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    Printed wiring board assembly and related methods
    83.
    发明授权
    Printed wiring board assembly and related methods 有权
    印刷电路板组装及相关方法

    公开(公告)号：US09012782B2

    公开(公告)日：2015-04-21

    申请号：US13960287

    申请日：2013-08-06

    Applicant: Harris Corporation

    Inventor： Anders P. Pedersen ,  Daniel A. Robison ,  Alan W. Mast

    IPC: H05K1/11 ,  H05K1/14 ,  H05K3/36 ,  H05K3/40 ,  H05K1/02 ,  H05K3/30

    CPC classification number: H05K1/144 ,  H05K1/0219 ,  H05K1/111 ,  H05K1/117 ,  H05K1/142 ,  H05K3/301 ,  H05K3/366 ,  H05K3/403 ,  H05K2201/09145 ,  H05K2201/0919 ,  H05K2201/09481 ,  H05K2201/09809 ,  H05K2201/10446

    Abstract: A method is for making a printed wiring board (PWB) assembly. The method may include forming a first PWB having a plurality of first electrically conductive pads, forming a second PWB including a plurality of electrically conductive traces having exposed ends on an edge surface of the second PWB, and covering the edge surface of the second PWB with an electrically conductive layer. The method may also include selectively removing portions of the electrically conductive layer to define a plurality of second electrically conductive pads electrically connected to corresponding ones of the exposed ends of the electrically conductive traces, and assembling the first and second PWBs together so that the first and second electrically conductive pads are electrically coupled together to define the PWB assembly.

    Abstract translation: 一种制造印刷电路板（PWB）组件的方法。 该方法可以包括形成具有多个第一导电焊盘的第一PWB，形成第二PWB，第二PWB包括在第二PWB的边缘表面上具有暴露端的多个导电迹线，并且用第二PWB的边缘表面覆盖第二PWB的边缘表面 导电层。 该方法还可以包括选择性地去除导电层的部分以限定电连接到导电迹线的相应的暴露端的多个第二导电焊盘，以及将第一和第二PWB组合在一起，使得第一和 第二导电焊盘电耦合在一起以限定PWB组件。

    WIRING SUBSTRATE AND MULTI-PIECE WIRING SUBSTRATE
    85.
    发明申请
    WIRING SUBSTRATE AND MULTI-PIECE WIRING SUBSTRATE 有权
    接线基板和多层接线基板

    公开(公告)号：US20140174803A1

    公开(公告)日：2014-06-26

    申请号：US14234604

    申请日：2012-12-25

    Applicant: NGK SPARK PLUG CO., LTD

    Inventor： Jyun Suzuki ,  Naoki Kito ,  Masami Hasegawa ,  Chizuo Nakashima

    IPC: H05K1/03

    CPC classification number: H05K1/0306 ,  H05K1/183 ,  H05K3/0052 ,  H05K3/403 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09354

    Abstract: A wiring substrate includes a substrate body formed of a plate-like ceramic, having a front surface, a back surface, and a height of 0.8 mm or less; a cavity opening at the front surface and having a rectangular shape as viewed in plane; and side walls having a thickness of 0.3 mm or less between a side surface of the cavity and a side surface of the substrate body. The wiring substrate further includes an electrically conductive layer having the form of a frame and formed on the front surface to surround an opening of the cavity; a ceramic surface having the form of a frame and located adjacently to the electrically conductive layer and along the outer periphery of the front surface; and a via conductor formed in the substrate body along the side surface of the cavity between a bottom surface of the cavity and the front surface.

    Abstract translation: 布线基板包括由板状陶瓷形成的基板主体，具有前表面，背面和0.8mm以下的高度; 在前表面开口的空腔，在平面上具有矩形形状; 以及在空腔的侧表面和基板主体的侧表面之间具有0.3mm或更小的厚度的侧壁。 布线基板还包括具有框架形式并形成在前表面上以包围空腔的开口的导电层; 陶瓷表面，其具有框架的形式并且与导电层相邻并且沿着前表面的外周定位; 以及形成在所述基板主体中的所述通孔导体，其沿​​着所述空腔的底表面和所述前表面之间的所述空腔的侧表面。

    Golden Finger and Board Edge Interconnecting Device
    86.
    发明申请
    Golden Finger and Board Edge Interconnecting Device 有权
    金手指和板边缘互连设备

    公开(公告)号：US20140004720A1

    公开(公告)日：2014-01-02

    申请号：US14016398

    申请日：2013-09-03

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Kai Yao ,  Yongfa Zhu ,  Yingpei Huang

    IPC: H05K1/11

    CPC classification number: H05K1/117 ,  H05K1/0265 ,  H05K1/0298 ,  H05K3/4046 ,  H05K2201/0919 ,  H05K2201/09481 ,  H05K2201/0979 ,  H05K2201/10416

    Abstract: A golden finger and a board edge interconnecting device are disclosed. The golden finger includes a printed circuit board (PCB) surface layer and at least one PCB inner layer, where a metal foil of the PCB inner layer is connected to a metal foil of the PCB surface layer through a current-carrying structure, so that a current-carrying channel of the golden finger passes through the PCB surface layer and the PCB inner layer. The board edge interconnecting device includes the foregoing golden finger. In the embodiments, a current-carrying capacity of a PCB in the golden finger is increased without increasing a size and thickness of a copper foil of the PCB in the golden finger, thereby effectively improving the current-carrying capacity of the PCB in the golden finger.

    Abstract translation: 公开了金手指和板边缘互连装置。 金手指包括印刷电路板（PCB）表面层和至少一个PCB内层，其中PCB内层的金属箔通过载流结构连接到PCB表面层的金属箔，使得 金手指的载流通道穿过PCB表面层和PCB内层。 板边缘互连装置包括上述金手指。 在实施例中，金手指上的PCB的载流能力增加，而不增加金手指中PCB的铜箔的尺寸和厚度，从而有效地提高了黄金中PCB的载流能力 手指。

    Switch structure on sidewall of circuit board for electronic device
    87.
    发明授权
    Switch structure on sidewall of circuit board for electronic device 有权
    电子设备电路板侧壁开关结构

    公开(公告)号：US08410380B2

    公开(公告)日：2013-04-02

    申请号：US13481596

    申请日：2012-05-25

    Applicant: Chih-Feng Yeh ,  Wen-Nan Hsia ,  Cheng-Ju Lee

    Inventor： Chih-Feng Yeh ,  Wen-Nan Hsia ,  Cheng-Ju Lee

    IPC: H01H1/20

    CPC classification number: H05K3/403 ,  H01H1/5805 ,  H01H13/10 ,  H05K2201/09145 ,  H05K2201/0919 ,  H05K2201/10053 ,  H05K2201/10446 ,  Y10T29/49105 ,  Y10T29/49124

    Abstract: A switch structure on the sidewall of a circuit board for an electronic device and manufacturing methods of the circuit board are provided. The switch structure includes a circuit board, a plurality of conductive portions, and a movable unit. The conductive portions are formed on a sidewall of the circuit board and electrically insulated from each other. The movable unit is disposed corresponding to the conductive portions to electrically connect or disconnect the plurality of conductive portions to achieve the switch function. The switch structure utilizes the structural design of the circuit board to reduce the space on the circuit board preserved for a circuit board switch.

    Abstract translation: 提供了一种用于电子设备的电路板的侧壁上的开关结构和电路板的制造方法。 开关结构包括电路板，多个导电部分和可移动单元。 导电部分形成在电路板的侧壁上并彼此电绝缘。 可移动单元对应于导电部分设置以电连接或断开多个导电部分以实现开关功能。 开关结构利用电路板的结构设计，减少电路板开关保留的电路板上的空间。

    High-speed transmission circuit board connection structure
    88.
    发明授权
    High-speed transmission circuit board connection structure 有权
    高速传输电路板连接结构

    公开(公告)号：US08395906B2

    公开(公告)日：2013-03-12

    申请号：US12801279

    申请日：2010-06-01

    Applicant: Masayuki Nikaido ,  Yoshiaki Ishigami ,  Kenichi Tamura ,  Takehiko Tokoro

    Inventor： Masayuki Nikaido ,  Yoshiaki Ishigami ,  Kenichi Tamura ,  Takehiko Tokoro

    IPC: H05K1/11

    CPC classification number: H05K1/142 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/3011 ,  H05K1/0215 ,  H05K1/0219 ,  H05K1/025 ,  H05K3/0061 ,  H05K3/403 ,  H05K3/4053 ,  H05K2201/0919 ,  H05K2201/09236 ,  H05K2201/09318 ,  H05K2201/09354 ,  H05K2201/09845 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A high-speed transmission circuit board connection structure includes a first high-speed transmission circuit board including a laminated substrate including a first signal transmission wiring formed on a surface thereof and a ground plane formed inside thereof, a second high-speed transmission circuit board including a circuit substrate and a second signal transmission wiring formed on a surface of the circuit substrate, a conductive board connecting member for fixing the first and second high-speed transmission circuit boards to a surface thereof, and a bonding wire for electrically connecting the first signal transmission wiring and the second signal transmission wiring. The ground plane is exposed on a side end face of the laminated substrate, and a conductive film is formed on the side end face such that the ground plane of the first high-speed transmission circuit board is electrically connected to the board connecting member with the conductive film.

    Abstract translation: 高速传输电路板连接结构包括：第一高速传输电路板，包括：层叠基板，其包括形成在其表面上的第一信号传输布线和形成在其内部的接地平面;第二高速传输电路板，包括 电路基板和形成在电路基板的表面上的第二信号传输布线，用于将第一和第二高速传输电路板固定到其表面的导电板连接部件，以及用于将第一信号 传输线和第二信号传输线。 接地面暴露在层叠基板的侧端面上，在侧端面上形成导电膜，使得第一高速传输电路板的接地面与板连接部件电连接 导电膜。

    Systems and methods for providing vias through a modular component
    89.
    发明授权
    Systems and methods for providing vias through a modular component 有权
    通过模块化组件提供通孔的系统和方法

    公开(公告)号：US08310835B2

    公开(公告)日：2012-11-13

    申请号：US12769086

    申请日：2010-04-28

    Applicant: Gloria Lin ,  Bryson Gardner, Jr. ,  Joseph Fisher, Jr. ,  Dennis Pyper ,  Amir Salehi

    Inventor： Gloria Lin ,  Bryson Gardner, Jr. ,  Joseph Fisher, Jr. ,  Dennis Pyper ,  Amir Salehi

    IPC: H05K7/02 ,  H01R43/00

    CPC classification number: H05K1/145 ,  H05K1/115 ,  H05K1/141 ,  H05K3/222 ,  H05K2201/0919 ,  H05K2201/09627 ,  H05K2201/10446 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T29/49169

    Abstract: This relates to systems and methods for providing one or more vias through a module of an electrical system. For example, in some embodiments, the module can include one or more passive and/or active elements of the electrical system around which a packaging has been plastic molded. The module can be stacked under another component of the electrical system. Vias can then be provided that extend through the module. The vias can include, for example, electrically conductive pathways. In this manner, the vias can provide electrical pathways for coupling the component stacked on top of the module to other entities of an electronic device including the electrical system. For example, the component can be coupled to other entities such as other components, other modules, printed circuit boards, other electrical systems, or to any other suitable entity.

    Abstract translation: 这涉及用于通过电气系统的模块提供一个或多个通孔的系统和方法。 例如，在一些实施例中，该模块可以包括电气系统的一个或多个被动和/或有源元件，其中包装已经被塑料模制。 该模块可以堆叠在电气系统的另一个部件下。 然后可以提供通过模块延伸的通孔。 通孔可以包括例如导电通路。 以这种方式，通孔可以提供用于将堆叠在模块顶部上的部件耦合到包括电气系统的电子设备的其他实体的电路径。 例如，组件可以耦合到诸如其他组件，其他模块，印刷电路板，其他电气系统或任何其它合适实体的其他实体。

    SWITCH STRUCTURE ON SIDEWALL OF CIRCUIT BOARD FOR ELECTRONIC DEVICE AND MANUFACTURING METHODS OF THE CIRCUIT BOARD
    90.
    发明申请
    SWITCH STRUCTURE ON SIDEWALL OF CIRCUIT BOARD FOR ELECTRONIC DEVICE AND MANUFACTURING METHODS OF THE CIRCUIT BOARD 有权
    电路板电路板开关结构及电路板制造方法

    公开(公告)号：US20120228100A1

    公开(公告)日：2012-09-13

    申请号：US13481596

    申请日：2012-05-25

    Applicant: Chih-Feng YEH ,  Wen-Nan HSIA ,  Cheng-Ju LEE

    Inventor： Chih-Feng YEH ,  Wen-Nan HSIA ,  Cheng-Ju LEE

    IPC: H01H1/20 ,  H01H11/00

    CPC classification number: H05K3/403 ,  H01H1/5805 ,  H01H13/10 ,  H05K2201/09145 ,  H05K2201/0919 ,  H05K2201/10053 ,  H05K2201/10446 ,  Y10T29/49105 ,  Y10T29/49124

    Abstract: A switch structure on the sidewall of a circuit board for an electronic device and manufacturing methods of the circuit board are provided. The switch structure includes a circuit board, a plurality of conductive portions, and a movable unit. The conductive portions are formed on a sidewall of the circuit board and electrically insulated from each other. The movable unit is disposed corresponding to the conductive portions to electrically connect or disconnect the plurality of conductive portions to achieve the switch function. The switch structure utilizes the structural design of the circuit board to reduce the space on the circuit board preserved for a circuit board switch.

    Abstract translation: 提供了一种用于电子设备的电路板的侧壁上的开关结构和电路板的制造方法。 开关结构包括电路板，多个导电部分和可移动单元。 导电部分形成在电路板的侧壁上并彼此电绝缘。 可移动单元对应于导电部分设置以电连接或断开多个导电部分以实现开关功能。 开关结构利用电路板的结构设计，减少电路板开关保留的电路板上的空间。

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