公开(公告)号：US3714706A

公开(公告)日：1973-02-06

申请号：US3714706D

申请日：1970-08-21

Applicant: PERKIN ELMER CORP

Inventor： REIZMAN F ,  MCGRAW R

IPC: H05K1/03 ,  H05K3/40 ,  H01B13/00 ,  H05K3/00

CPC classification number: H05K3/4038 ,  H05K1/0306 ,  H05K2201/09609 ,  H05K2201/1028 ,  H05K2203/0235 ,  Y10T29/49002 ,  Y10T29/49069 ,  Y10T29/49194 ,  Y10T29/49798

Abstract: ARRAYS OF CONDUCTORS ACCURATELY FIXED IN POSITION RELATIVE TO EACH OTHER ARE MADE BY LAYING STRIPES OF CONDUCTIVE MATERIAL, SUCH AS THIN STRIPES OF CHROMIUM, GOLD OR PLATINUM GROUP METALS, ON A SURFACE OF EACH OF A NUMBER OF PLATES OF DIELECTRIC MATERIAL, SUCH AS GLASS, THAT SOFTENS WHEN HEATED AND THAT FUSES TO SIMILAR MATERIAL AT THE SOFTENING POINT. THE PLATES AR STACKED, PLACED UNDER COMPRESSION NORMAL TO THEIR CONDUCTOR BEARING SURFACES IN A PARTIAL VACUUM AND HEATED TO THE SOFTENING POINT, THE VACUUM IS THEN RELIEVED AND THE HEAT TURNED OFF. AFTER THE STACK COOLS BELOW THE SOFTENING POINT, THE FUSED STACK IS SLICED AT AN ANGLE TO THE LENGTHS OF THE CONDUCTORS TO PORIVIDE PLATES HAVING CONDUCTOR ARRAYS THERETHROUGH.

公开(公告)号：US3698884A

公开(公告)日：1972-10-17

申请号：US3698884D

申请日：1970-12-09

Applicant: HUGHES AIRCRAFT CO

Inventor： CURRAN ROBERT E ,  ROBERTSON GLENN D JR ,  KETCHPEL RICHARD D

IPC: H05K1/03 ,  H05K3/40 ,  C03B29/00 ,  C03C27/00 ,  C03C29/00

CPC classification number: H05K3/4038 ,  H05K1/0306 ,  H05K2201/09609 ,  H05K2201/10287 ,  H05K2203/0235

Abstract: A METHOD OF CONSTRUCTING A FACEPLATE IS DESCRIBED, WHICH CONTAINS A MULTITUDE OF CLOSELY SPACED, DISCRETE, CONDUCTIVE ELEMENTS TO PERMIT PASSAGE OF ELECTRICAL SIGNALS FROM ONE SIDE OF THE FACEPLATE TO THE OTHER. THE FACEPLATE IS COMPLETELY IMPERMEABLE TO GASES. THIS METHOD COMPRISES PLACING A METAL BAR PATTERN ON RIBBON GLASS, CUTTING AND STACKING SHEETS OF THE GLASS, AND SUBJECTING THE STACK TO HEAT AND PRESSURE. THE METHOD OF CONSTRUCTION PERMITS THE READY PLACEMENT OF A LARGE NUMBER OF CLOSELY SPACED DISCRETE CONDUCTING PATHS TRANSVERSELY THROUGH THE FACEPLATE MAKING POSSIBLE TWO-DIMENSIONAL ARRAYS OF 500 OR MORE ELEMENTS PER INCH.

公开(公告)号：US3530229A

公开(公告)日：1970-09-22

申请号：US3530229D

申请日：1968-09-03

Applicant: IBM

Inventor： BURKE PETER J JR

IPC: H01B7/08 ,  H01R12/58 ,  H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H05K3/42 ,  H05K1/04

CPC classification number: H05K3/3447 ,  H01R12/58 ,  H05K1/0201 ,  H05K1/0237 ,  H05K1/0393 ,  H05K1/116 ,  H05K3/42 ,  H05K2201/062 ,  H05K2201/0715 ,  H05K2201/09609 ,  H05K2201/0969

公开(公告)号：US3496516A

公开(公告)日：1970-02-17

申请号：US3496516D

申请日：1967-01-09

Applicant: AMP INC

Inventor： MCFADDEN BRUCE RICHARD

IPC: H01R12/58 ,  H01R12/71 ,  H01R31/08 ,  H05K3/06 ,  H05K3/30 ,  H05K3/32 ,  H05K3/40 ,  H01R25/00 ,  H01R29/00

CPC classification number: H05K3/4092 ,  H01R12/585 ,  H05K3/06 ,  H05K3/306 ,  H05K3/326 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09609 ,  H05K2201/1059 ,  H05K2203/063 ,  H05K2203/0769 ,  H05K2203/0786

公开(公告)号：US3492537A

公开(公告)日：1970-01-27

申请号：US3492537D

申请日：1967-12-11

Applicant: ZENITH RADIO CORP

Inventor： INMAN DARWIN E

IPC: H04N5/64 ,  H04N5/655 ,  H05K1/00 ,  H05K3/32 ,  H05K7/06 ,  H05K7/08 ,  H05K7/12

CPC classification number: H05K7/08 ,  H01R12/718 ,  H04N5/64 ,  H04N5/655 ,  H05K1/0287 ,  H05K7/06 ,  H05K2201/09609

公开(公告)号：US3470612A

公开(公告)日：1969-10-07

申请号：US3470612D

申请日：1966-11-14

Applicant: TEXAS INSTRUMENTS INC

Inventor： HELMS JOHN D

IPC: H05K1/00 ,  H05K3/10 ,  H05K3/40 ,  H05K7/06 ,  H05K3/20

CPC classification number: H05K7/06 ,  H05K1/0287 ,  H05K1/0289 ,  H05K1/0298 ,  H05K3/103 ,  H05K3/4046 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/09945 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2203/0195 ,  H05K2203/085 ,  H05K2203/175 ,  Y10T29/49004

公开(公告)号：US3325766A

公开(公告)日：1967-06-13

申请号：US58161766

申请日：1966-09-23

Applicant: HARRIS INTERTYPE CORP

Inventor： KOLB EDWIN R ,  CAMPEN GORDON E VAN

IPC: H01R12/71 ,  H05K1/00 ,  H05K3/22 ,  H05K7/10

CPC classification number: H01R12/585 ,  H05K1/0287 ,  H05K3/222 ,  H05K7/10 ,  H05K7/103 ,  H05K2201/09609 ,  H05K2201/10287 ,  H05K2201/10333 ,  H05K2201/10689 ,  H05K2201/10969 ,  H05K2201/2036

公开(公告)号：US3019283A

公开(公告)日：1962-01-30

申请号：US80988859

申请日：1959-04-29

Applicant: THOMAS LITTLE

Inventor： THOMAS LITTLE

IPC: H01R12/00 ,  H05K1/00 ,  H05K1/03 ,  H05K3/30

CPC classification number: H05K3/306 ,  H05K1/0287 ,  H05K1/036 ,  H05K2201/09063 ,  H05K2201/09609 ,  H05K2201/09945 ,  H05K2201/10575 ,  H05K2203/1189

公开(公告)号：US2963535A

公开(公告)日：1960-12-06

申请号：US70301657

申请日：1957-12-16

Applicant: SANDERS ASSOCIATES INC

Inventor： WEGENER HOWARD W ,  MIKULIS BENJAMIN M

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/38 ,  H05K9/00

CPC classification number: H05K1/028 ,  H05K1/0224 ,  H05K3/385 ,  H05K9/0039 ,  H05K2201/0715 ,  H05K2201/09263 ,  H05K2201/09609 ,  H05K2201/09663 ,  H05K2203/0315

公开(公告)号：US20240321711A1

公开(公告)日：2024-09-26

申请号：US18606035

申请日：2024-03-15

Applicant: Chengdu Monolithic Power Systems Co., Ltd.

Inventor： Yingjiang Pu ,  Hang Jiang

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/02 ,  H05K1/11 ,  H05K3/42

CPC classification number: H01L23/49838 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H05K1/0271 ,  H05K1/115 ,  H05K3/429 ,  H05K2201/09609 ,  H05K2201/09636

Abstract: A substrate includes a first dielectric layer having a first surface and a second surface. The first dielectric layer includes a plurality of first conductive vias and a plurality of second conductive vias. These two kinds of conductive vias are formed to penetrate the first dielectric layer and have different orientations for reduce warpage of the substrate.