(公告)日：2006-07-04

申请号：US11138982

申请日：2005-05-26

Applicant: Tiger Wang

Inventor： Tiger Wang

IPC: H01R12/00

CPC classification number: H01R4/182 ,  F21K9/00 ,  F21V19/0025 ,  F21Y2115/10 ,  H01R12/58 ,  H05K3/202 ,  H05K3/326 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/1084

Abstract: A light emitting diode (LED) assembly has a printed circuit board, multiple conductors and multiple light emitting diodes (LEDs). The printed circuit board has multiple mounting holes. The conductors are mounted on the PCB and serve respectively as positive electrode conductors and negative electrode conductors. Each conductor has a contact pin and at least one through hole with an inner edge. Each LED is mounted on the positive electrode conductor and the negative electrode conductor and has a die and two contact tabs. Each contact tab has a through hole having an inner edge and multiple hooks extending from the inner edge of the through hole in the contact tab and hooking the inner edge of the at least one through hole in the conductor. Consequently, neither solder nor welding is required to assemble the LED assembly.

Abstract translation: 发光二极管（LED）组件具有印刷电路板，多个导体和多个发光二极管（LED）。 印刷电路板有多个安装孔。 导体安装在PCB上，分别用作正极导体和负极导体。 每个导体具有接触销和至少一个具有内边缘的通孔。 每个LED安装在正极导体和负极导体上，并具有一个模具和两个接触片。 每个接触片具有一个通孔，该通孔具有一个内边缘和多个钩子，它们从接触片中的通孔的内边缘延伸出来并钩住导体中至少一个通孔的内边缘。 因此，组装LED组件不需要焊料或焊接。

公开(公告)号：US07046100B2

公开(公告)日：2006-05-16

申请号：US10944181

申请日：2004-09-20

Applicant: Takatoshi Yagisawa ,  Tadashi Ikeuchi

Inventor： Takatoshi Yagisawa ,  Tadashi Ikeuchi

IPC: H03H5/00 ,  H01G4/38

CPC classification number: H01P1/203 ,  H01P1/2013 ,  H05K1/0231 ,  H05K1/0239 ,  H05K1/184 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/09481 ,  H05K2201/1053 ,  H05K2201/10545 ,  H05K2201/10636 ,  H05K2201/10643 ,  Y02P70/611

Abstract: In the direct current cut structure of the present invention, two capacitors are provided in parallel between signal transmission line patterns facing each other on a substrate, and each of the two capacitors is electrically connected to each surface of each transmission line pattern that is exposed through a hole part provided on the substrate. It is preferable for the two capacitors to have different capacity. If there is no need to cover such a broad band, only one capacitor can also connected to either side of each transmission line pattern exposed through the hole part.

Abstract translation: 在本发明的直流切断结构中，在基板上彼此面对的信号传输线图案之间并联设置两个电容器，并且两个电容器中的每一个电连接到每个传输线图案的暴露于 设置在基板上的孔部。 两个电容器的电容最好具有不同的容量。 如果不需要覆盖这样的宽带，则只有一个电容器也可以连接到通过孔部分暴露的每个传输线图案的任一侧。

公开(公告)号：US07040906B2

公开(公告)日：2006-05-09

申请号：US10623626

申请日：2003-07-21

Applicant: Shuji Yamakawa ,  Eriko Yuasa

Inventor： Shuji Yamakawa ,  Eriko Yuasa

IPC: H01R12/00

CPC classification number: H05K3/328 ,  H01R4/029 ,  H01R4/70 ,  H01R43/0214 ,  H01R2201/26 ,  H05K3/202 ,  H05K2201/0397 ,  H05K2201/10053 ,  H05K2201/10977 ,  H05K2203/1316 ,  Y10S439/936

Abstract: A connection structure is between bus bars and relay terminals in an electrical connection box to be mounted on an automobile. Each bus bar is produced by punching an aluminum-based metal plate into a desired circuit configuration. An end of each bus bar is bent so that the end is connected to each respective relay terminal. Each bus bar end is welded to the respective relay terminal. Connection parts between the bus bars and the relay terminals are embedded in a molded insulation. Alternatively, grease is applied to and fills in exteriors and clearances of the connection parts.

Abstract translation: 连接结构在要安装在汽车上的电气接线盒中的母线和继电器端子之间。 每个汇流条通过将铝基金属板冲压成所需的电路结构来制造。 每个母线的端部被弯曲，使得端部连接到每个相应的中继端子。 每个母线端焊接到相应的中继端子。 母线和继电器端子之间的连接部分嵌入模制绝缘体中。 或者，将润滑脂施加到并填充连接部件的外部和间隙。

公开(公告)号：US07035105B2

公开(公告)日：2006-04-25

申请号：US10691502

申请日：2003-10-24

Applicant: Jun Yamaguchi

Inventor： Jun Yamaguchi

IPC: H05K7/20

CPC classification number: B60R16/0238 ,  H05K3/202 ,  H05K3/284 ,  H05K7/026 ,  H05K2201/0397 ,  H05K2203/1147 ,  Y10T29/4935

Abstract: A power circuit section including a plurality of bus bars is disposed through an insulation layer on a circuit arrangement surface of a heat radiation member. An end of each of the bus bars is folded up from the circuit arrangement surface to form an external connection terminal. An enclosure wall member that surrounds the power circuit section including the external connection terminal is disposed on the heat radiation member. A connector housing contains an external connection connector that comprises a bottom portion provided with terminal, a through-hole into which the external connection terminal is inserted, and a hood that surrounds the external connection terminal. The external connection connector can be coupled to another connector together with the external connection terminal. A waterproof layer is formed within the enclosure wall member so that at least a part of the power circuit section is sealed and the terminal through-hole is sealed.

Abstract translation: 包括多个母线的电源电路部分穿过散热部件的电路装置表面上的绝缘层。 每个母线的端部从电路布置表面折叠以形成外部连接端子。 围绕包括外部连接端子的电源电路部分的封闭壁构件设置在散热构件上。 连接器壳体包括外部连接连接器，其包括设置有端子的底部，插入外部连接端子的通孔和围绕外部连接端子的罩。 外部连接连接器可以与外部连接端子一起耦合到另一个连接器。 在外壳壁构件内形成有防水层，使得电源电路部分的至少一部分被密封，并且端子通孔被密封。

公开(公告)号：US07009142B2

公开(公告)日：2006-03-07

申请号：US10850223

申请日：2004-05-20

Applicant: Zhong-You (Joe) Shi ,  Peter J. Sinkunas

Inventor： Zhong-You (Joe) Shi ,  Peter J. Sinkunas

IPC: B23K26/00

CPC classification number: H05K3/363 ,  B23K1/0008 ,  B23K2101/38 ,  H05K3/3494 ,  H05K2201/0108 ,  H05K2201/0397 ,  H05K2203/107

Abstract: A method for interconnecting flat cable is disclosed. The flat cable has a plurality of conductors attached to an insulating layer. The method includes removing an insulation layer from a first and second flat cable portions to expose the plurality of conductors, applying a thermal plate to the exposed plurality of conductors of the first flat cable portion, applying solder to first flat cable portion, placing the plurality of conductors of second flat cable portion over the plurality of conductors of first flat cable portion having applied solder, applying a transparent plate over the first and second flat cable portions, scanning a laser beam through the transparent plate to reflow the solder between the first and second flat cable portions.

Abstract translation: 公开了一种用于互连扁平电缆的方法。 扁平电缆具有连接到绝缘层的多个导体。 该方法包括从第一和第二扁平电缆部分去除绝缘层以露出多个导体，将热板施加到暴露的第一扁平电缆部分的多个导体，将焊料施加到第一扁平电缆部分， 在第一扁平电缆部分的多个导体上的第二扁平电缆部分的导体具有施加的焊料，在第一和第二扁平电缆部分上施加透明板，扫描通过透明板的激光束以在第一和第二扁平电缆部分之间回流焊料， 第二扁平电缆部分。

公开(公告)号：US20060040522A1

公开(公告)日：2006-02-23

申请号：US11211810

申请日：2005-08-25

Applicant: Thomas Distefano ,  Joseph Fjelstad

Inventor： Thomas Distefano ,  Joseph Fjelstad

IPC: H05K1/00

CPC classification number: H05K3/462 ,  H01L23/49827 ,  H01L23/5385 ,  H01L2924/0002 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2414 ,  H01R43/0256 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/326 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1744 ,  H01L2924/00

Abstract: A microelectronic interposer is made by providing a sacrificial layer over the surface of a planar body. Apertures are formed passing through the body and the sacrificial layer. A layer of an electrically conductive structural material is deposited in each of the apertures and over the sacrificial layer, proximate to each aperture to thereby form contacts. The sacrificial layer is removed leaving the contacts with outwardly flaring peripheral portions spaced vertically above the surface of the planar body.

Abstract translation: 通过在平面体的表面上设置牺牲层来制造微电子插入器。 形成穿过身体和牺牲层的孔。 一层导电结构材料沉积在每个孔中并在牺牲层上方，靠近每个孔，从而形成接触。 去除牺牲层，留下接触件，其外部扩张的外围部分在平面体的表面上方垂直地间隔开。