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    Floating optical carrier
    81.
    发明授权
    Floating optical carrier 有权
    浮动光载体

    公开(公告)号：US06853779B2

    公开(公告)日：2005-02-08

    申请号：US10060067

    申请日：2002-01-29

    Applicant: Kristofer Morzheim ,  Kelvin Chau

    Inventor： Kristofer Morzheim ,  Kelvin Chau

    IPC: G02B6/42 ,  G02B6/43 ,  H05K3/30 ,  H05K3/34 ,  G02B6/26

    CPC classification number: G02B6/43 ,  G02B6/422 ,  G02B6/4231 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10484 ,  Y02P70/613

    Abstract: An apparatus and method for aligning one or more optical fibers is disclosed. The apparatus includes a carrier having one or more through holes and one or more plugs, each of which is sized to be received in one or more of the three or more through holes. The carrier is adapted to receive one or more waveguides. The waveguides may be aligned by inserting a plug into each of one or more through holes in a carrier; attaching a waveguide to the carrier; aligning the carrier to align the one or more waveguides with respect to an optical device attached to a substrate; and tacking one or more of the plugs to the substrate to maintain the alignment of the waveguides with respect to the optical device.

    Abstract translation: 公开了一种用于对准一根或多根光纤的装置和方法。 该装置包括具有一个或多个通孔和一个或多个插头的载体，每个插头的尺寸被设计成容纳在三个或更多个通孔中的一个或多个中。 载体适于接收一个或多个波导。 波导可以通过将插头插入到载体中的一个或多个通孔中的每一个中而对准; 将波导附接到所述载体; 对准载体以使一个或多个波导相对于连接到基板的光学装置对准; 并且将一个或多个插头固定到基板以保持波导相对于光学装置的对准。

    Solder reserve transfer device and process
    83.
    发明申请
    Solder reserve transfer device and process 失效
    焊接储备转移装置及工艺

    公开(公告)号：US20040209495A1

    公开(公告)日：2004-10-21

    申请号：US10843972

    申请日：2004-05-13

    Applicant: Autosplice Systems Inc.

    Inventor： Craig M. Kennedy ,  Donald S. Eisenberg

    IPC: H01R012/00

    CPC classification number: H01R43/0235 ,  H01R4/028 ,  H01R12/52 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/10303 ,  H05K2203/042

    Abstract: A solder transfer method which uses an electrically-conductive, e.g., metal, surface, of a stamping or pin or pad as a vehicle to transfer molten solder from a remote solder reserve to a solder joint to be made. In on of the preferred embodiments, a solder deposit previously formed on a surface mount pad during a first reflow step will transfer up to the adjoining contact surfaces by a wicking process to provide the additional solder needed to fabricate a robust solder joint. The method and construction are useful for attaching a daughter board to motherboard, and for surface mounting a long header with multiple pins to the contact surfaces of a PCB without the need to separately add solder during a second reflow step to make a robust solder joint between the contact surfaces.

    Abstract translation: 使用冲压或引脚或焊盘的导电的例如金属表面作为车辆的焊接转移方法将熔融焊料从远程焊料储存器转移到待制造的焊点。 在优选实施例中，在第一回流步骤期间预先形成在表面安装焊盘上的焊料沉积物将通过芯吸工艺传递到相邻的接触表面，以提供制造坚固的焊接接头所需的附加焊料。 该方法和结构对于将子板附接到主板是有用的，并且用于将具有多个引脚的长插头表面安装到PCB的接触表面，而不需要在第二回流步骤期间单独添加焊料，以在第二回流步骤之间形成牢固的焊接接头 接触面。

    Solder reserve transfer device and process
    84.
    发明授权
    Solder reserve transfer device and process 失效
    焊接储备转移装置及工艺

    公开(公告)号：US06780028B1

    公开(公告)日：2004-08-24

    申请号：US10310215

    申请日：2002-12-06

    Applicant: Craig M. Kennedy ,  Donald S. Eisenberg

    Inventor： Craig M. Kennedy ,  Donald S. Eisenberg

    IPC: H01R1200

    CPC classification number: H01R43/0235 ,  H01R4/028 ,  H01R12/52 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/10303 ,  H05K2203/042

    Abstract: A solder transfer method which uses an electrically-conductive, e.g., metal, surface, of a stamping or pin or pad as a vehicle to transfer molten solder from a remote solder reserve to a solder joint to be made. In a preferred embodiment, a solder deposit previously-formed on a surface mount pad during a first reflow step will transfer up to the adjoining contact surfaces by a wicking process to provide the additional solder needed to fabricate a robust solderjoint. When one of the contact surfaces is a contact or pin on a first PCB, and the other contact surface is a SMT pad on a second PCB serving, for example, as a memory card, the process of the invention makes for an easy SMT processed attachment of the memory card to the first PCB without the need to add solder during a second reflow step to make a robust solder joint between the contact surfaces.

    Abstract translation: 使用冲压或引脚或焊盘的导电的例如金属表面作为车辆的焊接转移方法将熔融焊料从远程焊料储存器转移到待制造的焊点。 在优选实施例中，在第一回流步骤期间预先形成在表面安装焊盘上的焊料沉积物将通过芯吸工艺传递到相邻的接触表面，以提供制造坚固的焊接点所需的附加焊料。 当其中一个接触表面是第一PCB上的触点或引脚，另一个接触表面是第二个PCB上的SMT焊盘，例如作为存储卡时，本发明的工艺使得SMT处理容易 将存储卡连接到第一PCB，而不需要在第二回流步骤期间添加焊料以在接触表面之间形成坚固的焊接接头。

    Circuit board assembly which utilizes a pin assembly and techniques for making the same
    85.
    发明授权
    Circuit board assembly which utilizes a pin assembly and techniques for making the same 有权
    采用针组件的电路板组件及其制造技术

    公开(公告)号：US06773269B1

    公开(公告)日：2004-08-10

    申请号：US10259053

    申请日：2002-09-27

    Applicant: Stuart D. Downes

    Inventor： Stuart D. Downes

    IPC: H01R1200

    CPC classification number: H01R12/523 ,  H01R43/0256 ,  H01R43/0263 ,  H05K3/3447 ,  H05K3/368 ,  H05K13/028 ,  H05K2201/10303 ,  H05K2201/10424

    Abstract: A pin assembly is configured to interconnect a first circuit board and a second circuit board. The pin assembly includes a set of pins. Each pin of the set of pins has a first end, a second end, and a mid-portion. The pin assembly further includes a frame which contacts the mid-portion of each pin of the set of pins to position the pins such that (i) the first ends of the pins simultaneously register into respective holes of the first circuit board when the pin assembly engages with the first circuit board, and (ii) the second ends of the pins simultaneously register into respective holes of the second circuit board when the pin assembly engages with the second circuit board.

    Abstract translation: 销组件被配置为互连第一电路板和第二电路板。 销组件包括一组销。 该组销的每个销具有第一端，第二端和中间部分。 销组件还包括框架，该框架接触该组销的每个销的中间部分以定位销，使得（i）当销组件（1）的销组件中时，销的第一端部同时登记到第一电路板的相应孔中 与第一电路板接合，并且（ii）当销组件与第二电路板接合时，引脚的第二端同时寄存在第二电路板的相应孔中。

    Circuit board inter-connection system and method
    86.
    发明申请
    Circuit board inter-connection system and method 失效
    电路板互连系统及方法

    公开(公告)号：US20040092174A1

    公开(公告)日：2004-05-13

    申请号：US10666945

    申请日：2003-09-19

    Inventor： Daniel S. Eichorn ,  Michael W. Allender ,  Dominic Anthony Messuri ,  Christopher Alan Brandon

    IPC: H01R004/02

    CPC classification number: H01R12/58 ,  H01R12/523 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10568 ,  H05K2201/2036 ,  Y10T29/49147

    Abstract: An electrical inter-connection is provided such that a terminal pin which is positioned in a pin block extends through a plated through-hole in a circuit board substrate and is connected with the circuit board using a conductive bonding agent such as solder. The terminal pin is capable of inter-connection with conductive elements located on each major side of the circuit board and eliminates the need for an interference fit between the terminal pin and circuit board. The pin block includes a body and at least one stand-off. The stand-off maintains the body a sufficient distance from the circuit board substrate to enable a solder fillet to form between the plated through-hole and the terminal pin during re-flow processing. The electrical inter-connection further includes an eccentric aperture in the circuit board suitable for interference fit inter-connection with a protruding cylindrical feature such as on an electrical ground that has poor solderability characteristics. The preferred embodiment limits normal forces caused by temperature cycling, vibration, and other conditions to two areas of contact yet enables adequately low electrical contact resistance.

    Abstract translation: 提供电连接，使得定位在销块中的端子销延伸穿过电路板基板中的电镀通孔，并且使用诸如焊料的导电粘合剂与电路板连接。 端子引脚能够与位于电路板的每个主要侧面上的导电元件相互连接，并且不需要端子引脚和电路板之间的过盈配合。 销块包括主体和至少一个支架。 支架将主体与电路板基板保持足够的距离，以便在再流动处理期间能够在电镀通孔和端子销之间形成焊锡圆角。 电气互连还包括电路板中的偏心孔，其适于与诸如在具有差的可焊性特性的电气接地上的突出圆柱形特征相互连接的过盈配合。 优选的实施例将由温度循环，振动和其他条件引起的正常力限制到两个接触区域，但是能够实现足够低的电接触电阻。

    Floating optical carrier
    88.
    发明申请
    Floating optical carrier 有权
    浮动光载体

    公开(公告)号：US20020159707A1

    公开(公告)日：2002-10-31

    申请号：US10060067

    申请日：2002-01-29

    Applicant: Onix Microsystems, Inc.

    Inventor： Kristofer Mortzheim ,  Kelvin Chau

    IPC: G02B006/26

    CPC classification number: G02B6/43 ,  G02B6/422 ,  G02B6/4231 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10484 ,  Y02P70/613

    Abstract: An apparatus and method for aligning one or more optical fibers is disclosed. The apparatus includes a carrier having one or more through holes and one or more plugs, each of which is sized to be received in one or more of the three or more through holes. The carrier is adapted to receive one or more waveguides. The waveguides may be aligned by inserting a plug into each of one or more through holes in a carrier; attaching a waveguide to the carrier; aligning the carrier to align the one or more waveguides with respect to an optical device attached to a substrate; and tacking one or more of the plugs to the substrate to maintain the alignment of the waveguides with respect to the optical device.

    Abstract translation: 公开了一种用于对准一根或多根光纤的装置和方法。 该装置包括具有一个或多个通孔和一个或多个插头的载体，每个插头的尺寸被设计成容纳在三个或更多个通孔中的一个或多个中。 载体适于接收一个或多个波导。 波导可以通过将插头插入到载体中的一个或多个通孔中的每一个中而对准; 将波导附接到所述载体; 对准载体以使一个或多个波导相对于连接到基板的光学装置对准; 并且将一个或多个插头固定到基板以保持波导相对于光学装置的对准。

    Wiring unit
    89.
    发明授权
    Wiring unit 失效
    接线单元

    公开(公告)号：US06465748B2

    公开(公告)日：2002-10-15

    申请号：US09887093

    申请日：2001-06-25

    Applicant: Makoto Yamanashi ,  Takao Murakami ,  Hiroyuki Suzuki

    Inventor： Makoto Yamanashi ,  Takao Murakami ,  Hiroyuki Suzuki

    IPC: H01R1204

    CPC classification number: H01R12/774 ,  H01R12/523 ,  H01R12/613 ,  H01R12/78 ,  H05K3/368 ,  H05K2201/10303 ,  H05K2201/10333 ,  H05K2201/10962

    Abstract: A wiring unit 1 with a plurality of printed circuit boards 2 which are successively stacked and pin units 3. The printed circuit boards 2 each has a conductor pattern 7 formed on the surface 6a of an insulating plate 6. The conductor pattern 7 is composed of a first plurality of belt-like conductors 11 and a second plurality of belt-like conductors 12. Through-holes 13 are formed at points 14 where the belt-like conductors 11 and 12 cross each other. The pin units 21 each is composed of a conductive pin 20 and a C-bush 21. The C-bush 21 is provided with a pair of spring segment segments 24. The C-bush 21 is press-fit into the through-hole 13 to sandwich the printed circuit board 2 between the pair of spring segments 24. The C-bush 21 is communicated with the conductor pattern 7. The pin 20 is inserted into the through-hole 13 into which the C-bush 21 is press-fit. The conductive pin 20 is communicated with the C-bush 21. In this configuration, the wiring unit can be minimized in production cost and size.

    Abstract translation: 具有连续堆叠的多个印刷电路板2的布线单元1和针单元3.印刷电路板2各自具有形成在绝缘板6的表面6a上的导体图案7.导体图案7由 第一多个带状导体11和第二多个带状导体12.在带状导体11和12彼此交叉的点14处形成通孔13。 销单元21各自由导电销20和C形衬套21构成.C-衬套21设置有一对弹簧段段24.将C形衬套21压配合到通孔13中 将印刷电路板2夹在该对弹簧片24之间.C-衬套21与导体图形7连通。销20被插入通孔13中，C衬套21被压入其中 。 导电销20与C型衬套21连通。在这种结构中，布线单元的生产成本和尺寸可以最小化。

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