公开(公告)号：US3928682A

公开(公告)日：1975-12-23

申请号：US43008474

申请日：1974-01-02

Applicant: MARTIN PROCESSING CO INC

Inventor： HERMES JULIUS

IPC: B32B15/08 ,  C08J7/12 ,  H05K1/00 ,  H05K3/38 ,  B05D3/00 ,  B32B9/04 ,  B32B27/06

CPC classification number: B32B15/09 ,  B32B15/08 ,  B32B15/20 ,  B32B2457/08 ,  C08J7/12 ,  C08J2367/02 ,  H05K1/0393 ,  H05K3/381 ,  H05K2201/0145 ,  H05K2201/0355 ,  H05K2203/0783 ,  Y10T428/31786

Abstract: Polyester materials are treated in such fashion as to impart to the treated surface thereof good bondability toward other materials, such as thin films of copper foil, to provide composite laminated articles useful in the industrial arts such as for printed circuitry and the like. The treatment consists essentially in subjecting the surface of the polyester material to a solution, preferably anhydrous, of an alkali metal hydroxide in a high boiling glycol such as ethylene glycol, propylene glycol, dipropylene glycol, diethylene glycol and tetraethylene glycol.

Abstract translation: 聚酯材料的处理方式是使处理过的表面对其它材料（例如铜箔薄膜）具有良好的粘合性，以提供用于印刷电路等工业领域的复合层压制品。 处理主要在于使聚酯材料的表面经受高沸点二醇如乙二醇，丙二醇，二丙二醇，二甘醇和四甘醇中的碱金属氢氧化物溶液，优选无水溶液。

公开(公告)号：US3855047A

公开(公告)日：1974-12-17

申请号：US32144473

申请日：1973-01-05

Applicant: MINNESOTA MINING & MFG

Inventor： GROFF G

IPC: D04H1/42 ,  H05K1/03 ,  D04H1/04 ,  B32B7/04

CPC classification number: H05K1/0366 ,  D04H1/4342 ,  D04H1/435 ,  D04H1/4382 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10T428/2904 ,  Y10T442/2164 ,  Y10T442/2475

Abstract: The disclosed laminate is suitable for use in the art of printed circuitry and comprises an electrically conductive layer and a nonwoven backing layer. The nonwoven backing has unusual dimensional stability under a wide variety of conditions and preferably comprises a blend of at least 15 wt. % polyester staple and at least 10 wt. % aromatic polyamide staple. This blend is impregnated with a thermosettable resin.

Abstract translation: 所公开的层压体适用于印刷电路领域，并且包括导电层和非织造背衬层。 非织造背衬在各种条件下具有不寻常的尺寸稳定性，并且优选包含至少15wt。 ％聚酯短纤维和至少10重量％ ％芳族聚酰胺短纤维。 该混合物用热固性树脂浸渍。

公开(公告)号：US3527665A

公开(公告)日：1970-09-08

申请号：US3527665D

申请日：1967-01-23

Applicant: FMC CORP

Inventor： WRIGHT CARL L ,  BEACHAM HARRY H

IPC: H05K1/03 ,  H05K3/38 ,  B32B15/04

CPC classification number: H05K1/0326 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/386 ,  H05K3/389 ,  H05K2201/0145 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0759 ,  Y10S428/901 ,  Y10T428/31678 ,  Y10T442/3415

公开(公告)号：US3437522A

公开(公告)日：1969-04-08

申请号：US3437522D

申请日：1965-02-19

Applicant: SCHJELDAHL CO G T

Inventor： FICK HERBERT J ,  JOHNSON ROGER W

IPC: C09D9/00 ,  C11D7/08 ,  H01B3/44 ,  H05K1/00 ,  H05K1/03 ,  H05K3/06 ,  H05K3/28 ,  H05K3/38 ,  B08B3/08

CPC classification number: H01B3/441 ,  C09D9/00 ,  C11D7/08 ,  H05K1/032 ,  H05K1/034 ,  H05K1/0393 ,  H05K3/06 ,  H05K3/288 ,  H05K3/386 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0355 ,  H05K2203/0769 ,  H05K2203/0786 ,  H05K2203/0789 ,  Y10S428/901

公开(公告)号：US12035467B2

公开(公告)日：2024-07-09

申请号：US18341796

申请日：2023-06-27

Applicant: Ticona LLC

Inventor： Young Shin Kim

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q21/06 ,  H05K1/03 ,  H05K3/00 ,  H05K3/18

CPC classification number: H05K1/0373 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q21/065 ,  H05K3/0032 ,  H05K3/182 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0263 ,  H05K2201/10098 ,  H05K2203/072

Abstract: A circuit structure that comprises a substrate and one or more conductive elements disposed on the substrate is provided. The substrate comprises a polymer composition that comprises an electrically conductive filler distributed within a polymer matrix. The polymer matrix contains at least one thermoplastic high performance polymer having a deflection under load of about 40° C. or more as determined in accordance with ISO 75-2:2013 at a load of 1.8 MPa, and the polymer composition exhibits a dielectric constant of about 4 or more and a dissipation factor of about 0.3 or less, as determined at a frequency of 2 GHz.

公开(公告)号：US11910524B2

公开(公告)日：2024-02-20

申请号：US18085611

申请日：2022-12-21

Applicant: Molex, LLC

Inventor： Steven Fulton ,  Matthew Shannon

IPC: H05K1/02 ,  G06F3/044 ,  H03K17/96 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/0274 ,  G06F3/044 ,  H03K17/962 ,  H05K1/0281 ,  H05K1/0326 ,  H05K1/0393 ,  H05K1/09 ,  G06F2203/04103 ,  H03K2217/960755 ,  H05K2201/0145 ,  H05K2201/10106 ,  H05K2201/10121

Abstract: A number of user interface devices are described. In one example, a user interface device includes a lens having a graphic visible through the lens, a transparent circuit film comprising a top surface and a bottom surface, a reflector film bonded to the bottom surface of the transparent circuit film, the reflector film including an embossed area which defines a pocket between the reflector film and the bottom surface of the transparent circuit film, a light emitting diode (LED) bonded to the bottom surface of the transparent circuit film and positioned within the pocket between the reflector film and the bottom surface of the transparent circuit film, and a layer of transparent pressure-sensitive adhesive interposed between the bottom surface of the lens and the top surface of the transparent circuit film.

公开(公告)号：US20240052093A1

公开(公告)日：2024-02-15

申请号：US18021381

申请日：2021-06-24

Applicant: DIC Corporation

Inventor： Ryuichi MATSUOKA ,  Lichen YANG ,  Hiroyoshi KANNARI

IPC: C08G63/193 ,  C08G63/199 ,  C08G63/672 ,  C08G63/81 ,  C08G64/06 ,  C08G64/30 ,  C08K5/14 ,  C08K5/5313 ,  C08K5/523 ,  C08K5/5333 ,  C08L67/03 ,  C08L69/00 ,  C09D167/03 ,  C09D169/00 ,  C08J5/24 ,  H05K1/03

CPC classification number: C08G63/193 ,  C08G63/199 ,  C08G63/672 ,  C08G63/81 ,  C08G64/06 ,  C08G64/307 ,  C08K5/14 ,  C08K5/5313 ,  C08K5/523 ,  C08K5/5333 ,  C08L67/03 ,  C08L69/00 ,  C09D167/03 ,  C09D169/00 ,  C08J5/24 ,  H05K1/0366 ,  C08J2367/03 ,  C08J2369/00 ,  H05K2201/0145

Abstract: An object is to provide a cured product and the like with excellent fire retardancy, heat resistance, and dielectric properties by using a curable resin having a specific structure and a curable resin composition containing the curable resin, a radical polymerization initiator, and a fire retardant. Specifically provided are a curable resin represented by General Formula (1) and a curable resin composition containing the curable resin, a radical polymerization initiator (B), and a fire retardant (C):






in the formula, Ra and Rb each independently represent an alkyl group, an aryl group, an aralkyl group, or a cycloalkyl group with a carbon number of 1 to 12; k indicates an integer of 0 to 3; X represents a hydrocarbon group; and Y represents General Formula (2) or (3) below:










in the formula, Z represents an alicyclic group, an aromatic group, or a heterocyclic group.

公开(公告)号：US20180327541A1

公开(公告)日：2018-11-15

申请号：US15527876

申请日：2015-11-10

Applicant: DIC Corporation

Inventor： Kazuo Arita ,  Tatsuya Okamoto

IPC: C08G59/40 ,  C08G63/197 ,  H05K1/03

CPC classification number: C08G59/40 ,  C08G63/181 ,  C08G63/197 ,  C08J5/24 ,  H01L23/29 ,  H01L23/295 ,  H01L23/31 ,  H01L2924/0002 ,  H05K1/03 ,  H05K1/0373 ,  H05K3/46 ,  H05K2201/012 ,  H05K2201/0145 ,  H01L2924/00

Abstract: Provided are a thermosetting resin composition whose cured product exhibits a low dielectric constant and a low loss tangent as well as excellent flame retardancy, heat resistance, and thermal decomposition resistance, a cured product obtained from the thermosetting resin composition, and an active ester resin for use in the thermosetting resin composition. Specifically, the thermosetting resin composition contains, as essential components, an epoxy resin and an active ester resin having a resin structure that has a structural segment represented by formula (I) below and monovalent aryloxy groups at both terminals:

公开(公告)号：US20180317314A1

公开(公告)日：2018-11-01

申请号：US15770114

申请日：2016-10-24

Applicant: Universität des Saarlandes

Inventor： Simon Olberding ,  Jürgen Steimle

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/16 ,  G06T19/00 ,  G06F3/044

CPC classification number: H05K1/028 ,  G06F3/044 ,  G06F3/0488 ,  G06F2203/0339 ,  G06F2203/04102 ,  G06T19/00 ,  G06T2219/021 ,  G09F9/301 ,  H03K17/962 ,  H05K1/0326 ,  H05K1/0386 ,  H05K1/11 ,  H05K1/162 ,  H05K3/0005 ,  H05K3/1216 ,  H05K2201/0145 ,  H05K2201/046 ,  H05K2201/047 ,  H05K2201/09381 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10053 ,  H05K2201/10128 ,  H05K2201/10151

Abstract: The invention is directed to an object (2) with a three-dimensional shape made of a folded sheet (4) so as to form at least one face (6), at least one corner (10) and/or at least one edge (8), the object comprising electrically conductive traces (14) printed on the sheet (4); and at least one functional area (12) printed on one of the at least one face (6), adjacent to one of the at least one edge (8), or adjacent to one of the at least one corner (10), the at least one functional area (12) being electrically connected to the conductive traces (14) and forming at least one control for a touch input, for a display output, and/or for sensing a change of shape of the object.

公开(公告)号：US20180263118A1

公开(公告)日：2018-09-13

申请号：US15978268

申请日：2018-05-14

Applicant: Compass Technology Company Limited

Inventor： Kelvin Po Leung Pun ,  Chee Wah Cheung

IPC: H05K3/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K3/0041 ,  G06F3/041 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06K9/00013 ,  H01L29/1606 ,  H05K1/0278 ,  H05K1/0306 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/09 ,  H05K1/144 ,  H05K3/0064 ,  H05K3/025 ,  H05K3/027 ,  H05K3/381 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0323 ,  H05K2201/042 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/095 ,  H05K2203/1545

Abstract: A process for forming a graphene circuit pattern on an object is described. A graphene layer is grown on a metal foil. A bonding layer is formed on a protective film and a surface of the bonding layer is roughened. The graphene layer is transferred onto the roughened surface of the bonding layer. The protective film is removed and the bonding layer is laminated to a first core dielectric substrate. The metal foil is etched away. Thereafter the graphene layer is etched using oxygen plasma etching to form graphene circuits on the first core dielectric substrate. The first core dielectric substrate having graphene circuits thereon is bonded together with a second core dielectric substrate wherein the graphene circuits are on a side facing the second core dielectric substrate wherein an air gap is left there between.