公开(公告)号：US20070212934A1

公开(公告)日：2007-09-13

申请号：US10593344

申请日：2005-03-17

Applicant: Dietmar Birgel ,  Karl-Peter Hauptvogel

Inventor： Dietmar Birgel ,  Karl-Peter Hauptvogel

IPC: H01R13/60

CPC classification number: H05K1/119 ,  H05K3/0047 ,  H05K3/306 ,  H05K3/42 ,  H05K2201/09854 ,  H05K2201/1059 ,  H05K2203/1476

Abstract: A circuit board with a holding mechanism integrated into the circuit board for the holding of wired, electronic components. To this end, a connection bore is provided for receiving a connection wire or pin of the component. The connection bore is formed from two neighboring and partially mutually overlapping bores. In such case, the first bore is so placed relative to a second bore that ridges are formed in the interior of the connection bore as a result of the overlapping of the first and second bores. The ridges provide a narrowing of the open passageway through the connection bore. In this narrowing, the connection wire or pin is controllably, securely seized by the ridges.

Abstract translation: 一种电路板，其具有集成在电路板中用于保持有线，电子部件的保持机构。 为此，提供连接孔以接收部件的连接线或销。 连接孔由两个相邻和部分相互重叠的孔形成。 在这种情况下，第一孔相对于第二孔相对放置，由于第一和第二孔的重叠，脊形成在连接孔的内部。 脊通过连接孔提供开口通道的变窄。 在这种变窄的情况下，连接线或销被脊部可控地牢固地抓住。

公开(公告)号：US20070107933A1

公开(公告)日：2007-05-17

申请号：US10595259

申请日：2005-02-08

Applicant: Issey Yamamoto ,  Naoki Kaise ,  Yutaka Morikita

Inventor： Issey Yamamoto ,  Naoki Kaise ,  Yutaka Morikita

IPC: H05K1/11 ,  H01R12/04

CPC classification number: H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15174 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/113 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/10674

Abstract: A multilayer substrate includes an internal conductor connection structure having first and second via conductors adjacent to each other in the multilayer substrate and a first line conductor disposed in the multilayer substrate. The first via conductor includes a first continuous via conductor arranged to extend in a direction away from the second via conductor, and the first via conductor is connected to the first line conductor through the first continuous via conductor.

Abstract translation: 多层基板包括具有在多层基板中彼此相邻的第一和第二通孔导体的内部导体连接结构和布置在多层基板中的第一线导体。 第一通孔导体包括布置成沿远离第二通路导体的方向延伸的第一连续通路导体，并且第一通孔导体通过第一连续通路导体连接到第一线路导体。

公开(公告)号：US20070096995A1

公开(公告)日：2007-05-03

申请号：US11262909

申请日：2005-11-01

Applicant: Chang-Jung Lee

Inventor： Chang-Jung Lee

IPC: H01Q1/24

CPC classification number: H01Q1/243 ,  H01Q9/40 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09854 ,  H05K2201/10598 ,  H05K2201/10863 ,  H05K2201/2027

Abstract: A circuit board includes an antenna substrate and a main substrate. The antenna substrate has at least one first linking portion. The main substrate has at least one second linking portion. The first linking portion connects with the second portion so that the antenna substrate assembles with the main substrate. Herein, the antenna is substantially perpendicular to the main substrate.

Abstract translation: 电路板包括天线基板和主基板。 天线基板具有至少一个第一连接部。 主基板具有至少一个第二连接部分。 第一连接部分与第二部分连接，使得天线基板与主基板组装。 这里，天线基本上垂直于主基板。

公开(公告)号：US07161089B2

公开(公告)日：2007-01-09

申请号：US10721453

申请日：2003-11-26

Applicant: Satoshi Sasaki ,  Kazushi Tachimoto ,  Mitsunao Homma

Inventor： Satoshi Sasaki ,  Kazushi Tachimoto ,  Mitsunao Homma

IPC: H01R12/04

CPC classification number: H01G4/228 ,  H01F17/0013 ,  H01L41/0474 ,  H01L41/0475 ,  H05K1/115 ,  H05K2201/09827 ,  H05K2201/09854

Abstract: An electronic component comprises a substrate having a through hole formed in a thickness direction thereof; and a conductor, disposed in the through hole, for electrically connecting one side of the substrate to the other side thereof. The through hole has a major axis diameter and a minor axis diameter on at least one of one side and the other side of the substrate.

Abstract translation: 电子部件包括：基板，其具有沿其厚度方向形成的通孔; 以及布置在所述通孔中的导体，用于将所述基板的一侧电连接到所述基板的另一侧。 通孔在基板的一侧和另一侧中的至少一个上具有长轴直径和短轴直径。

公开(公告)号：US20060084291A1

公开(公告)日：2006-04-20

申请号：US11246167

申请日：2005-10-11

Applicant: Masuoka Hironobu ,  Yoshida Ryuji ,  Hanabusa Kazuyoshi

Inventor： Masuoka Hironobu ,  Yoshida Ryuji ,  Hanabusa Kazuyoshi

IPC: H01R12/00

CPC classification number: H05K3/3405 ,  H01R4/02 ,  H01R4/04 ,  H01R12/57 ,  H01R12/58 ,  H01R12/721 ,  H05K3/0052 ,  H05K3/3447 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09854 ,  H05K2201/1034

Abstract: A mounting structure for mounting a terminal at a circuit board, which allows the terminal to be mounted at the circuit board easily by using an automatic mounter and facilitates inspection of the bonding state at the mounting area where the terminal is mounted at another board, is provided. The mounting structure for a circuit board terminal also assures a sufficient level of strength at the terminal mounting area, reduces the electrical resistance and improves the usable area ratio at the circuit board. According to the present invention, one or a plurality of recessed electrodes (1a) are formed at an end of a circuit board (1) in correspondence to each terminal. One or a plurality of hollow through electrodes (1b) are disposed near the recessed electrodes (1a) at the circuit board (1) in correspondence to each terminal. A mounting portion (4b) of each terminal (4) which is mounted at the circuit board (1), includes a first vertical portion (4c), a horizontal portion (4d) and a second vertical portion (4e) formed by bending the front end of the horizontal portion (4d). The first vertical portion (4c) is fitted at the recessed electrodes (1a) at the circuit board (1) and is then bonded to the circuit board (1) via a conductive bonding material. The second vertical portion (4e) is inserted at the through electrodes (1b) and is then bonded via a conductive bonding material.

Abstract translation: 一种用于将端子安装在电路板上的安装结构，其允许通过使用自动安装器容易地将端子安装在电路板上，并且便于检查端子安装在另一个板上的安装区域的接合状态。 提供。 电路板端子的安装结构也确保端子安装区域的强度足够的水平，降低电阻并提高电路板的可用面积比。 根据本发明，对应于每个端子，在电路板（1）的一端形成一个或多个凹陷电极（1a）。 一对或多个中空贯通电极（1b）设置在电路板（1）的与每个端子对应的凹陷电极（1a）附近。 安装在电路板（1）上的每个端子（4）的安装部分（4b）包括第一垂直部分（4c），水平部分（4d）和第二垂直部分（4e） 通过弯曲水平部分（4d）的前端而形成。 第一垂直部分（4c）装配在电路板（1）的凹陷电极（1a）处，然后通过导电接合材料结合到电路板（1）上。 第二垂直部分（4e）插入通孔（1b），然后通过导电接合材料接合。

公开(公告)号：US20060037778A1

公开(公告)日：2006-02-23

申请号：US11195600

申请日：2005-08-03

Applicant: Dietmar Birgel ,  Karl-Peter Hauptvogel

Inventor： Dietmar Birgel ,  Karl-Peter Hauptvogel

IPC: H05K1/11

CPC classification number: H05K1/119 ,  H05K3/0047 ,  H05K3/306 ,  H05K3/321 ,  H05K3/3415 ,  H05K3/42 ,  H05K2201/09854 ,  H05K2201/1059 ,  H05K2203/1446 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y02P70/613

Abstract: A circuit board and method for populating, securing and electrical contacting of components thereon is provided, as an alternative to the known pressfit technology. After the soldering of SMD-components on a first side of a circuit board, conductive adhesive and solder paste are applied on a second side of the circuit board and a connection pin of a thermally critical THT-component is inserted into the special connection bore from the first side of the circuit board. Then, on the second side of the circuit board, SMD-components are set into the solder paste. In a reflow soldering oven, the SMD components are soldered and the conductive adhesive is dried and cured. By the binding effect of a metallizing sleeve of the connection bore, the insertion of the connection pin in the area of the a constriction produces a kind of cold weld connection, which, alongside the electrical connection by the conductive adhesive, represents a redundant connection, which accompanies the highly secure mechanical connection by the conductive adhesive.

Abstract translation: 提供了一种用于在其上组装，固定和电接触零件的电路板和方法，作为已知的压配技术的替代方案。 在电路板第一面上焊接SMD元件之后，将导电粘合剂和焊膏施加在电路板的第二侧上，并将热临界THT元件的连接销插入到特殊连接孔中 电路板的第一面。 然后，在电路板的第二面，将SMD组件放入焊膏中。 在回流焊炉中，SMD部件被焊接，导电粘合剂被干燥和固化。 通过连接孔的金属化套筒的结合作用，将连接销插入收缩部的区域产生一种冷焊连接，其通过导电粘合剂与电连接一起代表冗余连接， 其伴随着通过导电粘合剂的高度安全的机械连接。

公开(公告)号：US20060015271A1

公开(公告)日：2006-01-19

申请号：US11175123

申请日：2005-07-05

Applicant: Peter Cowan ,  Markus Hirschbold

Inventor： Peter Cowan ,  Markus Hirschbold

IPC: G06F19/00

CPC classification number: H05K1/116 ,  G01R22/065 ,  H01R12/523 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/429 ,  H05K2201/09627 ,  H05K2201/09854

Abstract: A method and arrangement are disclosed for attaching one or more electrical bayonet-type blades to a circuit board with the bayonets being used to receive voltage and current signals from the electric circuit of an electrical meter. The arrangement includes a circuit board with at least one opening adapted to receive one blade. In addition, a sensor is coupled with the electric circuit to sense at least one electrical parameter from the circuit and generating a corresponding analog signal. A solder pad disposed on at least one surface of board surrounds the opening. Solder is applied around the electrically conducting bayonet on one surface of the circuit board and around the electrically conducting bayonet of the surface of the circuit board opposite to the solder pad.

公开(公告)号：US06848912B2

公开(公告)日：2005-02-01

申请号：US10317143

申请日：2002-12-12

Applicant: Tonglong Zhang

Inventor： Tonglong Zhang

IPC: H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  H01R12/00

CPC classification number: H05K1/115 ,  H01R12/523 ,  H05K3/0047 ,  H05K3/403 ,  H05K3/42 ,  H05K3/429 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/09854 ,  H05K2203/1476

Abstract: A via provides a plurality of electrical connections between conductors on different layers of a circuit board. The via includes an opening through the circuit board formed by a plurality of substantially partially overlapping bores. An electrically conductive plating is formed on an inner surface of the opening. The plating forms a plurality of distinct electrically conductive paths.

Abstract translation: 通孔在电路板的不同层上的导体之间提供多个电连接。 通孔包括通过由多个基本上部分重叠的孔形成的电路板的开口。 在开口的内表面上形成导电电镀。 电镀形成多个不同的导电路径。

公开(公告)号：US06835318B2

公开(公告)日：2004-12-28

申请号：US10067890

申请日：2002-02-08

Applicant: Takeyuki Suzuki ,  Noriyuki Matsuoka

Inventor： Takeyuki Suzuki ,  Noriyuki Matsuoka

IPC: H01B1300

CPC classification number: H01L23/544 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2924/0002 ,  H05K1/0266 ,  H05K1/0269 ,  H05K1/115 ,  H05K1/116 ,  H05K2201/09381 ,  H05K2201/09781 ,  H05K2201/09854 ,  H01L2924/00

Abstract: A method for forming a recognition mark on the back surface of a substrate for a KGD that can be easily produced at a low manufacturing cost and permits repeated use of a substrate is provided. In the method, wiring patterns are formed on a surface of one side of an insulating substrate. The method includes a step of forming a conductive pattern as a recognition mark on one surface where the wiring patterns are formed, and a step of forming a through hole from a surface where the wiring pattern is not formed toward the conductive pattern. In the substrate, bumps connected with the KGD are formed on the surface on which the wiring patterns are not formed. Also, the conductive pattern may have a shape as the recognition mark or the through hole may have the shape as the recognition mark.

Abstract translation: 提供了一种用于在用于KGD的基板的背面上形成识别标记的方法，其可以以低制造成本容易地制造并且允许重复使用基板。 在该方法中，在绝缘基板的一侧的表面上形成布线图案。 该方法包括在形成布线图案的一个表面上形成作为识别标记的导电图案的步骤，以及从未形成布线图案的表面向导电图案形成通孔的步骤。 在基板上，在没有形成布线图案的表面上形成与KGD连接的凸块。 此外，导电图案可以具有识别标记或通孔可以具有作为识别标记的形状的形状。

公开(公告)号：US06762944B2

公开(公告)日：2004-07-13

申请号：US10263201

申请日：2002-10-03

Applicant: Manabu Mizusaki

Inventor： Manabu Mizusaki

IPC: H05K714

CPC classification number: H05K1/0271 ,  H05K7/142 ,  H05K2201/09063 ,  H05K2201/09854 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: Disclosed is a novel deformation-resistant structure of a portable device, capable of reducing an electric failure by decreasing a distortion which occurs in a soldered portion between a printed circuit board of the portable device and an electric part mounted on the board due to a mechanical stress such as drop or pressure. Through slits are formed in positions in a printed wiring plate, which correspond to bosses having prepared holes disposed at the corners of a casing. By inserting screws into the prepared holes through the through slits, the printed circuit board is mounted in the casing. Although the casing is deformed when an external mechanical stress is applied to the casing, the screw and the boss can slide along each of the through slits. Thus, a deformation amount of the printed circuit board is not caused or becomes smaller than that of the casing.

Abstract translation: 公开了一种便携式装置的新型抗变形结构，其能够通过减少由便携式装置的印刷电路板和安装在电路板上的电气部件之间的焊接部分产生的变形而导致的电气故障，这是由于机械 压力如跌落或压力。 通过狭缝形成在印刷布线板中的与设置在壳体的角部的具有预定孔的凸起相对应的位置。 通过将穿过狭缝将螺钉插入预备的孔中，将印刷电路板安装在壳体中。 虽然当壳体施加外部机械应力时壳体变形，但是螺钉和凸台可以沿着每个通孔滑动。 因此，不会引起印刷电路板的变形量或变得小于壳体的变形量。