公开(公告)号：US10072830B2

公开(公告)日：2018-09-11

申请号：US15148236

申请日：2016-05-06

Applicant: Hung Lin

Inventor： Hung Lin

IPC: F21V1/00 ,  F21V23/00 ,  F21V23/02 ,  H05K1/02 ,  H05K1/18 ,  F21Y103/00 ,  F21Y105/00

CPC classification number: F21V23/001 ,  F21V23/005 ,  F21V23/02 ,  F21Y2103/00 ,  F21Y2105/00 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/62 ,  H05B33/0803 ,  H05K1/0296 ,  H05K1/181 ,  H05K2201/10106

Abstract: A uniform luminance light-emitting diode (LED) circuit board includes a first primary trace and a second primary trace mounted on a substrate along a direction and are spaced apart, multiple LED strings mounted on the substrate along the direction and parallelly connected between the first primary trace and the second primary trace, a first power trace and a second power trace respectively connected to the first primary trace and the second primary trace, and a first auxiliary trace with two ends respectively connected to the second primary trace and the second power trace. By adjusting trace widths of the first primary trace and the second primary trace to limit current passing through each LED string and using the first auxiliary trace to provide an additional current path, identical current flowing through all the LED strings results in uniform luminance of the LED strings.

公开(公告)号：US20180252859A1

公开(公告)日：2018-09-06

申请号：US15755555

申请日：2016-08-26

Applicant: SHARP KABUSHIKI KAISHA

Inventor： YUUSUKE YAMAMOTO

IPC: F21V8/00 ,  H05K1/03 ,  H05K1/18

CPC classification number: G02B6/0083 ,  G02B6/0045 ,  G02B6/0073 ,  H05K1/0259 ,  H05K1/0393 ,  H05K1/181 ,  H05K1/189 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2201/10136

Abstract: A backlight device 20 includes LEDs 21, a metal housing 40 that accommodates the LEDs 21, an LED drive substrate 26 that is disposed outside the housing 40 and drives the LEDs 21, and an LED-mounted substrate 30 on which the LEDs 21 are mounted. The LED-mounted substrate 30 includes a connector portion 31 disposed outside the housing 40 and connected to the LED drive substrate 26, a wiring pattern 32 that connects the connector portion 31 and the LEDs 21, and a conductive layer 33 that is exposed on a substrate surface 30B facing the housing 40 at a position overlapping the wiring pattern 32 and is conductive but electrically independent of the wiring pattern 32. A display device of this embodiment includes the backlight device 20 described above, and a liquid crystal panel 11 that uses light from the backlight device 20 for display purposes.

公开(公告)号：US10064270B2

公开(公告)日：2018-08-28

申请号：US15174677

申请日：2016-06-06

Applicant: North Carolina State University

Inventor： Jesse S. Jur ,  Murat Yokus ,  Rachel Foote ,  Amanda Caton Myers ,  Raj Pravinbhai Bhakta

IPC: H05K1/02 ,  H01L23/498 ,  H05K1/18 ,  H05K1/03 ,  H05K3/36 ,  G01N33/36

CPC classification number: H05K1/0283 ,  G01N33/367 ,  H01L23/4985 ,  H01L23/49883 ,  H01L33/62 ,  H05K1/038 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/0129 ,  H05K2201/09263 ,  H05K2201/10106 ,  H05K2201/10219

Abstract: Provided herein are flexible interconnects, systems containing one or more flexible interconnects, and textiles including one or more flexible interconnects.

公开(公告)号：US10054731B2

公开(公告)日：2018-08-21

申请号：US15146263

申请日：2016-05-04

Applicant: Seoul Semiconductor Co., Ltd.

Inventor： Seoung Ho Jung ,  Jung Hwa Jung ,  Ki Bum Nam

IPC: H01L33/60 ,  F21V8/00 ,  F21V7/10 ,  F21V23/00 ,  H01L33/50 ,  H05K1/18 ,  G02F1/1335 ,  H01L33/40

CPC classification number: G02B6/0031 ,  F21V7/10 ,  F21V23/005 ,  G02B6/0026 ,  G02B6/0073 ,  G02B6/009 ,  G02F1/133615 ,  H01L33/405 ,  H01L33/50 ,  H01L33/60 ,  H01L2224/16225 ,  H05K1/181 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10674

Abstract: A light source module including a circuit board, a first light emitting device mounted on the circuit board by flip-chip bonding or surface mount technology (SMT), a reflective portion disposed on the circuit board and having at least one recess accommodating the first light emitting device, and a bonding member disposed between the circuit board and the reflective portion. The reflective portion has a height greater than a height of the first light emitting device.

公开(公告)号：US10054300B2

公开(公告)日：2018-08-21

申请号：US15097946

申请日：2016-04-13

Applicant: Hubbell Incorporated

Inventor： Derek B. Baker ,  Cory A. Passerello ,  Thomas Clawson

IPC: F21V23/00 ,  F21V23/06 ,  F21S8/04 ,  H05K1/02 ,  F21Y103/10 ,  F21Y115/10

CPC classification number: F21V23/003 ,  F21S8/04 ,  F21V23/009 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/0286 ,  H05K2201/09063 ,  H05K2201/09127 ,  H05K2201/10106

Abstract: A light board for a light fixture includes a first portion and a second portion. The first portion includes at least one light emitting element, and the second portion includes at least one light emitting element. A first state is defined by the second portion being coupled to the first portion and a second state is defined by the second portion being detached from the first portion. In the first state, the light emitting elements of the first portion and the second portion are configured to provide an evenly distributed light output along at least the combined length of the first portion and the second portion. In the second state, the at least one light emitting element of the first portion is configured to provide an evenly distributed light output along at least the length of the first portion.

公开(公告)号：US20180228028A1

公开(公告)日：2018-08-09

申请号：US15945913

申请日：2018-04-05

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Andreas Huber ,  Harald Huels ,  Stefano S. Oggioni ,  Thomas Strach ,  Thomas-Michael Winkel

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/34 ,  H05K3/00 ,  H05K3/18 ,  H05K3/46 ,  H05K1/14 ,  H05K1/11

CPC classification number: H01L23/49838 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06537 ,  H01L2225/06548 ,  H05K1/0219 ,  H05K1/115 ,  H05K1/144 ,  H05K1/181 ,  H05K1/183 ,  H05K3/0097 ,  H05K3/18 ,  H05K3/34 ,  H05K3/4697 ,  H05K2201/049 ,  H05K2201/10015 ,  H05K2201/10106

Abstract: The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.

公开(公告)号：US20180213633A1

公开(公告)日：2018-07-26

申请号：US15499586

申请日：2017-04-27

Applicant: Shiu Li Technology Co., Ltd.

Inventor： Chung-Cheng Chien

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/12

CPC classification number: H05K1/0209 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/095 ,  H05K3/1216 ,  H05K3/14 ,  H05K3/44 ,  H05K2201/0266 ,  H05K2201/10106 ,  H05K2203/0736 ,  H05K2203/1366

Abstract: A heat dissipator having a circuit formed by screen printing or spraying includes a circuit layer and an isolation layer. The circuit layer, which is on a surface of a heat dissipation part of the heat dissipator having the circuit formed by screen printing or spraying, is formed by screen printing or spraying a uniformly distributed plastic material and low electrical resistance conductive powder. The isolation layer is disposed on the circuit layer and the heat dissipation part.

公开(公告)号：US10030828B2

公开(公告)日：2018-07-24

申请号：US14967125

申请日：2015-12-11

Applicant: Lilibrand LLC

Inventor： Ariel Meir

IPC: F21S4/00 ,  F21S4/22 ,  H05K3/36 ,  H05K3/30 ,  H05K1/14 ,  H05K3/28 ,  F21Y115/10

CPC classification number: F21S4/22 ,  F21K9/64 ,  F21Y2115/10 ,  H05K1/142 ,  H05K3/284 ,  H05K3/285 ,  H05K3/30 ,  H05K3/361 ,  H05K2201/0133 ,  H05K2201/10106 ,  H05K2203/1305 ,  Y10T29/49126

Abstract: The present invention is directed to the use of light emitting diode (LED) lighting in flexible strips, where the color of the lighting emitted from the flexible strip is consequential to the encapsulation process and heat from the lights is adequately dissipated.

公开(公告)号：US20180199433A1

公开(公告)日：2018-07-12

申请号：US15742190

申请日：2016-08-02

Applicant: Soko Kagaku Co., Ltd. ,  Asahi Glass Company, Limited

Inventor： Akira HIRANO ,  Ko AOSAKI

IPC: H05K1/03 ,  H01L33/62 ,  H01L33/32 ,  H05K1/11 ,  H05K1/09 ,  H05K3/46 ,  H05K3/00 ,  H05K3/40 ,  H05K3/28

CPC classification number: H05K1/036 ,  H01L33/32 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/16225 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K3/0044 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0104 ,  H05K2201/015 ,  H05K2201/10106 ,  H05K2201/10674 ,  H05K2203/0228 ,  H05K2203/0548 ,  H05K2203/0759

Abstract: To prevent degradation of electrical characteristics caused by a resin filled between electrodes in an ultraviolet light-emitting operation, the present invention provides a base 10 that comprises an insulating base material 11 and two or more metal films 12 and 13 that are formed on one side of the insulating base material 11 and electrically separated from each other. The two or more metal films are formed to include an upper surface and a side wall surface that are covered by gold or a platinum group metal, to be capable of mounting thereon one or more nitride semiconductor light-emitting elements and the like, and to have, as a whole, a predetermined planar view shape including two or more electrode pads. On the one side of the base material 11, along a boundary line between an exposed surface of the base material 11 that is not covered by the metal film 12, 13 and a side wall surface of the metal film 12, 13, at least a first part of the exposed surface of the base material 11 continuous with the boundary line that is sandwiched between two adjacent electrode pads and the side wall surfaces of the metal films 12 and 13 that oppose to each other with the first part interposed therebetween are covered by a fluororesin film 16, and a part of an upper surface of the metal film 12, 13 that composes at least the electrode pad is not covered by the fluororesin film 16.

公开(公告)号：US20180184526A1

公开(公告)日：2018-06-28

申请号：US15737935

申请日：2016-06-28

Applicant: Molex, LLC

Inventor： Marko SPIEGEL ,  Victor ZADEREJ ,  Amrit PANDA

IPC: H05K3/18 ,  H05K1/18 ,  H05K3/10 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K3/188 ,  H05K1/0265 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/183 ,  H05K3/027 ,  H05K3/107 ,  H05K3/182 ,  H05K3/202 ,  H05K2201/0154 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2203/0706 ,  H05K2203/0709 ,  H05K2203/0716 ,  H05K2203/108 ,  H05K2203/1131

Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.