公开(公告)号：US09609743B2

公开(公告)日：2017-03-28

申请号：US14412196

申请日：2014-01-31

Applicant: KYOCERA Corporation

Inventor： Akihiko Funahashi ,  Kanae Horiuchi ,  Yousuke Moriyama

IPC: H05K1/02 ,  H05K1/03 ,  H01L27/146 ,  H01L33/62 ,  H01L33/48 ,  H04N5/225 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H01L27/14618 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/49175 ,  H04N5/2254 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/183 ,  H05K2201/10121 ,  H05K2201/10378 ,  H05K2201/2018 ,  H01L2924/00

Abstract: There are provided an electronic device mounting substrate and an electronic apparatus which are capable of miniaturization. An electronic device mounting substrate includes: an insulating base including a frame section; an electrode pad disposed on an upper surface of the frame section; and a first conductor disposed on a side surface of the frame section, the first conductor being electrically connected to the electrode pad, the electrode pad extending over a side surface of the first conductor from the upper surface of the frame section. By suppressing separation of the first conductor from the insulating base by means of the electrode pad, disconnection at the first conductor can be suppressed.

公开(公告)号：US20170066088A1

公开(公告)日：2017-03-09

申请号：US14846489

申请日：2015-09-04

Applicant: Intel Corporation

Inventor： Mohit Sood ,  Boxi Liu ,  Wei Tan ,  Huili Xu ,  Kabir J. Mirpuri

IPC: B23K35/26 ,  B23K35/02 ,  H01L23/00 ,  H05K3/36 ,  H01L21/48 ,  H05K1/18 ,  H05K1/14 ,  H05K3/34 ,  B23K1/00 ,  H01L23/498

CPC classification number: B23K35/262 ,  B23K1/0016 ,  B23K35/0244 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/131 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13118 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/1339 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16502 ,  H01L2224/16505 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/3511 ,  H01L2924/3841 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/042 ,  H05K2201/10234 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/041 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01323 ,  H01L2924/01324 ,  H01L2924/01079 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/00014 ,  H01L2924/0665

Abstract: Embodiments herein may relate to an apparatus with a ball grid array (BGA) package that includes a plurality of solder balls of an off-eutectic material. In embodiments, the respective solder balls of the plurality of solder balls may form solder joints between a substrate of the BGA and a second substrate. In some embodiments the joints may be less than approximately 0.6 micrometers from one another. Other embodiments may be described and/or claimed.

Abstract translation: 本文的实施例可以涉及具有球栅阵列（BGA）封装的装置，其包括多个非共晶材料的焊球。 在实施例中，多个焊球的相应焊球可以在BGA的衬底和第二衬底之间形成焊接接头。 在一些实施例中，接头可以彼此小于约0.6微米。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20170047261A1

公开(公告)日：2017-02-16

申请号：US15335260

申请日：2016-10-26

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chun-Lin Lu ,  Kai-Chiang Wu ,  Yen-Ping Wang ,  Shih-Wei Liang ,  Ching-Feng Yang

IPC: H01L23/24 ,  H01L25/10 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L23/24 ,  H01L21/481 ,  H01L21/4885 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18161 ,  H05K1/181 ,  H05K2201/049 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An interposer may comprise a metal layer above a substrate. A dam or a plurality of dams may be formed above the metal layer. A dam surrounds an area of a size larger than a size of a die which may be connected to a contact pad above the metal layer within the area. A dam may comprise a conductive material, or a non-conductive material, or both. An underfill may be formed under the die, above the metal layer, and contained within the area surrounded by the dam, so that no underfill may overflow outside the area surrounded by the dam. Additional package may be placed above the die connected to the interposer to form a package-on-package structure.

Abstract translation: 插入件可以包括衬底上方的金属层。 可以在金属层上方形成坝或多个堤坝。 大坝围绕尺寸大于模具尺寸的区域，该区域可以连接到该区域内的金属层上方的接触垫。 大坝可以包括导电材料或非导电材料，或两者。 可以在模具下方形成底部填充物，在金属层之上，并且包含在由坝围绕的区域内，使得底部填充物不会溢出到由坝围绕的区域外部。 附加封装可以放置在与插入件连接的管芯上方以形成封装封装结构。

公开(公告)号：US20170034925A1

公开(公告)日：2017-02-02

申请号：US15289950

申请日：2016-10-10

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju CHEN ,  Ming-Hao WU ,  Cheng-Po YU

IPC: H05K3/46 ,  H05K3/30 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H01L35/30 ,  H05K3/36 ,  H05K3/40 ,  H05K1/02

CPC classification number: H05K3/4647 ,  G06F1/206 ,  H01L23/12 ,  H01L23/13 ,  H01L23/4275 ,  H01L23/49827 ,  H01L35/30 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15153 ,  H01L2924/15313 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/14 ,  H05K1/181 ,  H05K1/185 ,  H05K1/187 ,  H05K3/36 ,  H05K3/4697 ,  H05K2201/048 ,  H05K2201/10219 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10734

Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.

Abstract translation: 具有热恢复功能的电路板包括基板，储热装置和热电装置。 储热装置嵌入在基板中并与处理器连接，以与处理器进行热交换。 嵌入在基板中的热电装置包括第一金属结表面和第二金属结表面。 第一金属接合面与蓄热装置连接，与蓄热装置进行热交换。 第二金属结表面与第一金属结表面接合，其中热电装置通过第一金属接合表面和第二金属结表面之间的温度差产生电位。

公开(公告)号：US20170025342A1

公开(公告)日：2017-01-26

申请号：US15287729

申请日：2016-10-06

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang Tseng ,  Yu-Hua Chen ,  Ra-Min Tain

IPC: H01L23/498 ,  H01L23/48 ,  C25D7/12 ,  H01L25/10 ,  H01L21/48 ,  H01L23/31 ,  H01L23/367

CPC classification number: H01L23/49833 ,  C25D5/022 ,  C25D5/34 ,  C25D5/48 ,  C25D7/12 ,  C25D7/123 ,  H01L21/486 ,  H01L21/4875 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H05K1/113 ,  H05K3/424 ,  H05K3/4647 ,  H05K3/4682 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0733 ,  Y10T29/49155

Abstract: A chip package structure including a molding compound, a carrier board, a chip, a plurality of conductive pillars and a circuit board is provided. The carrier board includes a substrate and a redistribution layer. The substrate has a first surface and a second surface. The redistribution layer is disposed on the first surface. The chip and the conductive pillars are disposed on the redistribution layer. The molding compound covers the chip, the conductive pillars, and the redistribution layer. The circuit board is connected with the carrier board, wherein the circuit board is disposed on the molding compound, such that the chip is located between the substrate and the circuit board, and the chip and the redistribution layer are electrically connected with the circuit board through the conductive pillars. Heat generated by the chip is transmitted through the substrate from the first surface to the second surface to dissipate.

Abstract translation: 提供了包括模制化合物，载体板，芯片，多个导电柱和电路板的芯片封装结构。 载体板包括基板和再分布层。 基板具有第一表面和第二表面。 再分配层设置在第一表面上。 芯片和导电柱设置在再分配层上。 模塑料覆盖芯片，导电柱和再分布层。 电路板与承载板连接，其中电路板设置在模塑料上，使得芯片位于基板和电路板之间，并且芯片和再分布层通过电路板电连接 导电支柱。 由芯片产生的热量通过基板从第一表面传递到第二表面以消散。

公开(公告)号：US20170006705A1

公开(公告)日：2017-01-05

申请号：US14755490

申请日：2015-06-30

Applicant: Raytheon Company

Inventor： Tse E. Wong ,  Kenneth T. Teshiba ,  Shea Chen

IPC: H05K1/18 ,  C22C13/00 ,  C22C11/06 ,  H05K1/11 ,  B23K35/26

CPC classification number: H05K1/181 ,  B23K35/262 ,  B23K35/268 ,  C22C11/06 ,  C22C13/00 ,  H01L23/15 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/80 ,  H05K1/111 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/4061 ,  H05K2201/10378 ,  H05K2201/2081 ,  Y02P70/613

Abstract: An adaptive interposer is provided to be operably disposable between first and second solder materials of first and second electronic devices, respectively. The adaptive interposer includes a plate element formed to define cavities and third solder material disposable in the cavities to be electrically communicative with the first and second solder materials. The third solder material is more compliant and has a higher melting temperature than at least the second solder materials.

Abstract translation: 提供自适应插入器以分别在第一和第二电子器件的第一和第二焊料材料之间可操作地一次性使用。 自适应插入器包括形成为限定空腔的一个板状元件和在空腔中一次性与第一和第二焊料材料电连通的第三焊料材料。 第三焊料材料更柔顺并且具有比至少第二焊料材料更高的熔化温度。

公开(公告)号：US20170005077A1

公开(公告)日：2017-01-05

申请号：US15068372

申请日：2016-03-11

Applicant: Apple Inc.

Inventor： Hoon Sik Kim ,  Yung-Yu Hsu ,  Paul S. Drzaic

IPC: H01L25/075 ,  G06F3/041 ,  G06F3/0346 ,  H01L33/62

CPC classification number: G02B6/0041 ,  G02B6/00 ,  G02B6/0021 ,  G02B6/0036 ,  G02B6/006 ,  G02B6/0065 ,  G02B6/0068 ,  G02B6/0073 ,  G06F1/1643 ,  G06F1/1652 ,  G06F2203/04102 ,  G06F2203/04106 ,  G06F2203/04109 ,  H01L23/5387 ,  H01L51/0097 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0274 ,  H05K1/0283 ,  H05K1/0287 ,  H05K1/141 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/09263 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10378

Abstract: An electronic device may have control circuitry coupled to input-output devices such as a display. A flexible input-output device may be formed from an elastomeric substrate layer. The substrate layer may have signal paths to which components are mounted. Openings may be formed in the elastomeric substrate layer between the signal paths to create a stretchable mesh-shaped substrate. The electrical components may each include an interposer having solder pads soldered to the elastomeric substrate. Electrical devices such as micro-light-emitting diodes may be soldered to the interposers. The electrical components may also include electrical devices such as sensors and actuators. A stretchable lighting unit may have a stretchable light guide illuminated by a stretchable light source.

Abstract translation: 电子设备可以具有耦合到诸如显示器的输入输出设备的控制电路。 灵活的输入 - 输出设备可以由弹性体基底层形成。 衬底层可以具有安装组件的信号路径。 可以在信号路径之间的弹性体基底层中形成开口，以产生可拉伸的网状基底。 电气部件可以各自包括具有焊接到弹性体基板的焊盘的插入器。 诸如微型发光二极管的电气装置可以焊接到插入件。 电气部件还可以包括诸如传感器和致动器的电气装置。 可拉伸照明单元可以具有由可拉伸光源照亮的可拉伸光导。

公开(公告)号：US20170003440A1

公开(公告)日：2017-01-05

申请号：US15070498

申请日：2016-03-15

Applicant: Apple Inc.

Inventor： Hoon Sik Kim ,  Yung-Yu Hsu ,  Paul S. Drzaic

IPC: F21V8/00 ,  G06F1/16

CPC classification number: G02B6/0041 ,  G02B6/00 ,  G02B6/0021 ,  G02B6/0036 ,  G02B6/006 ,  G02B6/0065 ,  G02B6/0068 ,  G02B6/0073 ,  G06F1/1643 ,  G06F1/1652 ,  G06F2203/04102 ,  G06F2203/04106 ,  G06F2203/04109 ,  H01L23/5387 ,  H01L51/0097 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0274 ,  H05K1/0283 ,  H05K1/0287 ,  H05K1/141 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/09263 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10378

Abstract: An electronic device may have control circuitry coupled to input-output devices such as a display. A flexible input-output device may be formed from an elastomeric substrate layer. The substrate layer may have signal paths to which components are mounted. Openings may be formed in the elastomeric substrate layer between the signal paths to create a stretchable mesh-shaped substrate. The electrical components may each include an interposer having solder pads soldered to the elastomeric substrate. Electrical devices such as micro-light-emitting diodes may be soldered to the interposers. The electrical components may also include electrical devices such as sensors and actuators. A stretchable lighting unit may have a stretchable light guide illuminated by a stretchable light source.

公开(公告)号：US09526174B2

公开(公告)日：2016-12-20

申请号：US14199695

申请日：2014-03-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Soo Park ,  Min Cheol Park

IPC: H01G4/30 ,  H05K1/18 ,  H01G2/06 ,  H01G4/012 ,  H01G4/232 ,  H01G4/228 ,  H01G4/236 ,  H01G4/06 ,  H01G4/018 ,  H01G4/005 ,  H01G4/08 ,  H01G4/12

CPC classification number: H05K1/181 ,  H01G2/065 ,  H01G4/005 ,  H01G4/012 ,  H01G4/018 ,  H01G4/08 ,  H01G4/12 ,  H01G4/228 ,  H01G4/232 ,  H01G4/236 ,  H01G4/30 ,  H05K2201/10015 ,  H05K2201/10378 ,  Y02P70/611

Abstract: A multilayer ceramic electronic component may include: a multilayer ceramic capacitor including a ceramic body, a plurality of first and second internal electrodes formed to be alternately exposed to both side surfaces of the ceramic body, having a dielectric layer therebetween, and first and second external electrodes connected to the first and second internal electrodes, respectively; and an interposer board including an insulation board coupled to the mounting surface of the multilayer ceramic capacitor and first and second connection terminals formed on the insulation board and connected to the first and second external electrodes, respectively.

Abstract translation: 多层陶瓷电子部件可以包括：多层陶瓷电容器，其包括陶瓷体，形成为交替地暴露于陶瓷体的两个侧表面的多个第一和第二内部电极，其间具有电介质层，以及第一和第二外部电极 分别连接到第一和第二内部电极的电极; 以及插入板，其包括耦合到所述多层陶瓷电容器的安装表面的绝缘板和形成在所述绝缘板上并分别连接到所述第一外部电极和所述第二外部电极的第一和第二连接端子。

公开(公告)号：US20160358858A1

公开(公告)日：2016-12-08

申请号：US15241482

申请日：2016-08-19

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Takaharu YAMANO ,  Hajime IIZUKA ,  Hideaki SAKAGUCHI ,  Toshio KOBAYASHI ,  Tadashi ARAI ,  Tsuyoshi KOBAYASHI ,  Tetsuya KOYAMA ,  Kiyoaki IIDA ,  Tomoaki MASHIMA ,  Koichi TANAKA ,  Yuji KUNIMOTO ,  Takashi YANAGISAWA

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/85 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/207 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/185 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4644 ,  H05K2201/10007 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00

Abstract: An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.

Abstract translation: 公开了一种电子部件嵌入式基板。 电子部件嵌入式基板包括第一基板，第二基板，电子部件，电连接部件和密封部件。 还公开了一种制造电子部件嵌入式基板的方法。 该方法包括将电子部件安装到第一基板上，通过电连接部件将第二基板层压在第一基板上; 以及用密封构件填充第一基板和第二基板之间的空间以密封电子部件。