公开(公告)号：US06470545B1

公开(公告)日：2002-10-29

申请号：US09632361

申请日：2000-08-03

Applicant: Shaul Branchevsky

Inventor： Shaul Branchevsky

IPC: H01G700

CPC classification number: H05K1/162 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/185 ,  H05K3/403 ,  H05K3/4053 ,  H05K2201/09645 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  H01L2924/00

Abstract: Embedded green multi-layer ceramic capacitors in low-temperature co-fired ceramic (LTCC) substrates are provided. A first set of electrodes is printed on a ceramic tape. A first dielectric layer is placed over the first set of electrodes and the ceramic tape. A second set of electrodes is printed on the first dielectric layer. A second dielectric layer is placed over the second set of electrodes and the first dielectric layer. A third set of electrodes is printed on the second dielectric layer. The sheet is then cut to form separate green multi-layer ceramic capacitor chips. The green multi-layer ceramic capacitor chips are then placed in a cavity formed by ceramic tape.

Abstract translation: 提供了低温共烧陶瓷（LTCC）基板中的嵌入式绿色多层陶瓷电容器。 第一组电极印在陶瓷胶带上。 将第一电介质层放置在第一组电极和陶瓷带上。 在第一电介质层上印刷第二组电极。 第二介电层放置在第二组电极和第一介电层上。 第三组电极被印刷在第二介电层上。 然后将片材切割成单独的绿色多层陶瓷电容器芯片。 然后将绿色多层陶瓷电容器芯片放置在由陶瓷带形成的空腔中。

公开(公告)号：US06388895B1

公开(公告)日：2002-05-14

申请号：US09842145

申请日：2001-04-26

Applicant: Pey-Son Hsu

Inventor： Pey-Son Hsu

IPC: H02B101

CPC classification number: H05K7/1445 ,  H04Q1/14 ,  H04Q2201/12 ,  H05K1/0289 ,  H05K3/403 ,  H05K3/429 ,  H05K7/1444 ,  H05K2201/096 ,  H05K2201/09645 ,  H05K2201/10893

Abstract: Telecommunication main distribution frame structure including a PC board, several pairs of insertion pins, four insertion seats, four buses, four corresponding insertion seats connected with one end of the buses and four connectors connected with the other end of the buses. The PC board is formed with several insertion holes and soldering holes electrically connected with each other. The insertion seats are soldered at the soldering holes of the PC board. The corresponding insertion seats are inserted in the insertion seats. The PC board has a left board, a middle board and a right boards integrally connected with each other. Each of two openings of the insertion hole is provided with a circle of shallow conductive face divided-by a locating split into a left and a right halves. Each of two openings of the soldering hole is provided with a shallow conductive face. The insertion pin is a rectangular column made of insulating material. Each of two ends thereof is formed with a lip and a resilient well conductive plate is connected between the lips. The insertion pins are inserted into the insertion holes with the conductive plate aimed at the locating split of the insertion hole, whereby the conductive plate is resiliently pressed to contact with the conductive faces of the insertion hole so as to electrically connect the conductive faces.

Abstract translation: 电信主配线框架结构包括一个PC板，几对插针，四个插座，四个总线，四个相应的插座，与一总线连接，四个连接器与总线的另一端连接。 PC板形成有多个彼此电连接的插入孔和焊接孔。 插入座被焊接在PC板的焊接孔处。 相应的插入座插入到插入座中。 PC板具有彼此整体连接的左板，中板和右板。 插入孔的两个开口中的每一个设置有一个浅导电面的圆，被划分成左半部和右半部的定位分开。 焊接孔的两个开口中的每一个设置有浅导电面。 插销是由绝缘材料制成的矩形柱。 其两个端部中的每一个都形成有唇缘，弹性导电板连接在唇缘之间。 插入销插入到插入孔中，导电板瞄准插入孔的定位分裂，由此导电板被弹性压制以与插入孔的导电面接触，以便电连接导电面。

公开(公告)号：US06388892B1

公开(公告)日：2002-05-14

申请号：US09542594

申请日：2000-04-04

Applicant: Osamu Maeda

Inventor： Osamu Maeda

IPC: H05K114

CPC classification number: H05K9/006 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09645 ,  H05K2201/10371

Abstract: A tuner unit includes a unit board. The unit board is formed, at its lower end, with a protrusion to have a terminal pattern formed on the protrusion. A frame chassis has a side plate having, at its lower end, a protrusion having a tapered side face in one of side faces. When the protrusion of the unit board is inserted in a hole of a main board, the tapered side face is inserted while abutted against an inner edge of a hole of the main board. This urges the protrusion in a direction that the terminal pattern is brought close to the connection pattern of the main board.

Abstract translation: 调谐器单元包括单元板。 单元板在其下端形成有突起，以形成在突起上的端子图案。 框架底板具有在其下端具有在一个侧面中具有锥形侧面的突起的侧板。 当单元板的突起插入主板的孔中时，锥形侧面插入，同时抵靠主板的孔的内边缘。 这使得突出部沿端子图案靠近主板的连接图案的方向推动。

公开(公告)号：US20020044429A1

公开(公告)日：2002-04-18

申请号：US09198740

申请日：1998-11-24

Inventor： JEAN LOUIS BOUCHERON ,  EMMANUEL FARGUES

IPC: H05K005/00 ,  H05K005/04 ,  H05K005/06

CPC classification number: B60R16/02 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09645

Abstract: A control module for a motor vehicle cab, the module comprising a box, at least one power card and at least one control card placed in said box, wherein the control card extends substantially perpendicularly to the power card and wherein said box is constituted by two half-boxes that are closed together and hinged about a hinge with which they are integrally formed, one of the half-boxes having means forming housings that receive tongues and/or female pins which co-operate with said housing-forming means to define connectors, and also having a case which provides mechanical protection for the control card.

Abstract translation: 一种用于机动车驾驶室的控制模块，所述模块包括一个盒子，至少一个电源卡片和放置在所述盒子中的至少一个控制卡，其中所述控制卡基本上垂直于所述电源卡延伸，并且其中所述盒子由两个 封闭在一起并围绕它们整体形成的铰链铰接的半框，半框中的一个具有形成容纳舌片和/或阴销的装置，该壳体与所述壳体形成装置配合以限定连接器 并且还具有为控制卡提供机械保护的壳体。

公开(公告)号：US20020024801A1

公开(公告)日：2002-02-28

申请号：US09741610

申请日：2000-12-19

Inventor： Chih-Pin Hung ,  Jung-Sheng Chiang

IPC: H05K001/11

CPC classification number: H05K1/162 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K3/4069 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09645 ,  H05K2201/09981 ,  H01L2924/00

Abstract: An integrated circuit package substrate. At least one insulating layer is formed between every two neighboring patterned wiring layers for isolation. At least a via is formed to penetrate through the insulating layers to electrically connect the patterned wiring layers. A capacitor is formed within at least one of the insulating layer. The capacitor has two electrodes insulated by a dielectric layer. One of the electrodes is connected to a power source, while the other is connected to ground.

Abstract translation: 集成电路封装基板。 在每两个相邻的图案化的布线层之间形成至少一个绝缘层用于隔离。 至少形成通孔以穿透绝缘层以电连接图案化的布线层。 在绝缘层的至少一个内部形成电容器。 电容器具有由电介质层绝缘的两个电极。 电极中的一个连接到电源，而另一个连接到地。

公开(公告)号：US20020022110A1

公开(公告)日：2002-02-21

申请号：US09883876

申请日：2001-06-18

Inventor： Alexander W. Barr ,  Samuel C. Ramey ,  Larry Edward Moser

IPC: B32B003/10

CPC classification number: H05K3/403 ,  H05K1/115 ,  H05K1/165 ,  H05K3/0047 ,  H05K3/184 ,  H05K3/42 ,  H05K3/429 ,  H05K2201/09645 ,  H05K2203/1476 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49167 ,  Y10T428/24322

Abstract: A printed circuit board includes at least one via providing a conductive path through the printed circuit board. The via comprises at least one axially extending conductive strip fonned by cutting material from a metal barrel lining the interior wall of the via.

Abstract translation: 印刷电路板包括至少一个通孔，该通孔提供穿过印刷电路板的导电路径。 所述通孔包括至少一个轴向延伸的导电条，所述导电条由通过所述通孔的内壁的金属桶切割材料而形成。

公开(公告)号：US06184494B2

公开(公告)日：2001-02-06

申请号：US09478584

申请日：2000-01-06

Applicant: Arto Isokoski ,  Jari Marjakangas

Inventor： Arto Isokoski ,  Jari Marjakangas

IPC: H05B100

CPC classification number: H05K1/0212 ,  H01L23/345 ,  H01L2924/0002 ,  H05K3/3494 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/09645 ,  H05K2201/0969 ,  H05K2201/09772 ,  H05K2201/09781 ,  H01L2924/00

Abstract: The present invention relates to a heating method and a printed circuit board comprising a heating element which generates heat required to heat printed circuit board components. The printed circuit board comprises heat conductor between the heating element and the component to be heated, the heat conductor receiving heat generated by the heating element and conducting the heat along the surface of the printed circuit board beneath the lower surface of the component to be heated. Furthermore, the printed circuit board comprises conductor parts which are narrower that the heat conductor, or which have a smaller cross-sectional surface area than does the heat conductor, and which restrict heat transfer away from the heat conductor to a component other than the one to be heated when the heat conductor functions as a ground plane or a signal path.

Abstract translation: 本发明涉及加热方法和印刷电路板，其包括产生加热印刷电路板部件所需的热的加热元件。 印刷电路板包括加热元件和待加热元件之间的导热体，热导体接收由加热元件产生的热量，并沿着待加热元件的下表面的印刷电路板表面传导热量 。 此外，印刷电路板包括导体部分，导体部分比热导体更窄，或者具有比导热体更小的横截面表面积，并且限制热传导远离热导体到除了导体之外的部件 当热导体用作接地平面或信号路径时被加热。

公开(公告)号：US6022596A

公开(公告)日：2000-02-08

申请号：US684280

申请日：1996-07-17

Applicant: Thomas H. Baum ,  Luis J. Matienzo ,  Cindy Reidsema Simpson ,  Joseph E. Varsik

Inventor： Thomas H. Baum ,  Luis J. Matienzo ,  Cindy Reidsema Simpson ,  Joseph E. Varsik

IPC: C23C18/14 ,  C23C18/26 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/40 ,  B05D3/00 ,  B05D3/04 ,  B05D3/06 ,  B05D5/12

CPC classification number: H05K3/105 ,  C23C18/14 ,  H05K3/185 ,  H05K3/403 ,  H01L2924/0002 ,  H05K2201/09645 ,  H05K3/0082 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A method is provided for selectively metallizing one or more three-dimensional materials in an electronic circuit package comprising the steps of forming a layer of seeding solution on a surface of the three-dimensional material of interest, exposing this layer to light of appropriate wavelength, resulting in the formation of metal seed on regions of the three-dimensional material corresponding to the regions of the layer of seeding solution exposed to light; removing the unexposed regions of the layer of seeding solution by subjecting the exposed and unexposed regions of the layer of seeding solution to an alkaline solution. Thereafter, additional metal is deposited, e.g., plated, onto the metal seed using conventional techniques. Significantly, this method does not involve the use of a photoresist, or of a corresponding chemical developer or photoresist stripper. Of additional significance, this method is ideal for plating three-dimensional materials such as cone-shaped connectors used in electronic circuit packages.

Abstract translation: 提供了一种用于在电子电路封装中选择性地金属化一种或多种三维材料的方法，包括以下步骤：在感兴趣的三维材料的表面上形成接种溶液层，将该层暴露于适当波长的光， 导致在与暴露于光的接种溶液层的区域相对应的三维材料的区域上形成金属种子; 通过使接种溶液层的暴露和未曝光区域经受碱溶液来除去接种溶液层的未曝光区域。 此后，使用常规技术将另外的金属沉积，例如电镀到金属种子上。 重要的是，该方法不涉及光致抗蚀剂或相应的化学显影剂或光致抗蚀剂剥离剂的使用。 具有其他意义的是，该方法对于电子电路封装中使用的锥形连接器等三维材料的电镀是理想的。

公开(公告)号：US5973951A

公开(公告)日：1999-10-26

申请号：US878705

申请日：1997-06-19

Applicant: Andreas Bechtolsheim ,  Edward Frank ,  James Testa ,  Shawn Storm

Inventor： Andreas Bechtolsheim ,  Edward Frank ,  James Testa ,  Shawn Storm

IPC: G06F12/06 ,  G06F12/16 ,  G11C5/00 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/40 ,  G11C13/00

CPC classification number: G11C5/04 ,  G11C5/00 ,  H05K1/117 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/09645 ,  H05K2201/10689 ,  H05K2203/1572 ,  H05K3/403 ,  Y10S439/951

Abstract: A single in-line memory module (SIMM) for memory expansion in a computer system. The SIMM includes a plurality of memory chips surface-mounted on a printed circuit board. The printed circuit board includes a dual read-out connector edge adapted for insertion within a socket of the computer system. One or more driver chips may further be mounted on the printed circuit board and connected to distribute control signals to the memory chips. A full-width data path may further be connected between the dual read-out connector edge and the plurality of memory chips.

Abstract translation: 用于计算机系统中的内存扩展的单个在线存储器模块（SIMM）。 SIMM包括表面安装在印刷电路板上的多个存储器芯片。 印刷电路板包括适于插入计算机系统的插座内的双重读出连接器边缘。 一个或多个驱动器芯片还可以安装在印刷电路板上并被连接以将控制信号分配给存储器芯片。 全宽数据路径还可以连接在双读出连接器边缘和多个存储器芯片之间。

公开(公告)号：US5465229A

公开(公告)日：1995-11-07

申请号：US345477

申请日：1994-11-28

Applicant: Andreas Bechtolsheim ,  Edward Frank ,  James Testa ,  Shawn Storm

Inventor： Andreas Bechtolsheim ,  Edward Frank ,  James Testa ,  Shawn Storm

IPC: G06F12/06 ,  G06F12/16 ,  G11C5/00 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/40 ,  G11C13/00

CPC classification number: G11C5/04 ,  G11C5/00 ,  H05K1/117 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/09645 ,  H05K2201/10689 ,  H05K2203/1572 ,  H05K3/403 ,  Y10S439/951

Abstract: A full width single in-line memory module (SIMM) for dynamic random access memory (DRAM) memory expansions is disclosed. A printed circuit board having a multiplicity of DRAM memory elements mounted thereto is arranged in a data path having a width of 144 bits. The SIMM of the present invention further includes on-board drivers to buffer and drive signals in close proximity to the memory elements. In addition, electrically conductive traces are routed on the circuit board in such a manner to reduce loading and trace capacitance to minimize signal skew to the distributed memory elements. The SIMM further includes a high pin density dual readout connector structure receiving electrical traces from both sides of the circuit board for enhanced functionality. The SIMM is installed in complementary sockets one SIMM, at a time to provide memory expansion in full width increments. Finally, symmetrical power and ground routings to the connector structure insure that the SIMM cannot be inserted incorrectly, wherein physically reversing the SIMM in the connector slot will not reverse power the SIMM.

Abstract translation: 公开了用于动态随机存取存储器（DRAM）存储器扩展的全宽单列直插存储器模块（SIMM）。 具有安装在其上的多个DRAM存储元件的印刷电路板布置在宽度为144位的数据路径中。 本发明的SIMM还包括板载驱动器，用于缓冲和驱动紧邻存储器元件的信号。 此外，导电迹线以这样的方式布线在电路板上，以减少负载和跟踪电容以最小化到分布式存储器元件的信号偏移。 SIMM还包括高引脚密度双读出连接器结构，从电路板的两侧接收电迹线以增强功能。 SIMM安装在一个SIMM的互补插座中，以提供全宽度增量的内存扩展。 最后，连接器结构的对称电源和接地布线确保SIMM不能被错误地插入，其中物理地反转连接器插槽中的SIMM将不会使SIMM反向供电。