公开(公告)号：US3076164A

公开(公告)日：1963-01-29

申请号：US74183258

申请日：1958-06-13

Applicant: AMP INC

Inventor： ROBERT ULLMAN ,  KINKAID ROBERT J

IPC: H01R12/58 ,  H05K3/34 ,  H05K3/40

CPC classification number: H01R12/58 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/4046 ,  H05K2201/10401 ,  H05K2201/1081 ,  H05K2201/10916

公开(公告)号：US2894240A

公开(公告)日：1959-07-07

申请号：US55496055

申请日：1955-12-23

Applicant: MAUTNER ROBERT S

Inventor： MAUTNER ROBERT S

IPC: H01G9/00 ,  H01R12/55 ,  H01R13/11 ,  H01R13/115 ,  H01R33/76 ,  H05K3/34 ,  H05K3/40

CPC classification number: H01R13/111 ,  H01R12/718 ,  H05K3/3447 ,  H05K3/4046 ,  H05K2201/10401

公开(公告)号：US2470618A

公开(公告)日：1949-05-17

申请号：US65730346

申请日：1946-03-26

Applicant: HOLDEN LAWRENCE T

Inventor： HOLDEN LAWRENCE T

IPC: H01R12/18 ,  H01R35/02 ,  H05K1/14

CPC classification number: H01R35/02 ,  H05K1/148 ,  H05K2201/097 ,  H05K2201/1028 ,  H05K2201/10401 ,  H05K2201/10757 ,  H05K2203/1572 ,  Y10T24/45885 ,  Y10T24/45958 ,  Y10T403/60

公开(公告)号：US1892146A

公开(公告)日：1932-12-27

申请号：US39282729

申请日：1929-09-16

Applicant: HARSHBERGER NORMAN P

Inventor： HARSHBERGER NORMAN P

IPC: H05K3/10 ,  H05K3/46

CPC classification number: H05K3/103 ,  H05K3/4611 ,  H05K2201/10287 ,  H05K2201/10401 ,  H05K2203/063 ,  Y10T29/49142

公开(公告)号：US20240090801A1

公开(公告)日：2024-03-21

申请号：US18374887

申请日：2023-09-29

Applicant: ABBOTT DIABETES CARE INC.

Inventor： Mohammad E. Moein ,  Louis G. Pace ,  Udo Hoss ,  Phu X. Le ,  Samuel Mason Curry

IPC: A61B5/1486 ,  A61B5/00 ,  A61B5/145 ,  A61B5/1468 ,  A61B5/1473 ,  H05K3/32

CPC classification number: A61B5/1486 ,  A61B5/14532 ,  A61B5/14546 ,  A61B5/1468 ,  A61B5/1473 ,  A61B5/4839 ,  A61B5/6848 ,  H05K3/325 ,  A61B2562/227 ,  H01L24/72 ,  H01L2924/07811 ,  H01L2924/12042 ,  H05K2201/10401 ,  Y10T29/4913

Abstract: Glucose monitoring devices and related systems and methods, the glucose monitoring devices including a sensor electronics unit having a housing and a printed circuit board disposed within the housing, a transcutaneous glucose sensor assembly, and a conductive sensor connector. The printed circuit board includes a first electrical contact, the transcutaneous glucose sensor assembly includes a distal portion having a working electrode and proximal portion having a working-electrode contact in electrical communication with the working electrode, and the conductive sensor connector electrically connects the working-electrode contact with the first electrical contact. Further, the conductive sensor connector extends through a hole in the proximal portion of the transcutaneous glucose sensor assembly and through a hole in the printed circuit board.

公开(公告)号：US20180249767A1

公开(公告)日：2018-09-06

申请号：US15966912

申请日：2018-04-30

Applicant: OMsignal Inc.

Inventor： Aldjia BEGRICHE ,  Payam LAZEMI ,  Maria Elina NURKKA ,  Thierry DUMONT ,  Pascal FORTIER- POISSON

IPC: A41D1/00 ,  A41C3/00 ,  A63B24/00 ,  A41F15/00 ,  D02G3/44 ,  B32B5/02 ,  B32B27/12 ,  B32B5/26 ,  B32B27/40 ,  A61B5/0408 ,  A61B5/0492 ,  A61B5/00 ,  H05K1/03 ,  H05K1/02

CPC classification number: A41D1/005 ,  A41C3/0057 ,  A41D13/1281 ,  A41F15/002 ,  A61B5/0408 ,  A61B5/04085 ,  A61B5/0492 ,  A61B5/6804 ,  A61B2562/0209 ,  A61B2562/043 ,  A61B2562/125 ,  A61B2562/166 ,  A61B2562/227 ,  A63B24/0062 ,  A63B2230/04 ,  A63B2230/06 ,  A63B2230/42 ,  A63B2230/60 ,  B32B5/02 ,  B32B5/26 ,  B32B27/12 ,  B32B27/40 ,  B32B2307/202 ,  B32B2437/00 ,  B32B2457/00 ,  D02G3/441 ,  D10B2501/02 ,  H05K1/0283 ,  H05K1/038 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/10287 ,  H05K2201/10401

Abstract: Embodiments described herein relate generally to wearable electronic biosensing garments. In some embodiments, an apparatus comprises a biosensing garment and a plurality of electrical connectors that are mechanically fastened to the biosensing garment. A plurality of printed electrodes is disposed on the biosensing garment, each being electrically coupled, via a corresponding conductive pathway, to a corresponding one of the plurality of electrical connectors. The apparatus can further include an elongate member including a conductive member that is coupled to a plurality of elastic members in a curved pattern and that is configured to change from a first configuration to a second configuration as the elongate member stretches. The change from the first configuration to the second configuration can result in a change of inductance of the conductive member.

公开(公告)号：US10057982B2

公开(公告)日：2018-08-21

申请号：US15399924

申请日：2017-01-06

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Fraser I. MacIntosh

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0286 ,  H05K1/0287 ,  H05K1/0293 ,  H05K1/115 ,  H05K3/326 ,  H05K3/4046 ,  H05K2201/10053 ,  H05K2201/10303 ,  H05K2201/10363 ,  H05K2201/10401

Abstract: Embodiments of the invention provide a solderless breadboard for prototyping electrical circuits. The breadboard includes a plurality of electrically conductive lines arranged parallel to each other on an electrically non-conductive breadboard structure. An electrically conductive line includes a plurality of electrical insertion positions and at an electrical insertion position a moveable electrically conductive line section which is operable for breaking the electrically conductive line in moving from a closed to an open position. A plurality of pegs are inserted into the breadboard structure at electrical insertion positions to contact the moveable sections. A peg is rotatable after insertion and includes a head portion and a cylindrical shaft extending from the head portion to a terminating foot. The shaft includes a centrally arranged channel extending from an opening in the head portion towards the terminating foot.

公开(公告)号：US20180042111A1

公开(公告)日：2018-02-08

申请号：US15231438

申请日：2016-08-08

Applicant: BAKER HUGHES INCORPORATED

Inventor： Rocco DIFOGGIO ,  Otto N. FANINI ,  Paul G. CAIRNS ,  Brian D. BREAUX ,  Benjamin TODD

IPC: H05K1/18 ,  G01V3/18 ,  E21B49/00 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/181 ,  B23K1/0056 ,  B23K26/18 ,  B33Y10/00 ,  E21B47/011 ,  E21B49/00 ,  G01V3/18 ,  H05K1/113 ,  H05K3/325 ,  H05K3/341 ,  H05K2201/10151 ,  H05K2201/10257 ,  H05K2201/10295 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2201/10628 ,  H05K2203/107

Abstract: Methods, systems, devices, and products for manufacturing an electrical assembly, such as a completed downhole circuit board, for use in well logging. Methods include attaching an electrical component to a printed circuit board by mechanically fastening the electrical component to the printed circuit board. Methods may include using a laser to attach a plurality of legs to contact surfaces. Methods may include applying light from the laser to a material of the printed circuit board to produce heat, including mitigating reflection of the light from the material. Methods include forming a connection between a first electrical component of the electrical assembly and a second electrical component of the electrical assembly by causing heating of an additive manufacturing material by applying light from a laser. The connection may be at least one of: i) an electrical connection; ii) a structural connection; iii) an electrical insulation.

公开(公告)号：US20170244182A1

公开(公告)日：2017-08-24

申请号：US14436681

申请日：2014-11-13

Applicant: LEUKERT GMBH

Inventor： Matthias Müller ,  Rudi Heinz Kolb

IPC: H01R12/52 ,  H05K1/14 ,  H05K1/02 ,  H01R13/11

CPC classification number: H01R12/523 ,  H01R13/111 ,  H05K1/0263 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/10303 ,  H05K2201/10401

Abstract: A power contacting device includes a contact pin (1) and at least one contact pin receptacle (2) penetrated by the contact pin in the operating state. To provide a power contact which permanently ensures high-quality contacting, even when the contacted components move relative to one another, the contact pin receptacle (2) has a first guide arrangement (3) which is fixed to a component in the operating state and a second guide arrangement (4) which is conductively connected to the first guide arrangement, the second guide arrangement (4) being arranged displaceably on the first guide arrangement (3) and the contact pin (1) conductively contacting at least the second guide arrangement (4) in the operating state.

公开(公告)号：US20150338082A1

公开(公告)日：2015-11-26

申请号：US14284599

申请日：2014-05-22

Applicant: Wen-Sung Hu

Inventor： Wen-Sung Hu

IPC: F21V29/50 ,  F21K99/00 ,  F21V19/00

CPC classification number: F21V29/50 ,  F21K9/23 ,  F21V19/005 ,  F21V19/0055 ,  F21V29/74 ,  F21Y2101/00 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/0061 ,  H05K2201/042 ,  H05K2201/10106 ,  H05K2201/10401 ,  H05K2201/10409

Abstract: A heat dissipation structure of an SMD LED includes a substrate, an SMD LED and at least one engaging member. A plurality of conductive copper foils is covered on an upper end face of the substrate. Two electrodes are provided on a lower surface of the SMD LED and are respectively connected to two copper foils on the upper end face. An engaging hole extends through one of the copper foils adjacent the SMD LED and through the substrate. The engaging member is made of high thermal conductive metal and is engaged in the engaging hole to combine the copper foil and the substrate. Accordingly, heat generated by the SMD LED can be directly transferred to an exposed lower end face of the substrate through the engaging member for more heat dissipation and less luminance decrease of the SMD LED.

Abstract translation: SMD LED的散热结构包括衬底，SMD LED和至少一个接合构件。 多个导电铜箔被覆盖在基板的上端面上。 两个电极设置在SMD LED的下表面上，分别连接在上端面上的两个铜箔上。 接合孔延伸穿过与SMD LED相邻的铜箔中的一个并穿过衬底。 接合构件由高导热金属制成，并且接合在接合孔中以组合铜箔和基底。 因此，SMD LED产生的热量可以通过接合部件直接传递到基板的露出的下端面，从而具有更多的散热和更少的SMD LED的亮度降低。