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公开(公告)号：US20240040693A1
公开(公告)日：2024-02-01
申请号：US18269137
申请日：2021-12-10
Applicant: KYOCERA Corporation
Inventor： Atsuo KAWAGOE , Takashi ISHIOKA , Masanori NAITO , Nobuyuki UEDA
CPC classification number: H05K1/0298 , H05K1/115 , H03H1/00 , H05K2201/09609 , H05K2201/09836 , H03H2001/0085
Abstract: A printed wiring board includes a dielectric layer, a first and second conductor layer, and a plurality of via conductors. The dielectric layer has first and second opposing surfaces. The first and second conductor layer lie in the first second surfaces of the dielectric layer, respectively. Each via conductor extends through the dielectric layer and connects the first and second conductor layers to each other. Part of the printed wiring board is surrounded with the via conductors and is an overlap between the first conductor layer and the second conductor layer in a transparent plan view. When viewed in plan, the via conductors each have an aspect ratio greater than 1 and a major axis extending in a first direction and a minor axis extending in a second direction. The via conductors include a via conductor whose major axis extends and connects the via conductors arranged in a line.
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82.发明申请MULTILAYER WIRING SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND SUBSTRATE FOR PROBE CARD 有权多层布线基板及其制造方法及基板用于探针卡公开(公告)号：US20160044782A1
公开(公告)日：2016-02-11
申请号：US14919058
申请日：2015-10-21
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yoshihito Otsubo , Toru Meguro , Tatsunori Kan
CPC classification number: H05K1/09 , H01L21/4867 , H01L23/49822 , H01L2224/16225 , H01L2924/0002 , H01L2924/19105 , H05K1/0298 , H05K1/112 , H05K1/115 , H05K3/0058 , H05K3/3436 , H05K3/4038 , H05K3/4084 , H05K3/42 , H05K3/4629 , H05K3/4644 , H05K3/4667 , H05K2201/0376 , H05K2201/0382 , H05K2201/09545 , H05K2201/09627 , H05K2201/09836 , H05K2201/09845 , H05K2201/1006 , H05K2203/0278 , H05K2203/063 , H05K2203/068 , H05K2203/1126 , H01L2924/00
Abstract: A multilayer wiring substrate that can realize a higher-density wiring structure is obtained. Provided is a multilayer wiring substrate, where a multilayer body including a first insulating layer and a second insulating layer stacked on the bottom surface of the first insulating layer includes printed wiring electrodes; the printed wiring electrodes are formed by printing with and sintering conductive paste; the printed wiring electrodes respectively include first wiring electrode portions located on the second insulating layer and second wiring electrode portions respectively joined to first wiring electrode portions; and the second wiring electrode portions respectively extend into through holes and, further, are exposed at the top surface of the first insulating layer.
Abstract translation: 可以获得能够实现更高密度的布线结构的多层布线基板。 提供了一种多层布线基板，其中堆叠在第一绝缘层的底表面上的包括第一绝缘层和第二绝缘层的多层体包括印刷布线电极; 印刷布线电极通过印刷和烧结导电浆料形成; 印刷布线电极分别包括位于第二绝缘层上的第一布线电极部分和分别连接到第一布线电极部分的第二布线电极部分; 并且第二布线电极部分别分别延伸到通孔中，并且还暴露在第一绝缘层的顶表面处。
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公开(公告)号：US09155205B2
公开(公告)日：2015-10-06
申请号：US14134096
申请日：2013-12-19
Applicant: National Taipei University of Technology
Inventor： Chien-Yi Huang , Pin-Jou Liao
CPC classification number: H05K3/225 , H05K1/142 , H05K2201/09127 , H05K2201/0919 , H05K2201/09618 , H05K2201/09827 , H05K2201/09836 , H05K2203/175 , H05K2203/176 , Y10T29/4913
Abstract: An electronic device is disclosed. The electronic device includes at least an electronic element; and a circuit board having a base with at least a block, wherein the at least a block is used as a replaceable carrying portion for carrying the electronic element, and the electronic element is electrically connected to the circuit board. As such, when a defect occurs to the replaceable carrying portion, the replaceable carrying portion as well as the defective electronic element can be removed and replaced with good ones.
Abstract translation: 公开了一种电子设备。 电子设备至少包括电子元件; 以及具有至少具有块的基座的电路板，其中所述至少一个块用作用于承载所述电子元件的可替换的承载部分，并且所述电子元件电连接到所述电路板。 因此，当可替换的携带部分发生缺陷时，可以移除可替换的携带部分以及有缺陷的电子元件，并且更换好的。
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公开(公告)号：US09155196B2
公开(公告)日：2015-10-06
申请号：US14290193
申请日：2014-05-29
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko Morita
CPC classification number: H05K1/165 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01L2924/3511 , H05K1/0225 , H05K1/0366 , H05K1/116 , H05K3/244 , H05K3/4602 , H05K2201/0191 , H05K2201/0293 , H05K2201/0347 , H05K2201/0723 , H05K2201/0792 , H05K2201/09136 , H05K2201/09263 , H05K2201/09454 , H05K2201/09527 , H05K2201/096 , H05K2201/09672 , H05K2201/09836
Abstract: A wiring board includes a substrate having a laminated-inductor forming portion and including multiple first insulation layers and a second insulation layer formed on a first side of the first insulation layers such that the first insulation layers have the laminated-inductor forming portion, and a planar conductor formed on the second insulation layer of the substrate and formed to shield electromagnetic force generated from the laminated-inductor forming portion of the substrate. The laminated-inductor forming portion of the substrate has multiple inductor patterns formed on the first insulation layers and multiple via conductors connecting the inductor patterns through the first insulation layers, and the inductor patterns include an uppermost inductor pattern formed between the second insulation layer and the first insulation layers such that the uppermost inductor pattern has a distance of 100 μm or more from the planar conductor.
Abstract translation: 布线基板包括具有层叠电感器形成部分并且包括多个第一绝缘层的基板和形成在第一绝缘层的第一侧上的第二绝缘层，使得第一绝缘层具有层叠电感器形成部分，以及 形成在基板的第二绝缘层上并形成以屏蔽从基板的层叠电感器形成部分产生的电磁力的平面导体。 衬底的层叠电感器形成部分具有形成在第一绝缘层上的多个电感器图案和通过第一绝缘层连接电感器图案的多个通孔导体，并且电感器图案包括形成在第二绝缘层和 第一绝缘层，使得最上层的电感器图案与平面导体的距离为100μm以上。
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公开(公告)号：US20140353022A1
公开(公告)日：2014-12-04
申请号：US14290193
申请日：2014-05-29
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko MORITA
CPC classification number: H05K1/165 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01L2924/3511 , H05K1/0225 , H05K1/0366 , H05K1/116 , H05K3/244 , H05K3/4602 , H05K2201/0191 , H05K2201/0293 , H05K2201/0347 , H05K2201/0723 , H05K2201/0792 , H05K2201/09136 , H05K2201/09263 , H05K2201/09454 , H05K2201/09527 , H05K2201/096 , H05K2201/09672 , H05K2201/09836
Abstract: A wiring board includes a substrate having a laminated-inductor forming portion and including multiple first insulation layers and a second insulation layer formed on a first side of the first insulation layers such that the first insulation layers have the laminated-inductor forming portion, and a planar conductor formed on the second insulation layer of the substrate and formed to shield electromagnetic force generated from the laminated-inductor forming portion of the substrate. The laminated-inductor forming portion of the substrate has multiple inductor patterns formed on the first insulation layers and multiple via conductors connecting the inductor patterns through the first insulation layers, and the inductor patterns include an uppermost inductor pattern formed between the second insulation layer and the first insulation layers such that the uppermost inductor pattern has a distance of 100 μm or more from the planar conductor.
Abstract translation: 布线基板包括具有层叠电感器形成部分并且包括多个第一绝缘层的基板和形成在第一绝缘层的第一侧上的第二绝缘层，使得第一绝缘层具有层叠电感器形成部分，以及 形成在基板的第二绝缘层上并形成以屏蔽从基板的层叠电感器形成部分产生的电磁力的平面导体。 衬底的层叠电感器形成部分具有形成在第一绝缘层上的多个电感器图案和通过第一绝缘层连接电感器图案的多个通孔导体，并且电感器图案包括形成在第二绝缘层和 第一绝缘层，使得最上层的电感器图案与平面导体的距离为100μm以上。
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Patent Agency Ranking
公开(公告)号：US20140216794A1
公开(公告)日：2014-08-07
申请号：US14169314
申请日：2014-01-31
Applicant: IBIDEN CO., LTD.
Inventor： Toshiaki HIBINO
CPC classification number: H05K3/429 , H05K1/0366 , H05K1/0373 , H05K3/0032 , H05K3/0055 , H05K3/108 , H05K3/4602 , H05K2201/0209 , H05K2201/09536 , H05K2201/09827 , H05K2201/09836 , H05K2201/09854 , H05K2201/09863 , H05K2201/2072 , H05K2203/108 , H05K2203/1476
Abstract: A printed wiring board includes an insulating substrate having a penetrating hole formed through the substrate, a first conductive pattern formed on first surface of the substrate, a second conductive pattern formed on second surface of the substrate on the opposite side of the first surface, and a through-hole conductor formed in the penetrating hole in the substrate such that the conductor is connecting the first conductive pattern on the first surface of the substrate and the second conductive pattern on the second surface of the substrate. The penetrating hole has a first opening portion opening on the first surface of the substrate, a second opening portion opening on the second surface of the substrate and a third opening portion connecting the first and second opening portions, and the third opening portion has the maximum diameter which is greater than the minimum diameters of the first and second opening portions.
Abstract translation: 印刷布线板包括：绝缘基板，具有穿过该基板形成的贯通孔，形成在基板的第一面上的第一导体图案，形成在基板的与第一面相反一侧的第二面上的第二导电图案;以及 形成在所述基板的所述贯通孔中的通孔导体，使得所述导体将所述基板的第一表面上的所述第一导电图案与所述基板的所述第二表面上的所述第二导电图案连接。 所述贯通孔具有在所述基板的第一面上开口的第一开口部，在所述基板的第二面上开口的第二开口部，以及连接所述第一开口部和所述第二开口部的第三开口部， 其直径大于第一和第二开口部分的最小直径。
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公开(公告)号：US20140177177A1
公开(公告)日：2014-06-26
申请号：US14134096
申请日：2013-12-19
Applicant: National Taipei University of Technology
Inventor： Chien-Yi Huang , Pin-Jou Liao
CPC classification number: H05K3/225 , H05K1/142 , H05K2201/09127 , H05K2201/0919 , H05K2201/09618 , H05K2201/09827 , H05K2201/09836 , H05K2203/175 , H05K2203/176 , Y10T29/4913
Abstract: An electronic device is disclosed. The electronic device includes at least an electronic element; and a circuit board having a base with at least a block, wherein the at least a block is used as a replaceable carrying portion for carrying the electronic element, and the electronic element is electrically connected to the circuit board. As such, when a defect occurs to the replaceable carrying portion, the replaceable carrying portion as well as the defective electronic element can be removed and replaced with good ones.
Abstract translation: 公开了一种电子设备。 电子设备至少包括电子元件; 以及具有至少具有块的基座的电路板，其中所述至少一个块用作用于承载所述电子元件的可替换的承载部分，并且所述电子元件电连接到所述电路板。 因此，当可替换的携带部分发生缺陷时，可以移除可替换的携带部分以及有缺陷的电子元件，并且更换好的。
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公开(公告)号：US20140151107A1
公开(公告)日：2014-06-05
申请号：US13845325
申请日：2013-03-18
Applicant: UNIMICRON TECHNOLOGY CORP.
Inventor： CHENG-MING WENG , WEI-MING CHENG , HAN-PEI HUANG
CPC classification number: H05K1/115 , H05K3/0032 , H05K3/42 , H05K3/426 , H05K2201/09563 , H05K2201/09709 , H05K2201/09836 , H05K2201/09854 , H05K2203/1476 , H05K2203/1572 , Y10T29/49165
Abstract: A wiring board includes a substrate, a first conductor layer, a second conductor layer, and a through-via conductor. The substrate has a first surface, a second surface, and at least one through-via. The first conductor layer is formed on the first surface, and the second conductor layer is formed on the second surface. The through-via conductor is formed in the through-via for electrically connecting to the first conductor layer and the second conductor layer. The through-via has a first depressed portion exposed in the first surface, a second depressed portion exposed in the second surface, and a tunnel portion between the first depressed portion and the second depressed portion for connecting the first depressed portion and the second depressed portion. The first depressed portion and the second depressed, portion are non-coaxial.
Abstract translation: 布线基板包括基板，第一导体层，第二导体层和通孔导体。 衬底具有第一表面，第二表面和至少一个通孔。 第一导体层形成在第一表面上，第二导体层形成在第二表面上。 通孔导体形成在用于电连接到第一导体层和第二导体层的通孔中。 通孔具有暴露在第一表面中的第一凹陷部分，暴露在第二表面中的第二凹部，以及在第一凹陷部分和第二凹陷部分之间的用于连接第一凹陷部分和第二凹陷部分的隧道部分 。 第一凹陷部分和第二凹陷部分是非同轴的。
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公开(公告)号：US08536456B2
公开(公告)日：2013-09-17
申请号：US13156359
申请日：2011-06-09
Applicant: Yung-Chieh Chen , Shou-Kuo Hsu , Hsien-Chuan Liang , Shin-Ting Yen , Dan-Chen Wu
Inventor： Yung-Chieh Chen , Shou-Kuo Hsu , Hsien-Chuan Liang , Shin-Ting Yen , Dan-Chen Wu
IPC: H05K1/09
CPC classification number: H05K1/0251 , H05K1/0245 , H05K2201/09309 , H05K2201/09672 , H05K2201/09836
Abstract: A printed circuit board includes a first signal layer, a first reference layer, a second signal layer, and a third signal layer in that order and includes a first slanted via and a second slanted via. The first signal layer includes an parallel first transmission wire and a second transmission wire. The first and second transmission wires are coupled with each other and cooperatively constitute a first differential pair with an edge-coupled structure. The second signal layer includes a third transmission wire. The third signal layer includes a fourth transmission wire parallel to and coupled with the third transmission wire. The third and fourth transmission wires cooperatively constitute a second differential pair with a broadside-coupled structure. The first slanted via obliquely are interconnected between the first transmission wire and the third transmission wire. The second slanted via obliquely are interconnected between the second transmission wire and the fourth transmission wire.
Abstract translation: 印刷电路板依次包括第一信号层，第一参考层，第二信号层和第三信号层，并且包括第一倾斜通孔和第二倾斜通孔。 第一信号层包括并行的第一传输线和第二传输线。 第一和第二传输线彼此耦合并协同地构成具有边缘耦合结构的第一差分对。 第二信号层包括第三传输线。 第三信号层包括与第三传输线并联并与第三传输线耦合的第四传输线。 第三和第四传输线协作地构成具有宽侧耦合结构的第二差分对。 第一倾斜地倾斜地在第一传输线和第三传输线之间互连。 第二倾斜地倾斜地在第二传输线和第四传输线之间互连。
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90.发明申请WAVE SOLDERING OF SURFACE-MOUNTING ELECTRONIC DEVICES ON PRINTED CIRCUIT BOARD 有权表面安装电子设备在印刷电路板上的波纹焊接公开(公告)号：US20130126590A1
公开(公告)日：2013-05-23
申请号：US13655555
申请日：2012-10-19
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Concetto Privitera , Cristiano Gianluca Stella
IPC: B23K31/02
CPC classification number: H05K3/3468 , H05K1/0206 , H05K1/112 , H05K3/303 , H05K3/3431 , H05K2201/09836 , H05K2201/10166 , H05K2203/044 , Y02P70/613
Abstract: A system includes a device of the surface-mounting type having an insulating package provided with a mounting surface and a contact pin exposed on the mounting surface. The device is attached to an insulating board including a gluing surface and an opposite surface. The process for manufacturing the system includes forming through holes a contact region on the gluing surface. The mounting surface is glued to the gluing surface with the contact pin aligned with the contact region. Wave soldering is performed to electrically join the device to the board by hitting the opposite surface with a wave of soldering paste to form, by capillary action with the soldering paste ascending in the through holes up to the overflow on the gluing surface, a conductive contact electrically connecting the contact pin of the electronic device through a solder connection to the contact region of the electronic board.
Abstract translation: 一种系统包括表面安装型的装置，其具有设置有安装表面的绝缘封套和暴露在安装表面上的接触销。 该装置附接到包括胶合表面和相对表面的绝缘板。 制造该系统的方法包括在胶合表面上形成通孔的接触区域。 安装表面胶合到胶合表面，接触销与接触区域对准。 进行波峰焊接以通过用焊膏波撞击相对表面来将该装置电连接到板上，通过毛细作用形成通过在通孔中上升至焊接表面上的溢流的焊膏的导电接触 通过焊接连接将电子设备的接触针电连接到电子板的接触区域。
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