公开(公告)号：US20090109636A1

公开(公告)日：2009-04-30

申请号：US12290053

申请日：2008-10-27

Applicant: Shawn Arnold

Inventor： Shawn Arnold

IPC: H05K7/00 ,  H05K3/00

CPC classification number: H01L23/4985 ,  H01L25/0652 ,  H01L2224/16 ,  H05K1/141 ,  H05K1/147 ,  H05K1/148 ,  H05K3/363 ,  H05K3/4691 ,  H05K2201/055 ,  Y10T29/49124

Abstract: A multiple package module and a method of fabricating a multiple package module. The module comprises a central region of a rigid flex circuit board for mounting circuitry, and at least one wing connected by a flexible portion to at least one edge of the central region of the rigid flex circuit board.

Abstract translation: 多封装模块和制造多封装模块的方法。 模块包括用于安装电路的刚性柔性电路板的中心区域，以及至少一个通过柔性部分连接到刚性柔性电路板的中心区域的边缘的翼。

公开(公告)号：US20090061660A1

公开(公告)日：2009-03-05

申请号：US12230037

申请日：2008-08-22

Applicant: Mitsuru Honjo

Inventor： Mitsuru Honjo

IPC: H05K1/00

CPC classification number: H05K3/363 ,  H05K1/056 ,  H05K2201/055 ,  H05K2201/09663 ,  H05K2203/041

Abstract: The connection structure between wired circuit boards connects a first wired circuit board and a second wired circuit board. The first wired circuit board includes a metal supporting layer, a first insulating layer formed on the metal supporting layer, and a first conductive pattern formed on the first insulating layer and having a first terminal portion. The metal supporting layer is arranged so as not to be opposed to the first terminal portion in a thickness direction. The first terminal portion and the first insulating layer opposed to the first terminal portion in a thickness direction are folded back into a curved shape. The second wired circuit board includes a second insulating layer, and a second conductive pattern formed on the second insulating layer and having a second terminal portion. The first terminal portion and the second terminal portion are electrically connected to each other.

Abstract translation: 布线电路板之间的连接结构连接第一布线电路板和第二布线电路板。 第一布线电路板包括金属支撑层，形成在金属支撑层上的第一绝缘层和形成在第一绝缘层上并具有第一端子部分的第一导电图案。 金属支撑层被布置成在厚度方向上不与第一端子部分相对。 在厚度方向上与第一端子部分相对的第一端子部分和第一绝缘层被折回到弯曲的形状。 第二布线电路板包括第二绝缘层和形成在第二绝缘层上并具有第二端子部分的第二导电图案。 第一端子部分和第二端子部分彼此电连接。

公开(公告)号：US20090013526A1

公开(公告)日：2009-01-15

申请号：US11959212

申请日：2007-12-18

Applicant: CHIH-KANG YANG ,  CHENG-HSIEN LIN

Inventor： CHIH-KANG YANG ,  CHENG-HSIEN LIN

IPC: H05K3/36 ,  H05K3/42

CPC classification number: H05K3/0097 ,  H05K1/0393 ,  H05K3/06 ,  H05K3/242 ,  H05K3/4611 ,  H05K3/4635 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/055 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/1028 ,  H05K2203/1536 ,  H05K2203/1545 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49165 ,  Y10T428/15

Abstract: An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other. An exemplary method for manufacturing multilayer printed circuit boards using the inner substrate is also provided. The method can improve efficiency of manufacturing multilayer printed circuit boards.

Abstract translation: 提供了用于制造多层印刷电路板的示例性内基板。 内部基板具有多个基板单元和沿着内部基板的纵向方向交替排列的多个横向折叠部。 每个基板单元被构造成用于形成一体的印刷电路板。 每个折叠部分在相邻的基板单元之间互连。 每个折叠部分限定垂直于内部基板的纵向方向的至少一条线弱点，以便于相邻的基板单元相互折叠和展开。 还提供了使用内部基板制造多层印刷电路板的示例性方法。 该方法可以提高制造多层印刷电路板的效率。

公开(公告)号：US20090008131A1

公开(公告)日：2009-01-08

申请号：US11659131

申请日：2005-07-28

Applicant: Osamu Shibata ,  Takeshi Nakayama ,  Yoshiyuki Saito

Inventor： Osamu Shibata ,  Takeshi Nakayama ,  Yoshiyuki Saito

IPC: H05K1/02

CPC classification number: H05K1/0219 ,  H05K1/0237 ,  H05K1/118 ,  H05K2201/055 ,  H05K2201/09236 ,  H05K2201/09445 ,  H05K2201/09727

Abstract: A flexible printed board that is adapted to high-speed transmission and can mount a plurality of connectors at low cost is provided. The board comprises a flexible printed board body 100 that has a first side 100a and a second side 100b opposed to each other, and an overlap portion 105 formed by bending its one end; a plurality of wiring lines 101 that are arranged on the first side 100a of the body substantially in parallel to each other; first pads 103 that are connected to respective ends of wiring lines, wider than the wiring lines and formed on the first-side surface 105a of the overlap potion; and second pads 104 that are located at respective ends of wiring lines, wider than the wiring lines and formed on the second-side surface 105b of the overlap potion. The wiring lines 101a with the first pads connected thereto and the wiring lines 101b with the second pads 104 connected thereto are alternatively arranged on the first side.

Abstract translation: 提供了适用于高速传输并可以以低成本安装多个连接器的柔性印刷电路板。 板包括具有彼此相对的第一侧100a和第二侧面100b的柔性印刷电路板主体100和通过使其一端弯曲形成的重叠部分105; 布置在主体的第一侧100a上的多个布线101基本上彼此平行; 第一焊盘103，其连接到布线的相应端部，比布线宽，并形成在重叠部分的第一侧表面105a上; 以及第二焊盘104，其位于布线的相应端部，比布线宽，并且形成在重叠部分的第二侧表面105b上。 具有与其连接的第一焊盘的布线101a和与其连接的第二焊盘104的布线101b交替布置在第一侧上。

公开(公告)号：US20080285243A1

公开(公告)日：2008-11-20

申请号：US12119289

申请日：2008-05-12

Applicant: Shigeru Kagawa

Inventor： Shigeru Kagawa

IPC: H05K1/00

CPC classification number: G11B25/043 ,  G11B5/4846 ,  G11B33/122 ,  H05K1/189 ,  H05K3/301 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2201/2009 ,  H05K2201/2018 ,  H05K2203/1147

Abstract: A storage apparatus includes an enclosure that has an opening in a bottom, and a carriage block. A flexible printed board has an upper part and a lower part, and a connector attached on an opposed surface of the lower part to a bottom plate of the enclosure inserted through the opening. A connector packing is fixed around the connector, with a catching part that stretches toward the flexible printed board. The flexible printed board has a first opening formed in the lower part, into which the catching part of the connector packing is infixed and a second opening formed in the upper part, into which the catching part of the connector packing fixed into the first opening is further fixed with the upper part folded on the lower part.

Abstract translation: 存储装置包括在底部具有开口的外壳和支架块。 柔性印刷电路板具有上部和下部，以及连接器，该连接器安装在下部的相对的表面与通过该开口插入的外壳的底板之间。 连接器包装固定在连接器周围，具有朝向柔性印刷板延伸的捕获部分。 柔性印刷电路板具有形成在下部的第一开口，连接器衬垫的捕获部分被固定在该第一开口中，第二开口形成在上部中，固定到第一开口中的连接器封装的捕获部分 进一步固定，上部折叠在下部。

公开(公告)号：US20080238600A1

公开(公告)日：2008-10-02

申请号：US12079777

申请日：2008-03-28

Applicant: Bruce D. Olson

Inventor： Bruce D. Olson

IPC: H05K3/12 ,  H01F27/28 ,  H01F7/06

CPC classification number: H05K1/165 ,  H01F17/0006 ,  H01F2017/006 ,  H01F2027/2861 ,  H05K1/0393 ,  H05K2201/055 ,  Y10T29/4902 ,  Y10T29/4906 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/5313

Abstract: A multi-turn coil device comprising a flexible circuit board and a plurality of serially electrically coupled coils coupled to both sides of the flexible circuit board. The coils are formed such that when the circuit board is folded in an accordion manner, the coils are substantially aligned and have the same direction of current flow. The coils are serially coupled sequentially from front to back and back to front wherein the coupling of the coils is through a plated through hole in the flexible circuit board.

Abstract translation: 一种多匝线圈装置，包括柔性电路板和耦合到柔性电路板两侧的多个串联电耦合线圈。 线圈形成为使得当电路板以手风琴的方式折叠时，线圈基本上对齐并具有相同的电流方向。 线圈从前到后顺序地顺序地连接到前面，其中线圈的耦合通过柔性电路板中的电镀通孔。

公开(公告)号：US20080202797A1

公开(公告)日：2008-08-28

申请号：US12037924

申请日：2008-02-26

Applicant: Tomoyuki Kubo

Inventor： Tomoyuki Kubo

IPC: H05K1/18

CPC classification number: H05K1/118 ,  H01L23/4985 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/114 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/055 ,  H05K2201/09081 ,  H05K2201/09236 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A plurality of first output terminals is provided along one side of a circuit element, and a plurality of input terminals and a plurality of second output terminals are provided adjacently along the other opposite side thereof. Leads include a first output lead extending from the first output terminal to an output connection electrode, and a second output lead extending from the second output terminal to the output connection electrode. The second output lead is extended from the other side of the circuit element to one side of the circuit element through a surface of a flexible wiring cable opposite the circuit element and further extended in parallel with the first output lead and connected to the output connection electrode.

Abstract translation: 沿着电路元件的一侧设置多个第一输出端子，并且沿其另一侧相邻设置多个输入端子和多个第二输出端子。 引线包括从第一输出端子延伸到输出连接电极的第一输出引线和从第二输出端子延伸到输出连接电极的第二输出引线。 第二输出引线从电路元件的另一侧通过与电路元件相对的柔性布线电缆的表面延伸到电路元件的一侧，并进一步与第一输出引线平行延伸并连接到输出连接电极 。

公开(公告)号：US20080199597A1

公开(公告)日：2008-08-21

申请号：US11994928

申请日：2006-07-11

Applicant: Arved Huebler

Inventor： Arved Huebler

IPC: H05K3/00

CPC classification number: H05K1/16 ,  H05K1/0393 ,  H05K1/095 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/4635 ,  H05K2201/055 ,  H05K2203/0221

Abstract: The invention relates to a method for producing a three-dimensional circuit having at least two superimposed, flexibly formed substrate layers comprising conductor paths and/or circuit elements composed of electrical functional materials. The method has a combination of the following method steps: a. using a continuous sheet of material for the at least two substrate layers, b. printing the electrical functional materials onto the substrate layers, c. providing at least one folding or bending edge in the sheet of material in order to delimit the at least two substrate layers from each other, the folding operation being carried out inline with the printing operation, d. folding the sheet of material about the folding or bending edge after the conductor paths and/or circuit elements have been printed on, so that the at least two substrate layers are arranged one above the other.

Abstract translation: 本发明涉及一种三维电路的制造方法，所述三维电路具有至少两个叠加的，柔性形成的基底层，包括由电功能材料构成的导体路径和/或电路元件。 该方法具有以下方法步骤的组合：a。 使用连续的材料片用于至少两个基底层，b。 将电功能材料印刷到基底层上，c。 在所述材料片材中提供至少一个折叠或弯曲边缘以便将所述至少两个基底层彼此界定，所述折叠操作与所述打印操作一致地进行。 在已经印刷了导体路径和/或电路元件之后，在折叠或弯曲边缘周围折叠材料片，使得至少两个基板层彼此上下排列。

公开(公告)号：US20080030666A1

公开(公告)日：2008-02-07

申请号：US11833270

申请日：2007-08-03

Applicant: Hideaki Abe ,  Shinji Tanabe ,  Kouichi Inoue ,  Yasuaki Kondo

Inventor： Hideaki Abe ,  Shinji Tanabe ,  Kouichi Inoue ,  Yasuaki Kondo

IPC: H05K1/02 ,  H05K5/02

CPC classification number: H05K3/381 ,  G02F1/13452 ,  G02F2001/133354 ,  H05K1/0269 ,  H05K1/0286 ,  H05K2201/055 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/166 ,  H05K2203/168

Abstract: The present invention can perform, at the time of mounting flexible printed circuit boards on a display substrate, the accurate alignment without wrong mounting. A first alignment mark and a second alignment mark for performing the alignment of a flexible printed circuit board with a display substrate are attached to left and right sides of a group of lines which are formed on the flexible printed circuit board. Further, when at least one of the first alignment mark and the second alignment mark is equally divided into four areas, a shape of the alignment mark in at least one area is a shape obtained by folding back the shape of the alignment mark in other areas.

Abstract translation: 本发明可以在将柔性印刷电路板安装在显示基板上时进行准确的对准而不会错误地安装。 用于执行柔性印刷电路板与显示基板的对准的第一对准标记和第二对准标记被附接到形成在柔性印刷电路板上的一组线的左侧和右侧。 此外，当第一对准标记和第二对准标记中的至少一个被等分成四个区域时，至少一个区域中的对准标记的形状是通过在其它区域中折回对准标记的形状而获得的形状 。

公开(公告)号：US20070218589A1

公开(公告)日：2007-09-20

申请号：US11724265

申请日：2007-03-15

Applicant: Yoshihiro Machida

Inventor： Yoshihiro Machida

IPC: H01L21/46

CPC classification number: H05K3/4614 ,  H05K1/0393 ,  H05K3/0052 ,  H05K3/28 ,  H05K3/4602 ,  H05K3/4635 ,  H05K2201/0195 ,  H05K2201/055 ,  H05K2201/09536 ,  H05K2203/061

Abstract: A first multilayer wiring structural body 16 and a second multilayer wiring structural body 56 are simultaneously formed on both surfaces 101A, 101B of a substrate 101 and thereafter the portion of a structural body 120 corresponding to a third region C1 is folded so as to oppose a second structural body 22 to a second structural body 62 and the first multilayer wiring structural body 16 is electrically connected to the second multilayer wiring structural body 56.

Abstract translation: 在基板101的两面101A，101B上同时形成第一多层布线结构体16和第二多层布线结构体56，然后将与第三区域C 1对应的结构体120的部分折叠成 将第二结构体22与第二结构体62相对，第一多层布线结构体16与第二多层布线结构体56电连接。