公开(公告)号：US20200320724A1

公开(公告)日：2020-10-08

申请号：US16848623

申请日：2020-04-14

Applicant: APPLEJACK 199 L.P.

Inventor： Wojciech J WALECKI ,  Wei-Chun HUNG

IPC: G06T7/40 ,  G01B11/00 ,  G01B11/30 ,  G01B11/16

Abstract: The present subject matter at-least provides a system for measurement of topography of specular surfaces. The system comprises a set of indexed light-sources and a controller configured to drive the set of light-sources for irradiating a specular-surface by sequentially illuminating a plurality of sub-sets of the light-sources in accordance with a pre-defined encoding criteria. Further, at least one camera is provided to capture reflected light-radiation from the specular-surface and thereby generate a plurality of images in accordance with the sequential-illumination, such that each of the generated-image corresponds to a particular sub-set of illuminated light sources. Further, a processing system is configured to process each generated image in accordance with an image-processing criteria specific to the encoding-criteria to determine one or more index of light-sources and thereby identify the light-sources within the images; and determine topography of the specular-surface at-least based on calculation of spatial-coordinates and the determined identity of each light-source.

公开(公告)号：US20200152783A1

公开(公告)日：2020-05-14

申请号：US16741628

申请日：2020-01-13

Applicant: Applejack 199 L.P.

Inventor： Oanh Nguyen ,  Wojciech Jan Walecki

IPC: H01L29/786 ,  H01L21/48 ,  H01L27/12 ,  H01L21/66 ,  H01L21/16 ,  G01R31/26

Abstract: A method for non-contact measurement of stress in a thin-film deposited on a substrate is disclosed. The method may include measuring first topography data of a substrate having a thin-film deposited thereupon. The method may also include comparing the first topography data with second topography data of the substrate that is measured prior to thin-film deposition. The method may further include obtaining a vertical displacement of the substrate based on the comparison between the first topography data and the second topography data. The method may also include detecting a stress value in the thin-film deposited on the substrate based on a fourth-order polynomial equation and the vertical displacement.

公开(公告)号：US10553623B2

公开(公告)日：2020-02-04

申请号：US15722645

申请日：2017-10-02

Applicant: Applejack 199 L.P.

Inventor： Wojciech Jan Walecki ,  Oanh Nguyen

IPC: H01L27/12 ,  G01B11/30 ,  G01B11/24 ,  G01B11/16 ,  G01M11/08 ,  G01L1/24 ,  H01L21/66

Abstract: A method for non-contact measurement of stress in a thin-film deposited on a substrate is disclosed. The method may include measuring first topography data of a substrate having a thin-film deposited thereupon. The method may also include comparing the first topography data with second topography data of the substrate that is measured prior to thin-film deposition. The method may further include obtaining a vertical displacement of the substrate based on the comparison between the first topography data and the second topography data. The method may also include detecting a stress value in the thin-film deposited on the substrate based on a fourth-order polynomial equation and the vertical displacement.

公开(公告)号：US10209058B1

公开(公告)日：2019-02-19

申请号：US15914445

申请日：2018-03-07

Applicant: APPLEJACK 199 L.P.

Inventor： Wojciech J Walecki

IPC: G01B9/02 ,  G01B11/30 ,  G01B11/06

Abstract: The present subject matter at-least provides an apparatus for characterization of a slab of a material. The apparatus comprises a plurality of frequency-domain optical-coherence tomography (FD-OCT) probes configured for irradiating the slab of material at at-least one location, and detecting radiation reflected from the slab of material or transmitted there-through. Further, a centralized actuation-mechanism is connected to the plurality of OCT probes for simultaneously actuating one or more elements in each of said OCT probes to at-least cause a synchronized detection of the radiation from the slab of material. A spectral-analysis module is provided for analyzing at least an interference-pattern with respect to each of said OCT probes to thereby determine at least one of thickness and topography of the slab of the material.

公开(公告)号：US20190025041A1

公开(公告)日：2019-01-24

申请号：US16048712

申请日：2018-07-30

Applicant: Applejack 199 L.P.

Inventor： WOJCIECH JAN WALECKI ,  ALEXANDER PRAVDIVTSEV

IPC: G01B9/02 ,  G01B11/06 ,  G01B11/24

Abstract: A system for inspecting a slab of material may include a polarization maintaining single mode optical-fiber, a linearly polarized broadband light-source configured to emit a polarized-light over the optical fiber, a beam-assembly configured to receive the light over the optical fiber and direct the light toward a slab of material; a polarization-rotator for controlling polarization of the light directed to the slab of material from the beam-assembly; a computer-controlled etalon filter configured to receive the light over the optical fiber, filter the light, and direct the light over the optical fiber; and a computer-controlled spectrometer configured to receive the light over the optical fiber after the light has been filtered by the etalon filter and after the light has been reflected from or transmitted through the slab of material and spectrally analyze the light.

公开(公告)号：US10113860B1

公开(公告)日：2018-10-30

申请号：US15486146

申请日：2017-04-12

Applicant: Applejack 199 L.P.

Inventor： Wojciech Jan Walecki ,  Alexander Pravdivtsev

IPC: G01B11/06 ,  G01B9/02

Abstract: Inspecting a multilayer sample. In one example embodiment, a method may include receiving, at a beam splitter, light and splitting the light into first and second portions; combining, at the beam splitter, the first portion of the light after being reflected from a multilayer sample and the second portion of the light after being reflected from a reflector; receiving, at a computer-controlled system for analyzing Fabry-Perot fringes, the combined light and spectrally analyzing the combined light to determine a value of a total power impinging a slit of the system for analyzing Fabry-Perot fringes; determining an optical path difference (OPD); recording an interferogram that plots the value versus the OPD for the OPD; performing the previous acts of the method one or more additional times with a different OPD; and using the interferogram for each of the different OPDs to determine the thicknesses and order of the layers of the multilayer sample.

公开(公告)号：US09915564B1

公开(公告)日：2018-03-13

申请号：US15410328

申请日：2017-01-19

Applicant: Applejack 199 L.P.

Inventor： Wojciech Jan Walecki ,  Alexander Pravdivtsev

IPC: G01J3/26 ,  G01N21/25 ,  G01B9/02 ,  G01B11/06 ,  G01B11/24 ,  G01J3/12

CPC classification number: G01J3/26 ,  G01B9/02044 ,  G01B11/06 ,  G01B11/2441 ,  G01J2003/1247 ,  G01N21/255 ,  G01N2201/084

Abstract: According to an aspect of one or more embodiments, a system for inspecting a slab of material may include a single mode optical fiber, a broadband light source configured to emit light over the optical fiber, a beam assembly configured to receive the light over the optical fiber and direct the light toward a slab of material, a computer-controlled etalon filter configured to receive the light over the optical fiber either before the light is directed toward the slab of material or after the light has been reflected from or transmitted through the slab of material, filter the light, and direct the light over the optical fiber, and a computer-controlled spectrometer configured to receive the light over the optical fiber after the light has been filtered by the etalon filter and after the light has been reflected from or transmitted through the slab of material and spectrally analyze the light.

公开(公告)号：US20150323313A1

公开(公告)日：2015-11-12

申请号：US14705161

申请日：2015-05-06

Applicant: Applejack 199 L.P.

Inventor： ARUN ANANTH AIYER ,  GUOGUANG LI

IPC: G01B11/24 ,  G01N21/95 ,  G01B11/06

CPC classification number: G01N21/9501 ,  G01B11/06 ,  G01B11/0625 ,  G01B11/16 ,  G01B11/2441 ,  G01B11/306 ,  G01N21/9505

Abstract: According to an aspect of an embodiment, a method may include measuring, based on interferometry, a film thickness of a surface film of a semiconductor wafer at a plurality of locations that are along a scanline of the wafer. The method may also include measuring, based on interferometry, a substrate thickness of a substrate of the semiconductor wafer at the plurality of locations. Moreover, the method may include measuring, based on an optical measurement technique, a curvature of the semiconductor wafer along the scanline. In addition, the method may include determining a stress of the surface film along the scanline based on the measured film thickness at the plurality of locations, based on the measured substrate thickness at the plurality of locations, and based on the measured curvature along the scanline.

Abstract translation: 根据实施例的一个方面，一种方法可以包括基于干涉测量在沿着晶片的扫描线的多个位置处测量半导体晶片的表面膜的膜厚度。 该方法还可以包括基于干涉测量在多个位置处测量半导体晶片的衬底的衬底厚度。 此外，该方法可以包括基于光学测量技术测量沿着扫描线的半导体晶片的曲率。 此外，该方法可以包括基于在多个位置处测量的基板厚度，并且基于沿着扫描线的测量的曲率来确定基于在多个位置处测量的膜厚度沿着扫描线的表面膜的应力 。

公开(公告)号：US20140235348A1

公开(公告)日：2014-08-21

申请号：US14243575

申请日：2014-04-02

Applicant: Applejack 199 L.P.

Inventor： Jun LIANG ,  Ann KOO ,  Nicolai MALTSEV

IPC: A63F13/40

CPC classification number: A63B60/46 ,  A63B24/0003 ,  A63B24/0006 ,  A63B53/10 ,  A63B69/36 ,  A63B69/3632 ,  A63B2024/0009 ,  A63B2024/0012 ,  A63B2024/0015 ,  A63B2220/24 ,  A63B2220/34 ,  A63B2220/40 ,  A63B2220/44 ,  A63B2220/62 ,  A63B2220/806 ,  A63B2225/20 ,  A63B2225/50 ,  A63F13/21 ,  A63F13/211 ,  A63F13/212 ,  A63F13/213 ,  A63F2300/1012 ,  G01P15/18 ,  G06F3/011 ,  G07F17/3223

Abstract: A method of providing a sensor-based gaming system for an avatar to represent a player in a virtual environment includes wirelessly receiving a set of measurements describing attributes of the player. The method includes generating a player profile associated with the player and including an avatar depicting a virtual embodiment of the player in a virtual world. The method includes receiving sensor data from sensors. The sensor data describes a change in a real world position of the player. The method includes determining an estimate of a player movement. The method includes determining a difference between a screen position of the avatar in the virtual world and the real world position of the player in the real world. The method includes generating avatar image data representative of movement of the avatar corresponding to movement of the player.

Abstract translation: 为虚拟环境提供用于表示玩家的基于传感器的游戏系统的方法包括无线地接收描述玩家属性的一组测量。 该方法包括生成与玩家相关联的玩家简档，并且包括描绘虚拟世界中的玩家的虚拟实施例的头像。 该方法包括从传感器接收传感器数据。 传感器数据描述了玩家现实世界位置的变化。 该方法包括确定玩家运动的估计。 该方法包括确定虚拟世界中化身的屏幕位置与现实世界中的玩家的真实世界位置之间的差异。 该方法包括生成代表对应于玩家的移动的化身的运动的化身图像数据。

公开(公告)号：US10964730B2

公开(公告)日：2021-03-30

申请号：US16741628

申请日：2020-01-13

Applicant: Applejack 199 L.P.

Inventor： Oanh Nguyen ,  Wojciech Jan Walecki

IPC: H01L27/12 ,  G01B11/30 ,  G01B11/24 ,  G01B11/16 ,  G01M11/08 ,  G01L1/24 ,  H01L21/66 ,  H01L21/48 ,  G01B11/06 ,  G01R31/26 ,  H01L21/16 ,  H01L29/786

Abstract: A method for non-contact measurement of stress in a thin-film deposited on a substrate is disclosed. The method may include measuring first topography data of a substrate having a thin-film deposited thereupon. The method may also include comparing the first topography data with second topography data of the substrate that is measured prior to thin-film deposition. The method may further include obtaining a vertical displacement of the substrate based on the comparison between the first topography data and the second topography data. The method may also include detecting a stress value in the thin-film deposited on the substrate based on a fourth-order polynomial equation and the vertical displacement.