公开(公告)号：US06778142B2

公开(公告)日：2004-08-17

申请号：US10257207

申请日：2002-10-09

Applicant: Kenichi Horie

Inventor： Kenichi Horie

IPC: H01G136

CPC classification number: H05K3/0052 ,  H01L2224/48227 ,  H01L2924/19105 ,  H01Q23/00 ,  H05K1/0237 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/0909 ,  H05K2201/09181

Abstract: The electronic device of the invention is such constructed that the antenna part (3) and the RF circuit part (4) can show their respective functions even after the antenna part (3) and the RF circuit part (4) have been separated. Besides a scribe line 6 is formed on a—preferably ceramic—substrate for separating the antenna part (3) from the RF circuit part (4). Both parts may be separated after a change in any environmental condition, such as a change in the circuit configuration of the board on which the device (10) is to be mounted.

Abstract translation: 本发明的电子设备的结构是，即使在天线部分（3）和RF电路部分（4）已经分离之后，天线部分（3）和RF电路部分（4）也可以显示它们各自的功能。 除了划线6形成在优选陶瓷基板上，用于将天线部分（3）与RF电路部分（4）分开。 在任何环境条件的改变之后，例如装置（10）将安装在其上的板的电路配置的变化，两个部分可以分离。

公开(公告)号：US20040099875A1

公开(公告)日：2004-05-27

申请号：US10662289

申请日：2003-09-16

Inventor： Jung Kan Lin

IPC: H01L027/15

CPC classification number: H01L33/486 ,  H01L2924/0002 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10106 ,  Y02P70/613 ,  H01L2924/00

Abstract: The invention provides a structure of Surface Mount Device Light Emitting Diode (SMD LED), which includes a printed circuit board with a metal reflection cup set concavely on the printed circuit board. Besides, at least one LED chip is bonded to the metal reflection cup and electrically connected to the printed circuit board. In addition, an encapsulant is utilized to cover the LED chip and also protrudes from the surface of the printed circuit board for forming a desired shape. The encapsulant of the invention can be directly molded on the printed circuit board and integrally formed in any shape so that the encapsulant will not come off the printed circuit board in any circumstances and that the metal reflection cup can let the light to be fully reflected.

Abstract translation: 本发明提供了一种表面贴装器件发光二极管（SMD LED）的结构，其包括印刷电路板，该印刷电路板具有设置在印刷电路板上的金属反射杯。 此外，至少一个LED芯片被接合到金属反射杯并电连接到印刷电路板。 此外，使用密封剂来覆盖LED芯片并且还从印刷电路板的表面突出以形成期望的形状。 本发明的密封剂可以直接模制在印刷电路板上并且整体地形成为任何形状，使得密封剂在任何情况下都不会脱离印刷电路板，并且金属反射杯可以使光被完全反射。

公开(公告)号：US20040066589A1

公开(公告)日：2004-04-08

申请号：US10674471

申请日：2003-10-01

Applicant: TDK CORPORATION

Inventor： Masaaki Togashi ,  Taisuki Ahiko

IPC: H02H007/16

CPC classification number: H01G2/065 ,  H05K1/115 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/0979 ,  H05K2201/09854 ,  H05K2201/10636 ,  H05K2201/10666 ,  Y02P70/611

Abstract: A multilayer capacitor (2) consisting of a capacitor body (1) and an interposer board (20) arranged underneath it, wherein a pair of land patterns are arranged on a front surface of the interposer board (20) for connection with a pair of terminal electrodes of the capacitor body (11) and (12), and a pair of external electrodes are arranged on a back surface of the interposer board (20) for connection with interconnect patterns (34) of a mounting board (33) by solder (35), the pair of land patterns and the pair of external electrodes being arranged on the interposer board (20) so that a direction of a line connecting the pair of land patterns and a direction of a line connecting the pair of external electrodes intersect perpendicularly.

公开(公告)号：US20040055782A1

公开(公告)日：2004-03-25

申请号：US10664353

申请日：2003-09-17

Applicant: Alps Electric Co., Ltd.

Inventor： Yukimasa Yamamoto

IPC: H05K001/00

CPC classification number: H05K3/3442 ,  H05K1/0201 ,  H05K1/141 ,  H05K3/28 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/062 ,  H05K2201/09181 ,  H05K2201/09263 ,  H05K2201/09909 ,  Y02P70/613

Abstract: The present invention provides a surface-mounting type electronic circuit unit having no melting of solder attaching an electric part thereto and having high reliability. Therefore, the surface-mounting type electronic circuit unit of the present invention has a side electrode arranged on a side face; a circuit substrate having a wiring pattern arranged on an upper face in a state connected to this side electrode; and an electric part connected to the wiring pattern by soldering. A connecting conductor of the wiring pattern connecting the electric part arranged in a position very near the side electrode is formed in a bent state. Therefore, the connecting conductor between the side electrode and the electric part can be lengthened. Accordingly, solder heat due to the soldering of an electrically conductive pattern and the side electrode and the heat of a flux fall on the electric part side, and an influence on the solder attaching the electric part thereto is small so that this solder is not melted and the surface-mounting type electronic circuit unit of high reliability is obtained.

Abstract translation: 本发明提供一种表面安装型电子电路单元，其不具有附着电气部件的焊料的熔化并且具有高可靠性。 因此，本发明的表面安装型电子电路单元具有配置在侧面的侧面电极， 电路基板，其具有布置在与该侧电极连接的状态的上表面上的布线图案; 以及通过焊接连接到布线图案的电气部件。 连接布置在非常靠近侧面电极的位置的电气部件的布线图案的连接导体形成为弯曲状态。 因此，可以延长侧电极和电气部件之间的连接导体。 因此，由于导电图案和侧面电极的焊接以及焊剂的热量引起的焊料热量落在电气部分侧，并且对附着电气部件的焊料的影响小，使得该焊料不熔化 并且获得了高可靠性的表面安装型电子电路单元。

公开(公告)号：US06664864B2

公开(公告)日：2003-12-16

申请号：US10004276

申请日：2001-10-31

Applicant: Mekell Jiles ,  Vladimir Telemaque ,  Eileen Bartley

Inventor： Mekell Jiles ,  Vladimir Telemaque ,  Eileen Bartley

IPC: H03L100

CPC classification number: H03L1/025 ,  H01L23/5386 ,  H01L24/97 ,  H01L2924/14 ,  H03B5/04 ,  H03L1/028 ,  H05K1/0237 ,  H05K1/183 ,  H05K3/403 ,  H05K3/4611 ,  H05K3/4697 ,  H05K2201/09181 ,  H01L2924/00

Abstract: A frequency controlled oscillator (100) is manufactured using an array (200) of mechanically interconnected oscillator bases (110) having component cavities (130) and wiring patterns therein. A frequency control component (120) serves as a cover for a cavity within the array, and in addition is electrically connected to oscillator components (140, 150) mounted within the cavity to regulate the frequency of electrical oscillation. Both the oscillator bases and finished oscillators may be tested while still in the array, prior to being separated from each other. In a most preferred embodiment, the array of oscillator bases are manufactured from a polymeric sheet material laminated with electrically conductive traces. The polymeric sheet material is selectively punched or formed prior to lamination so that intermediate and upper layers (112, 113) have predetermined sections removed. These removed sections will align with adjacent layers to form the component cavity from intermediate the top and bottom to the top of the finished laminate.

Abstract translation: 频率控制振荡器（100）使用机械互连的振荡器基座（110）的阵列（200）制造，所述振荡器基座（110）具有组件空腔（130）和其中的布线图案。 频率控制部件（120）用作阵列内的空腔的盖子，并且还与安装在腔体内的振荡器部件（140,150）电连接，以调节电振荡的频率。 在彼此分离之前，振荡器基座和完成的振荡器都可以在阵列中被测试。 在最优选的实施例中，振荡器基座的阵列由层叠有导电迹线的聚合物片材制成。 在层压之前选择性地冲压或形成聚合物片材，使得中间层和上层（112,113）具有去除的预定部分。 这些去除的部分将与相邻的层对准以从成品层压板的顶部和底部到顶部的中间形成部件空腔。

公开(公告)号：US20030209788A1

公开(公告)日：2003-11-13

申请号：US10457637

申请日：2003-06-09

Applicant: ROHM CO., LTD.

Inventor： Masahiko Kobayakawa

IPC: H01L021/44 ,  H01L021/48

CPC classification number: H01L23/49844 ,  H01L23/3121 ,  H01L23/49805 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/85424 ,  H01L2224/8547 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09381 ,  H05K2201/09472 ,  H05K2201/10166 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A semiconductor device includes an insulating substrate, a cutout formed in side surfaces of the substrate, a conductive pad formed on the obverse surface of the substrate, an electrode formed on the reverse surface of the substrate, a semiconductor chip mounted on the substrate, and a connector which connects the pad to the electrode. The connector is arranged in the cutout.

公开(公告)号：US20030164537A1

公开(公告)日：2003-09-04

申请号：US10296405

申请日：2003-02-24

Inventor： Herbert Brunner ,  Thomas Hofer ,  Harald Jager

IPC: H01L023/02

CPC classification number: H01L23/49805 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/854 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/181 ,  H05K1/0271 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09381 ,  H05K2201/09472 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: The invention relates to a semiconductor component comprising surface metallization and having at least one semiconductor body (3) and a package base body (2) on whose surface conductor path structures (7) are formed by means of surface metallization. A subregion of the conductor path structure (7) constitutes the solder connections of the semiconductor component. The solder connections (1) are combined to form rows, the individual rows of solder connections being arranged at a very small, predetermined spacing from one another.

Abstract translation: 本发明涉及包括表面金属化并且具有至少一个半导体本体（3）和封装基体（2）的半导体部件，其表面上通过表面金属化形成导体路径结构（7）。 导体路径结构（7）的一个子区域构成半导体元件的焊料连接。 焊接连接（1）被组合以形成行，各行焊接连接以彼此非常小的预定间隔布置。

公开(公告)号：US06609915B2

公开(公告)日：2003-08-26

申请号：US10000819

申请日：2001-11-30

Applicant: Christopher Scott Adams ,  Scott Brian Beardsley

Inventor： Christopher Scott Adams ,  Scott Brian Beardsley

IPC: H01R1200

CPC classification number: H05K3/368 ,  H01R12/52 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10378 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: An interconnect for attaching a module such as a PCB or a multi-chip module to a circuit substrate comprises a member elongated in a longitudinal direction. The member has at least a first elongated side and a second opposed and generally parallel elongated side. The first and second sides extend in the longitudinal direction. Each of the first and second sides have at least one portion formed by a series of depressions in the respective first and second sides. The depressions extend inwardly from a first outer surface of the first side and a second outer surface of the second side. The depressions are metallized to form leads. A circuit assembly is also provided comprising a multi-chip module having a plurality of electronic elements; a circuit substrate supporting thereon a conductive circuit pattern adapted for connection to the multi-chip module and at least one the interconnects for attaching the multi-chip module to the circuit pattern on the circuit substrate. A process for making the interconnect and a process for assembling the circuit assembly is also provided.

公开(公告)号：US20030131472A1

公开(公告)日：2003-07-17

申请号：US10050621

申请日：2002-01-15

Applicant: Mitac international Corp.

Inventor： Yu-Chiang Cheng ,  Jong-Kuei Chen

IPC: H05K003/36 ,  H05K003/34

CPC classification number: H05K3/403 ,  H05K3/3405 ,  H05K3/368 ,  H05K3/4614 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/096 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144

Abstract: In a method of fabricating a multi-layer circuit board assembly, at least two multi-layer circuit board modules are provided. Each of the modules has a lateral edge provided with a plurality of solder pads that are connected electrically with module interconnect circuit traces on a respective one of the modules. The modules are stacked one upon the other, and are bonded together such that the solder pads of one of the modules are connected to registered ones of the solder pads of the other one of the modules, thereby establishing electrical connection among the circuit traces on the modules.

Abstract translation: 在制造多层电路板组件的方法中，提供至少两个多层电路板模块。 每个模块具有设置有多个焊盘的横向边缘，该多个焊盘在相应的一个模块上与模块互连电路迹线电连接。 这些模块一个接一个堆叠，并且结合在一起，使得其中一个模块的焊盘连接到另一个模块的注册的焊盘，从而在模块的电路迹线之间建立电连接 模块。

公开(公告)号：US20030058064A1

公开(公告)日：2003-03-27

申请号：US10253991

申请日：2002-09-25

Applicant: TDK Corporation

Inventor： Masahiro Nakano

IPC: H03H009/64

CPC classification number: H03H9/059 ,  H01L2224/16225 ,  H01L2924/15311 ,  H03H9/1071 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/09181 ,  Y02P70/613

Abstract: On a piezoelectric substrate 23, there are provided surface acoustic wave devices F1 and F2 in which predetermined circuit patterns are formed, and a package substrate 11 comprising side vias 16 formed in a caved manner in the thickness direction on side surfaces on which the surface acoustic wave devices are mounted. When the side vias 16 are each assumed to have the opening width null and the maximum depth D, a size satisfying null/2

Abstract translation: 在压电基板23上，设置有表面声波装置F1和F2，其中形成有预定的电路图案，以及封装基板11，其包括侧面通孔16，该侧面通孔在厚度方向上以表面声学 波装置。 当侧面通孔16各自具有开口宽度phi和最大深度D时，假定满足phi / 2