公开(公告)号：US20140166344A1

公开(公告)日：2014-06-19

申请号：US14183558

申请日：2014-02-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Noboru KATO ,  Jun SASAKI ,  Satoshi ISHINO

IPC: H05K1/02

CPC classification number: H05K1/0281 ,  H05K1/024 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/032 ,  H05K1/09 ,  H05K2201/0141 ,  H05K2201/057 ,  H05K2201/0715 ,  H05K2201/09018 ,  H05K2201/09409

Abstract: A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.

Abstract translation: 保持弯曲状态而不引起电特性波动的多层基板包括：主体，其包括要堆叠并由柔性材料制成的多个绝缘片。 信号线在主体中延伸。 接地导体相对于主体中的信号线在z轴方向的正方向侧设置，并且在从z轴方向看的俯视图中与信号线重叠。 接地导体相对于主体中的信号线在z轴方向的负方向侧设置，并且在从z轴方向观察的俯视图中与信号线重叠。 主体弯曲的状态使得信号线定义为电弧，由接地导体的塑性变形保持。

公开(公告)号：US20140022789A1

公开(公告)日：2014-01-23

申请号：US13551637

申请日：2012-07-18

Applicant: LI-YU LIN

Inventor： LI-YU LIN

IPC: F21V29/00 ,  H05K13/00 ,  F21V21/00

CPC classification number: F21K9/232 ,  F21K9/90 ,  F21V3/00 ,  F21Y2107/00 ,  F21Y2107/20 ,  F21Y2107/30 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2201/0999 ,  H05K2201/10106 ,  Y10T29/49002

Abstract: The present invention provides a light core structure and a manufacturing process thereof Firstly, an insulation material that is temperature resistant and has high thermal conductivity is provided to serve as a base material and the base material is used to form a thermal conductive body that has a cylindrical shape, a circular tubular shape, a spherical pillar shape, or a conical pillar shape. Printing techniques are then applied to print solderable conductive metal wiring on a surface of the thermal conductive body and heat is applied to cure the wiring to form a curved surface circuit. Afterwards, SMD bonding technique is applied, together with a fixture, to mount SMD LED elements to the curved surface of the thermal conductive body through soldering. The thermal conductive body is then coupled to an adaptor element through threading or other suitable machining or being used in combination with other thermally conductive bar.

Abstract translation: 本发明提供一种轻芯结构及其制造方法首先，提供耐热性且导热性高的绝缘材料作为基材，并且该基材用于形成导热体，该导热体具有 圆柱形，圆柱形，球形或圆柱形。 然后施加打印技术以在导热体的表面上印刷可焊接的导电金属布线，并施加热量以固化布线以形成曲面电路。 之后，SMD贴片技术与固定装置一起通过焊接将SMD LED元件安装到导热体的弯曲表面。 然后，导热体通过穿线或其他合适的加工或与其它导热棒结合使用而耦合到适配器元件。

公开(公告)号：US08625296B2

公开(公告)日：2014-01-07

申请号：US13158037

申请日：2011-06-10

Applicant: Shinji Watanabe ,  Nobuhiro Mikami ,  Junya Sato ,  Kenichiro Fujii ,  Katsumi Abe ,  Atsumasa Sawada

Inventor： Shinji Watanabe ,  Nobuhiro Mikami ,  Junya Sato ,  Kenichiro Fujii ,  Katsumi Abe ,  Atsumasa Sawada

IPC: H05K7/00

CPC classification number: H05K1/18 ,  H01L24/18 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1515 ,  H01L2924/15151 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/023 ,  H05K1/0271 ,  H05K1/0284 ,  H05K1/185 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/32 ,  H05K3/4644 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09436 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/1469 ,  H05K2203/302 ,  Y02P70/611 ,  H01L2924/00

Abstract: An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.

公开(公告)号：US08510939B2

公开(公告)日：2013-08-20

申请号：US11924696

申请日：2007-10-26

Applicant: Robert J. Greenberg ,  Matthew J. McMahon ,  James Singleton Little ,  Kelly H. McClure ,  Brian V. Mech ,  Neil Hamilton Talbot ,  Jordan M. Neysmith

Inventor： Robert J. Greenberg ,  Matthew J. McMahon ,  James Singleton Little ,  Kelly H. McClure ,  Brian V. Mech ,  Neil Hamilton Talbot ,  Jordan M. Neysmith

IPC: H01K3/22

CPC classification number: A61N1/36046 ,  A61N1/0543 ,  A61N1/37223 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/118 ,  H05K3/0014 ,  H05K3/28 ,  H05K2201/0133 ,  H05K2201/09018 ,  H05K2201/09145 ,  H05K2201/09909 ,  H05K2201/2009 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/302 ,  Y10T29/49158

Abstract: Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, and cortical stimulation, and many related purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow. Common flexible circuit fabrication techniques generally require that a flexible circuit electrode array be made flat. Since neural tissue is almost never flat, a flat array will necessarily apply uneven pressure. Further, the edges of a flexible circuit polymer array may be sharp and cut the delicate neural tissue. By applying the right amount of heat to a completed array, a curve can be induced. With a thermoplastic polymer it may be further advantageous to repeatedly heat the flexible circuit in multiple molds, each with a decreasing radius. Further, it is advantageous to add material along the edges. It is further advantageous to provide a fold or twist in the flexible circuit array. Additional material may be added inside and outside the fold to promote a good seal with tissue.

Abstract translation: 聚合物材料可用作神经刺激的电极阵列体。 它们特别有用于视网膜刺激以产生人造视觉，耳蜗刺激以产生人造听觉和皮质刺激以及许多相关目的。 通过电极阵列对视网膜或其他神经组织施加的压力是至关重要的。 太小的压力会导致电阻增加以及电场分散。 太大的压力可能会阻止血液流动。 通常的柔性电路制造技术通常需要使柔性电路电极阵列平坦。 由于神经组织几乎从不平坦，平面阵列必然会施加不均匀的压力。 此外，柔性电路聚合物阵列的边缘可以是尖锐的并切割精细的神经组织。 通过将适量的热应用于完整的阵列，可以引起曲线。 对于热塑性聚合物，可以进一步有利的是在多个模具中反复加热柔性电路，每个模具具有减小的半径。 此外，沿着边缘添加材料是有利的。 在柔性电路阵列中提供折叠或扭曲是更有利的。 可以在折叠内部和外部添加附加材料以促进与组织的良好密封。

公开(公告)号：US08449153B2

公开(公告)日：2013-05-28

申请号：US13224341

申请日：2011-09-02

Applicant: Hsing-Fen Lo ,  Chih-Hsun Ke ,  Shiun-Wei Chan

Inventor： Hsing-Fen Lo ,  Chih-Hsun Ke ,  Shiun-Wei Chan

IPC: F21V33/00

CPC classification number: H01L33/62 ,  F21V19/004 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H05K1/0284 ,  H05K1/056 ,  H05K3/326 ,  H05K2201/09018 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: An LED module includes a substrate comprising a base plate and an elastic arm extending from a periphery side of the base plate. The elastic arm includes a horizontal portion parallel to and spaced from the base plate. A receiving space is defined between the horizontal portion of the elastic arm and the base plate. A circuit layer is formed on the base plate. An LED is mounted on the base plate and electrically connects with the circuit layer. The LED comprises a base and at least one electrode extending outwardly from the base. The LED is fixed on the substrate via the at least one electrode slideably received in the receiving space with a downward force applied on the electrode by the horizontal portion of the elastic arm.

Abstract translation: LED模块包括基板，该基板包括基板和从基板的周边侧延伸的弹性臂。 弹性臂包括与基板平行并与基板隔开的水平部分。 在弹性臂的水平部分和基板之间限定接收空间。 电路层形成在基板上。 LED安装在基板上并与电路层电连接。 LED包括底座和从基座向外延伸的至少一个电极。 LED通过弹性臂的水平部分上施加在电极上的向下的力，通过可滑动地容纳在接收空间中的至少一个电极固定在基板上。

公开(公告)号：US08371241B2

公开(公告)日：2013-02-12

申请号：US12770528

申请日：2010-04-29

Applicant: Donald C. Sedberry ,  Derek S. Rollins ,  David S. Metzger

Inventor： Donald C. Sedberry ,  Derek S. Rollins ,  David S. Metzger

IPC: B05B5/00 ,  B05C11/00 ,  B05D1/02 ,  B05D5/00

CPC classification number: H05K3/1216 ,  H01Q1/42 ,  H05K1/0284 ,  H05K3/0091 ,  H05K3/4664 ,  H05K2201/09018 ,  H05K2203/1366 ,  H05K2203/1476 ,  H05K2203/1554

Abstract: An electric circuit is applied to an object having a curved surface. The curved surface of the object is divided into sections, and the circuit is applied one section at a time. The circuit is formed between layers of dielectric material. The dielectric is applied by a computer-controlled device, which controls the position of a spray head and the rotation of the object, such that the spray head is held substantially perpendicular to the surface of the object at all times, and such that a controlled thickness of dielectric material can be deposited. The fine-featured circuits formed by the invention are rugged, and can be used on objects intended to be exposed to harsh environments.

Abstract translation: 电路被施加到具有曲面的物体上。 物体的曲面被分成几部分，电路一次应用一个部分。 电路形成在介电材料层之间。 电介质通过计算机控制的装置施加，其控制喷头的位置和物体的旋转，使得喷头始终保持基本上垂直于物体的表面，并且使得受控的 介电材料的厚度可以沉积。 由本发明形成的精细电路是坚固的，并且可以用于旨在暴露于恶劣环境的物体上。

公开(公告)号：US20120250326A1

公开(公告)日：2012-10-04

申请号：US13433890

申请日：2012-03-29

Applicant: Noriaki SEKINE

Inventor： Noriaki SEKINE

IPC: F21V21/14

CPC classification number: H01L25/0753 ,  H01L33/56 ,  H01L33/64 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/181 ,  H05K1/0284 ,  H05K1/056 ,  H05K2201/0141 ,  H05K2201/09018 ,  H05K2201/10106 ,  H05K2203/0323 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A luminous-body flexible board includes a flexible board including a metal substrate of a bendable plate, an insulating layer of liquid crystal polymer of which one surface is joined directly to the metal substrate and a conductor layer joined to the other surface of the insulating layer and formed in a wiring pattern. The flexible board further has a plurality of cavities dented on a side of the conductor layer and protruded on a side of the metal substrate of the flexible board, being arranged in juxtaposition and configured to be mounted a luminous element respectively therein.

Abstract translation: 发光体柔性基板包括柔性基板，该柔性基板包括可弯曲板的金属基板，一个表面直接接合到金属基板的液晶聚合物的绝缘层和与该绝缘层的另一个表面接合的导体层 并以布线图案形成。 柔性基板还具有在导体层的侧面凹陷并在柔性基板的金属基板的一侧突出的多个空腔，并列配置成分别安装在发光元件上。

公开(公告)号：US20120162990A1

公开(公告)日：2012-06-28

申请号：US13411322

申请日：2012-03-02

Applicant: Wm. Todd Crandell ,  Anthony Mitchell Johnson ,  Tony Stephen Schweitzer ,  H. Vic Holec

Inventor： Wm. Todd Crandell ,  Anthony Mitchell Johnson ,  Tony Stephen Schweitzer ,  H. Vic Holec

IPC: F21V21/00

CPC classification number: F21V21/14 ,  B32B33/00 ,  B32B2307/206 ,  B32B2307/302 ,  B32B2311/12 ,  B32B2315/085 ,  F21K9/20 ,  F21V29/70 ,  H05K1/0366 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/0097 ,  H05K2201/09018 ,  H05K2201/10106 ,  H05K2203/1545 ,  Y10T156/10 ,  Y10T428/14 ,  Y10T428/26

Abstract: A layered structure for use with a high power light emitting diode system comprises an electrically insulating intermediate layer interconnecting a top layer and a bottom layer. The top layer, the intermediate layer, and the bottom layer form an at least semi-flexible elongate member having a longitudinal axis and a plurality of positions spaced along the longitudinal axis. The at least semi-flexible elongate member is bendable laterally proximate the plurality of positions spaced along the longitudinal axis to a radius of at least 6 inches, twistable relative to its longitudinal axis up to 10 degrees per inch, and bendable to conform to localized heat sink surface flatness variations having a radius of at least 1 inch. The top layer is pre-populated with electrical components for high wattage, the electrical components including at least one high wattage light emitting diode at least 1.0 Watt per 0.8 inch squared.

Abstract translation: 用于大功率发光二极管系统的分层结构包括互连顶层和底层的电绝缘中间层。 顶层，中间层和底层形成至少半柔性细长构件，其具有纵向轴线和沿着纵向轴线间隔开的多个位置。 所述至少半柔性细长构件在靠近沿着纵向轴线间隔开的多个位置处横向弯曲，至少为6英寸的半径，相对于其纵向轴线可扭转至多达10度/英寸，并且可弯曲以符合局部热 具有至少1英寸半径的凹槽表面平坦度变化。 顶层预先安装有用于高瓦数的电气部件，电气部件包括至少一个高功率发光二极管，每0.8平方英寸至少为1.0瓦特。

公开(公告)号：US20120138340A1

公开(公告)日：2012-06-07

申请号：US13369363

申请日：2012-02-09

Applicant: Noboru KATO ,  Jun SASAKI ,  Satoshi ISHINO

Inventor： Noboru KATO ,  Jun SASAKI ,  Satoshi ISHINO

IPC: H05K1/09

CPC classification number: H05K1/0281 ,  H05K1/024 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/032 ,  H05K1/09 ,  H05K2201/0141 ,  H05K2201/057 ,  H05K2201/0715 ,  H05K2201/09018 ,  H05K2201/09409

Abstract: A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.

Abstract translation: 保持弯曲状态而不引起电特性波动的多层基板包括：主体，其包括要堆叠并由柔性材料制成的多个绝缘片。 信号线在主体中延伸。 接地导体相对于主体中的信号线在z轴方向的正方向侧设置，并且在从z轴方向看的俯视图中与信号线重叠。 接地导体相对于主体中的信号线在z轴方向的负方向侧设置，并且在从z轴方向观察的俯视图中与信号线重叠。 主体弯曲的状态使得信号线定义为电弧，由接地导体的塑性变形保持。

公开(公告)号：US20120113644A1

公开(公告)日：2012-05-10

申请号：US13321183

申请日：2010-05-05

Applicant: Filip Bruyneel ,  Alfred Peeters

Inventor： Filip Bruyneel ,  Alfred Peeters

IPC: H05K1/18 ,  F21V21/00

CPC classification number: H05K1/189 ,  G02F1/133603 ,  G02F1/133608 ,  H05B33/0803 ,  H05K2201/051 ,  H05K2201/09018 ,  H05K2201/10106 ,  H05K2201/10159 ,  H05K2201/2009

Abstract: An oblong sized printed circuit board (1) comprises light emitting diode circuitry (2, 3). Parts of the printed circuit board (1) are flexible in at least one direction, to improve a manufacturing efficiency. Preferably, the printed circuit board (1) can make curves in length and width directions and does not require holes for screws. The light emitting diode circuitry (2, 3) may comprise light emitting diode circuits (2) with light emitting diodes and other circuitry (3) such as a driver for driving light emitting diode circuits (2) individually for providing ambient light for a display (5). A device (100) comprising the printed circuit board (1) may further comprise the display (5). Such a device (100) is for example a television receiver/display device/screen device. The printed circuit board (1) may be attached to structures (61, 62) moveable by hand/machine for directing the ambient light. The device (100) may be a roll (101) for rolling up the printed circuit board (1).

Abstract translation: 长方形的印刷电路板（1）包括发光二极管电路（2,3）。 印刷电路板（1）的部分在至少一个方向上是柔性的，以提高制造效率。 优选地，印刷电路板（1）可以在长度和宽度方向上形成曲线，并且不需要用于螺钉的孔。 发光二极管电路（2,3）可以包括具有发光二极管和其它电路（3）的发光二极管电路（2），例如用于驱动发光二极管电路（2）的驱动器，用于为显示器提供环境光 （5）。 包括印刷电路板（1）的设备（100）还可以包括显示器（5）。 这样的设备（100）例如是电视接收机/显示设备/屏幕设备。 印刷电路板（1）可以附接到用手或机器移动以引导环境光的结构（61,62）。 设备（100）可以是用于卷绕印刷电路板（1）的卷（101）。