公开(公告)号：US20170358878A1

公开(公告)日：2017-12-14

申请号：US15617767

申请日：2017-06-08

Applicant: TE Connectivity Corporation

Inventor： Graham Harry Smith, JR. ,  Scott Eric Walton ,  Michael Frank Cina

IPC: H01R12/71 ,  H01R13/6474 ,  H01R12/70

CPC classification number: H01R12/714 ,  H01P5/028 ,  H01R12/7005 ,  H01R12/721 ,  H01R13/2492 ,  H01R13/6474 ,  H01R13/6587 ,  H05K1/025 ,  H05K1/117 ,  H05K3/403 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/09727

Abstract: An electrical contact pad for electrically contacting a connector includes a first region having a first length in a longitudinal direction, and a second region having a second length in the longitudinal direction that is greater than the first length. The first region is arranged to contact a first arm of the connector and the second region is arranged to contact a second arm of the connector. The first length being smaller than the second length results in an increase in the impedance of the electrical contact pad as compared to typical contact pads which tend to correspond to low impedance regions.

公开(公告)号：US09767241B2

公开(公告)日：2017-09-19

申请号：US12749254

申请日：2010-03-29

Applicant: Norman L. Rogers ,  John W. Hoffman ,  Jun Feng ,  Charles Krauter

Inventor： Norman L. Rogers ,  John W. Hoffman ,  Jun Feng ,  Charles Krauter

IPC: G06F17/50 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00

CPC classification number: G06F17/5068 ,  H05K1/0206 ,  H05K1/029 ,  H05K1/0295 ,  H05K1/111 ,  H05K1/114 ,  H05K3/0005 ,  H05K3/0064 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09418 ,  H05K2201/09454 ,  H05K2201/09663 ,  H05K2201/09954 ,  H05K2201/10022 ,  H05K2201/10166 ,  H05K2201/10636 ,  H05K2203/173 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49124

Abstract: A method and apparatus for inputting a plurality of different circuit schematics designed with printed circuit board (PCB) mountable components; extracting circuit topologies for said plurality of different circuit schematics; transforming said extracted circuit topologies to a fixed number of connection points; and generating a configurable circuit PCB physical layout pattern having said fixed number of connection points such that said PCB mountable components when positioned on one or more of said fixed number of connection points can implement any circuit represented by said plurality of different circuit schematics.

公开(公告)号：US09723712B2

公开(公告)日：2017-08-01

申请号：US14559837

申请日：2014-12-03

Applicant: Samsung Display Co. Ltd.

Inventor： Dong Beom Cho

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/36 ,  H05K1/14 ,  H05K1/18

CPC classification number: H05K1/028 ,  H05K1/111 ,  H05K1/147 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/09445 ,  H05K2201/10136 ,  Y02P70/611

Abstract: A curved display device is provided. The curved display device includes: a curved display panel configured to have short sides and long sides; a printed circuit board (PCB) configured to provide signals for driving the curved display panel; and a flexible wiring board including a first portion, which is connected to a first area, a second portion, which is connected to the PCB, and a third portion, which is disposed between the first portion and the second portion and has curved sides, wherein a curvature radius of a first side of the curved sides differs from a curvature radius of a second side of the curved sides.

公开(公告)号：US09698111B2

公开(公告)日：2017-07-04

申请号：US15222162

申请日：2016-07-28

Applicant: ROHM CO., LTD.

Inventor： Tsuguto Maruko

IPC: H01L23/52 ,  H01L23/00 ,  H01L23/31 ,  H01L23/528 ,  H05K1/18 ,  H05K1/11 ,  H01L23/498

CPC classification number: H01L24/02 ,  H01L23/3114 ,  H01L23/49838 ,  H01L23/528 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/02373 ,  H01L2224/13024 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2224/1623 ,  H01L2224/1713 ,  H01L2224/17134 ,  H01L2224/17179 ,  H01L2924/14 ,  H01L2924/381 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/09418

Abstract: A semiconductor package includes: a semiconductor integrated circuit; an interlayer film disposed on the semiconductor integrated circuit; a rewiring layer disposed on the interlayer film; post electrodes disposed on the rewiring layer; a protective layer which is disposed on the interlayer film and covers the rewiring layer and the post electrodes; and a plurality of balls which is respectively disposed on the post electrodes and is connected to the rewiring layer, wherein balls existing on a wiring path of internal wirings connected to inner lands of a plurality of lands, which is arranged on a printed circuit board substrate to face the plurality of balls and is connectable to the plurality of balls, are non-connected to the rewiring layer.

公开(公告)号：US09674950B1

公开(公告)日：2017-06-06

申请号：US14268775

申请日：2014-05-02

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Zhen Feng ,  Anwar Mohammed

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/03 ,  H05K3/32

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more metal foils, one metal foil coupled to one electrical connection point on an electronic component. The metal foil is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the metal foil.

公开(公告)号：US20170154899A1

公开(公告)日：2017-06-01

申请号：US15429411

申请日：2017-02-10

Applicant: Samsung Display Co., Ltd.

Inventor： Dae Geun Lee

IPC: H01L27/12 ,  H01L23/00

CPC classification number: H01L27/124 ,  G02F1/13458 ,  H01L24/05 ,  H01L24/06 ,  H01L24/81 ,  H01L27/3276 ,  H01L2224/05552 ,  H01L2224/06152 ,  H01L2224/81132 ,  H01L2924/3511 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/09709 ,  H05K2201/09954 ,  H05K2201/10128 ,  H05K2203/166 ,  Y02P70/611 ,  Y10T29/49005

Abstract: An array substrate including a display area and a non-display area surrounding the display area. The non-display area includes a pad portion including one or more first pads that each have a parallelogram shape.

公开(公告)号：US20170059097A1

公开(公告)日：2017-03-02

申请号：US15232185

申请日：2016-08-09

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takaaki KATAOKA

IPC: F21K9/64 ,  F21S2/00 ,  H05K1/18 ,  F21K9/69 ,  F21V5/00

CPC classification number: F21V5/007 ,  F21K9/69 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/181 ,  H05K2201/09418 ,  H05K2201/10106

Abstract: An LED module includes light sources that are disposed on a surface of a circuit substrate and each of which has LED chips and a wavelength conversion member covering the LED chips. The light sources include first light sources and second light sources. LED chips in each of the first light sources differ in number from LED chips in each of the second light sources. The circuit substrate includes a conductive pattern that is connected with the first and second light sources, and that forms each of one or more series circuits along with at least one of the first light sources and at least one of the second light sources.

Abstract translation: LED模块包括设置在电路基板的表面上并具有LED芯片和覆盖LED芯片的波长转换部件的光源。 光源包括第一光源和第二光源。 每个第一光源中的LED芯片的数量与每个第二光源中的LED芯片的数量不同。 电路基板包括与第一和第二光源连接的导电图案，并且与第一光源和至少一个第二光源中的至少一个一起形成一个或多个串联电路中的每一个。

公开(公告)号：US09565765B2

公开(公告)日：2017-02-07

申请号：US14420373

申请日：2014-11-10

Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.

Inventor： Lijia Song

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/111 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2201/10022 ,  Y02P70/611

Abstract: A printed circuit board is disclosed. Pins of a plurality of resistors on the PCB are connected to the same input line. At least two out of the resistors are connected to the same input line with access pins overlapped. One shared bonding pad is located in every overlapped area, electrical components are bonded on the shared bonding pads. As at least two out of the resistors are connected to the same input line with the access pins overlapped, the utilization of space is maximized. In this way, not only the dimension of the PCB is reduced, but also the manufacturing cost is reduced at the same time.

Abstract translation: 公开了印刷电路板。 PCB上的多个电阻器的引脚连接到相同的输入线。 至少两个电阻器连接到相同的输入线路，其中接入引脚重叠。 一个共享焊盘位于每个重叠区域中，电气部件粘合在共享焊盘上。 由于至少两个电阻器连接到与接入引脚重叠的相同输入线路上，空间的利用率最大化。 以这种方式，不仅PCB的尺寸减小，而且同时降低了制造成本。

公开(公告)号：US09524931B2

公开(公告)日：2016-12-20

申请号：US14592105

申请日：2015-01-08

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Satoshi Shiraki

IPC: H01L23/12 ,  H01L23/053 ,  H01L21/20 ,  H01L21/36 ,  H01L23/498 ,  H05K1/11 ,  H01L25/10 ,  H01L23/00 ,  H01L23/538 ,  H01L23/31 ,  H05K1/14 ,  H05K3/00 ,  H01L23/29

CPC classification number: H01L23/49838 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/16237 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12044 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/1533 ,  H01L2924/181 ,  H05K1/111 ,  H05K1/144 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/0939 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10977 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/01047 ,  H01L2924/01029

Abstract: A wiring substrate includes a block with substrates laid out in an array. The block includes corners and a plan view center. Each substrate includes a substrate body. Pads are formed on the substrate body. Each pad includes a pad surface. The pads of the substrates include first pads, which are the pads of one of the substrates located in at least one of the corners of the block. The pad surface of each of the first pads includes a first axis extending from the first pad toward the plan view center of the block. The pad surface of each of the first pads has a first length along the corresponding first axis and a second length along a second axis, which is orthogonal to the first axis. The first length is longer than the second length.

Abstract translation: 布线基板包括具有布置在阵列中的基板的块。 该块包括角落和平面图中心。 每个基板包括基板主体。 垫片形成在基板主体上。 每个垫包括垫表面。 衬底的焊盘包括第一焊盘，其是位于块的至少一个角落中的一个衬底的焊盘。 每个第一焊盘的焊盘表面包括从第一焊盘朝向块的平面图中心延伸的第一轴。 每个第一焊盘的焊盘表面具有沿着对应的第一轴线的第一长度和沿着与第一轴线正交的第二轴线的第二长度。 第一长度比第二长度长。

公开(公告)号：US09338915B1

公开(公告)日：2016-05-10

申请号：US14228021

申请日：2014-03-27

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Anwar Mohammed ,  Zhen Feng

IPC: H05K1/16 ,  H05K1/18 ,  H05K3/30 ,  H05K7/02 ,  H05K3/10

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: A wearable electronics assembly includes one or more electronic modules coupled to a wearable electronics fabric. Each of the one or more electronic modules includes one or more plated through holes, through each of which is coupled an electrically conductive wire. The electrically conductive wire is stitched through the plated through hole and to a fabric onto which the electronic module is attached. The electronic module can include one or more electronic components coupled to a printed circuit board.

Abstract translation: 可穿戴电子组件包括耦合到可穿戴电子织物的一个或多个电子模块。 一个或多个电子模块中的每一个包括一个或多个电镀通孔，每个电镀通孔中的每一个都连接有导电线。 导电线穿过电镀通孔和连接电子模块的织物。 电子模块可以包括耦合到印刷电路板的一个或多个电子部件。