公开(公告)号：US20050020108A1

公开(公告)日：2005-01-27

申请号：US10627268

申请日：2003-07-24

Applicant: Ted Ju

Inventor： Ted Ju

IPC: H01R4/02 ,  H01R12/00 ,  H05K3/34

CPC classification number: H01R4/028 ,  H05K3/3426 ,  H05K2201/10189 ,  H05K2201/1084 ,  H05K2203/046 ,  Y02P70/613

Abstract: An electrical connector is bonded to a circuit board by solder materials. The solder materials are well arranged so that no short circuits occur. The electrical connector can be applied in a wide range of uses with high yield and reduced cost. The electrical connector has an insulator having a plurality of terminals and a solder material therein. The electrical connector is characterized by the insulator being provided with a plurality of overflow holes in a direction along which the insulator and terminals apply pressure to the solder material.

Abstract translation: 电连接器通过焊料粘合到电路板上。 焊料材料布置良好，不会发生短路。 电连接器可以广泛应用于高产量和低成本。 电连接器具有绝缘体，其中具有多个端子和焊料材料。 电连接器的特征在于绝缘体沿着绝缘体和端子对焊料材料施加压力的方向上设置有多个溢流孔。

公开(公告)号：US06843662B2

公开(公告)日：2005-01-18

申请号：US10401884

申请日：2003-03-31

Applicant: Ted Ju

Inventor： Ted Ju

IPC: H01R12/04 ,  H01R43/02 ,  H05K3/34 ,  H01R12/00 ,  H05K1/00

CPC classification number: H05K3/3426 ,  H01R43/0256 ,  H01R43/0263 ,  H05K3/3436 ,  H05K2201/1084 ,  H05K2201/10984 ,  H05K2203/041 ,  Y02P70/613

Abstract: An electric connector is disclosed to include an electrically insulative housing, the housing having a plurality of terminal slots and a protruded block in each terminal slot near the bottom side, a plurality of U-shaped terminals respectively mounted in the terminal slots in the housing, each terminal having two bonding ends held between two opposite lateral sidewalls of the corresponding terminal slot and two sides of the corresponding protruded block, and a plurality of solder balls located on the bottom side of the housing and supported on the protruded block in each terminal slot and clamped between the bonding ends of each terminal.

Abstract translation: 公开了一种电连接器，其包括电绝缘壳体，所述壳体具有多个端子槽和在底侧附近的每个端子槽中的突出块，分别安装在壳体中的端子槽中的多个U形端子， 每个端子具有两个接合端部，其保持在相应的端子槽的两个相对的侧向侧壁和相应的突出块的两侧之间，以及多个焊球，位于壳体的底侧并且支撑在每个端子槽中的突出块上 并夹在每个端子的接合端之间。

公开(公告)号：US20050003582A1

公开(公告)日：2005-01-06

申请号：US10490980

申请日：2002-09-27

Applicant: Masayuki Sakakibara ,  Masaru Morishita

Inventor： Masayuki Sakakibara ,  Masaru Morishita

IPC: H01L21/56 ,  H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H05K3/34 ,  H01L21/44 ,  H01L21/50

CPC classification number: H05K3/3426 ,  H01L21/4853 ,  H01L21/4867 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/49582 ,  H01L23/49805 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H05K2201/0347 ,  H05K2201/10689 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Cut faces 15a to 15h are formed on the front end faces 13a to 13h of the exposed portions 12a to 12h of respective lead terminals 11a to 11h of a semiconductor device 100, and plating for increasing the solderability is provided on the cut faces 15a to 15h.

Abstract translation: 在半导体装置100的各引线端子11a〜11h的露出部12a〜12h的前端面13a〜13h上形成有切割面15a〜15h，在切断面15a〜15h上设置用于提高可焊性的电镀 。

公开(公告)号：US06837755B1

公开(公告)日：2005-01-04

申请号：US10685401

申请日：2003-10-16

Applicant: Yoshikazu Kitajima ,  Iwao Nishimura ,  Koji Ito

Inventor： Yoshikazu Kitajima ,  Iwao Nishimura ,  Koji Ito

IPC: H01H85/20 ,  H01R4/48 ,  H01R43/20 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01R43/205 ,  H01H85/202 ,  H01H2085/2085 ,  H01R4/4809 ,  H05K3/301 ,  H05K3/341 ,  H05K2201/10181 ,  H05K2201/1031 ,  H05K2201/10583 ,  H05K2201/1084 ,  Y02P70/611

Abstract: A fuse holder component includes a bottom plate fixed to a printed board, and first and second side plates whose main body portions individually extend from side edges of the bottom plate. The second side plate includes a suction portion extending through an extension portion from the main body portion and provided with a suction surface to which a suction nozzle of a mounter is accessible. A pair of fuse holder components, surface-mounted on the printed board by using the mounter, constitute a fuse holder that stably holds a glass-tube fuse.

Abstract translation: 保险丝保持器部件包括固定到印刷电路板的底板，以及主体部分分别从底板的侧边缘延伸的第一和第二侧板。 第二侧板包括从主体部分延伸穿过延伸部分并且设置有吸附表面的抽吸部分，安装器的吸嘴可到达吸入表面。 通过使用安装器表面安装在印刷电路板上的一对保险丝座组件构成了可以稳定地保持玻璃管保险丝的保险丝座。

公开(公告)号：US06739044B2

公开(公告)日：2004-05-25

申请号：US10197395

申请日：2002-07-16

Applicant: John W. Abouchar

Inventor： John W. Abouchar

IPC: H05K330

CPC classification number: C23C2/08 ,  B23K1/08 ,  B23K3/0646 ,  B23K35/224 ,  B23K35/262 ,  B23K2101/38 ,  B23K2103/14 ,  C23C2/02 ,  H05K3/3452 ,  H05K3/3468 ,  H05K2201/10287 ,  H05K2201/10818 ,  H05K2201/1084 ,  H05K2201/2081 ,  Y10T29/49139

Abstract: A method of tinning one or more electrical terminals by hot solder dipping is disclosed herein. The process generally involves placing a solder resistant material in a through hole formed in an electrical terminal, and then dipping at least a portion of the terminal into a hot solder. The solder resistant material may include, for example, a titanium or stainless steel wire, and the solder may be a tin-lead solder such as Sn63.

公开(公告)号：US20030123233A1

公开(公告)日：2003-07-03

申请号：US10037705

申请日：2001-12-29

Inventor： Ryan Yeh

IPC: H05K005/00 ,  H05K005/04 ,  H05K005/06

CPC classification number: H05K3/303 ,  H01R43/0256 ,  H01R43/0263 ,  H05K3/3426 ,  H05K2201/1031 ,  H05K2201/10424 ,  H05K2201/1084 ,  Y02P70/611 ,  Y02P70/613

Abstract: A locating means assembly (100) includes a housing (1) and a plurality of terminals (2). The housing has a plurality of side walls (14) and defines a plurality of passageways (13) therein. A pair of ribs (12) protrude inwardly from lower portions of two side walls in each passageway and define a pair of grooves (11). Each terminal has a planar soldering portion (21), and a pair of fins (211) extending and bending upwardly from two lateral sides of the soldering portion, respectively. The terminal is received in the housing, the pair of fins elastically engaging in the two grooves, respectively. After the housing with the terminal is picked up and placed on a printed circuit board (PCB), the terminal is soldered to the PCB, and then the housing is removed.

Abstract translation: 定位装置组件（100）包括壳体（1）和多个端子（2）。 壳体具有多个侧壁（14）并且在其中限定多个通道（13）。 一对肋（12）从每个通道中的两个侧壁的下部向内突出并限定一对凹槽（11）。 每个端子具有平面焊接部分（21）和分别从焊接部分的两个侧面向上延伸和弯曲的一对翅片（211）。 端子容纳在壳体中，一对翅片分别弹性地接合在两个凹槽中。 将带有端子的外壳拿起并放置在印刷电路板（PCB）上后，将端子焊接到PCB上，然后拆下外壳。

公开(公告)号：US06490173B2

公开(公告)日：2002-12-03

申请号：US09740115

申请日：2000-12-19

Applicant: Russell Wayne Perkins ,  Mark Alan Yoder ,  Christopher Day States ,  Theodore Paul Corbin

Inventor： Russell Wayne Perkins ,  Mark Alan Yoder ,  Christopher Day States ,  Theodore Paul Corbin

IPC: H05K900

CPC classification number: H05K9/0028 ,  H05K1/0201 ,  H05K3/3447 ,  H05K2201/062 ,  H05K2201/10371 ,  H05K2201/1084 ,  H05K2201/10848 ,  Y10S174/34

Abstract: An apparatus and method for shielding electrical components mounted on a printed circuit board (PCB) from electromagnetic and radio frequency interference by reducing the dissipation of heat away from solder joints. In an embodiment of the invention a radio frequency (RF) shield for a printed circuit board comprises a shield for RF shielding a portion of the PCB having electronic components mounted thereon. The shield has a first portion and a second portion, wherein the first portion has a reduced cross sectional area, for reducing heat conduction between the first and the second portion when the first portion of the shield is inserted into a first plurality of holes in the PCB, for soldering the first portion of the shield to a copper foil of the PCB.

公开(公告)号：US06401332B1

公开(公告)日：2002-06-11

申请号：US09374971

申请日：1999-08-16

Applicant: Antonio Canova

Inventor： Antonio Canova

IPC: H05K334

CPC classification number: H05K3/305 ,  H05K1/0263 ,  H05K3/341 ,  H05K3/3452 ,  H05K2201/099 ,  H05K2201/10272 ,  H05K2201/1028 ,  H05K2201/1084 ,  H05K2203/0588 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53178

Abstract: There is described a process for producing printed circuits comprising a laminar support, an electrically conductive track on the laminar support, and an auxiliary conductive element soldered to the conductive track. There is a provision to apply the auxiliary conductive element by means of an apparatus for applying SMD components.

Abstract translation: 描述了一种用于生产印刷电路的方法，该印刷电路包括层状载体，层状载体上的导电轨道和焊接到导电轨道的辅助导电元件。 通过用于施加SMD部件的装置来施加辅助导电元件。

公开(公告)号：US20010041370A1

公开(公告)日：2001-11-15

申请号：US09430559

申请日：1999-10-29

Inventor： MIKE BROOKS ,  WALTER L. MODEN

IPC: H01L021/00

CPC classification number: H01L23/36 ,  H01L23/4334 ,  H01L2924/0002 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H05K3/341 ,  H05K2201/10689 ,  H05K2201/1078 ,  H05K2201/1084 ,  H05K2201/10969 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: A semiconductor package and method for fabricating the package are provided. The package includes a semiconductor die and a heat sink in thermal communication with the die. The heat sink includes one or more pad structures adapted to form bonded connections, and thermal paths to contacts on a substrate. The method includes forming multiple heat sinks on a frame similar to a lead frame, and etching or stamping the pad structures on the heat sink. The frame can then be attached to a leadframe containing encapsulated dice, and the assembly singulated to form separate packages. The packages can be used to form electronic assemblies such as circuit board assemblies and multi chip modules.

Abstract translation: 提供一种用于制造封装的半导体封装和方法。 封装包括半导体管芯和与管芯热连通的散热器。 散热器包括适于形成接合连接的一个或多个焊盘结构，以及衬底上的触点的热路径。 该方法包括在类似于引线框架的框架上形成多个散热器，以及蚀刻或冲压散热器上的焊盘结构。 然后可以将该框架连接到包含封装的骰子的引线框架上，并且该组件被单个化以形成单独的封装。 这些封装可用于形成诸如电路板组件和多芯片模块之类的电子组件。

公开(公告)号：US6165819A

公开(公告)日：2000-12-26

申请号：US206151

申请日：1998-12-07

Applicant: Masaaki Seki ,  Katsuhiro Hayashida ,  Mitsutaka Sato ,  Toshio Hamano

Inventor： Masaaki Seki ,  Katsuhiro Hayashida ,  Mitsutaka Sato ,  Toshio Hamano

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H05K3/34 ,  H01L21/44

CPC classification number: H01L23/49551 ,  H01L21/4835 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/49537 ,  H01L23/49548 ,  H01L23/49555 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06135 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/3511 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A method of producing a semiconductor device includes a device body producing step, electrically coupling leads and a semiconductor chip, and producing a device body by encapsulating the semiconductor chip by a resin package so that portions of the leads are exposed from the resin package, a honing step, carrying out a honing process using a polishing solution at least with respect to a resin flash adhered on the portions of the leads exposed from the resin package, an etching step, removing an unwanted stacked layer structure formed on the leads by carrying out an etching process after the honing step, and a plating step, carrying out a plating process with respect to the leads after the etching step to form a plated layer made of a soft bonding material. The honing step removes a portion of the unwanted stacked layer structure in addition to the resin flash.