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公开(公告)号:US10000954B2
公开(公告)日:2018-06-19
申请号:US14998225
申请日:2015-12-24
Applicant: Intel Corporation
Inventor: Bok Eng Cheah , Howe Yin Loo , Min Suet Lim , Chung Peng Jackson Kong , Poh Tat Oh
Abstract: A personal computing device is provided with a first housing portion, a second housing portion, and a hinge joining the first housing portion to the second housing portion. The hinge is configured to allow the first housing portion to rotate substantially three-hundred-sixty degrees relative to the second housing portion. The hinge can be implemented as a plurality of interlinked parallel hinge segments, each hinge segment to rotate about a respective one of a plurality of parallel axes of the hinge to enable the rotation of the first housing portion.
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公开(公告)号:US20180145051A1
公开(公告)日:2018-05-24
申请号:US15357233
申请日:2016-11-21
Applicant: Intel Corporation
Inventor: Howe Yin Loo , Eng Huat Goh , Min Suet Lim , Bok Eng Cheah , Jackson Chung Peng Kong , Khang Choong Yong
IPC: H01L25/065 , H01L25/16 , H01L25/00 , H01L23/498 , H05K1/11 , H05K3/36 , H05K3/30
CPC classification number: H01L25/0657 , H01L23/49811 , H01L25/0655 , H01L25/16 , H01L25/50 , H01L2224/16145 , H01L2224/16225 , H01L2224/73204 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/15311 , H05K1/111 , H05K1/141 , H05K3/30 , H05K3/36 , H05K3/368 , H05K2201/042 , H05K2201/10015 , H05K2201/1003 , H05K2201/10159 , H05K2201/10378 , H05K2201/10545 , H05K2201/10734
Abstract: A system-in-package apparatus includes a package substrate configured to carry at least one semiconductive device on a die side and a through-mold via package bottom interposer disposed on the package substrate on a land side. A land side board mates with the through-mold via package bottom interposer, and enough vertical space is created by the through-mold via package bottom interposer to allow space for at least one device disposed on the package substrate on the land side.
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公开(公告)号:US09360896B2
公开(公告)日:2016-06-07
申请号:US14229830
申请日:2014-03-28
Applicant: Intel Corporation
Inventor: Min Suet Lim , Bok Eng Cheah , Howe Yin Loo , Jackson Chung Peng Kong , Poh Tat Oh
CPC classification number: G06F1/1681 , G06F1/1616 , G06F1/1618 , G06F1/1637 , Y10T16/547
Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a low-profile hinge design that includes a first segment that connects to a first element using a first coupler and to a second segment that connects to the first segment using a second coupler, where the second segment connects to a second element using a third coupler. The first coupler, the second coupler, and the third coupler may each have a first coupling arm and a second coupling arm and the first coupling arm can be offset from a plane of the second coupling arm by about five degrees to about forty-five degrees.
Abstract translation: 本文描述的特定实施例提供了一种电子设备,例如笔记本电脑或膝上型计算机,其包括耦合到多个电子部件(其包括任何类型的组件,元件,电路等)的电路板。 电子设备的一个具体示例实现可以包括低轮廓铰链设计,其包括使用第一耦合器连接到第一元件的第一段和使用第二耦合器连接到第一段的第二段,其中第二段 段使用第三耦合器连接到第二元件。 第一耦合器,第二耦合器和第三耦合器可以各自具有第一耦合臂和第二耦合臂,并且第一耦合臂可以从第二耦合臂的平面偏移约五度至约四十五度 。
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公开(公告)号:US20150277505A1
公开(公告)日:2015-10-01
申请号:US14229830
申请日:2014-03-28
Applicant: Intel Corporation
Inventor: Min Suet Lim , Bok Eng Cheah , Howe Yin Loo , Jackson Chung Peng Kong , Poh Tat Oh
IPC: G06F1/16
CPC classification number: G06F1/1681 , G06F1/1616 , G06F1/1618 , G06F1/1637 , Y10T16/547
Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a low-profile hinge design that includes a first segment that connects to a first element using a first coupler and to a second segment that connects to the first segment using a second coupler, where the second segment connects to a second element using a third coupler. The first coupler, the second coupler, and the third coupler may each have a first coupling arm and a second coupling arm and the first coupling arm can be offset from a plane of the second coupling arm by about five degrees to about forty-five degrees.
Abstract translation: 本文描述的特定实施例提供了一种电子设备,例如笔记本电脑或膝上型计算机,其包括耦合到多个电子部件(其包括任何类型的组件,元件,电路等)的电路板。 电子设备的一个具体示例实现可以包括低轮廓铰链设计,其包括使用第一耦合器连接到第一元件的第一段和使用第二耦合器连接到第一段的第二段,其中第二段 段使用第三耦合器连接到第二元件。 第一耦合器,第二耦合器和第三耦合器可以各自具有第一耦合臂和第二耦合臂,并且第一耦合臂可以从第二耦合臂的平面偏移约五度至约四十五度 。
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公开(公告)号:US20250113428A1
公开(公告)日:2025-04-03
申请号:US18478967
申请日:2023-09-29
Applicant: Intel Corporation
Inventor: Min Suet Lim , Eng Huat Goh , Tin Poay Chuah , Kavitha Nagarajan , Telesphor Kamgaing , Poh Boon Khoo , Jiun Hann Sir
Abstract: Technologies for a shield for electromagnetic interference include a circuit board with an integrated circuit package on it, with a hole in the circuit board under the integrated circuit package. The integrated circuit package may include one or more dies or other components on the underside of the package, at least partially positioned in the hole in the circuit board. An electromagnetic shield box can be positioned in the hole. Tabs of the electromagnetic shield box may interface with pads on the same side of the circuit board as the integrated circuit package. The electromagnetic shield box may prevent or reduce electromagnetic or radiofrequency interference on the components of the integrated circuit package. Positioning the electromagnetic shield box can reduce the overall height of the circuit board, among other advantages.
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公开(公告)号:US20250052512A1
公开(公告)日:2025-02-13
申请号:US18447951
申请日:2023-08-10
Applicant: Intel Corporation
Inventor: Shantanu Kulkarni , Jeff Ku , Baomin Liu , Tongyan Zhai , Min Suet Lim , Chee Chun Yee , Eng Huat Goh , Jun Liao , Kavitha Nagarajan
IPC: F28D15/04
Abstract: Systems, apparatus, articles of manufacture, and methods related to multi-sectional vapor chambers for electronic devices are disclosed. An example vapor chamber includes a first panel, a second panel, and a wall extending between the first panel and the second panel to separate the vapor chamber into a first section and a second section between both the first panel and the second panel, the wall including insulation.
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公开(公告)号:US12204370B2
公开(公告)日:2025-01-21
申请号:US17359224
申请日:2021-06-25
Applicant: Intel Corporation
Inventor: Jeff Ku , Jose Oviedo Salazar , Twan Sing Loo , Khai Ern See , Min Suet Lim
IPC: G06F1/16
Abstract: Electronic devices with moveable display screens are described herein. An example electronic device includes a lid having a first display screen and a base. The lid is moveably coupled to the base. The base includes a housing having a top side and a bottom side, a physical keyboard to be accessed on the top side of the housing, and a second display screen moveable between a first position in which the keyboard is exposed and a second position in which the second display screen covers the keyboard.
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公开(公告)号:US20250016930A1
公开(公告)日:2025-01-09
申请号:US18895796
申请日:2024-09-25
Applicant: Intel Corporation
Inventor: Min Suet Lim , Luis Alvarez Mata , Jia Yan Go , Smit Kapila , Chaitra Kotehal , Jeff Ku , Shantanu Kulkarni , Kari Mansukoski , Surya Pratap Mishra
IPC: H05K1/18
Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for inductors of voltage regulators that are built into and/or around mounting holes of a printed circuit board. An example apparatus includes a printed circuit board that includes a plurality of layers and a mounting hole extending through the plurality of layers, and an inductor at least partially in the mounting hole between two or more of the plurality of layers.
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公开(公告)号:US20250008685A1
公开(公告)日:2025-01-02
申请号:US18216049
申请日:2023-06-29
Applicant: Intel Corporation
Inventor: Jeff Ku , Nirmala Bailur , Min Suet Lim , Tongyan Zhai , Chee Chun Yee , Ruander Cardenas , Lance Lin , Eng Huat Goh , Javed Shaikh , Jun Liao , Kavitha Nagarajan , Tin Poay Chuah , Martin M. Chang , Shantanu D. Kulkarni , Telesphor Kamgaing
Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for cooling electronic devices. An example apparatus includes a fan module for an electronic device. The fan module includes a first cover; a second cover; an input/output (IO) board adjacent the second cover, the second cover and IO board beneath the first cover; and a fan between the first cover and the second cover, the fan to operate above the second cover and a portion of the IO board.
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公开(公告)号:US20240314921A1
公开(公告)日:2024-09-19
申请号:US18121297
申请日:2023-03-14
Applicant: Intel Corporation
Inventor: Jeff Ku , Baomin Liu , Cora Nien , Min Suet Lim , Tongyan Zhai
CPC classification number: H05K1/0209 , F16K31/504 , H05K7/20254 , H05K2201/0209
Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to cool electronic devices. An example thermal solution to cool an electronic device Includes a first cooling plate at a first side of a printed circuit board and a second cooling plate at a second side of the printed circuit board, the second side opposite the first side. The second cooling plate is fluidically coupled with the first cooling plate.
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