公开(公告)号：US07307221B2

公开(公告)日：2007-12-11

申请号：US11100005

申请日：2005-04-05

Applicant: Chun-Chieh Pan

Inventor： Chun-Chieh Pan

IPC: H05K1/16

CPC classification number: H01L24/73 ,  H01L24/14 ,  H01L24/81 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/14051 ,  H01L2224/14104 ,  H01L2224/16237 ,  H01L2224/17104 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2203/0465 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A fabrication method and structure for a PCBA, and tool for assembly of the structure. The structure includes a circuit board, at least one first solder joint, a plurality of second solder joints, and an electronic device. The circuit board has a solder mask, having a plurality of openings exposing at least one first pad and a plurality of second pads arranged beyond the first pad, on a surface. The first solder joint has a maximum width J1 and electrically connects to the first pad. The second solder joints respectively have a maximum width J2 exceeding J1 and respectively electrically connect to the second pads. The electronic device has a plurality of third pads, arranged substantially corresponding to the openings, respectively electrically connecting to the first pad and second pads.

Abstract translation: PCBA的制造方法和结构，以及用于组装结构的工具。 该结构包括电路板，至少一个第一焊接接头，多个第二焊点和电子器件。 电路板具有焊接掩模，其具有在表面上暴露至少一个第一焊盘和布置成超过第一焊盘的多个第二焊盘的多个开口。 第一焊点具有最大宽度J 1并且电连接到第一焊盘。 第二焊点分别具有超过J 1的最大宽度J 2并且分别电连接到第二焊盘。 电子设备具有多个第三焊盘，其大致对应于开口分别电连接到第一焊盘和第二焊盘。

公开(公告)号：US20070281557A1

公开(公告)日：2007-12-06

申请号：US11759210

申请日：2007-06-06

Applicant: Chao-Wen Shih

Inventor： Chao-Wen Shih

IPC: H01R4/02

CPC classification number: H01L21/4853 ,  H01L21/4846 ,  H01L23/49838 ,  H01L2224/0401 ,  H01L2224/05018 ,  H01L2224/05027 ,  H01L2224/05559 ,  H01L2224/05572 ,  H01L2224/13006 ,  H01L2224/13562 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/243 ,  H05K3/28 ,  H05K2201/0367 ,  H05K2201/0391 ,  H05K2201/09381 ,  H05K2201/09436 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2224/05552

Abstract: A method of fabricating an electrical connecting structure of a circuit board is disclosed. The method includes: providing a circuit board having a plurality of first and a plurality of second conductive pads; forming on the circuit board a solder mask having a plurality of openings to thereby expose the first and the second conductive pads; forming an metal adhesive layer on the first and the second conductive pads; forming a conductive layer on the circuit board and the metal adhesive layer; forming on the conductive layer a resistive layer, wherein a plurality of openings are formed in the resistive layer to expose the conductive layer on the second conductive pads; forming a metal post by electroplating through the conductive layer on the second conductive pads; removing the resistive layer and the conductive layer covered underneath; and forming a soldering layer on the metal post. This invention discloses a method of forming different connecting elements on a circuit board.

Abstract translation: 公开了一种制造电路板的电连接结构的方法。 该方法包括：提供具有多个第一和多个第二导电焊盘的电路板; 在所述电路板上形成具有多个开口的焊料掩模，从而暴露所述第一和第二导电焊盘; 在第一和第二导电焊盘上形成金属粘合剂层; 在电路板和金属粘合剂层上形成导电层; 在所述导电层上形成电阻层，其中在所述电阻层中形成多个开口以暴露所述第二导电焊盘上的导电层; 通过电镀穿过第二导电焊盘上的导电层形成金属柱; 去除覆盖在下面的电阻层和导电层; 并在金属柱上形成焊接层。 本发明公开了一种在电路板上形成不同连接元件的方法。

公开(公告)号：US20070272437A1

公开(公告)日：2007-11-29

申请号：US11802758

申请日：2007-05-24

Applicant: Takeshi Kondo

Inventor： Takeshi Kondo

IPC: H05K1/16

CPC classification number: H05K1/111 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2924/3511 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/0989 ,  H05K2201/099 ,  Y02P70/611

Abstract: In a printed board having a wiring pattern and an NSMD type land, the present invention prevents disconnection between the land and the wiring pattern and separation of the land from the printed board. The printed circuit board has a main wiring pattern, a protective film covering the main wiring pattern and having an opening formed therein, and a land located inside of the opening of the protective film so that the land is spaced from a circumferential edge of the opening of the protective film. The printed circuit board also has an auxiliary wiring pattern including a first auxiliary wiring portion located under the protective film so as to surround the land and second auxiliary wiring portions radially extending from the land to the first auxiliary wiring portion.

Abstract translation: 在具有布线图案和NSMD型焊盘的印刷电路板中，本发明防止焊盘和布线图案之间的断开以及焊盘与印刷电路板的分离。 印刷电路板具有主布线图案，覆盖主布线图案并且具有形成在其中的开口的保护膜，以及位于保护膜的开口内部的平台，使得平台与开口的周边边缘间隔开 的保护膜。 印刷电路板还具有辅助布线图案，其包括位于保护膜下面的第一辅助布线部分，以围绕脊部和从脊部向第一辅助布线部分径向延伸的第二辅助布线部分。

公开(公告)号：US07301103B2

公开(公告)日：2007-11-27

申请号：US11352293

申请日：2006-02-13

Applicant: Makoto Tanaka ,  Shigenori Miyagawa

Inventor： Makoto Tanaka ,  Shigenori Miyagawa

IPC: H05K1/00

CPC classification number: H05K1/116 ,  H05K1/111 ,  H05K1/114 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/10189 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144

Abstract: A printed-wiring board having a multiplayer structure including a plurality of insulating layers and a plurality of conducting layers includes a signal pattern provided in at least one of outermost layers of the conducting layers which includes a plurality of pad portions which are provided in positions opposite to a plurality of signal terminals of a connector component arranged in a predetermined form and perform electrical connection, reinforcing portions which are provided to extend from the pad portions respectively in a lengthwise direction, and land portions to perform the electrical connection to another layer of the conducting layers, and a solder resist provided on the outermost layer of the conducting layers to cover the reinforcing portion and having an opening portion to expose the pad portion.

Abstract translation: 具有包括多个绝缘层和多个导电层的多玩家结构的印刷电路板包括设置在导电层的最外层中的至少一个中的信号图案，该信号图案包括多个焊盘部分，该多个焊盘部分设置在相对的位置 连接部件的多个信号端子以预定的形式布置并且进行电连接，所述加强部分分别设置成沿长度方向从所述焊盘部分延伸，并且将所述接地部分电连接到所述另一层 导电层，以及设置在导电层的最外层上的阻焊剂，以覆盖加强部分并具有露出焊盘部分的开口部分。

公开(公告)号：US20070253148A1

公开(公告)日：2007-11-01

申请号：US11496565

申请日：2006-07-31

Applicant: Kiyokazu Ishizaki

Inventor： Kiyokazu Ishizaki

IPC: H02B1/00

CPC classification number: H05K1/111 ,  H01L2224/16225 ,  H05K1/114 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/0979 ,  H05K2201/10734 ,  Y02P70/611

Abstract: According to one embodiment, a printed circuit board includes an insulating substrate, a plurality of lands formed on the insulating substrate, a conductive wiring pattern coupled to the lands, a protective film covering the insulating substrate and having an opening larger than the outer profile of each of the lands, a plurality of bumps bonded to the lands and a circuit component electrically connected to the lands via the bumps. Each land has a land body having a gap along an opening rim of the opening, and an extension part extending from a part of the land body to the opening rim of the opening.

Abstract translation: 根据一个实施例，印刷电路板包括绝缘衬底，形成在绝缘衬底上的多个焊盘，耦合到焊盘的导电布线图案，覆盖绝缘衬底的保护膜，并且具有大于外部轮廓的开口 焊盘中的每一个，焊盘接合的多个凸块和通过凸块电连接到焊盘的电路部件。 每个台面具有沿着开口的开口边缘具有间隙的平台主体，以及从该陆部的一部分延伸到开口的开口边缘的延伸部分。

公开(公告)号：US20070235748A1

公开(公告)日：2007-10-11

申请号：US11764098

申请日：2007-06-15

Applicant: Tetsushi Tamura ,  Tatsumi Setomoto ,  Nobuyuki Matsui ,  Masanori Shimizu ,  Yoshihisa Yamashita

Inventor： Tetsushi Tamura ,  Tatsumi Setomoto ,  Nobuyuki Matsui ,  Masanori Shimizu ,  Yoshihisa Yamashita

IPC: H01L33/00

CPC classification number: H01L33/20 ,  H01L33/38 ,  H01L2924/0002 ,  H05K1/111 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/10106 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: A wiring board used for mounting an LED bare chip capable of firmly bonding the LED bare chip and improving yield. In a printed wiring board 2, a distance D between wiring patterns 81 and 85 disposed so as to oppose each other is the smallest at a position nearest to a center point (G) of an LED chip 14 disposed at a designed location, and increases with an increasing distance from the point G. In addition, pattern edges 83 and 87 of the wiring patterns 81 and 85 recede in the direction of widening the distance D as a distance from the center point G increases with respect to electrode edges 148 and 149 of the LED chip 14.

Abstract translation: 用于安装LED裸芯片的布线板，能够牢固地接合LED裸芯片并提高产量。 在印刷布线板2中，布置在彼此相对的布线图案81和85之间的距离D在最靠近布置在设计位置处的LED芯片14的中心点（G）的位置处最小，并且增加 距离点G的距离增加。此外，布线图案81和85的图案边缘83和87随着距离中心点G的距离相对于电极边缘148和149而增加的方向后退。 的LED芯片14。

公开(公告)号：US07268303B2

公开(公告)日：2007-09-11

申请号：US10682780

申请日：2003-10-09

Applicant: Takeshi Ashida

Inventor： Takeshi Ashida

IPC: H05K1/16

CPC classification number: H01L23/50 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/11822 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/111 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/09772 ,  H05K2201/0989 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In a circuit board including a pad for mounting a ball grid array and a wiring, a mounting structure of the ball grid array, an electro-optic device, and an electronic device, the circuit board includes a pad for mounting the ball grid array, a wiring for connecting the pad and an external terminal, and a soldering resist having an opening portion exposing the pad and the wiring.

Abstract translation: 在包括用于安装球栅阵列的焊盘和布线的电路板，球栅阵列的安装结构，电光器件和电子器件中，电路板包括用于安装球栅阵列的焊盘， 用于连接焊盘和外部端子的布线，以及具有露出焊盘和布线的开口部分的焊接抗蚀剂。

公开(公告)号：US20070145553A1

公开(公告)日：2007-06-28

申请号：US11613753

申请日：2006-12-20

Applicant: Yasushi Araki ,  Seiji Sato ,  Masatoshi Nakamura ,  Takashi Ozawa

Inventor： Yasushi Araki ,  Seiji Sato ,  Masatoshi Nakamura ,  Takashi Ozawa

IPC: H01L23/02

CPC classification number: H05K3/3452 ,  H01L21/563 ,  H01L23/3171 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/02 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/10175 ,  H01L2224/11 ,  H01L2224/1132 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A solder resist and a central pad to which a central Au bump provided on a semiconductor chip is flip-chip bonded are formed on a substrate main body. In a flip-chip mounting substrate where an underfill resin is provided after the semiconductor chip is mounted, a central opening portion for exposing the central pad is formed in the solder resist, and also, an edge portion forming the outer peripheral portion of the solder resist is partially overlapped with the outer peripheral portion of the central pad.

Abstract translation: 在衬底主体上形成阻焊剂和设置在半导体芯片上的中心Au凸块倒装芯片接合的中心焊盘。 在安装半导体芯片之后设置底部填充树脂的倒装芯片安装基板中，在阻焊层中形成用于露出中心焊盘的中心开口部分，并且还形成形成焊料外周部分的边缘部分 抗蚀剂部分地与中心焊盘的外周部分重叠。

公开(公告)号：US20070102830A1

公开(公告)日：2007-05-10

申请号：US11586209

申请日：2006-10-24

Applicant: Akira Muto ,  Tomokazu Tanaka

Inventor： Akira Muto ,  Tomokazu Tanaka

IPC: H01L23/52

CPC classification number: H05K1/118 ,  H01R12/79 ,  H05K1/0219 ,  H05K1/0237 ,  H05K3/42 ,  H05K2201/093 ,  H05K2201/09381 ,  H05K2201/09409 ,  H05K2201/09481 ,  H05K2201/09618 ,  H05K2201/09727 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A flexible printed circuit board has an insulation layer, a first signal wiring layer including a microstrip line, a second signal wiring layer including a signal connection terminal for allowing the microstrip line to connect the exterior connector electrically, and a ground conductive section having a ground connection terminal for connecting the exterior connector. The microstrip line and the signal connection terminal are connected to each other by a wiring via hole. The wiring via hole passes through the insulation layer, the first signal wiring layer, and the second signal wiring layer. The microstrip line has a taper section which gradually enlarges a width of the microstrip line toward the wiring via hole in the vicinity of the wiring via hole. The ground conductive section that corresponds to the microstrip line has a taper section with a shape matching the taper section of the microstrip line.

Abstract translation: 柔性印刷电路板具有绝缘层，包括微带线的第一信号布线层，包括用于允许微带线将外部连接器电连接的信号连接端子的第二信号布线层和具有地面的接地导电部分 用于连接外部连接器的连接端子。 微带线和信号连接端子通过布线孔相互连接。 布线通孔穿过绝缘层，第一信号布线层和第二信号布线层。 微带线具有锥形部，其在布线通孔附近逐渐扩大微带线的宽度朝向布线通孔。 对应于微带线的接地导电部分具有与微带线的锥形部分匹配的形状的锥形部分。

公开(公告)号：US20070093107A1

公开(公告)日：2007-04-26

申请号：US11585959

申请日：2006-10-25

Applicant: Kenji Motohashi ,  Takashi Yanagimoto ,  Hideji Miyanishi ,  Kazumasa Aoki

Inventor： Kenji Motohashi ,  Takashi Yanagimoto ,  Hideji Miyanishi ,  Kazumasa Aoki

IPC: H01R29/00

CPC classification number: H05K1/117 ,  H05K1/0224 ,  H05K1/0298 ,  H05K2201/0792 ,  H05K2201/093 ,  H05K2201/09381 ,  H05K2201/0969 ,  H05K2201/09727

Abstract: A design rule for a printed wiring board is provided. A conductive layer and a pad are separate from each other in a distance defined by the design rule, which sufficiently prevents the capacitance coupling between the conductive layer and the pad.

Abstract translation: 提供印刷电路板的设计规则。 导电层和焊盘在由设计规则限定的距离内彼此分开，这足以防止导电层和焊盘之间的电容耦合。