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公开(公告)号：US20080156851A1
公开(公告)日：2008-07-03
申请号：US11648119
申请日：2006-12-29
Applicant: Harikrishnan Ramanan , Sabina Houle , Nitin Deshpande , Michael Colella , Nagaratnam Murugaiah
Inventor： Harikrishnan Ramanan , Sabina Houle , Nitin Deshpande , Michael Colella , Nagaratnam Murugaiah
CPC classification number: H05K3/0091 , H01L21/67126 , H01L21/6715 , H05K3/3489 , H05K2203/1366
Abstract: Methods and apparatus to improve flux spray atomization and/or splash control are described. In one embodiment, a flux nozzle includes a plurality of injection holes to deposit flux fluid through an exit hole of an air cap onto a substrate (such as a printed circuit board). The flux fluid may atomize prior to deposition onto the substrate as relatively smaller broken down flux droplets that may aid reduced spray splash. Other embodiments are also described.
Abstract translation: 描述了改善焊剂喷雾雾化和/或飞溅控制的方法和装置。 在一个实施例中，磁通喷嘴包括多个喷射孔，以将通过空气帽的出口的磁通流体沉积到基板（例如印刷电路板）上。 在沉积到衬底上之前，焊剂流体可以雾化，作为可以有助于减少喷雾飞溅的相对较小的分解通量液滴。 还描述了其它实施例。
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公开(公告)号：US20080237364A1
公开(公告)日：2008-10-02
申请号：US11731224
申请日：2007-03-30
Applicant: Nitin Deshpande , Harikrishnan Ramanan , Ray Krick
Inventor： Nitin Deshpande , Harikrishnan Ramanan , Ray Krick
IPC: B05B7/06
CPC classification number: B05B7/0475 , B05B7/066 , B05B7/10
Abstract: Methods and apparatus to improve flux air cap and/or spray nozzle designs are described. In one embodiment, a flux nozzle may include a cylindrical portion and a conical portion. Other embodiments are also described.
Abstract translation: 描述了改善通量气帽和/或喷嘴设计的方法和设备。 在一个实施例中，磁通喷嘴可以包括圆柱形部分和锥形部分。 还描述了其它实施例。
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公开(公告)号：US20080149692A1
公开(公告)日：2008-06-26
申请号：US11613490
申请日：2006-12-20
Applicant: Harikrishnan Ramanan , Nitin Deshpande , Sabina J. Houle
Inventor： Harikrishnan Ramanan , Nitin Deshpande , Sabina J. Houle
CPC classification number: B23K3/082 , B05B5/032 , B05B5/0403 , B05B7/0861 , B05B12/36 , B05B14/30 , B05B15/65 , B05C5/02 , B23K35/0244 , Y10T137/2931
Abstract: A solder-flux composition is sprayed onto a substrate by rotating the solder-flux composition inside a spray cap, and before the solder-flux liquid exits the spray cap, perturbing the flow thereof with a fluid.
Abstract translation: 通过使焊剂组合物在喷雾帽内旋转，并且在焊剂液体离开喷雾帽之前，通过流体扰动其流动，将焊剂组合物喷涂到基底上。
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公开(公告)号：US20120266972A1
公开(公告)日：2012-10-25
申请号：US13540552
申请日：2012-07-02
Applicant: Harikrishnan RAMANAN , Nitin DESHPANDE , Sabina J. HOULE
Inventor： Harikrishnan RAMANAN , Nitin DESHPANDE , Sabina J. HOULE
IPC: B67D7/06
CPC classification number: B23K3/082 , B05B5/032 , B05B5/0403 , B05B7/0861 , B05B12/36 , B05B14/30 , B05B15/65 , B05C5/02 , B23K35/0244 , Y10T137/2931
Abstract: A solder-flux composition is sprayed onto a substrate by rotating the solder-flux composition inside a spray cap, and before the solder-flux liquid exits the spray cap, perturbing the flow thereof with a fluid.
Abstract translation: 通过使焊剂组合物在喷雾帽内旋转，并且在焊剂液体离开喷雾帽之前，通过流体扰动其流动，将焊剂组合物喷涂到基底上。
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公开(公告)号：US08215536B2
公开(公告)日：2012-07-10
申请号：US11613490
申请日：2006-12-20
Applicant: Harikrishnan Ramanan , Nitin Deshpande , Sabina J. Houle
Inventor： Harikrishnan Ramanan , Nitin Deshpande , Sabina J. Houle
IPC: B23K1/20
CPC classification number: B23K3/082 , B05B5/032 , B05B5/0403 , B05B7/0861 , B05B12/36 , B05B14/30 , B05B15/65 , B05C5/02 , B23K35/0244 , Y10T137/2931
Abstract: A solder-flux composition is sprayed onto a substrate by rotating the solder-flux composition inside a spray cap, and before the solder-flux liquid exits the spray cap, perturbing the flow thereof with a fluid.
Abstract translation: 通过使焊剂组合物在喷雾帽内旋转，并且在焊剂液体离开喷雾帽之前，通过流体扰动其流动，将焊剂组合物喷涂到基底上。
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Patent Agency Ranking
公开(公告)号：US07644871B2
公开(公告)日：2010-01-12
申请号：US11648119
申请日：2006-12-29
Applicant: Harikrishnan Ramanan , Sabina Houle , Nitin Deshpande , Michael Colella , Nagaratnam Murugaiah
Inventor： Harikrishnan Ramanan , Sabina Houle , Nitin Deshpande , Michael Colella , Nagaratnam Murugaiah
IPC: A62C5/02
CPC classification number: H05K3/0091 , H01L21/67126 , H01L21/6715 , H05K3/3489 , H05K2203/1366
Abstract: Methods and apparatus to improve flux spray atomization and/or splash control are described. In one embodiment, a flux nozzle includes a plurality of injection holes to deposit flux fluid through an exit hole of an air cap onto a substrate (such as a printed circuit board). The flux fluid may atomize prior to deposition onto the substrate as relatively smaller broken down flux droplets that may aid reduced spray splash. Other embodiments are also described.
Abstract translation: 描述了改善焊剂喷雾雾化和/或飞溅控制的方法和装置。 在一个实施例中，磁通喷嘴包括多个喷射孔，以将通过空气帽的出口的磁通流体沉积到基板（例如印刷电路板）上。 在沉积到衬底上之前，焊剂流体可以雾化，作为可以有助于减少喷雾飞溅的相对较小的分解通量液滴。 还描述了其它实施例。
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公开(公告)号：US20080238589A1
公开(公告)日：2008-10-02
申请号：US11729486
申请日：2007-03-29
Applicant: Nhan Toan Quan , Harikrishnan Ramanan
Inventor： Nhan Toan Quan , Harikrishnan Ramanan
IPC: H01H51/22
CPC classification number: B05B7/0475 , H01L21/6715
Abstract: Methods and apparatus to improve air cap design for controlling spray flux are described. In one embodiment, a plurality of opposing gas inlets are provided in an air cap, e.g., to reduce or eliminate potential opposing turbulence inside the air cap. Other embodiments are also described.
Abstract translation: 描述了改进控制喷雾通量的气帽设计的方法和装置。 在一个实施例中，多个相对的气体入口设置在空气帽中，例如以减少或消除空气帽内的潜在的相对的湍流。 还描述了其它实施例。
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公开(公告)号：US09180541B2
公开(公告)日：2015-11-10
申请号：US13540552
申请日：2012-07-02
Applicant: Harikrishnan Ramanan , Nitin Deshpande , Sabina J. Houle
Inventor： Harikrishnan Ramanan , Nitin Deshpande , Sabina J. Houle
IPC: B23K1/00 , B23K3/08 , B05B7/08 , B05B15/04 , B05B5/03 , B05B15/06 , B23K35/02 , B05C5/02 , B05B5/04
CPC classification number: B23K3/082 , B05B5/032 , B05B5/0403 , B05B7/0861 , B05B12/36 , B05B14/30 , B05B15/65 , B05C5/02 , B23K35/0244 , Y10T137/2931
Abstract: A solder-flux composition is sprayed onto a substrate by rotating the solder-flux composition inside a spray cap, and before the solder-flux liquid exits the spray cap, perturbing the flow thereof with a fluid.
Abstract translation: 通过使焊剂组合物在喷雾帽内旋转，并且在焊剂液体离开喷雾帽之前，通过流体扰动其流动，将焊剂组合物喷涂到基底上。
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9.发明授权Nozzle array configuration to facilitate deflux process improvement in chip attach process 有权喷嘴阵列配置方便芯片连接过程中的脱屑工艺改进公开(公告)号：US07767025B2
公开(公告)日：2010-08-03
申请号：US11865057
申请日：2007-09-30
Applicant: Harikrishnan Ramanan , Yongqian J. Wang
Inventor： Harikrishnan Ramanan , Yongqian J. Wang
CPC classification number: B08B3/022 , B08B5/023 , H01L21/67051 , H05K3/26 , H05K2201/10674 , H05K2203/0746 , H05K2203/1509
Abstract: Systems and methods for treating workpieces are described. One embodiment relates to a deflux system including at least one array of nozzles, the nozzles adapted to transmit a fluid outward therefrom. The nozzles are moveable relative to one another, so that a distance between adjacent nozzles can be varied. The nozzles are individually adjustable with respect to an angle of spray emitted therefrom during operation. The system also includes a controller adapted to send a signal to each of the nozzles to transmit the fluid therethrough at a desired angle at a desired time. Other embodiments are described and claimed.
Abstract translation: 描述了用于处理工件的系统和方法。 一个实施例涉及一种包括至少一个喷嘴阵列的排油系统，喷嘴适于将流体向外传送。 喷嘴可以相对于彼此移动，使得相邻喷嘴之间的距离可以变化。 喷嘴相对于在操作期间从其喷出的喷雾角度可单独调节。 该系统还包括控制器，其适于向每个喷嘴发送信号以在期望的角度以期望的角度透过流体。 描述和要求保护其他实施例。
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10.发明申请NOZZLE ARRAY CONFIGURATION TO FACILITATE DEFLUX PROCESS IMPROVEMENT IN CHIP ATTACH PROCESS 有权喷嘴阵列配置，以便在芯片连接过程中完善DEFLUX过程改进公开(公告)号：US20090084412A1
公开(公告)日：2009-04-02
申请号：US11865057
申请日：2007-09-30
Applicant: Harikrishnan Ramanan , Yongqian J. Wang
Inventor： Harikrishnan Ramanan , Yongqian J. Wang
IPC: B08B3/02
CPC classification number: B08B3/022 , B08B5/023 , H01L21/67051 , H05K3/26 , H05K2201/10674 , H05K2203/0746 , H05K2203/1509
Abstract: Systems and methods for treating workpieces are described. One embodiment relates to a deflux system including at least one array of nozzles, the nozzles adapted to transmit a fluid outward therefrom. The nozzles are moveable relative to one another, so that a distance between adjacent nozzles can be varied. The nozzles are individually adjustable with respect to an angle of spray emitted therefrom during operation. The system also includes a controller adapted to send a signal to each of the nozzles to transmit the fluid therethrough at a desired angle at a desired time. Other embodiments are described and claimed.
Abstract translation: 描述了用于处理工件的系统和方法。 一个实施例涉及一种包括至少一个喷嘴阵列的排油系统，喷嘴适于将流体向外传送。 喷嘴可以相对于彼此移动，使得相邻喷嘴之间的距离可以变化。 喷嘴相对于在操作期间从其喷出的喷雾角度可单独调节。 该系统还包括控制器，其适于向每个喷嘴发送信号以在期望的角度以期望的角度透过流体。 描述和要求保护其他实施例。
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